JPH08325095A - Method for growing diamond film and device therefor - Google Patents

Method for growing diamond film and device therefor

Info

Publication number
JPH08325095A
JPH08325095A JP13020395A JP13020395A JPH08325095A JP H08325095 A JPH08325095 A JP H08325095A JP 13020395 A JP13020395 A JP 13020395A JP 13020395 A JP13020395 A JP 13020395A JP H08325095 A JPH08325095 A JP H08325095A
Authority
JP
Japan
Prior art keywords
anode
plasma
diamond film
reaction chamber
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP13020395A
Other languages
Japanese (ja)
Inventor
Kenichi Sasaki
謙一 佐々木
Tsukasa Itani
司 井谷
Kazuaki Kurihara
和明 栗原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP13020395A priority Critical patent/JPH08325095A/en
Publication of JPH08325095A publication Critical patent/JPH08325095A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/26Deposition of carbon only
    • C23C16/27Diamond only
    • C23C16/272Diamond only using DC, AC or RF discharges

Abstract

PURPOSE: To improve the homogeneity and thickness distribution of a diamond film by forming the thin film while adjusting the opening of an anode. CONSTITUTION: Plural throttle blades 15 each having a rotating shaft 16 at its center are combined to form a variable-throttle anode. The anode is set in the opening of a plasma torch 4 furnished in a reaction chamber 1. A substrate to be treated is placed on a substrate holder, a raw gas contg. hydrocarbons and hydrogen is supplied into the reaction chamber 1 through the torch 4, and an evacuating system is operated to evacuate the reaction chamber. An arc discharge is then generated between the anode consisting of the throttle blades 15 and a cathode to form a plasma jet. The rotating shaft 16 is simultaneously rotated through a motor 18 set on the torch 4 to adjust the opening diameter of the throttle blades 15, and the substrate is irradiated with carbon plasma to grow a diamond film.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は気相合成によるダイヤモ
ンド膜の合成方法とその装置に関する。ダイヤモンドは
炭素(C)の同素体であり、所謂るダイヤモンド構造を
示し、ビッカース硬度は10,000Kg/ mm2と大きく、ま
た、熱伝導度は2000W/mkと他の材料に較べて格段に優
れており、また、バルクを伝播する音速は18,000m/s と
他の材料に較べて格段に速いなどの特徴をもっている。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for synthesizing a diamond film by vapor phase synthesis. Diamond is an allotrope of carbon (C), exhibits a so-called diamond structure, has a large Vickers hardness of 10,000 Kg / mm 2, and has a thermal conductivity of 2000 W / mk, which is far superior to other materials. In addition, the sound velocity propagating through the bulk is 18,000 m / s, which is much faster than other materials.

【0002】そのため、この性質を利用して各種の用途
が検討されているが、このうち熱伝導度の高いのを利用
して半導体素子のヒートシンク(Heat-sink) の構成材と
しての利用が考えられている。
Therefore, various applications have been studied by utilizing this property. Among them, it is considered to be used as a constituent material of a heat sink of a semiconductor device by utilizing its high thermal conductivity. Has been.

【0003】また、工具への耐摩耗性コーティング、ス
ピーカーの振動板への利用、光学部品の透明コーティン
グなどへの利用が検討されている。
Further, the use of abrasion resistant coating on tools, use as a diaphragm of a speaker, use as a transparent coating of optical parts, and the like are being studied.

【0004】[0004]

【従来の技術】ダイヤモンドの気相合成法としてはマイ
クロ波プラズマ気相成長法( 略してマイクロ波プラズマ
CVD法),熱フィラメント法, 燃焼炎法など多くの方法
が実用化されているが、何れの方法によっても被処理基
板上に微結晶の形でダイヤモンド膜を成長させることが
できる。
2. Description of the Related Art As a vapor phase synthesis method for diamond, many methods such as a microwave plasma vapor phase growth method (abbreviated microwave plasma CVD method), a hot filament method, and a combustion flame method have been put into practical use. The diamond film can be grown in the form of microcrystals on the substrate to be processed also by the above method.

【0005】こゝで、発明者等が開発したDCプラズマ
ジェットCVD法( 特開昭64-33096) はアノードとカソ
ードの間から水素(H2)と炭化水素例えばメタン(CH
4 )との混合ガスを反応室に供給すると共に排気系を動
作して反応室内を減圧した状態でアノードとカソードと
の間にアーク放電を生じさせ、混合ガスを分解させてプ
ラズマ化させると、炭素プラズマを含むプラズマジェッ
トは被処理基板に衝突し、微結晶からなるダイヤモンド
膜が成長する方法である。
The DC plasma jet CVD method (Japanese Patent Laid-Open No. 64-33096) developed by the inventors of the present invention uses hydrogen (H 2 ) and hydrocarbon such as methane (CH 2 ) from between the anode and the cathode.
4 ) is supplied to the reaction chamber with the mixed gas and the exhaust system is operated to generate arc discharge between the anode and the cathode in a state where the pressure inside the reaction chamber is reduced, and the mixed gas is decomposed into plasma, This is a method in which a plasma jet containing carbon plasma collides with a substrate to be processed and a diamond film made of fine crystals grows.

【0006】さて、先に記したような用途に気相合成ダ
イヤモンドを利用する場合、ダイヤモンドの合成速度が
大きなことが製造コストを低減させる上で重要であり、
この点でDCプラズマジェットCVD法は100 μm /h
以上の高い成膜速度を得ることから、優れた方法と言う
ことができる。
In the case of using vapor-phase synthetic diamond for the above-mentioned applications, it is important that the diamond synthesis rate is high in order to reduce the manufacturing cost.
In this respect, the DC plasma jet CVD method is 100 μm / h
It can be said to be an excellent method because the above high film forming rate is obtained.

【0007】然し、この方法は直流のアーク放電を利用
していることから、アノードとカソードの放電部位が加
熱されて消耗し、放電を続けるのに比例して電極間距離
が拡がると云う問題がある。
However, since this method uses direct-current arc discharge, there is a problem that the discharge sites of the anode and the cathode are heated and consumed, and the distance between the electrodes increases in proportion to the continuous discharge. is there.

【0008】[0008]

【発明が解決しようとする課題】発明者等が開発したD
CプラズマジェットCVD法はダイヤモンド膜の成膜速
度が100 μm /h以上と速く、優れた方法と言える。
[Problems to be Solved by the Invention] D developed by the inventors
The C plasma jet CVD method is an excellent method because the diamond film formation rate is as high as 100 μm / h or more.

【0009】図3はDCプラズマジェットCVD装置の
構成を示すもので、反応室1の中には水冷機構を備え、
回転可能な基板ホルダ2があり、この上にダイヤモンド
膜の成長を行う被処理基板3を載置し、一方、この被処
理基板3に対向して反応室1にはプラズマトーチ4が設
けられている。こゝで、プラズマトーチ4の外周部は窒
化硼素(BN)などの耐熱性絶縁物よりなり、その中央
部にはタングステン(W)や水冷した銅(Cu )などか
らなるカソード5が設けられており、また、先端部には
Wなどよりなるアノード6が設けられており、それぞれ
直流電源7に回路接続されている。
FIG. 3 shows the structure of a DC plasma jet CVD apparatus, in which a water cooling mechanism is provided in the reaction chamber 1.
There is a rotatable substrate holder 2 on which a substrate 3 to be processed for growing a diamond film is placed, while a plasma torch 4 is provided in the reaction chamber 1 facing the substrate 3 to be processed. There is. Here, the outer periphery of the plasma torch 4 is made of a heat-resistant insulator such as boron nitride (BN), and the cathode 5 made of tungsten (W) or water-cooled copper (Cu) is provided at the center thereof. Further, an anode 6 made of W or the like is provided at the tip end thereof, and each is circuit-connected to a DC power supply 7.

【0010】一方、プラズマトーチ4には炭化水素ガス
例えばメタン(CH4 )と水素(H 2 )などの原料ガス
8を供給するガス配管9が設けられており、原料ガス8
はプラズマトーチ4の中を通り、アノード6の先端から
噴出するよう形成されている。そして、反応室1の排気
口11より排気を続けて室内を減圧した状態でアノード6
とカソード5との間に電圧を印加し、アーク放電を行わ
せて原料ガス8に点火させると、原料ガス8は約5000℃
に加熱され、炭化水素ガスはプラズマ化し、アノードか
らプラズマジェット12を噴出し、このプラズマジェット
12が被処理基板3に当たって、この上に微結晶からなる
ダイヤモンド膜13が成長する。
On the other hand, the plasma torch 4 contains hydrocarbon gas.
For example, methane (CHFour) And hydrogen (H 2) And other source gases
8 is provided with a gas pipe 9 for supplying 8
Passes through the plasma torch 4 and from the tip of the anode 6.
It is formed so as to squirt. And the exhaust of the reaction chamber 1
Anode 6 while exhausting air from the port 11 to reduce the pressure in the room
A voltage is applied between the cathode and the cathode 5 to perform arc discharge.
When the raw material gas 8 is ignited, the raw material gas 8 is about 5000 ° C.
The hydrocarbon gas is turned into plasma and heated to the anode.
Plasma jet 12 is ejected from this plasma jet
12 hits the substrate 3 to be processed and is composed of fine crystals on it.
The diamond film 13 grows.

【0011】然し、この方法の問題はプラズマジェット
12の温度が約5000℃と高く、そのため、放電を続けるの
に従ってプラズマトーチ4に設けられている放電電極、
特にアノード6が消耗して開口部が拡がり、放電状態が
経時変化することである。すなわち、定電流方式をとっ
て放電を行っている場合は放電電圧が変化して次第に上
昇してくる。
However, the problem with this method is that it is a plasma jet.
The temperature of 12 is as high as about 5000 ° C. Therefore, the discharge electrode provided on the plasma torch 4 as the discharge continues,
Particularly, the anode 6 is consumed, the opening is expanded, and the discharge state changes with time. That is, when discharging is performed by the constant current method, the discharge voltage changes and gradually increases.

【0012】また、放電はアノードとカソードの間で一
様に行われるのではなく、特定の位置で選択的に行われ
ることから、ダイヤモンド膜の成長が均等には行われ
ず、また、プラズマトーチの直下では成長速度が大き
く、外側に行くほど小さくなることから、均等な膜厚分
布を得ることは困難なことが問題である。
Further, since the discharge is not uniformly performed between the anode and the cathode but selectively at a specific position, the diamond film is not uniformly grown, and the plasma torch It is difficult to obtain a uniform film thickness distribution, because the growth rate is large immediately below and decreases toward the outside.

【0013】[0013]

【課題を解決するための手段】上記の課題はDCプラズ
マジェットCVD法により基板上にダイヤモンド膜の合
成を行なう際に、アノードの開口部の大きさが調節可能
に形成することを特徴としてダイヤモンド膜を製造する
ことにより解決することができる。
The above-mentioned problems are characterized in that when the diamond film is synthesized on the substrate by the DC plasma jet CVD method, the size of the opening of the anode is adjustable. Can be solved by manufacturing.

【0014】[0014]

【作用】本発明はアノードの開口部を可変絞り型とする
ことにより問題を解決するもので、図1は本発明を適用
したDCプラズマジェットCVD装置の部分断面図を、
また、図2は可変絞り型アノードの平面図を示してい
る。
The present invention solves the problem by making the aperture of the anode a variable aperture type. FIG. 1 is a partial sectional view of a DC plasma jet CVD apparatus to which the present invention is applied.
FIG. 2 shows a plan view of the variable diaphragm type anode.

【0015】すなわち、アノードをカメラの絞りと同様
に複数の絞り羽根を用いて開口径を調節するものである
が、異なるところは、 絞り羽根の回動をモータにより行うが、その際、そ
れぞれ独立に行えるようにしたこと、 羽根を耐熱性の優れたWなどで形成すると共に、機
械的な強度を付与したこと、 である。すなわち、図2において、3枚の絞り羽根15に
よりアノードが形成されており、この羽根15の中心には
回転軸16があって、この回転軸16の回動によりアノード
の開口径を調節するもので、3枚の絞り羽根15が同図
(B)の状態にあるときの開口径を標準とし、同図
(A)は開口の大きさを大にする場合、また、同図
(C)は小にする場合の絞り羽根の状態を示している。
すなわち、図1に示すようにプラズマトーチ4の上に載
置してあるモータ18により回転軸16を回動させ、これに
よりアノードの開口部の大きさを調節するものである。
That is, the aperture diameter is adjusted by using a plurality of diaphragm blades for the anode, similar to the diaphragm of a camera. The difference is that the diaphragm blades are rotated by a motor, but at this time, they are independent of each other. That is, the blade is made of W, which has excellent heat resistance, and mechanical strength is imparted. That is, in FIG. 2, an anode is formed by three diaphragm blades 15, and a rotary shaft 16 is provided at the center of the blade 15, and the opening diameter of the anode is adjusted by the rotation of the rotary shaft 16. When the three diaphragm blades 15 are in the state shown in FIG. 7B, the aperture diameter is used as a standard. In FIG. 7A, the size of the aperture is increased, and in FIG. The state of the diaphragm blades when it is made small is shown.
That is, as shown in FIG. 1, the rotating shaft 16 is rotated by the motor 18 mounted on the plasma torch 4, thereby adjusting the size of the opening of the anode.

【0016】次に、DCプラズマジェットCVD装置を
使用してダイヤモンド膜の成長を行う場合の問題点はア
ノードとカソード間の放電は一様に生ずるのではなく特
定の位置で生じ、そのためにプラズマジェットは放電方
向に傾くことから、その延長線上の被処理基板にダイヤ
モンド膜が厚く成長することである。
Next, the problem in growing a diamond film by using a DC plasma jet CVD apparatus is that the discharge between the anode and the cathode does not occur uniformly but at a specific position, and therefore the plasma jet Means that the diamond film grows thick on the substrate to be processed on the extension line because it tilts in the discharge direction.

【0017】この対策としてはプラズマジェットの方向
を変化できるようにすればよく、これは可変絞り型アノ
ードの一方向だけを広くすることにより可能で、これは
一個のモータだけを働かせて開口径を拡げることにより
実現することができる。
As a countermeasure against this, it is sufficient to change the direction of the plasma jet, and this can be achieved by widening only one direction of the variable diaphragm type anode. This makes only one motor work to increase the aperture diameter. It can be realized by expanding.

【0018】なお、被処理基板上にダイヤモンド膜を成
長させる場合は広い面積に亙って均一な厚さに形成した
いが、DCプラズマジェットCVD法による場合はジェ
ットの当たる中心部分は膜厚が厚く、周辺に行くに従っ
て薄くなる現象は避けられない。そこで、均一に膜形成
する方法としては可変絞り型アノードの絞り方向を周期
的に変化させて、プラズマジェットが被処理基板上で円
を描くように照射することにより、中心部と周辺部の膜
厚を等しくすることができる。
When a diamond film is to be grown on the substrate to be processed, it is desired to form it with a uniform thickness over a wide area. However, in the case of the DC plasma jet CVD method, the central part on which the jet hits has a large film thickness. , The phenomenon of becoming thinner as going to the surroundings is inevitable. Therefore, as a method for forming a uniform film, the diaphragm direction of the variable diaphragm type anode is periodically changed and the plasma jet is irradiated so as to draw a circle on the substrate to be processed. The thickness can be equal.

【0019】次に、本発明に係る絞り羽根には反応ガス
が当たることから、耐熱性以外に機械的強度が必要で、
三組の絞り羽根をそれぞれ複数枚で形成することが好ま
しく、これにより強度が増して変形を防ぐことができ
る。
Next, since the reaction gas hits the diaphragm blade according to the present invention, mechanical strength is required in addition to heat resistance.
It is preferable that each of the three sets of diaphragm blades is formed by a plurality of sheets, which increases strength and prevents deformation.

【0020】[0020]

【実施例】【Example】

実施例1:(図2関連) 3組の絞り羽根よりなる可変絞り型アノードを厚さが1
mm厚のW板5枚を組合せて形成し、プラズマトーチの上
に設けた3個のステッピングモータでそれぞれの絞り羽
根を6段階に調節できるようにした。
Example 1 (Related to FIG. 2) A variable diaphragm type anode composed of three pairs of diaphragm blades has a thickness of 1
Five W plates each having a thickness of mm were formed in combination, and each diaphragm blade could be adjusted in six stages by three stepping motors provided on the plasma torch.

【0021】また、アノードとカソード間の電圧値を制
御用パソコンに入力し、この電圧値が設定値を超えたら
ステッピングモータが働き、絞り羽根が動いて開口径を
減少させることで、開口径を一定にし、電圧値を一定に
保つようにした。なお、従来のプラズマジェットCVD
装置では10時間の放電により約1mmの消耗が見受けられ
ている。
Further, the voltage value between the anode and the cathode is input to the control personal computer, and when the voltage value exceeds the set value, the stepping motor operates and the diaphragm blades move to reduce the opening diameter, thereby reducing the opening diameter. It was kept constant and the voltage value was kept constant. Conventional plasma jet CVD
In the device, about 10 mm of wear is observed after 10 hours of discharge.

【0022】先ず、被処理基板として20×20×5mmのM
o 板を用い、水冷されている基板ホルダの上に設置し、
原料ガスとしてH2 を40リットル/分,Ar を20リット
ル/分,CH4 を1cc/分の流量でプラズマトーチを通
して反応室に供給すると共に排気系を動作させて排気口
より排気を続け、反応室を20torrに減圧させると共に、
直流電源より20Aの電流を通じてアーク放電させ、アノ
ードの絞り羽根の開口径を調節して放電電圧を150 Vに
してプラズマジェットを照射させ、成膜速度250 μm /
hでダイヤモンド膜の成長を行った。
First, as a substrate to be processed, an M of 20 × 20 × 5 mm
o Use a plate and place it on the water-cooled substrate holder,
As a raw material gas, H 2 is supplied at a flow rate of 40 liters / minute, Ar is supplied at a rate of 20 liters / minute, and CH 4 is supplied at a flow rate of 1 cc / minute into the reaction chamber through the plasma torch. Decompress the chamber to 20 torr,
Arc discharge is performed with a current of 20 A from a DC power source, the aperture diameter of the diaphragm blade of the anode is adjusted to a discharge voltage of 150 V, and a plasma jet is irradiated to form a film at a deposition rate of 250 μm /
A diamond film was grown at h.

【0023】その結果、20A,150 Vの安定した状態で
プラズマジェットを照射させることができ、均質なダイ
ヤモンド膜を得ることができた。 実施例2 実施例1と全く同様にして被処理基板にダイヤモンド膜
の成長を行ったが、この際に制御用パソコンにより、3
個のステッピングモータの内の1個づつを順繰りに回動
させ、アノードの開口部を楕円形状とすることでプラズ
マジェットの照射方向を変え、被処理基板上に円を描く
ように照射させた。その結果、実施例1に較べて膜厚分
布が良く平坦なダイヤモンド膜を得ることができた。
As a result, it was possible to irradiate the plasma jet in a stable state of 20 A and 150 V, and to obtain a uniform diamond film. Example 2 A diamond film was grown on a substrate to be processed in exactly the same manner as in Example 1. At this time, a diamond film was grown by a control personal computer.
Each of the stepping motors was rotated in turn, and the irradiation direction of the plasma jet was changed by making the opening of the anode elliptical so that the substrate to be processed was irradiated so as to draw a circle. As a result, a flat diamond film having a better film thickness distribution than in Example 1 could be obtained.

【0024】[0024]

【発明の効果】可変絞り型アノードを使用し、アノード
の消耗によるプラズマジェットの出力変動を補償し、ま
た、プラズマジェットの照射方向をコントロールする本
発明の実施により、ダイヤモンド膜の成長に当たって均
質性を増すことができ、また、膜厚分布の向上が可能と
なる。
EFFECTS OF THE INVENTION A variable diaphragm type anode is used to compensate for fluctuations in the output of the plasma jet due to exhaustion of the anode, and by carrying out the present invention in which the irradiation direction of the plasma jet is controlled, it is possible to achieve uniformity in the growth of diamond film. In addition, the film thickness distribution can be improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明を実施したDCプラズマジェットCVD
装置の部分断面図である。
FIG. 1 is a DC plasma jet CVD according to the present invention.
It is a fragmentary sectional view of an apparatus.

【図2】可変絞り型アノードの動作を示す平面図であ
る。
FIG. 2 is a plan view showing the operation of the variable diaphragm type anode.

【図3】DCプラズマジェットCVD装置の構成を示す
断面図である。
FIG. 3 is a sectional view showing the configuration of a DC plasma jet CVD apparatus.

【符号の説明】[Explanation of symbols]

1 反応室 3 被処理基板 4 プラズマトーチ 5 カソード 6 アノード 8 原料ガス 12 プラズマジェット 13 ダイヤモンド膜 15 絞り羽根 16 回転軸 18 モータ 1 Reaction Chamber 3 Processed Substrate 4 Plasma Torch 5 Cathode 6 Anode 8 Material Gas 12 Plasma Jet 13 Diamond Film 15 Diaphragm Blade 16 Rotating Shaft 18 Motor

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 カソードとアノードとを備えたプラズマ
トーチに炭化水素と水素を含む原料ガスを供給して反応
室へ噴出せしめ、排気系により該反応室内を減圧した状
態で前記アノードとカソードとの間にアーク放電を生じ
させて炭素プラズマを含むプラズマジェットを作り、該
炭素プラズマを反応室内に載置してある被処理基板に照
射するDCプラズマジェットCVD法によって該基板上
に微結晶からなるダイヤモンド膜を成長させる方法にお
いて、 前記アノードの開口部を調節しながら成膜することを特
徴とするダイヤモンド膜の成長方法。
1. A plasma torch having a cathode and an anode is supplied with a raw material gas containing hydrocarbon and hydrogen to be jetted into a reaction chamber, and the exhaust system is used to reduce the pressure in the reaction chamber to form the anode and the cathode. A diamond consisting of microcrystals is formed on the substrate by a DC plasma jet CVD method in which an arc discharge is generated between them to form a plasma jet containing carbon plasma, and the carbon plasma is applied to a substrate to be processed placed in a reaction chamber. A method for growing a film, wherein the film is formed while adjusting the opening of the anode.
【請求項2】 前記プラズマトーチのアノード開口部が
可変絞り型アノードよりなることを特徴とするダイヤモ
ンド膜の成長装置。
2. An apparatus for growing a diamond film, wherein the anode opening of the plasma torch is a variable aperture type anode.
【請求項3】 前記可変絞り型アノードの絞り形状を変
えてダイヤモンド膜の膜厚分布を調節することを特徴と
する請求項1記載のダイヤモンド膜の成長方法。
3. The method for growing a diamond film according to claim 1, wherein the diaphragm shape of the variable diaphragm type anode is changed to adjust the film thickness distribution of the diamond film.
JP13020395A 1995-05-29 1995-05-29 Method for growing diamond film and device therefor Withdrawn JPH08325095A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13020395A JPH08325095A (en) 1995-05-29 1995-05-29 Method for growing diamond film and device therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13020395A JPH08325095A (en) 1995-05-29 1995-05-29 Method for growing diamond film and device therefor

Publications (1)

Publication Number Publication Date
JPH08325095A true JPH08325095A (en) 1996-12-10

Family

ID=15028565

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13020395A Withdrawn JPH08325095A (en) 1995-05-29 1995-05-29 Method for growing diamond film and device therefor

Country Status (1)

Country Link
JP (1) JPH08325095A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001092611A1 (en) * 2000-05-29 2001-12-06 Tohoku Techno Arch Co., Ltd. Method of forming high-quality diamond and device therefor
JP2008282824A (en) * 2001-11-07 2008-11-20 Rapt Industries Inc Apparatus and method for reactive atom plasma processing for material deposition
JP2013216947A (en) * 2012-04-10 2013-10-24 Kojima Press Industry Co Ltd Plasma cvd apparatus
CN114772592A (en) * 2022-06-21 2022-07-22 成都沃特塞恩电子技术有限公司 Diamond cultivation equipment adjusting method and device, electronic equipment and storage medium

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2001092611A1 (en) * 2000-05-29 2001-12-06 Tohoku Techno Arch Co., Ltd. Method of forming high-quality diamond and device therefor
JP2008282824A (en) * 2001-11-07 2008-11-20 Rapt Industries Inc Apparatus and method for reactive atom plasma processing for material deposition
JP2013216947A (en) * 2012-04-10 2013-10-24 Kojima Press Industry Co Ltd Plasma cvd apparatus
CN114772592A (en) * 2022-06-21 2022-07-22 成都沃特塞恩电子技术有限公司 Diamond cultivation equipment adjusting method and device, electronic equipment and storage medium
CN114772592B (en) * 2022-06-21 2022-09-16 成都沃特塞恩电子技术有限公司 Diamond cultivation equipment adjusting method and device, electronic equipment and storage medium

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