JP2946286B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method for an electronic component, and more particularly to a mounting method for removing heat generated from an electronic component used in an electronic unit for an automobile.

[0002]

2. Description of the Related Art Among electronic components mounted on a circuit board in an electronic unit, there are those which operate with a large current, such as an output transistor, whose temperature rises significantly during energization. Such a rise in the temperature of the components not only causes a malfunction, but also causes inconveniences such as performance degradation and shortened life. For this reason, conventionally, electronic components such as FETs mounted on the circuit board in the electronic unit are mounted on the heat sink with screws, and the heat generated from the electronic components is transmitted to the heat sink, and the heat is dissipated by the heat sink. The method of making it use is used. FIG. 4 illustrates such a conventional mounting method.

As shown in FIG. 1, the electronic component 1 has its back surface 5 in contact with a contact surface 40A of a heat sink 40 and is screwed. The heat sink 40 is screwed into a screw hole 31B of a circuit board 31 with a screw 41. Locked. Here, the lead terminal 10 of the electronic component 1 is connected to a lead terminal hole 31 provided in the circuit board 31.
A and is connected to the back surface of the circuit board 31 by soldering or the like.

According to this method, when the electronic component 1 generates heat during operation, the heat is transmitted from the back surface 5 of the electronic component 1 to the heat radiating plate 40 and is radiated mainly from the surface of the heat radiating plate 40. As a result, heat generated in the electronic component 1 is removed by heat, so that an undesired rise in temperature of the electronic component 1 can be suppressed.

[0005]

By the way, in the conventional mounting method as described above, one heat sink is prepared for one electronic component. Moreover, the heat radiating plate not only occupies space itself, but also requires a mounting place on a circuit board to be mounted. As a result, not only does it hinder the reduction in size and weight of the electronic unit, but there is a problem that it cannot be applied when the circuit board is small and there is not enough space. In addition, each electronic component requires a dedicated radiator plate or a component such as a screw for attaching the radiator plate, thereby increasing the cost.

SUMMARY OF THE INVENTION The present invention has been made to solve such problems and disadvantages of the prior art. It is an object of the present invention to provide a mounting method of an electronic component which requires only a small mounting space and can radiate heat without increasing the number of components. Is to provide.

[0007]

In order to achieve the above object, an electronic component mounting method according to the present invention has a structure in which both the first electronic component and the second electronic component operate simultaneously and do not generate heat at the same time. The first electronic component and the second electronic component are paired with each other, and an outer wall of the first electronic component and an outer wall of the second electronic component are connected to each other. The heat generated by one of the first electronic component and the second electronic component is transferred from the wall of the outer housing in a high temperature state to the outer wall of the opposite hand in a low temperature state. It is characterized by transmitting and radiating heat.

[0008]

According to the electronic component mounting method of the present invention, heat is transferred from the external wall of the high-temperature electronic component in a heat-generating state to the external wall of the low-temperature electronic component, which is in opposition to the electronic component. The heat is dissipated by the external structure of the electronic component.

[0009]

Embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a perspective view illustrating an embodiment of a method for mounting an electronic component according to the present invention. Further, FIG.
FIG. As shown in FIGS. 1 and 2,
In the electronic component mounting method M according to the present invention, the first electronic component 1 and the second electronic component 2 that do not generate heat by being energized simultaneously are paired. For example, a field effect transistor (FET) or the like is applied to the first electronic component 1 and the second electronic component 2.

The outer wall of the first electronic component 1, for example, the rear surface 5, and the outer wall of the second electronic component 2, for example, the rear surface 15, are arranged in contact with each other. A locking hole 1A provided in a locking portion 1B as an upper portion;
The rivet 8 is passed through the locking hole 2A provided in the locking portion 2B, which is the upper part of the rivet 8, and the rivet 8 is swaged to bring the two back portions 5, 15 into close contact.

The lead terminals 10 and 20 of the first electronic component 1 and the second electronic component 2 integrated as described above are inserted into the respective lead terminal holes 30A of the circuit board 30 and soldered or the like on the back surface. To fix the connection.

If one of the first electronic component 1 and the second electronic component 2 assembled as described above, for example, the first electronic component 1 is energized and operated to generate heat, the temperature becomes high. The generated heat is transferred from the rear part 5 of the external structure in a high temperature state to the rear part 15 of the external structure of the second electronic component 2 in a low temperature state. The transmitted heat is radiated by the outer structure of the second electronic component 2. That is, the low-temperature second
The low-temperature outer structure of the electronic component 2 functions as a heat sink.

Next, if the power supply to the first electronic component 1 is stopped and the heat generation stops, while the second electronic component 2 is energized and activated to generate heat, the generated heat component becomes high temperature. The heat is transferred from the rear part 15 of the external structure in the state to the rear part 5 of the external structure of the first electronic component 1 in the low temperature state. The transmitted heat is radiated by the outer structure of the first electronic component 1. That is, the low-temperature first electronic component 1 that is not operating
However, the low-temperature exterior works as a heat sink. As described above, according to the electronic component mounting method of the present invention, the two electronic components use the heat radiation function of the other external components to radiate the heat generated by themselves. In addition, a heat radiating plate is not required, so that not only the installation space can be saved, but also the number of parts can be reduced and the cost can be reduced.

FIG. 3 shows an example of a control circuit to which the electronic component mounting method according to the present invention is applied. As shown in the figure, the control circuit 21 includes two p-channel FETs 2
3A, 23B, two n-channel FETs 24A, 24
The reversible motor 22 is rotated forward or backward by operating the control unit 25 on any two of B. For example, when the control unit 25 has the FET 23A and the FE
When T24B is turned on and FET23B and FET24A are turned off, the reversible motor 22 rotates forward. Further, the control unit 25 turns off the FETs 23A and 24B, and the FE
When T23B and FET24A are turned on, the reversible motor 2
2 rotates in reverse.

Such a control circuit is used for controlling an electric retractable mirror control, controlling a centralized door lock, controlling a power window, and the like. In the above, the FET
The method of the present invention can be applied to a configuration as shown in FIG. 1 in which 23A and 23B are paired, one is a first electronic component, and the other is a second electronic component. Similarly, FETs 24A and 24B
, One as the first electronic component and the other as the second electronic component, the method of the present invention can be applied in a configuration as shown in FIG.

[0016]

As described above, the method for mounting electronic components according to the present invention uses electronic components used in electronic units such as automobiles that are not energized at the same time and therefore do not generate heat at the same time. A radiator plate that attaches and radiates heat from the high-temperature electronic components that are in a heat-generating state by radiating the heat from the surface of the electronic components in a low-temperature state that is the other hand by making contact with each other in pairs. This is advantageous in that not only can the number of parts be reduced and cost can be reduced, but also the circuit board can be applied without difficulty even when the circuit board is small and there is not enough space. Further, not only the assemblability of the parts is improved, but also the space for mounting the parts can be reduced, and the size and weight of the electronic unit can be reduced, which is effective in various aspects of manufacturing and operation.

[Brief description of the drawings]

FIG. 1 is a perspective view illustrating one embodiment of a method for mounting an electronic component according to the present invention.

FIG. 2 is a front view of FIG.

FIG. 3 is a circuit diagram of an example of an electronic circuit to which the method according to the present invention is applied.

FIG. 4 is a perspective view illustrating a conventional method for mounting an electronic component.

[Explanation of symbols]

 M Electronic component mounting method 1 First electronic component 1A Lock hole 1B Lock portion 2 Second electronic component 2A Lock hole 2B Lock portion 5 Back portion 8 Rivets 10 Lead terminal 15 Back portion 20 Lead terminal 30 Circuit board 30A Lead Terminal hole

──────────────────────────────────────────────────続 き Continued on the front page (72) Motoatsu Matsunaga Inventor 206-1 Nunobikihara, Haibara-cho, Haibara-gun, Shizuoka Prefecture Inside Yazaki Parts Co., Ltd. (56) References JP-A-2-265141 (JP, A) (58) ) Surveyed field (Int.Cl. ⁶ , DB name) H05K 1/18

Claims (1)

(57) [Claims] 1. A circuit having a configuration in which both a first electronic component and a second electronic component operate simultaneously and do not generate heat at the same time, wherein the first electronic component and the second electronic component are applied. The outer wall of the first electronic component and the outer wall of the second electronic component are arranged in contact with each other, and one of the first electronic component and the second electronic component is A method of mounting an electronic component, wherein the generated heat is transferred from the outer wall in a high temperature state to the outer wall in a low temperature state to dissipate heat.