JPS58100698A - Plating device - Google Patents

Abstract

PURPOSE:To permit plating and removing of materials to be plated at a high speed by containing a vessel for materials to be plated of an inverted circular truncated cone shape consisting of a water permeable non-conductor which is opened at the top end and is formed with spiral passages and cathodes in the inside wall rotatably in a plating cell. CONSTITUTION:Materials to be plated are passed through a hopper 9 and a passage 7 and are discharged through a supply port 7a into the bottom of a vessel 3. On the other hand, when a revolving shaft 4 and the vessel 3 fixed to the shaft 4 by means of a flange part 5 is rotated, the plating soln. in a plating bath cell 1 is supplied through intake ports 8b- to a replenishing passage 8 and is released through discharge ports 8a toward the upper side part in the vessel 3. The materials to be painted ascend in the direction opposite from the rotattion in spiral passages 11 and the plating soln. in the vessel 3 is discharged through perforated holes 3b-. Thereupon, electricity is conducted between the anodes 2, 2 and the cathodes 10 along the inside wall of the vessel 3 to plate the ascending materials to be plated. The materials to be plated pass through a drain board 13 from the top end part 3a and are colledcted in a groove part 14b beyond the guiding part 14a.

Description

[Detailed description of the invention] This invention can plate objects at high speed.

This invention relates to a tightening processing device that can be taken out.

With advances in electroplating technology, it is possible to increase the electrodeposition speed significantly compared to a static bath by increasing the flow rate to the plating bath and keeping the flow rate high near the anode and depot surfaces. It became. For example, the required plating film thickness, which can be obtained in 1 minute in a conventional blocking bath, can be obtained in 73 seconds in a plating bath with a flow rate as described above.

However, even if the required plating thickness is formed at such a high speed, unless a suitable device is developed to take out the plating product from the plating bath.

The effects of high-speed plating processing are not fully utilized.

Conventionally, for this reason, devices have been developed and prototyped that pick out the plating processed at high speed in the plating bath from the bathtub at a corresponding high speed. It is not possible to take out the plating product from the bath at a speed that can adapt to the current speed, and the effects of high-speed plating processing are not fully utilized.

In view of the above circumstances, DR Ming was researched and developed for the purpose of developing a plating processing device that can be adapted to high-speed plating processing. having an inner wall that then decreases in diameter;
A container of the object to be plated made of a water-permeable nonconductor with a spiral passage and a cathode provided on the inner wall is housed in a plating bath, and a rotating shaft of the container of the object to be plated is provided vertically in the plating bath. Furthermore, the outlet of the plating solution tank supply pipe is made to face inside the object to be plated container.

Hereinafter, the present invention will be explained based on the illustrated embodiment.
, 2 is installed in the bathtub.

3#'i An object container to be plated, which is made of a nonconducting material made of plastic and has an open top end and a diameter that decreases toward the bottom end, such as an inverted truncated conical shape, a parabolic shape, or a mouth shape. 4. A plating bath. 41i1 is a co-rotating axis of the plating object container 3 vertically installed in the interior.

The container 3 is housed in the plating bath 1 so that the open upper end 3α is located slightly above the liquid level, and a large number of water permeable holes 54. ...Gold formation.

The rotating shaft 4 is passed through the center thereof, and a flange portion 5 for fixing the rotating shaft 4 to the container 3 is provided in the penetrating portion, and the lower end of the rotating shaft 4 is rotatable at the bottom of the plating bath 1. A bearing portion 6 is provided to support the structure.

In this embodiment, the rotor 114 is entirely hollow, with a passage 7 for objects to be plated in its upper part and a supply passage 8 for plating liquid in its lower part.
A plating object supplying lower α facing the bottom of the plating object container 6 is provided at the lower end of the plating object passage 7, and the upper end of the plating solution supply path 8 projects obliquely upward into the container 5173. Tametsu 1! A liquid discharge port 8a is formed, and plating liquid intake ports 84, .

In addition, 1 mask! A supply hopper 9 for the material to be plated is provided at the upper end of the material passage 7, and the material to be plated is passed through the passage 7 to the bottom center of the container 3 through the supply lower A. Configure it to be supplied nearby.

On the other hand, the inner wall surface of the container 5 has a diameter, for example. r-6 round stick of compassion 1
0 forms a linear IIIA passageway 11 extending from the bottom of the container 3 to the upper end 3α in a direction opposite to the direction of rotation of the rotating shaft 4.

In this embodiment, the round bar 10 is made of a conductor such as copper and serves as a cathode; however, the round bar 1n is made of a non-conductor such as plastic, and a conductor is electrodeposited on its lower surface to serve as a cathode. Alternatively, a cathode may be separately provided on the bottom surface of the round bar 10. Furthermore, the passage 7 is a round bar 10
However, the structure is not limited to this, and may be formed of a plate-shaped body.

Furthermore, in this embodiment, the lower end K of the round bar 10 constituting the cathode
Connect the IJ-do wire 12.

On the other hand, the upper end 3a of the reactor is made into a somewhat gently tapered surface, and the lower end of the annular draining plate 15 provided in a tapered shape is exposed below the upper end 3a, and the upper outer periphery of the plating bath 1 is plated. A product removal guide 14 is provided. The guide 1
4 has a protruding guide portion 14α on the inner circumferential side and a flat groove portion 14J on the outer circumferential side, and the inner edge of the guide portion 14α faces below the upper end of the draining plate 13.

Note that 15 is a motor for driving the rotating shaft 4 of the container to be plated, and in this embodiment, the motor 15 is controlled by a computer 16 and uses a small variable speed motor, and the driving force of the motor is driven by a belt. 17 and a pulley 18 to the rotating shaft 4.

Next, to explain the plating treatment method using the plating treatment apparatus according to the present invention, the objects to be plated, such as bolts and nuts, are
Quantitative division using a device such as Patent No. 449552,
It is pretreated and supplied to the hopper 9 of this device, and then further passed through the passage 7.
It passes through the supply lower A and is discharged to the bottom of the container 3.

On the other hand, the container 3 fixed to the rotary shaft 4 by the interlocking shaft 4 and the flange portion 5 rotates at a preset speed of the motor 15. With this rotation, the plating solution in the plating bath 1 is supplied to the supply path 8 provided inside the rotating shaft 4 through the intake port 84, and then passes through the supply path 8 and exits from the discharge port 8a. It is released towards the upper side of the container 3.

Further, the object to be plated supplied into the container s by the centrifugal force of the rotation of the container 3 ascends in a direction opposite to the rotation in a spiral passage 11 formed along the inner wall of the container, and The plating solution is discharged into the plating bath 1 through the water permeable holes 34, . . . by rotational centrifugal force, and the plating bath W!
The flow rate of the plating solution is generated toward 1.

Therefore, if KAm is applied between the anode 2.2 and the cathode 10 provided along the inner wall of the container 3, the object to be plated rising in the spiral passage 11 will be quickly transferred to the plating processing plant in the plating solution at a flow rate. Further, due to rotational centrifugal force, the liquid is passed through the drain plate 13 from the upper end 3a of the container 3, which is the terminal end of the spiral passage 11, and is collected in the groove 144 over the raised guide @51Aa.

Therefore, according to the present invention, the object to be plated can be rapidly plated in the plating solution at a flow rate, and the product can be transferred to the plating bath 1 according to the plating processing speed.
It can be taken out from.

Note that the speed at which the product is removed from the plating bath 1 is related to the rotational speed of the container 3, but in this embodiment, the rotational speed of the variable speed motor 15 is controlled by the computer 16 to correspond to the rotational speed of the container 5. I'm letting you do it.

In addition, it is preferable that the object container 3 to be plated be of a shallow inverted truncated cone shape, a parabolic shape, or a mouth shape.If it is a deep inverted truncated cone shape, a paraboloid shape, or a mouth shape, the product can be taken out at high speed. Rotation is required, and there is a risk that the plating solution will run out in the container 3 due to centrifugal force due to high speed rotation.

In order to circulate and replenish the plating solution into the container 3, in this embodiment, the lower part of the rotary shaft 4 is made hollow to form a plating solution supply path 8, and its upper part is inserted diagonally upward into the container 3. Although the plating solution discharge port 8Ix is formed by protruding, the rotating shaft 4
Separately, a plating solution supply pipe may be provided, and the plating solution may be supplied into the container 5 through a pump.

Furthermore, in this embodiment, the upper part of the rotating shaft 4 is hollow to form the passage 7 for the plating object, but the object to be plated may also be supplied to the container 3 separately from the rotating shaft 4.

Note that in order to continuously rotate the container 3, the rotating shaft 4 is
It is preferable to provide a hand wheel or the like.

Further, in this embodiment, the container 3 is used with the water permeable holes 34, .

[Brief explanation of the drawing]

The drawing is a partially cutaway side view showing an embodiment of the present invention. In the figure, 1 is a plating bathtub, 3 is a container for plating objects, 4 is a rotating shaft, 8 plating and 18 liquid supply channels, and 11 is a spiral passage Patent applicant Fumiya Goto 51

Claims (1)

[Claims] The inner diameter is open at the upper end and decreases in diameter toward the lower end.
A container to be plated made of a water-permeable nonconductor with a spiral passage and a tube formed in the inner wall is housed in the plating bath, and the container for the plated material is placed in the plating bath. axis of rotation? A plating processing apparatus characterized in that a plating solution supply pipe has a discharge port facing into the plating container.