JPS60114597A - Method and device for vibration stirring type composite plating - Google Patents

Abstract

PURPOSE:To improve the finishing quality of composite plating and to automate operation by vibrating a plating cell to stir a plating liquid and oscillating and rotating materials to be plated tereby moving upward said materials. CONSTITUTION:A plating cell 1 having a rotary cylindrical shape is oscillated by a vibrator 8 to vibrate and stir a plating liquid and at the same time to place materials 3 to be plated gethering around the plateau-shaped base of the plating cell onto a spiral track 4, thereby moving the materials from the lower to upper part along the spiral direction. The materials 3 are rotated by the track 4 while said materials are subjected to the fine vibration until the materials are arrayed on the track 4 and ascend. The materials 3 are thus uniformly plated and the materials completed of the plating are transferred into a finishing cage 6 on the outside of the cell. If the plating is insufficient, the materials are returned into the cell by the operation of a gate 5 so as to be subjected to the plating again. The plating liquid is circulated between a preliminary vessel 2 and the vessel 1 and the components, temp., etc. thereof are controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to plating technology. Therefore, the present invention relates to a vibratory stirring type thinning plating method and apparatus fK, in which the plating plate in the plating solution is slightly vibrated, moved upward, and rotated, thereby performing composite plating with high efficiency in a good eutectoid state.

゛Recently, in various fields of industrial technology (e.g. industrial machinery, aerospace, 1-coat equipment), conventional plating raw materials such as Shimizu are no longer able to satisfy the requirements for high functionality, such as corrosion resistance, wear resistance, etc.
V and UC are required to have lubricity and heat resistance. Temporary a plating (also called dispersion plating) is
Developed to satisfy all the needs of the world! This is a technology in which non-bathproof fine particles are added to an open-cell electroplating solution or chemical plating solution, uniformly dispersed in a V-V, and the fine particles are eutectoid with the metal matrix on the surface of the object to be plated. While the dispersed fine particles are adsorbed on the surface of the plated object, they are successively precipitated and embedded within the plating film, forming a uniform dispersed phase in the eutectoid matrix. is formed. To give a specific example of such composite plating, the metal matrix for plating is Ca, NircR, Co+Sn*Zn, or an alloy thereof, and the insoluble fine particles to be dispersed have the required functions. Depending on the purpose, SiOx, Ba5o4rTzOze for corrosion resistance, l'i S i Cr A l z Oar B4 C for wear resistance.
+ WC, TLC, and in the case of lubricity, MoS
t t BN, PTFE, nylon, etc. are used.

In composite plating, sometimes particle dispersion composite plating, a large amount of insoluble solid particles are added to the plating solution and eutectoid with the metal matrix on the surface of the object to be plated to form a dispersed composite. As a major premise, it is essential that the particles are uniformly suspended in the plating solution.Generally, the solid particles to be dispersed have a higher specific gravity than the plating solution, so Most of the particles settle due to gravity and accumulate at the bottom of the plating tank.Therefore, to keep the dispersed particles uniformly suspended in the plating solution for a long time, the plating solution must be stirred. For this purpose, various plating solution stirring methods have been proposed so far as listed below.

■ Provera stirring method: A method in which a V-shaped propeller is installed in the plating tank and rotated to stir the entire plating solution.

■Liquid circulation method: A method in which the plating solution is blown up from the upper part of the plating tank using a bonder, and the plating solution is either overflowed from the top of the plating tank or completely suctioned.

■ Air stirring method 2 Air is blown into the plating tank and the plating solution is mixed with 4j? How to stir.

■ Liquid/air mixing method: Mixing air with the plating solution and -C(
How to stir each other.

Great bumper method: A method in which a plate with a large number of holes is moved horizontally in a metal V tank and moved up and down, and the jet of plating liquid blown up from these holes is used to perform dispersion.

■ Up 70-plating method: Plating liquid gold is introduced from the storage tank and poured into the upper part from the bottom of the plating tank, and the upper force is 1.
How to overflow.

In all of these methods, in order to perform composite plating in the middle or upper part of the plating tank, slight stirring is performed to prevent the dispersed particles from settling. However, the dispersion state of the fine particles in Mesoki Sodium is such that the specific gravity of the fine particles is low, so the bottom of the plating tank is inevitably higher in density, so it is inconvenient not to use the lower part of the plating tank. Be rational. In addition, if the object to be plated is left horizontally in the plating solution, the dispersed fine particles will settle in the F direction, so the fine particles will be adsorbed to the top of the object to be plated and will be compounded by the metal matrix. However, no fine particles settle or adsorb on the lower side, so no composite is formed.

Next, if we analyze the conventional plating technology from the perspective of transporting the object to be plated, we can see that the transport method is as follows. The barrel method, in which a large amount of small objects to be plated are placed in a kind of basket and immersed in a plating tank, was particularly popular.

However, with the hooking method, each object to be plated is individually hooked onto a hanging jig, which requires manpower and is inefficient.
In addition, it is unsuitable when the object to be plated is a small item.

In addition, although the barrel method is suitable for large quantities of small objects to be plated, the objects to be plated are easily deformed and the shape and dimensions of the temporary plated objects are approximately 1tjlJ. Yes, and in addition, one roll of plating once inside the barrel must be discharged /z l/-1, J
), it takes +HJ to drain the plating solution, and moreover, a considerable amount of plating solution is taken out of the tank.

With the υ11 machine barrel method, charging for plating is difficult and the final plating speed is slow.

The present invention solves the above-mentioned problems in gilding bales by fc personnel and in transporting the plated products in an integrated manner.
The advanced composite plating method and equipment DFF and R6 were created to solve the problem, and the purpose is to improve the quality of the finish of the plating process, and to improve the plating process itself! 11
b) and stricter work management.

ζ, C1 For this reason, the present invention is designed to assist the plating tank by adding a plating tank and stirring the internal plating solution (1).
! At the same time, the force of this plating 14 vibration caused the object to be plated in the plating solution to be slightly vibrated, moved upward, and rotated, while being discharged from the top of the plating tank along the wall circumference and out of the tank. It is something.

The details of the embodiments of the present invention are shown below with reference to the F1 drawings.
The situation is different.

The drawing is a conceptual illustration showing one embodiment of the present invention. The plating solution in which the insoluble particles to be combined are dispersed is placed in the plating tank 1 and the reserve I ￥12 (7 pieces are placed in the plating tank. It is made of metal in the shape of a rotating body, and the center of the bottom is shaped like a cone or a cone, with the center being shallow and the periphery gradually becoming deeper and more plateau-like.

Therefore, the object to be plated 3 placed in the plating solution automatically falls through the plating solution, reaches the raised bottom in the form of a plateau, and then gradually falls on the slope and accumulates around the bottom. .

Further, a helical track 4 is provided on the inner circumferential wall of the plating tank 1 from the bottom toward the upper gIS. This track 4 is a path in which the object 3 to be plated moves upward as the plating tank 1 vibrates 3 times later, and gradually forms a helical path with a right turn 9 or a left turn p on the upper inner circumferential wall of the plating tank 1. It is shaped so that it rolls up. In the illustrated embodiment, the track 4 is attached to the plating tank 1, but the plating tank 1 itself may be formed in the shape of the track 4 (C).

, Track 4 J) A gate 5 is provided at the middle corner (it can be done at night or outside A). This gate 5t, it's coming up north 4C from track 4 Kamikane 1 Borumu 1z.
l Plating proboscis 3 ke Remove the plating tank l while it is still in progress and proceed ('!t Finish the plating 3 9 +; Position where the horn is exposed to the retainer 6 and prevent the progress of the Saka plating proboscis 3.
Then, the plating 1>/J 3 k + '4 plating qX
I worked on the position to return tC in the h l/υ plating solution! ? "T fj and C ril. Slwa et al. That gate 5 & yo.
Pinch hitter plating was completed/and it was recognized that it was decided by IL Ruage B. Determine the amount and determine the plating conditions (separately as required).
6. ) This is the f-wave plating 1 and 3 on track 4.
The progress is progressing as it is, and if you are threatening to do so, you will be exposed to Meggi haze: 3 gold-plated cards must be used at the gate to return to VC. No-gate control means tCj: Position 7 has been changed to 17J.

If the plating tank l・υF force Kv is +1 Ilt to the pupil mover 8 (with a magnet, . . . ) and the sales copying mover 8, it will be excited and a total vibration will be generated. 111 means consisting of ilI, rhyme-'/r 9 are provided.

The vibrator 8 of this vibration means vibrates the plating tank 1' containing the plating solution clockwise or counterclockwise, thereby stirring the plating solution, dispersing fine particles with a large specific gravity, and causing them to settle. The object to be plated 3 gathered near the track 4 at the highest position is placed on the track 4 sequentially, and the object 3 is subjected to slight vibration and rotation according to the helical track 4. Move upward on track 4 from the bottom to the top. The specifications such as the frequency and width of the vibration caused by the vibration means can be adjusted by the vibration Ia source circuit 941.

Pole 1Ov'i of the plating power supply is provided at the upper center of plating #Il. Further, the ei 411 is branched into an appropriate number so as to contact the broken plating object 3 on the track 4 at any time. This is to prevent the plating thickness from becoming uneven due to a drop in the plating pressure and the amount of current being applied, and by making the plating as even as possible to achieve uniform plating thickness. I'm going to try it, so I'm going to try it.

Pre-υHf and tank 2 VJ are provided separately from plating tank 1.
,, the plating solution can be circulated between the plating tank l (a
It is said to be constructed. However, a delivery pump 13 is provided in the middle of the delivery pipe 12, and a return plumber 4 returns the plating group from the plating tank l using the siphon principle.
There is. The pre-tank 2 is provided with a stirring fan 15 and a motor 16 to constantly uniformize the plating solution.

Further, in order to adjust the temperature of the plating solution, a temperature control means 17 consisting of a heater or a cooler is arranged in parallel. The reason why such a reserve 1 and 2 is separately provided is that the plating tank 1 is shaken by the mouth shaking means. ffb, the vibrating plating tank l is filled with only the minimum amount of plating solution required at one time, and the components (trix and insoluble particulates) are kept in the plating tank l at a steady state. In order to achieve good plating quality, the plating solution is circulated from the preliminary tank 2, and the temperature and other factors are also controlled.

Next, when the operation of the above embodiment is carried out, the plating solution is agitated in a first 8-circular manner by the vibration stage of the vibrator 8 or the like connected to the plating bath l. According to this, the insoluble fine particles are uniformly dispersed and a good turbid state is achieved. Also,〃
By shaking the plating 1 liter in the old means, the material to be plated 3 that fell onto the bottom of the flat plated fgl and gathered around the bottom was placed on a spiral track 4 and (This winding direction and the direction of vibration by the vibrator 8 should be the same and fully open.) The plating tank l moves upward from the bottom to the top. This upper 4i8! When Ji/I
The corrugated object 3 is simultaneously subjected to slight vibrations and rotated by the helical track 4. Therefore, the directionality of the 3Qζ shape of the plated object is exactly the same as that of the medaka, i? The EAf+ matrix and the insoluble fine particles to be combined are evenly distributed over the entire surface of each object 3 to be plated. Therefore, no matter which object 3 to be plated is taken, the composite plating performance is extremely good.In addition, the plating object 3 and the plating object 3 can be shaken, rotated, and moved upward. Since the countermovement is constantly performed, the concentration of g near the plated object 3 becomes thinner even during the energization time.

In other words, it is the same as always changing the flow rate of the plating solution, thereby increasing the Ju1 volume for plating and speeding up the plating work.

Since the cross plating *3 & yo moves upward while being aligned on the tank 4, it passes relatively evenly from the lower part to the upper part of the threshold plating tank 1 at one time. At that time, rc% deformation and W
By simply transferring the broken plated object 3 to the plating bath 1 without having to receive the plating object 3, transportation of the object 3 to be plated is completely simplified.

The objects 3 to be plated that have reached the C gate 4 in the aligned state are transferred directly to the finisher 1516 outside the tank when it is recognized that the plating has been completed. If you have not done so, you will be returned to the tank, and 1
1 plated.

The preliminary tank 2 has a capacity of 13 tons [as mentioned above], which minimizes the load on the old installed means, facilitates the transmission of the plating tank 1, and always maintains optimal control (components, temperature, uniformity, etc.).
(raw, etc.) plating solution is circulated throughout the entire plating equipment.

As described above, according to the vibratory agitation type composite plating method and apparatus according to the present invention, first of all, as an effect in plating the work piece, the plating solution is stirred by the 7 cavities, so that the insoluble particulates are removed. Since the fractional state is tree-formed and the plating solution is always in a state of fungus, the conditions for plating are good.

Furthermore, since the object to be plated is subject to slight vibrations, upward movement, and rotation, there is no adhesion of the plating material, and good finishing quality can be achieved. It can be sped up. On the other hand, from the viewpoint of work efficiency, mainly transporting the objects to be plated, composite plating work can be automated without any jigs or barrels, and it is also possible to automate complex plating work without the need for jigs or barrels. It is suitable for plating objects with great precision, and it is also suitable for plating objects with great precision, and it can also be used to improve the quality of the work by strictly performing work procedures such as ga-do-gan, shi-i-kei, plating pressure, gate market control, etc. Quality grip A plating can be fully realized.

Note that although the above explanation of VCβ has been made exclusively for multi-layer plating, the original+Ji method and apparatus can also be applied to ordinary steam plating and IT screen degreasing. In addition, electroless plating, organic solvent degreasing, and history include degreasing, pickling, neutralization, and water washing during bottom surface treatment. It can also be applied to pretreatment J1L and post-treatments such as water washing, chromate treatment, coloring, and neutralization.

[Brief explanation of the drawing]

The drawings are from book J61. This is a conceptual explanatory diagram showing one embodiment of IIj. 1 ~ Plating 1°d 2 ~ Preliminary tank: 3 ~ vl, plated product 4 ~ Track 5 ~ Gate 7 ~ Gate control 1111 means 8 ~ I/l+I+ child 9 ~ Vibration power supply circuit 1l-e1 12 ~ Delivery distribution σ 13~ Delivery bonder 14~ Return distribution a 15~ Fan 17~ Temperature control means

Claims (1)

[Claims] 1. The plating bath containing the plating solution is vibrated to remove the plating solution. i2 Rice to be plated while stirring # +j
t-stirring double-type composite plating method, the center of the bottom of a rotary plating tank is raised in the shape of a plateau, and a helical track is provided from the bottom to the top of the inner circumferential wall, and the plating 41t is covered by the vibrating force. 2. A vibratory agitation gold plating method according to claim 1, wherein the plated material is placed on said truck and moved in an upward direction eζ while being vibrated and rotated to perform plating. 3. A vibrating stirring type composite plating device that includes a plating device containing a plating solution and a vibrating means that vibrates the entire plating solution to stir the plating solution. 4. Claim 3, wherein the center of the bottom of the plating tank is raised in the shape of a plateau, and a helical track is provided extending from the bottom of the peripheral wall part to part J:. Vibration stirring type bonding plating equipment. 5. A patent in which the truck is equipped with a gate that can switch between the position where the plated material is discharged to the outside of the plating tank and the position where the material to be plated is returned to the plating tank. A vibration agitation type composite plating apparatus according to claim 4. 6. The e-pole of the plating pole 1 is branched into an appropriate number so as to be in contact with the object to be plated on the track at any time. 7. The vibration agitation charge plating apparatus according to claim 4.7. Claim 4, further comprising a preliminary tank in which a plating solution can be circulated between the plating tank and the plating tank.
ikR excitation type double plating equipment installed in PI.