CN1161501C - Electroplating equipment - Google Patents
Electroplating equipment Download PDFInfo
- Publication number
- CN1161501C CN1161501C CNB001345443A CN00134544A CN1161501C CN 1161501 C CN1161501 C CN 1161501C CN B001345443 A CNB001345443 A CN B001345443A CN 00134544 A CN00134544 A CN 00134544A CN 1161501 C CN1161501 C CN 1161501C
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- web plate
- container
- equipment
- electroplated component
- component according
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- 238000009713 electroplating Methods 0.000 title abstract description 45
- 238000007747 plating Methods 0.000 claims description 27
- 239000008151 electrolyte solution Substances 0.000 claims description 24
- 238000003756 stirring Methods 0.000 claims description 23
- 239000004020 conductor Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 8
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 230000000737 periodic effect Effects 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- 239000010405 anode material Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 239000011133 lead Substances 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 239000011135 tin Substances 0.000 claims 1
- 239000003792 electrolyte Substances 0.000 abstract description 8
- 229910052751 metal Inorganic materials 0.000 description 9
- 239000002184 metal Substances 0.000 description 9
- 239000000243 solution Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000012634 fragment Substances 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000000354 decomposition reaction Methods 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 238000007634 remodeling Methods 0.000 description 1
- 239000003351 stiffener Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The present invention relates to an apparatus for electroplating small parts, which comprises an electroplating pond, a container and a conductive net as a bottom surface, wherein the electroplating pond is used for containing electrolyte and electroplating anodes; the container is at least provided with a netted part chamber for placing parts to be electroplated; the parts are arranged on the conductive net; the conductive net is suitable for being connected with a negative electrode of a power supply as cathode. A pump circulates the newly ionized electrolyte to the part chamber and guides electrolyte flow to turn the parts in the part chamber periodically. Then, the parts are vibrated by a vibrator. The parts are horizontally placed, so a surface and electrical contact between the parts and the conducting net are maximum when the parts are arranged on the conductive net. In the other embodiments of the present invention, the container can be the structure of a porous plate. The container can also comprise a dividing device which divides the container into a plurality of part chambers for electroplating various parts.
Description
The present invention relates to a kind of electroplating device, specifically, the present invention relates to a kind of equipment that is used to electroplate finding.
In electroplating process, be connected with the negative electrode (negative pole) of direct supply by galvanized part.One has the anode that is used for electroplated metal and is connected with the anode (positive pole) of direct supply.To and be used for electroplated metal by galvanized part and be immersed in the electroplating solution that contains metal ion.Behind power connection, metal ion reduction and the surface that is deposited on part form layer of metal film.Metal on the anode is oxidized and be dissolved in the electroplating solution with the metal ion in the make-up solution.
For the plating of big part, part generally be suspended at support that power cathode links to each other on.Yet, comprise the finding of electronic component for plating, because their sizes are little, quantity is big, is suspended on the support part unpractiaca often.
In order to electroplate finding, various public technologies of the prior art are exactly in order to overcome the little and big restriction of quantity of size.For example, the U.S. 5,490, No. 017 patent disclosure a kind of electro-plating method, wherein finding is placed in the plating frame of a rotation.Another example is 5,817, No. 220 patents of the U.S., and it discloses a kind of rotation cage with a part container.These designs provide shaking of finding, to obtain electroplating evenness preferably.But rotating electroplating has many significant disadvantages.
In the rotating electroplating process, with reference to being proposed in the example, because shape, size and the quality of part are different, part tends to separate with conducting medium, the overall quality decline that this can reduce the galvanized homogeneity of part and make production process as above-mentioned.Electroplating solution that contacts with conducting medium with part or electrolytic solution and most of solution often can not thorough mixing.The surf zone that a typical shortcoming of prior art is a part lacks electroplating evenness.Also have, quite a few metal deposition is consequently used metal and electric power too much, thereby is caused waste on conducting medium.In addition, in some soft metals, in plumbous and tin electroplating,, the rotation in conducting medium electroplates the non-metallic part that extends to part because can causing the scratch of soft metal and make.In addition, the separating and safeguard that being used for this galvanized conducting medium is time-consuming job very of part and conducting medium after the rotating electroplating.
In view of the above-mentioned shortcoming of prior art, wishing has a kind of equipment of electroplating finding, and it is brought up to galvanized homogeneity to greatest extent.Also wish when electroplating finding, to expend minimum anode metal and electric power simultaneously.When electroplating mild alloy belonged to finding, the scratch that reduces this part was with the unnecessary metal deposition of non-metallic part and avoid after electroplating part being separated with conducting medium and safeguarding that the work consuming time that is used for the galvanized conducting medium of drum is very favorable.
The invention provides a kind of electroplating device that is used for finding.This equipment comprises a plating tank (bath) that is used to hold electrolytic solution and galvanic anode, and this anode is connected with the positive charge source.
To be enclosed in the container that can be immersed in the electrolytic solution by galvanized part.This container has at least the cell of a web plate formula to be used for placing will be by galvanized part, and this cell comprises the conduction web plate as its bottom surface portions, and part is placed thereon.This conduction web plate is connected with the negative pole of power supply as negative electrode.
A pump is sent fresh circulation of elecrolyte into the part chamber and is guided electrolyte stream periodically to stir this indoor part.Afterwards, part is set level by vibrator vibration, make when part is placed on the web plate, the surface between part and the web plate with electrically contact maximum.
In an embodiment of the present invention, part stirs and vibrates and can carry out successively.Stirring and can carry out a preset time cycle part is separated from negative electrode, afterwards, then is the action of vibrator and the arrangement of part.In other embodiments of the invention, container can be a perforated plate construction.Also have, container can comprise that a separating device is divided into a plurality of cells with container, is used to electroplate various part, or is used for identical part and makes it to be evenly distributed.
These characteristics of the present invention and other characteristics and advantage will become apparent by the detailed description below in conjunction with accompanying drawing, and these accompanying drawings illustrate feature of the present invention by way of example.
Fig. 1 is the synoptic diagram of electroplating device of the present invention;
Fig. 2 is the decomposition diagram that the present invention is used for placing the representative electroplated discs (tray) of electroplated component;
Fig. 3 is the representative jet synoptic diagram of the present invention, and its supplies with the plating fluid of the part be used to stir the part chamber;
Fig. 4 is the decomposition diagram of the representative embodiment of electroplating device of the present invention.
Electroplating device of the present invention is the equipment of a high-level efficiency and multiduty plating finding, particularly electroplate the equipment of little electronic devices and components, can improve galvanized homogeneity and efficient, and avoid that prior art shows part is scratched or can impaired problem.
The synoptic diagram of this electroplating device as shown in Figure 1.This equipment comprises an electrolytic plating pool or plating tank 10, and it is suitable for storing electroplating solution or electrolytic solution 12.Galvanic anode 14 is immersed in the electrolytic solution 12, to replenish the positively charged ion that electrolytic solution is consumed in electroplating process.
For the ease of handling and removing fragment, anode 14 is placed on the anode frame 16, and anode frame 16 is arranged on the bottom of electrolytic plating pool 10.Anode frame 16 usefulness foraminous electro-conductive materials are made, and its boring ratio anode 14 is little of to prevent that anode from dropping to the bottom of electrolyzer 10.Anode frame 16 is propped the bottom surface 18 of a little higher than electrolyzer 10, so that fragment is fallen the bottom of electrolyzer 10, clears up and remove fragment for convenience, and anode frame 16 can be pulled down from electrolyzer 10.
Anode can be put slightly or in large quantities, decides according to concrete service condition.Can selectively anode be placed in the basket to substitute the placement of perforate anode frame as shown in Figure 1 for replacing bulk or in batch.
The present invention has one to place the container 24 of wanting electroplated component.Container 24 is suitable for being immersed in the electrolytic solution 12 of plating tank 10.As shown in Figure 1, container 24 has the sidewall 33 all around going up the following web plate 32 of 30, one formation container 24 bottom surfaces of web plate and define a part chamber 26, and this part chamber 26 is communicated with plating tank 10 usefulness fluids.Last web plate 30, down web plate 32 is all porose, and these holes are less than the part 28 that is placed on part chamber 26.In order to place or take out part, last web plate 30 can be opened or take off.As a kind of selection, in order to substitute the web plate structure, in the web plate or both can make with porous plate up and down, and the size in the hole of porous plate is less than the size of part.
A kind of electro-conductive material of following web plate 32 usefulness of container 24 is made, it be connected in one with terminal strapping 34 that the negative supply of power supply 22 is connected on.Like this, when making alive, following web plate 32 is finished the plating to the part 28 that contacts with following web plate 32 as negative electrode work.
As a kind of selection, a kind of electrical conductor, for example lead bar or traverse net can be positioned on the following web plate 32, and are connected to give part 28 negative charges with terminal strapping 34.In so optional embodiment, following web plate can be made with non-conducting material.
Electroplating device of the present invention has the pump in order to circular electrolyte 12, to guarantee electroplating device the constant electrolyte supply is arranged.This ionic that has reduced any part in the electroplating device system is concentrated or uneven concentration.
As shown in Figure 1,26 li part 28 is freely to settle (settle) on following web plate 32 in the part chamber.Yet about settling (settlement), some part may not have such as requested formation with negative electrode and is electrically connected so that cause plating.In order to guarantee that part is not covered and can be electrically connected with following web plate 32, pump is suitable for periodically producing jet and stirs part 28, after this, part can be placed.Gentle jet stirs and has significantly reduced that the part that takes place in the prior art is scratched or impaired danger.Each successive jet stirs and the part arrangement on following web plate 32 has subsequently increased the possibility that single part is electrically connected with negative electrode formation separately.Therefore unique distinction of the present invention is the overall quality that has strengthened the galvanized comprehensive homogeneity of single part and improved production process.
Pump of the present invention comprises a pump 38, and it is connected with the lower flow ground of plating tank 10 with a suitable pipe or a pipeline.This pump circulates it from the bottom suction electrolytic solution 12 of plating tank 10 and by electroplating system.Electrolytic solution is back near the anodic, to guarantee to supply with new solion.Pump 38 is delivered to a strainer 40 with electrolytic solution 12, and strainer is removed the fragment in the electrolytic solution and other impurity from the electroplating device system.
Part electrolytic solution 12 is delivered to electrolyzer 10 from strainer 40 again by valve 42.Another part electrolytic solution produces stirring of periodic part 28 through an ejector nozzle (jet) 46.As shown in Figure 1, ejector nozzle be arranged on container following web plate 32 near,, produce jet and stir part 28 to the upper reaches with guiding electrolytic solution.The speed of electrolyte stream exit flow nozzle is regulated by valve 43.In addition, valve 43 can be with a timing register (figure do not show) control, can saidly periodically carry out as top so that fluid stirs.Stir in order further to strengthen whole fluid, nozzle 46 can be driven by the mechanism 45 across the length of the lower cover 32 of part chamber 26.After part was stirred, they can be configured to contact with the indoor electronegative lower cover 32 of part, restart to electroplate.
The present invention has a vibrator 44 that links to each other with container 24, as shown in Figure 1.Follow periodically stir after, part 28 vibrations of Vibration on Start-up device 44 to produce a gentleness, part is set level in this vibration, is placed in down on the web plate 32, thereby provide surface maximum between a part and the following web plate 32 contact, and the efficient of raising electroplating device.
When circulating in the electroplating device system of electrolytic solution is when carrying out continuously, the jet of part chamber stirs and vibrates one after the other and carry out.Preferably, nozzle 46 is pressed the preset time cycling, so that can stir fully, and vibrator effect subsequently.After this, part can be positioned to again and electroplate.
The flow velocity of electrolytic solution and for jet stirs the scope that nozzle moves and the amplitude of vibration can be controlled to reach optimal results.Because the different metal electroplating thickness different with different application needs, the frequency that the part successive stirs and the timed interval, vibration and arrangement subsequently can be controlled to produce the quality of desirable electroplating thickness and production run.
Fig. 2 and Fig. 4 are an alternative embodiment of the invention, wherein, have one to be used to electroplate the container of various parts or to coil 50.Dish 50 comprises 52, one removable upper plates 54 of a framework and a lower plate 58, and they constitute one and are used to place the box or a part chamber of wanting electroplated component.Upper plate 54 and lower plate 58 are porous, and the part chamber and the plating tank 48 that are used for placing part like this are in the fluid connected state.
Be arranged on the separating device 62 between upper plate 54 and the lower plate 58, it becomes a plurality of parts chamber with upper plate with separated by spaces between the lower plate.The a plurality of parts chamber that obtains can be electroplated different parts simultaneously.Separating device 62 prevents that as fence part from moving to another part chamber from a part chamber.Like this, this embodiment of the present invention has a plurality of parts chamber can electroplate different parts simultaneously and without any mixing, does not have time-consuming part mask work after plating is finished simultaneously.This makes and uses electroplating device of the present invention not only to make things convenient for but also efficient that it is very convenient that galvanized different part is carried out in feasible placement and taking-up.
Be similar to the upper plate 30 and the lower plate 32 of container 24 as shown in Figure 1, each can make whole tool foraminous grid structure upper plate 54 and lower plate 58, and the size in its hole is less than the size of part.As shown in Figure 2, as a kind of selection, grid 55 and grid 59 can be installed in respectively and constitute upward a web plate and a following web plate on framework grid 56 and 60 respectively.Terminal strapping 34 is made and be connected in to grid 59 usefulness electro-conductive materials to receive the negative charge from power supply 22 in Fig. 2 and embodiment shown in Figure 4, and the function of grid 59 is negative electrodes of electroplating device like this.As Fig. 2 and shown in Figure 4, dish 50 has the carriage 64 and 66 that upwards promotes, and carriage 64 and 66 is supported on deflector roll 68 and 70, and deflector roll 68 and 70 is on the top of the opposing sidewalls 72 on plating tank 48 both sides and 74.In the time of in coiling 50 electrolytic solution that are immersed in the plating tank 48, dish 50 usefulness deflector rolls suspend downwards.Be similar to embodiment shown in Figure 1, Fig. 2 and embodiment shown in Figure 4 have a vibrator 44, it is connected on the carriage 66 of dish 50, this carriage is connected with vibrator, after periodically being stirred part 28, make the part 28 in dish 50 the single part chamber produce gentle vibration by the jet of ejector nozzle 46.Various vibrators can have been bought from the market.Being used for suitable vibrator of the present invention can be the vibrative eccentric stiffener of electric motor driving.
In the embodiment shown in fig. 4, nozzle 46 is arranged to that a plurality of jet pipes (nozzle) are arranged on the header 47, header be arranged in dish 50 below make and produce electrolyte stream upwards, be used for thoroughly stirring part.Header 47 itself is moved mechanism 45 again and drives, and travel mechanism 45 is suitable for moving horizontally across the length of dish 50 is round.Travel mechanism can buy from the market.Therefore its selection is not just described in detail at this.
From foregoing description as can be known, the present invention is a kind of efficient and multiduty equipment that is used to electroplate finding, can improve galvanized homogeneity and efficient and part scratch of avoiding occurring in the prior art or the problem of damaging.
Fairly obvious, the front has illustrated and has described particular form of the present invention, under the situation that does not exceed the spirit and scope of the present invention, can make various remodeling.Therefore, except claim, the present invention is not limited by other.
Claims (15)
1. the equipment of an electroplated component comprises:
I. hold electrolytic solution and the anodic plating tank that is immersed in the electrolytic solution;
Ii. one can be immersed in the plating tank and defines a container of placing the part chamber want electroplated component, and this container has that fluid is communicated with between a plurality of apertures permission plating tanks and the container;
Iii. suitable conduct charges also is arranged to and the contacted negative electrode of the part of part chamber;
Iv. be used for the pump of between plating tank and part chamber mobile electrolytic solution, stir with the jet that produces part;
V. be used for the part vibration is set level, make when part is placed on the web plate, surface between part and the web plate and the vibrator that electrically contacts maximum.
2. the equipment of electroplated component according to claim 1, wherein, anode material is selected from the alloy that tin, lead, nickel, copper, silver, gold and their are formed.
3. the equipment of electroplated component according to claim 1, wherein, negative electrode comprises a conduction web plate that a plurality of holes are arranged, the size in hole is less than the size of part.
4. the equipment of electroplated component according to claim 3, wherein, the conduction web plate constitutes the bottom surface of container.
5. the equipment of electroplated component according to claim 1, wherein, container comprises that a removable web plate, gone up constitutes container bottoms and the following web plate in a plurality of holes less than accessory size arranged and define the sidewall of part chamber.
6. the equipment of electroplated component according to claim 5, wherein, negative electrode comprise one near or as the electrical conductor of web plate down.
7. the equipment of electroplated component according to claim 5, wherein, following web plate is made by electro-conductive material.
8. the equipment of electroplated component according to claim 1, wherein, described pump comprises that one is connected in plating tank and is suitable for the pump that fluid periodically stirs part.
9. the equipment of electroplated component according to claim 1, it also comprises the supply unit that is connected in anode and negative electrode, is used for the plating of part.
10. the equipment of electroplated component according to claim 1, wherein, described pump comprises that also at least one guides electrolytic solution into want electroplated component jet pipe, stirs with the jet that produces part.
11. the equipment of electroplated component according to claim 1, wherein stirring before the part vibration of part carried out.
12. the equipment of electroplated component according to claim 11, it further comprises a timing register, periodically to stir and vibration part.
13. the equipment of an electroplated component comprises:
I. hold electrolytic solution and the anodic plating tank that is immersed in the electrolytic solution;
Ii. one can be immersed in the plating tank and has a plurality of placements to want the container of the part chamber of electroplated component, and this container has that fluid is communicated with between the fair plating tank of a plurality of apertures and the container;
Iii. suitable conduct charges also is arranged to and the contacted negative electrode of the part of part chamber;
Iv. be used for the pump of between plating tank and part chamber mobile electrolytic solution, stir with the periodic jet that produces part.
V. be used for the part vibration is set level, make when part is placed on the web plate, surface between part and the web plate and the vibrator that electrically contacts maximum.
14. the equipment of electroplated component according to claim 13, wherein, container comprise one movably go up web plate, one have a plurality of less than accessory size aperture and constitute the following web plate of the bottom surface of container, the sidewall that defines the part chamber and a separating device that is arranged between web plate and the following web plate and defines a plurality of parts chamber.
15. the equipment of electroplated component according to claim 14, wherein, negative electrode comprise one near or connect the electrical conductor of web plate down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001345443A CN1161501C (en) | 2000-12-11 | 2000-12-11 | Electroplating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001345443A CN1161501C (en) | 2000-12-11 | 2000-12-11 | Electroplating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1357648A CN1357648A (en) | 2002-07-10 |
| CN1161501C true CN1161501C (en) | 2004-08-11 |
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ID=4596267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB001345443A Expired - Fee Related CN1161501C (en) | 2000-12-11 | 2000-12-11 | Electroplating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1161501C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1300384C (en) * | 2003-12-11 | 2007-02-14 | 胡自谦 | Method and apparatus for electroplating |
| CN108914176B (en) * | 2018-09-04 | 2020-10-09 | 马鞍山领瞻机械科技有限公司 | Precision hole brush plating machine tool |
| CN109457283B (en) * | 2018-12-03 | 2021-04-16 | 上海雷迪埃电子有限公司 | Electroplating method for sheet-shaped parts |
| CN111118588B (en) * | 2020-01-13 | 2020-10-16 | 深圳市晟达真空钎焊技术有限公司 | System capable of circularly plating nickel inside liquid cooling plate |
| CN111455440B (en) * | 2020-05-18 | 2021-03-26 | 华福(上海)环保科技有限公司 | Electroplating equipment and electroplating method thereof |
-
2000
- 2000-12-11 CN CNB001345443A patent/CN1161501C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1357648A (en) | 2002-07-10 |
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