JPH08316616A - Cylindrical electronic part device and its manufacture - Google Patents
Cylindrical electronic part device and its manufactureInfo
- Publication number
- JPH08316616A JPH08316616A JP7118266A JP11826695A JPH08316616A JP H08316616 A JPH08316616 A JP H08316616A JP 7118266 A JP7118266 A JP 7118266A JP 11826695 A JP11826695 A JP 11826695A JP H08316616 A JPH08316616 A JP H08316616A
- Authority
- JP
- Japan
- Prior art keywords
- air
- core coil
- electronic component
- mounting
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は各種電子機器における円
柱形電子部品の取り付けに関する。特に空芯コイル等の
プリント配線基板の実装において空芯コイル等の傾きを
防止した円柱形電子部品の取り付け機構に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to mounting a cylindrical electronic component in various electronic devices. In particular, the present invention relates to a mounting mechanism for a cylindrical electronic component that prevents the air core coil or the like from tilting when mounting a printed wiring board such as the air core coil.
【０００２】[0002]
【従来の技術】最近の携帯電話機は、急激に小さくなっ
てきた。機能、デザイン、の向上を、更により軽量化
と、より薄型になり、電子部品の実装密度を高めること
が要求されている。急激に進んだ小型化に最も寄与した
１つに高周波部品の小型化が上げられる。わずか１２ｃ
ｃの容量の中に部品点数が１８０個以上と非常に高実装
密度となっている。このような背景から製造時特に空芯
コイルが傾きチップ部品に接触するという場合がある。
そこで空芯コイルが傾き、チップ部品に接触するのを防
ぐために遮蔽板を挿入していた。第２図はプリント配線
基板１に空芯コイル２とチップ部品３の間に遮蔽板４を
実装した断面図である。2. Description of the Related Art Recently, mobile phones have been rapidly reduced in size. Improvements in functions and designs are required to be even lighter and thinner, and to increase the mounting density of electronic components. One of the biggest contributions to the rapid miniaturization is miniaturization of high frequency components. Only 12c
In the capacity of c, the number of parts is 180 or more, which is a very high mounting density. Due to this background, the air-core coil may tilt and come into contact with the chip component during manufacture, in particular.
Therefore, a shield plate is inserted to prevent the air-core coil from tilting and coming into contact with the chip component. FIG. 2 is a cross-sectional view in which the shield plate 4 is mounted on the printed wiring board 1 between the air-core coil 2 and the chip component 3.
【０００３】[0003]
【発明が解決しようとする課題】本発明は空芯コイルを
プリント配線基板の実装に際し、空芯コイルが傾き他の
電子部品に接触することのないように遮蔽板を実装する
のは工数が増え、また、遮蔽板自体が機器の小型化を妨
げようという問題があった。SUMMARY OF THE INVENTION According to the present invention, when mounting an air-core coil on a printed wiring board, it takes a lot of man-hours to mount the shield plate so that the air-core coil does not tilt and come into contact with other electronic components. Further, there is a problem that the shield plate itself hinders miniaturization of the device.
【０００４】[0004]
【課題を解決するための手段】横置きした円柱型電子部
品をプリント配線基板上に搭載し、前記プリント配線基
板の導電パターンの相対向するランド部間に前記横置き
した円柱型電子部品の周端の電極を半田つけするように
した横置きした円柱型電子部品の取り付け機構におい
て、前記プリント配線基板上には、前記各ランド部間で
前記横置きした円柱型電子部品を周側面から鋏込む位置
に位置ずれ防止用保持部を設けた横置きした円柱型電子
部品の取り付け機構を提供する。また前記位置ずれ防止
用保持部は、接着剤で仮固定時に形成し、その大きさ
は、横置きした円柱型電子部品の周側面がプリント基板
に接する線より両側に横置きした円柱型電子部品の半径
Ｒの２／３〜１の範囲に、横置きした円柱型電子部品の
側面に接する高さに形成した横置きした円柱型電子部品
の取り付け機構を提供する。A horizontally mounted cylindrical electronic component is mounted on a printed wiring board, and a circumference of the horizontally mounted cylindrical electronic component is provided between opposing land portions of a conductive pattern of the printed wiring board. In a mounting mechanism for a horizontally mounted cylindrical electronic component in which end electrodes are soldered, the horizontally mounted cylindrical electronic component is scissored from a peripheral side surface on the printed wiring board between the respective land portions. (EN) Provided is a mounting mechanism for a horizontally mounted cylindrical electronic component, which is provided with a displacement prevention holding portion at a position. Further, the displacement prevention holding portion is formed at the time of temporary fixing with an adhesive, and its size is such that the circumferential side surface of the horizontally mounted cylindrical electronic component is laterally arranged on both sides of a line in contact with the printed circuit board. Provided is a mounting mechanism for a horizontally mounted cylindrical electronic component formed at a height in contact with a side surface of the horizontally mounted cylindrical electronic component in a range of ⅔ to 1 of a radius R of.
【０００５】[0005]
【作用】円柱型電子部品である空芯コイル等は当然安定
度は良くない。空芯コイル等の電極リードをプリント配
線基板のスルホール電極部に挿入して実装するが、スル
ホール電極部の孔径は空芯コイルの電極リードの径より
大きく従って傾きやすい。本発明は空芯コイル等の傾き
を防止するために空芯コイル等の周側面を両側から抱え
込む位置ずれ防止用保持部を設けチップ部品等の接触を
防止する。又空芯コイル等はプリント配線基板に部品実
装後の検査工程でコイル間隔を若干移動させて調整する
ため、空芯コイル等を樹脂等で固定してしまうことは出
来ない。そこで位置ずれ防止用保持部は接着剤で形成す
るが完全に硬化後に空芯コイルを実装することになる。Operation: The stability of the air-core coil, which is a cylindrical electronic component, is naturally not good. The electrode lead of the air core coil or the like is inserted and mounted in the through hole electrode portion of the printed wiring board, but the hole diameter of the through hole electrode portion is larger than the diameter of the electrode lead of the air core coil, and thus is easily inclined. According to the present invention, in order to prevent the air core coil or the like from being tilted, a position deviation preventing holding portion is provided to hold the peripheral side surfaces of the air core coil or the like from both sides to prevent contact with chip components and the like. Further, since the air-core coil and the like are adjusted by slightly moving the coil interval in the inspection step after mounting the components on the printed wiring board, the air-core coil and the like cannot be fixed with resin or the like. Therefore, the displacement prevention holding portion is formed of an adhesive, but the air core coil is mounted after it is completely cured.
【０００６】[0006]
【実施例】第１図は本発明による空芯コイル取り付け機
構の一実施例を示す図である。１はプリント配線基板、
２は空芯コイル、３はチップ部品、５は保持部、６は空
芯コイルの電極リード半田付け部である。プリント配線
基板１上にチップ部品３を実装するに前以てディスペン
サによる熱硬化性接着剤（エポキシ系樹脂ソマコートＩ
Ｒ１００ソマール（株）製）を所定の位置に塗布する。
この時同時に空芯コイル２の位置ずれ防止用保持部５を
前記熱硬化性接着剤で形成しておく、次にチップ部品３
を搭載し前記接着剤を硬化させる。次に空芯コイル２を
挿入して前記プリント配線基板１の裏面にクリーム半田
を塗布しリフロー炉にて半田付け固定する。従って空芯
コイル２の位置ずれ防止用保持部５を特別の工程を経な
いで形成できる。位置ずれ防止用保持部５は第３図に示
す。空芯コイル２の半径をＲとし、空芯コイル２とプリ
ント配線板１との接点をａ、空芯コイルの中心をｃとす
る。 保持部５はプリント配線板１上のａ点から両側に
２／３Ｒ〜Ｒの間に保持部５の中心線ｅが入るように形
成すれば空芯コイル２の傾きにおける安定度が良い。又
保持部５は空芯コイル２の周側面の両側に形成する他、
場合により片側のみで目的がはたせることも出来る。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a view showing an embodiment of an air core coil mounting mechanism according to the present invention. 1 is a printed wiring board,
Reference numeral 2 is an air core coil, 3 is a chip component, 5 is a holding portion, and 6 is an electrode lead soldering portion of the air core coil. Before mounting the chip component 3 on the printed wiring board 1, a thermosetting adhesive (epoxy resin Somacoat I
R100 Somar Co., Ltd. is applied to a predetermined position.
At this time, at the same time, the holding portion 5 for preventing the positional deviation of the air-core coil 2 is formed of the thermosetting adhesive.
And cure the adhesive. Next, the air-core coil 2 is inserted and cream solder is applied to the back surface of the printed wiring board 1 and fixed by soldering in a reflow furnace. Therefore, the holding portion 5 for preventing the positional deviation of the air-core coil 2 can be formed without a special process. The displacement prevention holding portion 5 is shown in FIG. The radius of the air-core coil 2 is R, the contact point between the air-core coil 2 and the printed wiring board 1 is a, and the center of the air-core coil is c. If the holding portion 5 is formed so that the center line e of the holding portion 5 is between 2 / 3R and R on both sides from the point a on the printed wiring board 1, the stability of the inclination of the air-core coil 2 is good. Further, the holding portions 5 are formed on both sides of the peripheral side surface of the air-core coil 2,
In some cases, one side can serve the purpose.
【０００７】[0007]
【発明の効果】プリント配線基板上にチップ部品を実装
するに前以てデスペンサによる熱硬化性接着剤を所定の
位置に塗布する。この時同時に空芯コイルの位置ずれ防
止用保持部を前記熱硬化性接着剤で形成しておく、次に
チップ部品を搭載し前記接着剤を硬化させる。次に空芯
コイルを挿入して前記プリント配線基板の裏面にクリー
ム半田を塗布しリフロー炉にて半田付け固定する。従っ
て空芯コイルの位置ずれ防止用保持部を特別の工程を経
ないで形成できる。また空芯コイルと他の電子部品との
接触をさけるための遮蔽板を別途設ける必要もない。EFFECTS OF THE INVENTION Before mounting a chip component on a printed wiring board, a thermosetting adhesive by a dispenser is applied to a predetermined position. At this time, at the same time, a holding portion for preventing displacement of the air-core coil is formed of the thermosetting adhesive, and then a chip component is mounted and the adhesive is cured. Next, an air-core coil is inserted, cream solder is applied to the back surface of the printed wiring board, and fixed by soldering in a reflow oven. Therefore, the holding portion for preventing the positional deviation of the air-core coil can be formed without a special process. Further, it is not necessary to separately provide a shield plate for preventing contact between the air-core coil and other electronic components.
【図１】 本発明による空芯コイル取り付け機構の一実
施例を示す側面図である。FIG. 1 is a side view showing an embodiment of an air-core coil attachment mechanism according to the present invention.
【図２】 従来の空芯コイル取り付け機構を示す側面図
である。FIG. 2 is a side view showing a conventional air-core coil attachment mechanism.
１ プリント配線基板 ２ 空芯コイル（円柱型電子部品） ３ チップ部品 ５ 位置ずれ防止用保持部 ６ 電極リード半田付け部分 1 Printed Wiring Board 2 Air-Core Coil (Cylindrical Electronic Component) 3 Chip Component 5 Misalignment Holding Section 6 Electrode Lead Soldering Section
Claims (3)
置きして装着する装置において、前記プリント配線基板
上に、前記円柱型電子部品を周側面から鋏込む位置に位
置ずれ防止用保持部を設けたことを特徴とする円柱型電
子部品の装着装置。1. A device for horizontally mounting a columnar electronic component on a printed wiring board and mounting the columnar electronic component on the printed wiring board at a position where the columnar electronic component is scissored from a peripheral side surface to prevent misalignment. An apparatus for mounting a cylindrical electronic component, characterized by being provided with.
ント配線基板上にチップ型電子部品を仮固定する際に同
時に形成することを特徴とする請求項１記載の円柱型電
子部品の装着方法。2. The mounting of the columnar electronic component according to claim 1, wherein the holding portion for preventing displacement is formed at the same time when the chip electronic component is temporarily fixed on the printed wiring board with an adhesive. Method.
品の周側面がプリント基板に接する線より両側に円柱型
電子部品の半径の２／３〜１の範囲に、円柱型電子部品
の周側面に接する高さに形成したことを特徴とする請求
項１記載の円柱型電子部品の取り付け機構。3. The position shift prevention holding portion is provided on both sides of a line where the peripheral side surface of the cylindrical electronic component is in contact with the printed circuit board within a range of 2/3 to 1 of the radius of the cylindrical electronic component, The mounting mechanism for a cylindrical electronic component according to claim 1, wherein the mounting mechanism is formed at a height in contact with the peripheral side surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7118266A JPH08316616A (en) | 1995-05-17 | 1995-05-17 | Cylindrical electronic part device and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7118266A JPH08316616A (en) | 1995-05-17 | 1995-05-17 | Cylindrical electronic part device and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08316616A true JPH08316616A (en) | 1996-11-29 |
Family
ID=14732386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7118266A Pending JPH08316616A (en) | 1995-05-17 | 1995-05-17 | Cylindrical electronic part device and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08316616A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014037978A1 (en) * | 2012-09-06 | 2014-03-13 | パナソニック株式会社 | Mounting structure and method for supplying reinforcing resin material |
-
1995
- 1995-05-17 JP JP7118266A patent/JPH08316616A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014037978A1 (en) * | 2012-09-06 | 2014-03-13 | パナソニック株式会社 | Mounting structure and method for supplying reinforcing resin material |
| CN104604343A (en) * | 2012-09-06 | 2015-05-06 | 松下知识产权经营株式会社 | Mounting structure and method for supplying reinforcing resin material |
| JP5942308B2 (en) * | 2012-09-06 | 2016-06-29 | パナソニックＩｐマネジメント株式会社 | Mounting structure and method for supplying reinforcing resin material |
| US9955604B2 (en) | 2012-09-06 | 2018-04-24 | Panasonic Intellectual Property Management Co., Ltd. | Mounting structure and method for supplying reinforcing resin material |
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