JPH0832967B2 - Continuous plating system - Google Patents

Continuous plating system

Info

Publication number
JPH0832967B2
JPH0832967B2 JP4265160A JP26516092A JPH0832967B2 JP H0832967 B2 JPH0832967 B2 JP H0832967B2 JP 4265160 A JP4265160 A JP 4265160A JP 26516092 A JP26516092 A JP 26516092A JP H0832967 B2 JPH0832967 B2 JP H0832967B2
Authority
JP
Japan
Prior art keywords
processing tank
plated
plating
processing
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4265160A
Other languages
Japanese (ja)
Other versions
JPH06116798A (en
Inventor
正巳 高木
康夫 三宅
幸久 建部
久司 柘植
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP4265160A priority Critical patent/JPH0832967B2/en
Publication of JPH06116798A publication Critical patent/JPH06116798A/en
Publication of JPH0832967B2 publication Critical patent/JPH0832967B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、液相メッキ法により被
メッキ部材にメッキを施す連続メッキシステムに関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a continuous plating system for plating a member to be plated by a liquid phase plating method.

【0002】[0002]

【従来の技術】一般に、液相メッキ法は、被メッキ部材
を酸などの処理液により清浄化する過程と、処理液の水
洗の過程と、メッキ液内で膜を生成する過程と、メッキ
液の水洗の過程とを含んでいる。このような一連の処理
を行うメッキシステムとしては、図5に示すように、被
メッキ部材(図示せず)をかご状のバレル20に収納し
ておき、ホイスト21によってバレル20を搬送し、各
過程の処理槽22a〜22fにバレル20を順に浸漬す
るものが考えられている。また、各処理槽22a〜22
fの中で液体と被メッキ部材とを十分に接触させるため
に、バレル20を回転させたり揺動させたりするための
駆動機構23が設けられている。処理槽22a〜22f
としては、被メッキ部材の清浄化を行う前処理の処理槽
22a、清浄化に用いる処理液を水洗する3個の処理槽
22b、メッキによる下地膜を形成する処理槽22c、
メッキ液を水洗する3個の処理槽22d、下地膜(たと
えばニッケル)の上に目的とする表面膜(たとえばクロ
ム)をメッキにより形成する処理槽22e、メッキ液を
水洗する3個の処理槽22fを備えている。
2. Description of the Related Art Generally, liquid phase plating is a process of cleaning a member to be plated with a treatment liquid such as an acid, a process of washing the treatment liquid with water, a process of forming a film in the plating liquid, and a plating liquid. The process of washing with water is included. As a plating system for performing such a series of treatments, as shown in FIG. 5, a member to be plated (not shown) is housed in a basket-shaped barrel 20, and the barrel 20 is conveyed by a hoist 21. It is considered that the barrel 20 is sequentially dipped in the processing tanks 22a to 22f in the process. Moreover, each processing tank 22a-22
A drive mechanism 23 for rotating or rocking the barrel 20 is provided in order to sufficiently bring the liquid into contact with the member to be plated in f. Processing tanks 22a to 22f
The processing tank 22a for pretreatment for cleaning the member to be plated, the three processing tanks 22b for washing the processing liquid used for cleaning with water, the processing tank 22c for forming a base film by plating,
Three treatment baths 22d for washing the plating liquid, a treatment bath 22e for forming an intended surface film (for example, chromium) on a base film (for example, nickel) by plating, and three treatment baths 22f for washing the plating liquid with water. Is equipped with.

【0003】[0003]

【発明が解決しようとする課題】上述したメッキシステ
ムでは、被メッキ部材をバレル20に収納して処理槽2
2a〜22fに浸漬するのであってバッチ処理になって
いるから、1バッチ当たりの被メッキ部材の量が少ない
とコスト高につながり、多品種少量生産には向かないと
いう問題がある。また、被メッキ部材を各処理槽22a
〜22fに出し入れするから、搬送装置として大型のホ
イスト21が必要であり、設備が大型化するという問題
もある。さらに、処理槽22a〜22fからバレル20
を取り出したときに、バレル20に各処理槽22a〜2
2fの中の液体が付着しているから、処理液やメッキ液
の消費量が多くなるという問題がある。また、バレル2
0を通して処理液やメッキ液が被メッキ部材に接触する
から、バレル20の中の処理液やメッキ液が十分に入れ
換わらず、清浄化やメッキの効率が低下する場合もあ
る。
In the plating system described above, the member to be plated is housed in the barrel 20 and the processing tank 2 is used.
Since it is immersed in 2a to 22f and is a batch process, there is a problem that a small amount of plated members per batch leads to high cost and is not suitable for high-mix low-volume production. In addition, the member to be plated is set in each processing tank 22a.
Since the large hoist 21 is required as a carrying device since the hoist 21 is put in and taken out of the equipment 22f, there is also a problem that the equipment becomes large. Furthermore, the barrels 20 are removed from the processing tanks 22a to 22f.
When taking out, each processing tank 22a-2
Since the liquid in 2f is attached, there is a problem that the consumption of the processing liquid and the plating liquid increases. Also, barrel 2
Since the treatment liquid or the plating liquid contacts the member to be plated through 0, the treatment liquid or the plating liquid in the barrel 20 may not be sufficiently replaced, and the cleaning or plating efficiency may decrease.

【0004】本発明は上記問題点の解決を目的とするも
のであり、バレルを用いずに各過程の処理を行うことこ
とによって、多品種少量生産を容易にし、かつ設備を小
型化し、しかもバレルを用いる場合に比較して清浄化に
用いる処理液やメッキ液の消費量を少なくした連続メッ
キシステムを提供しようとするものである。
The present invention is intended to solve the above-mentioned problems, and by carrying out the processing in each process without using a barrel, it is possible to easily carry out small-lot production of a wide variety of products, downsize the equipment, and further, the barrel. The present invention intends to provide a continuous plating system in which the consumption of the processing liquid and the plating liquid used for cleaning is reduced as compared with the case of using.

【0005】[0005]

【0006】[0006]

【課題を解決するための手段】 本発明では、被メッキ部
材を処理液によって清浄化する過程、処理液を水洗する
過程、清浄化された被メッキ部材をメッキ液に浸漬して
メッキによる膜を生成する過程、メッキ液を水洗する過
程を含むメッキ処理に用いる連続メッキシステムであっ
て、 各過程ごとの液体を入れる複数の処理槽が上下方向
に配列され、各処理槽は上面が開口した円筒状に形成さ
れて中心線が上下方向になるように配置され、各処理槽
の内周面には被メッキ部材が載置される螺旋状の搬送路
が固着され、被メッキ部材が搬送路に沿って上昇方向に
移動するように処理槽に対して上下方向および周方向の
振動を与える1つの加振器が各処理槽を連結する1本の
振動ロッドを介して各処理槽に結合され、各処理槽の搬
送路の上端部は処理槽から突出していて、各過程の処理
槽の搬送路の上端部から排出されて落下する被メッキ部
材を受けて次過程の処理槽内に投入するガイドが設けら
れている。
According to the present invention, the portion to be plated is
Process of cleaning material with treatment liquid, washing treatment liquid with water
In the process, soak the cleaned member in the plating solution
The process of forming a film by plating,
It is a continuous plating system used for the plating process including
, A plurality of processing tanks for containing the liquid for each process are arranged in the vertical direction, each processing tank is formed in a cylindrical shape with an open upper surface, and the center line is arranged in the vertical direction. A spiral transfer path on which the member to be plated is placed is fixed to the inner peripheral surface, and vibration in the vertical direction and the circumferential direction with respect to the processing tank is performed so that the member to be plated moves upward along the transfer path. One shaker that gives each of the processing tanks is connected to each processing tank through one vibrating rod that connects the processing tanks, and the upper end of the transport path of each processing tank projects from the processing tank, and the processing of each process is performed. guide to be introduced into the treatment tank for the next process that provided by receiving an object to be plated member to fall is discharged from the upper end portion of the transport path of the vessel.

【0007】[0007]

【作用】本発明の構成によれば、各過程で用いる処理槽
を円筒状に形成して内部に螺旋状の搬送路を形成すると
ともに、処理槽を加振器により周方向および上下方向に
振動させることによって、被メッキ部材を搬送路に沿っ
て上向きに移動させるのであり、しかも搬送路の上端部
を処理槽から外に突出させて被メッキ部材を取り出し、
次過程の処理槽まで被メッキ部材をコンベアによって搬
送するようにしているので、処理槽内に形成された搬送
路に沿って被メッキ部材を一方向に搬送していくことに
よって、被メッキ部材をバッチ処理ではなく連続処理で
処理することになる。すなわち、バッチ処理に比較すれ
ば、被メッキ部材の個数が少ない場合でもコストの増加
がなく、多品種を少量生産する場合でもコスト増が生じ
ないのである。また、被メッキ部材は、搬送路を下から
上に搬送されるのであって、被メッキ部材を処理槽の上
部から取り出すことができるから、従来のようにバレル
を用いることなく処理槽に投入した被メッキ部材を順次
取り出すことができ、結果的に被メッキ部材の投入およ
び取出の作業を完全に自動化することが可能になる。し
かも、処理槽は加振器によって振動されるから、バレル
を回転させたり揺動させたりする別途の手段を用いるこ
となく被メッキ部材と処理槽内の液との接触効率を高め
ることができることになる。さらに、処理槽に投入した
被メッキ部材を処理槽の中の液体を流出させることなく
取り出すことができるのであって、従来構成のようにバ
レルに処理槽内の液体が付着して外部に液体が持ち出さ
れることがなく、バレルを用いる場合に比較して処理液
やメッキ液の消費量が大幅に減少するのである。また、
処理槽からの処理液やメッキ液の流出量が減少すること
によって、環境汚染を軽減することができることにな
る。
According to the structure of the present invention, the processing tank used in each process is formed into a cylindrical shape to form a spiral transfer path therein, and the processing tank is vibrated in the circumferential direction and the vertical direction by a vibrator. By doing so, the member to be plated is moved upward along the transfer path, and furthermore, the upper end of the transfer path is projected out of the processing tank to take out the member to be plated,
Since the member to be plated is conveyed to the processing tank in the next process by a conveyor, the member to be plated is conveyed in one direction along the conveyance path formed in the processing tank, so that the member to be plated is It will be processed by continuous processing instead of batch processing. That is, as compared with the batch processing, the cost does not increase even when the number of members to be plated is small, and the cost does not increase even when a large number of various products are produced in a small amount. Further, since the member to be plated is transported from the bottom to the top of the transport path and the member to be plated can be taken out from the upper part of the processing tank, it is put into the processing tank without using a barrel as in the conventional case. The members to be plated can be sequentially taken out, and as a result, the work of loading and unloading the members to be plated can be completely automated. Moreover, since the treatment tank is vibrated by the vibrator, it is possible to enhance the contact efficiency between the member to be plated and the liquid in the treatment tank without using a separate means for rotating or swinging the barrel. Become. Further, the member to be plated placed in the processing tank can be taken out without causing the liquid in the processing tank to flow out. It is not taken out, and the consumption of processing liquid and plating liquid is greatly reduced compared to the case where a barrel is used. Also,
Environmental pollution can be reduced by reducing the outflow amount of the processing liquid and the plating liquid from the processing tank.

【0008】本発明の構成では、各処理槽が上下方向に
配列されるから、設置面積を小さくすることが可能であ
り、しかも加振器からの振動を1本の振動ロッドによっ
て各処理槽に伝達しているから、加振器を共用して設備
コストを低減できることになる。また、各処理槽から落
下する被メッキ部材をガイドで受けて次過程のメッキ槽
に投入するから、処理槽の間で被メッキ部材を搬送する
装置が不要であり、設備コストを一層低減できることに
なる。
In the structure of the present invention , since the processing tanks are arranged in the vertical direction, the installation area can be reduced, and the vibration from the vibrator can be applied to each processing tank by one vibrating rod. Since it is transmitted, equipment costs can be reduced by sharing the vibration exciter. Further, since the member to be plated falling from each processing tank is received by the guide and put into the plating tank in the next process, there is no need for a device for transporting the member to be plated between the processing tanks, and the facility cost can be further reduced. Become.

【0009】[0009]

【実施例】本実施例では、被メッキ部材の清浄化の過程
と、清浄化後の水洗の過程と、メッキの過程と、メッキ
の後の水洗の過程とを有した本発明の連続メッキシステ
ムを示す。図1に示すように、4個の処理槽1a〜1
は上下方向に配列されている。各処理槽1a〜1は、
図1のから順に、被メッキ部材の清浄化を行う前処理
の処理槽1a、前処理の処理液を水洗する処理槽1b、
下地膜を形成する第1段階のメッキ処理を行う処理槽1
c、メッキ液を水洗する処理槽1dになっている。ま
た、各処理槽1a〜1dは後の過程になるほど下に配置
されている。各処理槽1a〜1の間にはそれぞれガイ
ド8が配設されていて、このガイド8を用いることによ
って各処理槽1a〜1cから次過程に被メッキ部材を搬
送するようになっている。
EXAMPLE In this example, the process of cleaning the plated member
And the process of washing with water after cleaning, the process of plating, and the plating
And the subsequent step of washing with water, the continuous plating system of the present invention.
Show the As shown in FIG. 1, four processing tanks 1A~1 d
Are arranged vertically . Each processing tank 1A~1 d is
In order from the top of FIG. 1, a pretreatment tank 1a for cleaning the member to be plated, a treatment tank 1b for washing the pretreatment solution with water,
Treatment tank 1 for performing the first-stage plating treatment for forming a base film
c, which is the treatment tank 1 d for washing the plating solution. In addition, the processing tanks 1a to 1d are arranged lower in later steps.
Have been. Waso respectively Guy between each processing tank 1A~1 d
If the guide 8 is provided and this guide 8 is used,
Therefore, the member to be plated is carried from each of the processing tanks 1a to 1c to the next step.
It is supposed to be sent.

【0010】各処理槽1(1a〜1)は、図2に示す
ように、下面が閉塞され上面が開放された円筒状に形成
され、内周面には螺旋状の搬送路2が一体に形成され
る。処理槽1の底面は中央部が周部よりも高くなる凸状
に形成され、処理槽1の底部に投入された被メッキ部材
が処理槽1の周部に集まるようにしてある。搬送路2
は、処理槽1の内周面に一側縁が固着された平板状の主
片2aと、主片2aの他側縁から上方に突出した側片2
bとを連続一体に備える形状に塩化ビニル等によって形
成され、主片2aの上に被メッキ部材が載るようになっ
ている。搬送路2は処理槽1に対して幅方向の一側縁の
みが固定されて片持ちになっている。処理槽1の周壁の
上部には、処理槽1に入れたメッキ液の液面よりも上方
で排出口6が開口し、搬送路2の上端部は排出口6を通
して処理槽1の外に突出している。また、搬送路2の下
端は処理槽1の底面に連続している。
[0010] Each processing bath 1 (1a~1 d), as shown in FIG. 2, the lower surface is formed in a cylindrical shape whose upper surface is closed is opened, the inner peripheral surface conveyance path 2 spiral is integrally Is formed. The bottom surface of the processing tank 1 is formed in a convex shape in which the central portion is higher than the peripheral portion, and the members to be plated put in the bottom portion of the processing tank 1 gather on the peripheral portion of the processing tank 1. Transport path 2
Is a flat plate-shaped main piece 2a having one side edge fixed to the inner peripheral surface of the processing tank 1, and a side piece 2 protruding upward from the other side edge of the main piece 2a.
It is formed of vinyl chloride or the like so as to be continuously integrated with b, and a member to be plated is placed on the main piece 2a. The transfer path 2 is cantilevered with respect to the processing tank 1 by fixing only one side edge in the width direction. At the upper part of the peripheral wall of the processing tank 1, a discharge port 6 is opened above the liquid surface of the plating liquid put in the processing tank 1, and the upper end of the transport path 2 projects outside the processing tank 1 through the discharge port 6. ing. Further, the lower end of the transport path 2 is continuous with the bottom surface of the processing tank 1.

【0011】ところで、図2では処理槽1cにおいて電
気メッキを行う場合の構成を示している。したがって、
図2に示した処理槽1では、搬送路2の主片2aの上面
の全長に亙って線状の陰極3が配設される。図2では陰
極3を1条だけ設けているが、複数条設けるようにして
もよい。一方、処理槽1において搬送路2よりも内周側
には、八角形状に形成された陽極保持板4の周縁に上端
部が結合された短冊状の8本の陽極板5が挿入される。
メッキを行う処理槽1c以外の処理槽1a,1b,1
ついては、陰極3および陽極板5を除けば同様の構成
である。
By the way, it shows a configuration for performing Oite electroplating treatment tank 1 c in FIG. 2. Therefore,
In the processing tank 1 shown in FIG. 2, a linear cathode 3 is arranged over the entire length of the upper surface of the main piece 2a of the transport path 2. Although only one cathode 3 is provided in FIG. 2, a plurality of cathodes 3 may be provided. On the other hand, eight strip-shaped anode plates 5 each having an upper end coupled to the peripheral edge of an octagonal anode holding plate 4 are inserted on the inner peripheral side of the transport path 2 in the processing tank 1.
Processing tank 1 c other than the treatment tank 1a for performing plating, 1b, 1 d
For a, the same configuration except for the cathode 3 and the anode plate 5.

【0012】処理槽1の下面には加振器10の可動台1
1が結合される。加振器10は、図3に示すように、防
振のためのゴムよりなる据置座13を備えた固定ベース
12を備え、固定ベース12の上に2個の電磁ソレノイ
ド14が配置されている。可動台11は十字形に形成さ
れ、可動台11の各片が板ばね15を介して固定ベース
12に結合されることによって、可動台11は固定ベー
ス12の上方に配設される。また、可動台11のうちの
2片には電磁ソレノイド14に吸引される磁極板16が
垂設される。板ばね15は電磁ソレノイド14が励磁さ
れていない状態では、図3(b)のように傾斜して配置
されており、電磁ソレノイド14の励磁によって磁極板
16が吸引力を受けると、可動台11が図3(a)にお
ける左回りに回転し、このとき可動台11の固定ベース
12に対する距離が板ばね15によって規制されている
ことによって、可動台11は固定ベース12から離れる
ように移動する。すなわち、電磁ソレノイド14が励磁
されると、可動台11は回転しながら上方に移動するこ
とになる。電磁ソレノイド14を非励磁にすると、板ば
ね15の復帰力によって可動台11は元の位置に復帰す
る。電磁ソレノイド14は、端子台17を介してリード
線18に接続される。
On the lower surface of the processing tank 1, the movable base 1 of the vibrator 10 is provided.
1s are combined. As shown in FIG. 3, the vibrator 10 includes a fixed base 12 having a stationary seat 13 made of rubber for vibration isolation, and two electromagnetic solenoids 14 are arranged on the fixed base 12. . The movable base 11 is formed in a cross shape, and each piece of the movable base 11 is coupled to the fixed base 12 via the leaf spring 15, so that the movable base 11 is arranged above the fixed base 12. A magnetic pole plate 16 attracted by the electromagnetic solenoid 14 is vertically provided on two pieces of the movable table 11. The leaf springs 15 are arranged so as to be inclined as shown in FIG. 3B when the electromagnetic solenoid 14 is not excited, and when the magnetic pole plate 16 receives an attractive force due to the excitation of the electromagnetic solenoid 14, the movable table 11 is moved. Rotates counterclockwise in FIG. 3A, and at this time, the distance between the movable base 11 and the fixed base 12 is restricted by the leaf spring 15, so that the movable base 11 moves away from the fixed base 12. That is, when the electromagnetic solenoid 14 is excited, the movable table 11 moves upward while rotating. When the electromagnetic solenoid 14 is de-excited, the movable base 11 returns to its original position by the restoring force of the leaf spring 15. The electromagnetic solenoid 14 is connected to the lead wire 18 via a terminal block 17.

【0013】上述したように、電磁ソレノイド14の励
磁・非励磁によって、加振器10の可動台11は回転方
向に振動するとともに上下方向に振動するのであって、
可動台11には処理槽1が結合されているから、加振器
10によって処理槽1を周方向および上下方向に振動さ
せることができる。したがって、電磁ソレノイド14を
励磁すれば、搬送路2の上の被メッキ部材が斜め上向き
の力を受けて浮き上がり、このとき電磁ソレノイド14
を非励磁にすると被メッキ部材は搬送路2の上を転がり
ながら上方に進むのである。ここに、搬送路2は片持ち
になっているから、加振器10による処理槽1の振動に
よって、搬送路2が煽り運動を行うことになり、処理槽
1に入れられた処理液やメッキ液を攪拌することにな
る。ここに、加振器10の振動周期を処理槽1に共振す
るように設定すれば、搬送路2の煽り運動によって処理
槽1の外周側から内周側に向けて強い水流が生じること
になり、被メッキ部材に処理液やメッキ液を十分に接触
させることができるのである。
As described above, the movable base 11 of the vibration exciter 10 vibrates in the rotational direction and in the vertical direction by the excitation / non-excitation of the electromagnetic solenoid 14,
Since the treatment tank 1 is coupled to the movable table 11, the shaker 10 can vibrate the treatment tank 1 in the circumferential direction and the vertical direction. Therefore, when the electromagnetic solenoid 14 is excited, the member to be plated on the conveyance path 2 receives a diagonally upward force and floats up.
When is de-excited, the member to be plated moves upward while rolling on the transport path 2. Here, since the transfer path 2 is cantilevered, the vibration of the processing tank 1 by the shaker 10 causes the transfer path 2 to perform a wobbling motion, so that the processing liquid or plating solution contained in the processing tank 1 The liquid will be stirred. If the vibration cycle of the shaker 10 is set to resonate with the processing tank 1, a strong water flow is generated from the outer peripheral side to the inner peripheral side of the processing tank 1 due to the tilting motion of the transport path 2. The treatment liquid and the plating liquid can be sufficiently brought into contact with the member to be plated.

【0014】上述の構成によれば、搬送路2の内周と陽
極板5との間に被メッキ部材を投入すれば、処理槽1の
底面は中央部が周部よりも突出していることによって、
加振器10での振動に伴って被メッキ部材が処理槽1の
周部に集められ搬送路2に導入されることになる。その
後、処理槽1の振動に伴って被メッキ部材は搬送路2を
上方に移動し、排出口6を通して処理槽1の外部に取り
出されるのである。搬送路2から取り出された被メッキ
部材はガイド8の始端に載り、ガイド8の終端において
次過程の処理槽1に投入されるようになっている。
According to the above-mentioned structure, when the member to be plated is put between the inner periphery of the transport path 2 and the anode plate 5, the central portion of the bottom surface of the processing tank 1 is projected more than the peripheral portion. ,
The members to be plated are gathered in the peripheral portion of the processing tank 1 and introduced into the transport path 2 in accordance with the vibration in the vibrator 10. After that, the member to be plated moves upward in the transport path 2 along with the vibration of the processing tank 1 and is taken out of the processing tank 1 through the discharge port 6. It is plated member that has been removed from the transport path 2 rests beginning of the guide 8, and is introduced into the treatment tank 1 the following process at the end of the guide 8.

【0015】本発明の動作を判りやすくするために、処
理槽1a〜処理槽1fを横方向に配列した状態の図4を
使用し、この図4でその動作を説明する。すなわち処理
槽1aに被メッキ部材を投入すれば、被メッキ部材は清
浄化された後に水洗され、下地膜のメッキおよび水洗、
表面膜のメッキおよび水洗が施されるのであって、この
間は連続処理になるのである。メッキが終了した被メッ
キ部材は温風乾燥部31に導入されて乾燥される。とこ
ろで、この場合では、処理液やメッキ液が外部に排出さ
れて環境を汚染することを防止し、かつ処理液やメッキ
液の消費量を低減するために、バット7aに回収されて
オーバーフローした液体や処理槽1a〜1fからオーバ
ーフローした液体(図4に破線で示す)を回収槽32a
〜32fに回収した後、処理槽1a〜1fに循環させた
り、コンベア7での搬送中の被メッキ部材の予備洗浄に
用いたりしている。すなわち、処理液やメッキ液を用い
る処理槽1a,1c,1eでは、水切りによってバット
7aに回収された処理液やメッキ液を回収槽32a,3
2c,32eに回収し、ポンプ33a,33c,33e
によって処理槽1a,1c,1eに戻すようになってい
る。また、水洗を行う処理槽1b,1d,1fについて
はオーバーフローした水を回収槽32b,32d,32
fに回収して水洗前のコンベア7による搬送中での予備
水洗に用いるようにポンプ33b,33d,33fでく
み上げるようになっている。また、回収槽32a〜32
fに回収された液体は同種の液体ごとに排水処理装置3
4a〜34cに通されてイオン交換によって純度の高い
水を生成し、排水処理装置34a〜34cで生成された
水は、ポンプ33g〜33iによってくみ上げられて水
洗後のコンベア7による搬送中での水洗に用いられる。
このように、各液体を循環させて利用し、かつイオン交
換によって純化しているから、外部に処理液やメッキ液
が排出されることがなく、環境の汚染を防止することが
できる。
In order to make the operation of the present invention easier to understand,
FIG. 4 showing a state in which the processing tank 1a to the processing tank 1f are arranged in the lateral direction.
The operation will be described with reference to FIG. That is, when the member to be plated is put into the processing tank 1a, the member to be plated is cleaned and then washed with water, and the undercoat film is plated and washed with water.
The surface film is plated and washed with water, and during this period, continuous processing is performed. The plated member that has been plated is introduced into the warm air drying unit 31 and dried. By the way, in this case , in order to prevent the processing liquid or the plating liquid from being discharged to the outside and contaminate the environment, and to reduce the consumption of the processing liquid or the plating liquid, the liquid which is collected in the vat 7a and overflows. And the liquid (shown by the broken line in FIG. 4) overflowing from the processing tanks 1a to 1f is collected in the recovery tank 32a
After being collected in ~ 32f, they are circulated in the processing tanks 1a to 1f, or used for preliminary cleaning of members to be plated while being conveyed by the conveyor 7. That is, in the processing tanks 1a, 1c, and 1e that use the processing liquid or the plating liquid, the processing liquid or the plating liquid collected in the bat 7a by draining is collected in the collection tanks 32a, 3e.
2c, 32e, pumps 33a, 33c, 33e
Is to be returned to the processing tanks 1a, 1c, 1e. Further, regarding the treatment tanks 1b, 1d, 1f for washing with water, overflowed water is collected in the recovery tanks 32b, 32d, 32.
Pumps 33b, 33d, and 33f are used for pumping so that they can be collected in f and used for preliminary water washing while being conveyed by the conveyor 7 before water washing. In addition, the recovery tanks 32a to 32
The liquids collected in f are drainage treatment devices 3 for each liquid of the same type.
4a to 34c to generate high-purity water by ion exchange, and the water generated in the wastewater treatment devices 34a to 34c is pumped up by pumps 33g to 33i and washed with water after being washed by the conveyor 7. Used for.
As described above, since each liquid is circulated and used and is purified by ion exchange, the processing liquid and the plating liquid are not discharged to the outside, and environmental pollution can be prevented. can Ru.

【0016】上記の図4に示す構成では、メッキを行う
処理槽1c,1eにおいて、陰極3を線状に形成した例
を示したが、陰極3を点状に形成し搬送路2の全長に亙
って列設してもよい。また、この例では、電気メッキの
例を示したが、陰極3や陽極板5を設けずに、メッキ液
を無電解メッキ用に調製して無電解メッキを行うように
してもよい。この場合も、搬送路2の煽り運動によって
被メッキ部材とメッキ液とを十分に接触させることがで
きるとともに、被メッキ部材が搬送路2の上で転がりな
がら移動するから、メッキによる膜を効率よくかつ均一
に形成することができるのである。
In the structure shown in FIG. 4 , the cathode 3 is linearly formed in the plating treatment tanks 1c and 1e. You may line up in a row. Further, in this example, an example of electroplating is shown, but the plating solution may be prepared for electroless plating and electroless plating may be performed without providing the cathode 3 and the anode plate 5. Also in this case, the member to be plated and the plating solution can be sufficiently brought into contact with each other by the tilting motion of the transport path 2, and the member to be plated moves while rolling on the transport path 2, so that the film formed by plating can be efficiently used. And it can be formed uniformly.

【0017】[0017]

【0018】各処理槽1a〜1dについては、内部に螺
旋状の搬送路2を備える。また、各処理槽1a〜1dか
ら突出した搬送路2の上端部の下方にはガイド8が配設
される。ガイド8は、上の処理槽1a〜1cから落下し
た被メッキ部材を受けて下の処理槽1b〜1dに投入す
ることができる形状に形成されている。すなわち、ガ
ド8を用いることによって、各処理槽1a〜1cから次
過程に被メッキ部材を搬送することができる。
[0018] For each processing tank 1a~1d comprises a helical conveying path 2 to the inner part. A guide 8 is arranged below the upper end of the transport path 2 protruding from each of the processing tanks 1a to 1d. The guide 8 is formed in a shape capable of receiving a member to be plated dropped from the upper processing tanks 1a to 1c and putting it into the lower processing tanks 1b to 1d. That is, by using the gas Lee <br/> de 8, Ru can be from the processing tank 1a~1c conveying the plating member to the next process.

【0019】ところで、各処理槽1a〜1dの中央部に
は連結筒9が一体に形成され、連結筒9には管状の1本
の振動ロッド19が上下方向に貫通されている。振動ロ
ッド19の下端部には加振器10の可動体11が結合さ
れ、したがって、加振器11による振動を振動ロッド1
9を介して各処理槽1a〜1dに伝達できるようになっ
ている。すなわち、1つの加振器10によって4個の処
理槽1a〜1dを同時に振動させることができるもの
で、構成が簡単になっている。また、各処理槽1a〜1
dを上下方向に配列しているから、設置面積が小さくな
るという利点がある。
By the way, a connecting cylinder 9 is integrally formed in the central portion of each of the processing tanks 1a to 1d, and a single vibrating rod 19 having a tubular shape is vertically penetrated through the connecting cylinder 9. The movable body 11 of the vibration exciter 10 is coupled to the lower end portion of the vibrating rod 19, so that the vibration of the vibrating vibrator 11 is transmitted to the vibrating rod 1.
It can be transmitted to each of the processing tanks 1a to 1d via the line 9. That is, the one shaker 10 can simultaneously vibrate the four processing tanks 1a to 1d.
And the configuration is simple. Moreover, each processing tank 1a-1
Since d is arranged vertically, there is an advantage that the installation area is small.

【0020】[0020]

【発明の効果】本発明は上述のように、各過程で用いる
処理槽を円筒状に形成して内部に螺旋状の搬送路を形成
するとともに、処理槽を加振器により周方向および上下
方向に振動させ、被メッキ部材を搬送路に沿って上向き
に移動させるので、被メッキ部材をバッチ処理ではなく
連続処理で処理することができるという効果を奏する。
すなわち、バッチ処理に比較すれば、被メッキ部材の個
数が少ない場合でもコストの増加がなく、多品種を少量
生産する場合でもコスト増が生じないという利点があ
る。また、処理槽は加振器によって振動されるのであっ
て、バレルを回転させたり揺動させたりする別途の手段
を用いる必要がなく、しかも、バレルが存在しないか
ら、被メッキ部材と処理槽内の液との接触効率を高める
ことができるという利点があり、さらに、バレル内で被
メッキ部材を回転させたり揺動させたりする場合に比較
して、被メッキ部材同士の衝突が少なくなって被メッキ
部材の変形が少ないという利点もある。さらに、処理槽
に投入した被メッキ部材を処理槽の中の液体を流出させ
ることなく取り出すことができるのであって、従来構成
のようにバレルに処理槽内の液体が付着して外部に液体
が持ち出されることがなく、バレルを用いる場合に比較
して処理液やメッキ液の消耗量が大幅に減少するという
利点がある。また、処理槽からの処理液やメッキ液の流
出量が減少することによって、環境への影響を軽減する
ことができるという効果もある。
As described above, according to the present invention, the processing tank used in each process is formed into a cylindrical shape to form a spiral transfer path inside, and the processing tank is circumferentially and vertically moved by a vibrator. Since the member to be plated is moved upward along the transport path by vibrating the plate, the member to be plated can be processed by continuous processing instead of batch processing.
That is, compared with the batch processing, there is an advantage that the cost does not increase even when the number of members to be plated is small, and the cost does not increase even when a large number of various kinds of products are produced. Further, since the processing tank is vibrated by the vibrator, there is no need to use a separate means for rotating or swinging the barrel, and since there is no barrel, the member to be plated and the processing tank This has the advantage of increasing the efficiency of contact with the liquid of the plating solution. Furthermore, compared to the case of rotating or rocking the plating target member in the barrel, collisions between the plating target members are reduced and There is also the advantage that the deformation of the plated member is small. Further, the member to be plated placed in the processing tank can be taken out without causing the liquid in the processing tank to flow out. There is an advantage that the consumption amount of the processing liquid and the plating liquid is significantly reduced as compared with the case where the barrel is used without being taken out. Further, there is also an effect that the influence on the environment can be reduced by reducing the outflow amount of the treatment liquid or the plating liquid from the treatment tank.

【0021】本発明では、各処理槽が上下方向に配列さ
れるから、設置面積を小さくすることが可能であり、し
かも加振器からの振動を1本の振動ロッドによって各処
理槽に伝達しているから、加振器を共用して設備コスト
を低減できるという利点がある。また、各処理槽から落
下する被メッキ部材をガイドで受けて次過程のメッキ槽
に投入するから、処理槽の間で被メッキ部材を搬送する
装置が不要であり、設備コストを一層低減できるという
効果がある。
In the present invention, since the processing tanks are arranged in the vertical direction, the installation area can be reduced, and the vibration from the exciter is transmitted to each processing tank by one vibrating rod. Therefore, there is an advantage that equipment cost can be reduced by sharing the vibration exciter. Further, since the member to be plated falling from each processing tank is received by the guide and put into the plating tank in the next process, an apparatus for conveying the member to be plated between the processing tanks is not required, and the facility cost can be further reduced. effective.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す全体の構成の縦断面図
ある。
FIG. 1 is a vertical cross-sectional view of the overall configuration showing an embodiment of the present invention .

【図2】本発明の実施例のメッキ処理に用いる処理槽を
示し、(a)は平面図、(b)は縦断面図である。
2A and 2B show a treatment tank used for a plating treatment according to an embodiment of the present invention, in which FIG. 2A is a plan view and FIG. 2B is a vertical sectional view.

【図3】加振器を示し、(a)は平面図、(b)は側面
図である。
3A and 3B show a vibration exciter, in which FIG. 3A is a plan view and FIG. 3B is a side view.

【図4】複数個の処理槽を横方向に配列した場合の動作
説明図である。
[Fig. 4] Operation when a plurality of processing tanks are horizontally arranged
FIG .

【図5】従来例を示す概略構成図である。FIG. 5 is a schematic configuration diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1 処理槽 1a〜1 処理槽 2 搬送路 3 陰極 4 陽極保持板 5 陽極板 6 排出口 7 コンベア 8 ガイド 10 加振器 19 振動ロッド1 treatment tank 1A~1 d treatment vessel 2 carrying path 3 cathode 4 anode holding plate 5 the anode plate 6 outlet 7 conveyor 8 Guide 10 vibrator 19 vibrating rod

フロントページの続き (72)発明者 柘植 久司 大阪府門真市大字門真1048番地松下電工株 式会社内 (56)参考文献 特開 昭60−114597(JP,A) 特開 昭58−100698(JP,A) 特開 昭59−145789(JP,A)Front page continuation (72) Inventor Koji Tsuge 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (56) Reference JP 60-114597 (JP, A) JP 58-100698 (JP, JP, A) JP-A-59-145789 (JP, A)

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 被メッキ部材を処理液によって清浄化す
る過程、処理液を水洗する過程、清浄化された被メッキ
部材をメッキ液に浸漬してメッキによる膜を生成する過
程、メッキ液を水洗する過程を含むメッキ処理に用いる
連続メッキシステムであって、各過程ごとの液体を入れ
る複数の処理槽が上下方向に配列され、各処理槽は上面
が開口した円筒状に形成されて中心線が上下方向になる
ように配置され、各処理槽の内周面には被メッキ部材が
載置される螺旋状の搬送路が固着され、被メッキ部材が
搬送路に沿って上昇方向に移動するように処理槽に対し
て上下方向および周方向の振動を与える1つの加振器が
各処理槽を連結する1本の振動ロッドを介して各処理槽
に結合され、各処理槽の搬送路の上端部は処理槽から突
出していて、各過程の処理槽の搬送路の上端部から排出
されて落下する被メッキ部材を受けて次過程の処理槽内
に投入するガイドが設けられて成ることを特徴とする
続メッキシステム。
1. A member to be plated is cleaned with a treatment liquid.
Process, washing process solution with water, cleaned plating
The component is immersed in the plating solution to form a film by plating.
Used for plating process including washing the plating solution with water
It is a continuous plating system, in which liquid for each process is added.
Multiple processing tanks are arranged vertically, and each processing tank is on the top
Is formed into a cylindrical shape with an opening, and the center line is in the vertical direction
The parts to be plated are placed on the inner peripheral surface of each processing tank.
The spiral transport path to be placed is fixed,
For the processing tank to move upward along the transport path
One vibrator that gives vertical and circumferential vibrations
Each processing tank via one vibrating rod connecting each processing tank
The upper end of the transport path of each processing tank projects from the processing tank.
Out, and discharge from the upper end of the transport path of the processing tank in each process
In the processing tank of the next process after receiving the plated member that is dropped
A continuous plating system , characterized in that it is provided with a guide to be thrown into .
JP4265160A 1992-10-02 1992-10-02 Continuous plating system Expired - Lifetime JPH0832967B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4265160A JPH0832967B2 (en) 1992-10-02 1992-10-02 Continuous plating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4265160A JPH0832967B2 (en) 1992-10-02 1992-10-02 Continuous plating system

Publications (2)

Publication Number Publication Date
JPH06116798A JPH06116798A (en) 1994-04-26
JPH0832967B2 true JPH0832967B2 (en) 1996-03-29

Family

ID=17413455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4265160A Expired - Lifetime JPH0832967B2 (en) 1992-10-02 1992-10-02 Continuous plating system

Country Status (1)

Country Link
JP (1) JPH0832967B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2544723C1 (en) * 2013-09-02 2015-03-20 Закрытое акционерное общество "Климовский специализированный патронный завод" Line for chemical processing of components and drum for it

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS592759B2 (en) * 1981-12-10 1984-01-20 文弥 後藤 Plating processing equipment
JPS59145789A (en) * 1983-02-08 1984-08-21 Sahei Wazawa Continuous surface treating device for small parts
JPS60114597A (en) * 1983-11-28 1985-06-21 Masayuki Otsuki Method and device for vibration stirring type composite plating

Also Published As

Publication number Publication date
JPH06116798A (en) 1994-04-26

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