JPH0831925A - Housing container for semiconductor device and test method of semiconductor device - Google Patents

Abstract

PURPOSE:To obtain a test method which prevents a lead from being deformed and whose testing efficiency is enhanced by a method wherein an IC can be tested while housed in a container. CONSTITUTION:The housing container for a semiconductor device is provided with a housing part for the semiconductor device 4, with opening parts i2 which are formed in positions corresponding to leads for the housed semiconductor device and with protrusions 3 which are formed on a face on the opposite side of a face, on which the housing part has been formed, and which press the leads for the semiconductor device on the lower side when the housing container is stacked. The device is housed in the housing container, a plurality of housing containers are stacked, contact pins 5 are connected to the leads through the opening parts and the semiconductor device is tested.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a container for a semiconductor device used during the manufacturing process of semiconductor devices such as integrated circuit devices and during shipping.

[0002]

2. Description of the Related Art A conventional container used for carrying an integrated circuit device (IC) has a structure as shown in FIG.

FIGS. 3A to 3E are explanatory views of a conventional example of a storage container. 3A is a cross-sectional view of an IC to be stored, FIGS. 3B and 3C are cross-sectional views corresponding to one IC in a container containing ICs, and FIG. 3D is a plurality of ICs. FIG. 3 (E) is a perspective view of a stackable storage container that can store and stack the storage containers.

In the figure, 31A is a storage container, 31B and 31C are storage container lids, 32 is an IC to be stored, and 41 is a plurality of ICs.
The storage container 42 in which the ICs can be stacked is a storage part (recess) of the IC. The target IC package is a flat QFP (Quad Fl) with pins (leads) formed in four directions.
at Package), a small dual inline package
For example, SOP (Small Outline Package).

[0005]

Recently, ICs have been vulnerable due to the increase in the number of leads with the increase in integration density due to the fine pitch. Therefore, when the IC is taken out from the container and inserted into the socket of the test equipment, there are often problems such as deformation of the leads. IC when lead deforms
When mounting the IC on a printed circuit board, problems such as poor soldering occur.

An object of the present invention is to prevent the lead from being deformed and to improve the test efficiency by allowing the IC test to be performed with the IC stored in the container.

[0007]

Means for Solving the Problems To solve the above-mentioned problems, 1) a housing portion for a semiconductor device, an opening formed at a portion corresponding to the lead of the semiconductor device housed therein, and the housing portion are formed. A semiconductor device storage container having a protrusion formed on the surface opposite to the surface and holding the leads of the semiconductor device existing underneath when the storage containers are stacked, or 2) The semiconductor is added to the storage container described in 1 above. This is achieved by a semiconductor device testing method in which a plurality of devices are housed and stacked, and a contact pin is connected to the lead through the opening to test the semiconductor device.

[0008]

According to the present invention, the lead-corresponding portion of the storage container is opened, and the contact pin is inserted from the outside through this opening.
Since the characteristics are measured, it is not necessary to take out the IC from the container, so the leads are not deformed and the test man-hour can be reduced (see Fig. 1).

At this time, the protrusion formed on the lower surface of the container stacked on the upper side presses the contact portion of the lead from the side opposite to the contact pin to prevent the lead from being deformed and ensures the contact between the contact pin and the lead. With
The slope of this protrusion prevents displacement of the IC.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is an illustration of an embodiment of the present invention. The figure shows a cross-section of the tester board 6 with the contact pins 5 implanted in the tester board 6 aligned with the openings 2 of the storage container 1A and the storage containers 1A, 1B, ... placed on the tester board. It is a figure.

At this time, the protrusions 3 formed on the lower surface of the upper storage container 1B to be stacked are stored in the lower storage container 1A.
The contact portion of the IC lead is pressed from the opposite side of the contact pin, and the slope 3A of the protrusion prevents displacement of the IC.

2 (A) to 2 (C) are explanatory views of the construction of the storage container of the embodiment. FIG. 2A is a perspective view showing a state in which an SOP type IC is stored in the storage container 1 of the embodiment. Figure 2
(B) is a diagram showing a state in which the opening 2 for contacting the lead is formed in the container, and the protrusion 3 is provided on the bottom surface of the container so that the characteristics of the IC underneath can be surely tested. Is provided. In addition, the slope 3A of this protrusion prevents displacement of the IC.

FIG. 2C shows an example in which a partition is provided in the opening 2 so that the electrical characteristics of the IC can be tested more reliably. This partition can prevent contact between adjacent contact pins.

Next, the IC stored in the storage container of the embodiment
The test method will be described. The tester board is provided with contact pins implanted corresponding to the pin arrangement for one IC, and each contact pin is connected to the measuring instrument. The tester board or storage container is sequentially stepped to measure the stored ICs in order.

Further, since the storage container has a plurality of IC storage portions, it is possible to fabricate a tester board corresponding to one storage container and perform an IC test for one storage container at a time. .

Since the storage container is usually made of plastic and therefore has a considerable weight, the pressure contact pressure between the lead and the contact pin does not become insufficient. It is advisable to place an appropriate weight on top.

[0017]

According to the present invention, by stacking the storage containers on the test device, the leads of the ICs stored in the container are directly connected to the contact pins of the test device. As a result, the lead is not deformed. Therefore, it is possible to prevent the occurrence of defective soldering when mounting the IC.

Further, since the IC can be tested while it is stored in the container, the number of test steps can be reduced, and a plurality of ICs for one storage container can be tested at the same time, so that the test efficiency can be further improved. .

[Brief description of drawings]

FIG. 1 is an explanatory diagram of an embodiment of the present invention.

FIG. 2 is an explanatory diagram of the configuration of the storage container of the embodiment.

FIG. 3 is an explanatory view of a conventional example of a storage container.

[Explanation of symbols]

 1, 1A, 1B Storage container 2 Opening 3 Projection 3A Slope of projection 4 IC to be stored 5 Contact pin 6 Tester board

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location G01R 31/28 H01L 21/66 D 7514-4M

Claims (2)

[Claims] 1. A housing for a semiconductor device, an opening formed in a portion corresponding to a lead of the housed semiconductor device,
A storage container for a semiconductor device, which has a protrusion formed on a surface opposite to a surface on which the storage portion is formed and which holds a lead of a semiconductor device existing below when the storage container is stacked. . 2. A semiconductor device, wherein a plurality of semiconductor devices are stored in the storage container according to claim 1 and a plurality of semiconductor devices are stacked, and a contact pin is connected to the lead through the opening to test the semiconductor device. Equipment test method.