JPH08311164A - Epoxy resin composition for sealing - Google Patents
Epoxy resin composition for sealingInfo
- Publication number
- JPH08311164A JPH08311164A JP11944595A JP11944595A JPH08311164A JP H08311164 A JPH08311164 A JP H08311164A JP 11944595 A JP11944595 A JP 11944595A JP 11944595 A JP11944595 A JP 11944595A JP H08311164 A JPH08311164 A JP H08311164A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- component
- melamine
- resin composition
- novolac resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品、半導体素子等
の封止に用いられる封止用エポキシ樹脂組成物に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing epoxy resin composition used for sealing electronic parts, semiconductor elements and the like.
【０００２】[0002]
【従来の技術】電子部品、半導体素子を物理的、化学的
に保護し、且つ固着するための封止材料としてエポキシ
樹脂組成物が知られている。このエポキシ樹脂組成物の
ガラス転移点（以下Ｔｇと記す）を上げることで、耐熱
性の向上が試みられている。そこで、Ｔｇを高くするた
めに、活性の強い触媒を用いるとＴｇは高くなるが耐湿
性が劣り、例えば吸湿後の体積抵抗率が低下する問題が
ある。2. Description of the Related Art An epoxy resin composition is known as a sealing material for physically and chemically protecting and fixing electronic parts and semiconductor elements. Attempts have been made to improve heat resistance by increasing the glass transition point (hereinafter referred to as Tg) of this epoxy resin composition. Therefore, in order to increase Tg, when a catalyst having a strong activity is used, Tg increases, but the moisture resistance is poor, and there is a problem that the volume resistivity after moisture absorption decreases, for example.
【０００３】さらに、エポキシ樹脂組成物の熱膨張係数
をチップの熱膨張係数に近づけるため、シリカの含有量
を増加とシリコーン等の可撓剤の添加により熱膨張係数
を低くし、内部応力を緩和することが試みられている。
しかし、シリコーン等を添加すると内部応力の低下は認
められるものの、連続して成形を行った際に成形金型に
曇りが発生し易く、成形品に外観不良を起こしやすい欠
点がある。Further, in order to bring the thermal expansion coefficient of the epoxy resin composition close to that of the chip, the thermal expansion coefficient is lowered by increasing the content of silica and adding a flexible agent such as silicone to relieve the internal stress. Is being attempted.
However, although a decrease in internal stress is observed when silicone or the like is added, there is a drawback in that the molding die is liable to fog during continuous molding, and the appearance of the molded product tends to be poor.
【０００４】[0004]
【発明が解決しようとする課題】本発明は上述の事実に
鑑みてなされたもので、その目的とするところは、連続
して成形を行っても成形金型に曇りが発生せず、且つ、
耐熱性、耐湿性が良好な封止用エポキシ樹脂組成物を提
供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned facts, and an object thereof is to prevent fog from being generated in a molding die even when molding is continuously performed, and
An object of the present invention is to provide an epoxy resin composition for encapsulation which has good heat resistance and moisture resistance.
【０００５】[0005]
【課題を解決するための手段】本発明の請求項１に係る
封止用エポキシ樹脂組成物は、エポキシ樹脂、及び、硬
化剤を含有する封止用エポキシ樹脂組成物であって、上
記硬化剤が、フェノール性水酸基を有するフェノール類
と反応して得られたメラミン変性ノボラック樹脂と、フ
ェノールノボラック樹脂とを構成材料とし、且つ、上記
メラミン変性ノボラック樹脂の重量をＡ、上記フェノー
ルノボラック樹脂の重量をＢとすると、Ｂに対するＡの
比率（Ａ／Ｂ）が０．２〜０．８の範囲であることを特
徴とする。The epoxy resin composition for encapsulation according to claim 1 of the present invention is an epoxy resin composition for encapsulation containing an epoxy resin and a curing agent, wherein the curing agent is the above-mentioned curing agent. Is composed of a melamine-modified novolac resin obtained by reacting with phenols having a phenolic hydroxyl group and a phenol novolac resin, and the weight of the melamine-modified novolac resin is A and the weight of the phenol novolac resin is Assuming B, the ratio of A to B (A / B) is in the range of 0.2 to 0.8.
【０００６】本発明の請求項２に係る封止用エポキシ樹
脂組成物は、請求項１記載の封止用エポキシ樹脂組成物
において、上記エポキシ樹脂の重量をＣとすると、Ｃに
対する上記メラミン変性ノボラック樹脂とフェノールノ
ボラック樹脂の総重量（Ａ＋Ｂ）の比率が０．２０〜
１．１０の範囲であることを特徴とする。The epoxy resin composition for encapsulation according to claim 2 of the present invention is the epoxy resin composition for encapsulation according to claim 1, wherein C is the weight of the epoxy resin and the melamine-modified novolac is relative to C. The ratio of the total weight of resin and phenol novolac resin (A + B) is 0.20
It is characterized in that the range is 1.10.
【０００７】以下、本発明を詳細に説明する。本発明の
封止用エポキシ樹脂組成物はエポキシ樹脂を含有する。
上記エポキシ樹脂としては、例えば、フェノールノボラ
ック型エポキシ樹脂、クレゾールノボラック型エポキシ
樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノー
ルＦ型エポキシ樹脂、ビフェニル型エポキシ樹脂、難燃
性の高いブロム化エポキシ樹脂等が挙げられる。これら
は単独、あるいは２種以上を併用して使用される。Hereinafter, the present invention will be described in detail. The encapsulating epoxy resin composition of the present invention contains an epoxy resin.
Examples of the epoxy resin include a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, a biphenyl type epoxy resin, and a brominated epoxy resin having high flame retardancy. . These may be used alone or in combination of two or more.
【０００８】本発明の構成材料として、特徴的に用いら
れる硬化剤は、フェノール性水酸基を有するフェノール
類と反応して得られたメラミン変性ノボラック樹脂と、
フェノールノボラック樹脂とからなる。A curing agent characteristically used as a constituent material of the present invention is a melamine-modified novolak resin obtained by reacting with a phenol having a phenolic hydroxyl group,
It consists of phenol novolac resin.
【０００９】上記メラミン変性ノボラック樹脂の作製に
用いられるフェノール類は、例えば、フェノール、クレ
ゾール、ナフトール、カテコール、レゾルシン、ヒドロ
キシン、ピロガロール等が挙げられる。上記フェノール
類１モルに対し、ホルムアルデヒド０．３〜０．７モル
をｐＨ３以下で反応させた後に、メラミン０．１〜０．
２モルとホルムアルデヒド０．１〜０．２モルを加え、
ｐＨ８以上で反応させることにより、上記メラミン変性
ノボラック樹脂が得られる。上記メラミン変性ノボラッ
ク樹脂は反応の途中または反応後に水洗いを行ったり、
反応後に水蒸気蒸留を行って、未反応物等の不純物を除
去することが望ましい。この不純物の除去により、Ｔｇ
の低下を防止することができる。Examples of the phenols used for producing the melamine-modified novolac resin include phenol, cresol, naphthol, catechol, resorcin, hydroxyl, pyrogallol and the like. After reacting 0.3 to 0.7 mol of formaldehyde at a pH of 3 or less with 1 mol of the above phenols, melamine 0.1 to 0.
2 mol and formaldehyde 0.1-0.2 mol are added,
The above melamine-modified novolak resin can be obtained by reacting at pH 8 or higher. The melamine-modified novolac resin may be washed with water during or after the reaction,
After the reaction, steam distillation is preferably performed to remove impurities such as unreacted substances. By removing this impurity, Tg
Can be prevented.
【００１０】上記メラミン変性ノボラック樹脂と共に硬
化剤として、フェノールノボラック樹脂を含有する。本
発明においては、上記メラミン変性ノボラック樹脂の重
量をＡ、上記フェノールノボラック樹脂の重量をＢとす
ると、Ｂに対するＡの比率（Ａ／Ｂ）が０．２〜０．８
の範囲である。この範囲で上記メラミン変性ノボラック
樹脂とフェノールノボラック樹脂とを含有することによ
り、連続して成形を行っても成形金型に曇りが発生せ
ず、且つ、耐熱性、耐湿性が良好な封止用エポキシ樹脂
組成物が得られる。上記重量比（Ａ／Ｂ）が０．２未満
であると、耐熱性が低下すると共に成形金型に曇りが発
生し易く、上記重量比（Ａ／Ｂ）が０．８を超えると耐
湿性が低下する。A phenol novolac resin is contained as a curing agent together with the melamine-modified novolac resin. In the present invention, when the weight of the melamine-modified novolac resin is A and the weight of the phenol novolac resin is B, the ratio of A to B (A / B) is 0.2 to 0.8.
Range. By containing the melamine-modified novolac resin and the phenol novolac resin in this range, the molding die does not fog even when continuously molded, and the heat resistance and moisture resistance are good for sealing. An epoxy resin composition is obtained. If the weight ratio (A / B) is less than 0.2, heat resistance is lowered and the mold tends to fog, and if the weight ratio (A / B) exceeds 0.8, the moisture resistance is high. Is reduced.
【００１１】また、上記エポキシ樹脂の重量をＣとする
と、このエポキシ樹脂の重量Ｃに対し、上記メラミン変
性ノボラック樹脂とフェノールノボラック樹脂の総重量
（Ａ＋Ｂ）の比率が０．２０〜１．１０の範囲であるこ
とが好ましい。If the weight of the epoxy resin is C, the ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to the weight C of the epoxy resin is 0.20 to 1.10. It is preferably in the range.
【００１２】本発明の封止用エポキシ樹脂組成物は、上
述の成分と共に、必要に応じて、充填剤、硬化促進剤、
可撓剤、難燃化剤、離型剤、着色剤、表面処理剤等を適
宜含有する。上記充填剤としては、シリカ、窒化ケイ
素、アルミナ等が挙げられ、上記硬化促進剤としては、
第３級アミン、イミダゾール類、有機ホスフィン等が挙
げられ、上記可撓剤としてはシリコーンが挙げられ、上
記難燃化剤としては、三酸化アンチモン、水和アルミナ
等が挙げられ、上記離型剤としては、カルナバワック
ス、ステアリン酸、ステアリン酸塩等が挙げられ、上記
着色剤としては、カーボンブラック、金属酸化物等の顔
料等が挙げられる。上記表面処理剤としては、シランカ
ップリング剤、有機チタネート等が挙げられる。The encapsulating epoxy resin composition of the present invention contains, if necessary, a filler, a curing accelerator, and
A flexible agent, a flame retardant, a release agent, a coloring agent, a surface treatment agent, etc. are appropriately contained. Examples of the filler include silica, silicon nitride, alumina and the like, and as the curing accelerator,
Examples include tertiary amines, imidazoles, and organic phosphines, examples of the flexible agent include silicone, examples of the flame retardant include antimony trioxide, hydrated alumina, and the like. Examples thereof include carnauba wax, stearic acid, stearates, and the like, and examples of the colorant include carbon black, pigments such as metal oxides, and the like. Examples of the surface treatment agent include silane coupling agents and organic titanates.
【００１３】上述の配合成分をミキサ、ブレンダー等を
用いて均一に混合した後に、ニーダー、ロール等を用い
て混練して本発明の封止用エポキシ樹脂組成物が得られ
る。なお、混練した後に、必要に応じて冷却固化し、粉
砕して粉状としたり、粒状にして用いられる。The above-mentioned compounding ingredients are uniformly mixed by using a mixer, a blender or the like, and then kneaded by using a kneader, a roll or the like to obtain the encapsulating epoxy resin composition of the present invention. After kneading, it is cooled and solidified if necessary, and pulverized into powder or granules for use.
【００１４】[0014]
実施例１ メラミン変性ノボラック樹脂を次のようにして作製し
た。フェノール１モルに対し、ホルムアルデヒド０．３
モルと１Ｎ塩酸を加え、ｐＨ３の条件で反応させた後
に、メラミン０．２モルとホルムアルデヒド０．２モル
を加え、ｐＨ１０の条件で反応させることにより、上記
メラミン変性フェノールノボラック樹脂を得た。Example 1 A melamine-modified novolak resin was prepared as follows. Formaldehyde 0.3 against 1 mol of phenol
The above melamine-modified phenol novolac resin was obtained by adding 1 mol of hydrochloric acid and 1N hydrochloric acid and reacting under the condition of pH 3, then adding 0.2 mol of melamine and 0.2 mol of formaldehyde and reacting under the condition of pH 10.
【００１５】封止用エポキシ樹脂組成物は次のとおり作
製した。エポキシ樹脂として、クレゾールノボラック型
エポキシ樹脂（三菱油化株式会社製：レジンＨ−Ｌ）を
１８．０重量部（以下部と記す）、難燃性のエポキシ樹
脂としてビスフェノールＡ型エポキシ樹脂をブロム化し
たブロム化エポキシ樹脂（東都化成株式会社製：ＹＤＢ
４００）を２．０部、硬化剤として上記メラミン変性フ
ェノールノボラック樹脂を３．０部、フェノールノボラ
ック樹脂（荒川化学株式会社製：タマノール７５８）を
８．０部、充填剤として溶融シリカを３００部、硬化促
進剤として２−エチルイミダゾールを０．５部、可撓剤
として、ビニル変性シリコーン（平均重合度３５０）を
０．２部とメチルハイドロゲンシリコーン（平均重合度
６０）を０．２部、難燃化剤として三酸化アンチモンを
２．０部、離型剤として天然のカルナバワックスを２．
０部、着色剤としてカーボンブラックを１．５部、表面
処理剤としてシランカップリング剤を０．２部用いた。
シランカップリング剤に溶融シリカを浸漬し、表面処理
した後に、上記成分を配合し、ミキサで均一に混合し
た。その後、ニーダーで混練し、封止用エポキシ樹脂組
成物を得た。The epoxy resin composition for encapsulation was prepared as follows. As an epoxy resin, 18.0 parts by weight (hereinafter referred to as "part") of a cresol novolac type epoxy resin (manufactured by Mitsubishi Petrochemical Co., Ltd.) (hereinafter referred to as "part"), and a bisphenol A type epoxy resin as a flame-retardant epoxy resin are brominated. Brominated epoxy resin (manufactured by Tohto Kasei Co., Ltd .: YDB
400) 2.0 parts, 3.0 parts of the melamine-modified phenol novolac resin as a curing agent, 8.0 parts of phenol novolac resin (Tamanol 758 manufactured by Arakawa Chemical Co., Ltd.), and 300 parts of fused silica as a filler. 0.5 parts of 2-ethylimidazole as a curing accelerator, 0.2 parts of vinyl-modified silicone (average degree of polymerization 350) and 0.2 parts of methylhydrogen silicone (average degree of polymerization 60) as flexible agents, 1. 2.0 parts antimony trioxide as a flame retardant and natural carnauba wax as a release agent
0 part, 1.5 parts of carbon black as a colorant and 0.2 part of a silane coupling agent as a surface treatment agent were used.
Fused silica was dipped in a silane coupling agent, surface-treated, and then the above components were mixed and uniformly mixed with a mixer. Then, the mixture was kneaded with a kneader to obtain an epoxy resin composition for sealing.
【００１６】上記フェノールノボラック樹脂に対する、
上記メラミン変性ノボラック樹脂の重量比（Ａ／Ｂ）は
０．３７５であり、エポキシ樹脂に対する、上記メラミ
ン変性ノボラック樹脂とフェノールノボラック樹脂の総
重量（Ａ＋Ｂ）の比率は０．５５であった。For the above phenol novolac resin,
The weight ratio (A / B) of the melamine-modified novolac resin was 0.375, and the ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to the epoxy resin was 0.55.
【００１７】実施例２ メラミン変性ノボラック樹脂を次のようにして作製し
た。カテコール１モルに対し、ホルムアルデヒド０．３
モルと１Ｎ塩酸を加え、ｐＨ２．６の条件で反応させた
後に、メラミン０．２モルとホルムアルデヒド０．２モ
ルを加え、ｐＨ１０の条件で反応させることにより、上
記メラミン変性カテコールノボラック樹脂を得た。Example 2 A melamine-modified novolak resin was prepared as follows. Formaldehyde 0.3 against 1 mol of catechol
Mol and 1N hydrochloric acid were added and reacted under the condition of pH 2.6, and then 0.2 mol of melamine and 0.2 mol of formaldehyde were added and reacted under the condition of pH 10 to obtain the melamine-modified catechol novolak resin. .
【００１８】メラミン変性ノボラック樹脂に上記メラミ
ン変性カテコールノボラック樹脂を用いた以外は実施例
１と同様にして封止用エポキシ樹脂組成物を得た。An epoxy resin composition for sealing was obtained in the same manner as in Example 1 except that the melamine-modified catechol novolac resin was used as the melamine-modified novolac resin.
【００１９】上記フェノールノボラック樹脂に対する、
上記メラミン変性ノボラック樹脂の重量比（Ａ／Ｂ）は
０．３７５であり、エポキシ樹脂に対する、上記メラミ
ン変性ノボラック樹脂とフェノールノボラック樹脂の総
重量（Ａ＋Ｂ）の比率は０．５５であった。With respect to the above-mentioned phenol novolac resin,
The weight ratio (A / B) of the melamine-modified novolac resin was 0.375, and the ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to the epoxy resin was 0.55.
【００２０】実施例３ 実施例１の配合割合において、硬化剤として、上記メラ
ミン変性フェノールノボラック樹脂を９．０部、フェノ
ールノボラック樹脂を１２．０部とした以外は実施例１
と同様にして封止用エポキシ樹脂組成物を得た。Example 3 Example 1 except that the melamine-modified phenol novolac resin was 9.0 parts and the phenol novolac resin was 12.0 parts as the curing agent in the compounding ratio of Example 1.
An epoxy resin composition for sealing was obtained in the same manner as in.
【００２１】上記フェノールノボラック樹脂に対する、
上記メラミン変性ノボラック樹脂の重量比（Ａ／Ｂ）は
０．７５０であり、エポキシ樹脂に対する、上記メラミ
ン変性ノボラック樹脂とフェノールノボラック樹脂の総
重量（Ａ＋Ｂ）の比率は１．０５であった。With respect to the above phenol novolac resin,
The weight ratio (A / B) of the melamine-modified novolac resin was 0.750, and the ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to the epoxy resin was 1.05.
【００２２】比較例１ 実施例１の配合割合において、硬化剤として、フェノー
ルノボラック樹脂を１２．０部とした以外は実施例１と
同様にして封止用エポキシ樹脂組成物を得た。Comparative Example 1 An encapsulating epoxy resin composition was obtained in the same manner as in Example 1 except that the compounding ratio of Example 1 was changed to 12.0 parts of phenol novolac resin as a curing agent.
【００２３】比較例２ 実施例１の配合割合において、硬化剤として、上記メラ
ミン変性フェノールノボラック樹脂を１２．０部とした
以外は実施例１と同様にして封止用エポキシ樹脂組成物
を得た。Comparative Example 2 An epoxy resin composition for encapsulation was obtained in the same manner as in Example 1 except that 12.0 parts of the above melamine-modified phenol novolac resin was used as a curing agent in the compounding ratio of Example 1. .
【００２４】比較例３ 実施例１の配合割合において、硬化剤として、上記メラ
ミン変性フェノールノボラック樹脂を１０．０部、フェ
ノールノボラック樹脂を８．０部とした以外は実施例１
と同様にして封止用エポキシ樹脂組成物を得た。Comparative Example 3 Example 1 was repeated except that, in the compounding ratio of Example 1, 10.0 parts of the melamine-modified phenol novolac resin and 8.0 parts of the phenol novolac resin were used as curing agents.
An epoxy resin composition for sealing was obtained in the same manner as in.
【００２５】上記フェノールノボラック樹脂に対する、
上記メラミン変性ノボラック樹脂の重量比（Ａ／Ｂ）は
１．２５０であり、エポキシ樹脂に対する、上記メラミ
ン変性ノボラック樹脂とフェノールノボラック樹脂の総
重量（Ａ＋Ｂ）の比率は０．９０であった。With respect to the above phenol novolac resin,
The weight ratio (A / B) of the melamine-modified novolac resin was 1.250, and the ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to the epoxy resin was 0.90.
【００２６】[0026]
【表１】 [Table 1]
【００２７】[0027]
【表２】 [Table 2]
【００２８】得られた実施例１〜３、及び比較例１〜３
の封止用エポキシ樹脂組成物の連続成形した後の成形品
の外観、耐熱性、及び、耐湿性を評価した。上記封止用
エポキシ樹脂組成物は、常法に従って圧力５０ｋｇ／ｃ
ｍ2 、温度１５０℃で３分間成形し、さらに温度１５０
℃で５時間アフタキュアさせて成形品を得た。The obtained Examples 1 to 3 and Comparative Examples 1 to 3
The appearance, heat resistance, and moisture resistance of the molded product after continuous molding of the encapsulating epoxy resin composition were evaluated. The epoxy resin composition for sealing has a pressure of 50 kg / c according to a conventional method.
m 2 at a temperature of 150 ° C. for 3 minutes and then a temperature of 150
After-curing at 5 ° C. for 5 hours gave a molded product.
【００２９】上記成形品の外観は、１０００回連続成形
した後の成形品の外観を目視検査し、金型の曇りによる
不良の発生の有無を測定した。As for the appearance of the above-mentioned molded product, the appearance of the molded product after 1000 continuous moldings was visually inspected, and the presence or absence of defects due to clouding of the mold was measured.
【００３０】上記成形品の耐熱性は、ガラス転移点（Ｔ
ｇ）の温度を測定した。サーマルメカニカルアナライザ
ー（ＴＭＡ）を用い、直径４ｍｍ高さ１５ｍｍの成形品
を昇温速度５℃／分の条件で測定し、温度−線膨張曲線
を求め、屈曲点をＴｇとした。The heat resistance of the above-mentioned molded product depends on the glass transition point (T
The temperature of g) was measured. A thermal mechanical analyzer (TMA) was used to measure a molded product having a diameter of 4 mm and a height of 15 mm at a temperature rising rate of 5 ° C./min, a temperature-linear expansion curve was determined, and a bending point was defined as Tg.
【００３１】上記成形品の耐湿性は吸湿後の体積抵抗率
を測定した。１２１℃、１００時間プレッシャクッカー
テスト（ＰＣＴ）を行った後に、ＪＩＳ−Ｋ−６９１１
に基づいて、体積抵抗率を測定した。For the moisture resistance of the above-mentioned molded product, the volume resistivity after moisture absorption was measured. After performing a pressure cooker test (PCT) at 121 ° C. for 100 hours, JIS-K-6911
Based on the above, the volume resistivity was measured.
【００３２】結果は表３に示すとおり、実施例１〜３は
いずれも外観は曇りによる不良がなく（○で表記）、Ｔ
ｇは１７０℃以上の高い水準であり、体積抵抗率は１×
１０ 15以上と良好であった。比較例１と比較例３は曇り
による不良が発生（×で表記）し、比較例１はＴｇが１
６０℃以下の低い水準であり、比較例２と比較例３は体
積抵抗率が１×１０15未満と劣っていた。As shown in Table 3, the results of Examples 1 to 3 are
In each case, there is no defect due to cloudy appearance (marked with ○), T
g is a high level of 170 ° C. or higher, and the volume resistivity is 1 ×
10 FifteenThe above was good. Comparative Example 1 and Comparative Example 3 are cloudy
Caused a defect (denoted by x), and Comparative Example 1 has Tg of 1
It is a low level of 60 ° C or lower, and Comparative Examples 2 and 3 are
Product resistivity is 1 × 10FifteenIt was inferior to less than.
【００３３】[0033]
【表３】 [Table 3]
【００３４】[0034]
【発明の効果】本発明の封止用エポキシ樹脂組成物を用
いると、連続して成形を行っても成形金型に曇りが発生
せず、且つ、耐熱性、耐湿性が良好な封止用成形品を得
ることができる。EFFECT OF THE INVENTION When the encapsulating epoxy resin composition of the present invention is used, fog does not occur in the molding die even when molding is continuously carried out, and the encapsulating epoxy resin composition has good heat resistance and moisture resistance. A molded product can be obtained.
Claims (2)
封止用エポキシ樹脂組成物であって、上記硬化剤が、フ
ェノール性水酸基を有するフェノール類と反応して得ら
れたメラミン変性ノボラック樹脂と、フェノールノボラ
ック樹脂とを構成材料とし、且つ、上記メラミン変性ノ
ボラック樹脂の重量をＡ、上記フェノールノボラック樹
脂の重量をＢとすると、Ｂに対するＡの比率（Ａ／Ｂ）
が０．２〜０．８の範囲であることを特徴とする封止用
エポキシ樹脂組成物。1. An epoxy resin composition for encapsulation containing an epoxy resin and a curing agent, wherein the curing agent is a melamine-modified novolac resin obtained by reacting with phenols having a phenolic hydroxyl group. , A phenol novolac resin as a constituent material, and the weight of the melamine-modified novolac resin is A and the weight of the phenol novolac resin is B, the ratio of A to B (A / B)
Is in the range of 0.2 to 0.8, the epoxy resin composition for sealing.
Ｃに対する上記メラミン変性ノボラック樹脂とフェノー
ルノボラック樹脂の総重量（Ａ＋Ｂ）の比率が０．２０
〜１．１０の範囲であることを特徴とする請求項１記載
の封止用エポキシ樹脂組成物。2. When C is the weight of the epoxy resin,
The ratio of the total weight (A + B) of the melamine-modified novolac resin and the phenol novolac resin to C is 0.20.
The epoxy resin composition for encapsulation according to claim 1, wherein the epoxy resin composition is in the range of 1-10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11944595A JPH08311164A (en) | 1995-05-18 | 1995-05-18 | Epoxy resin composition for sealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11944595A JPH08311164A (en) | 1995-05-18 | 1995-05-18 | Epoxy resin composition for sealing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08311164A true JPH08311164A (en) | 1996-11-26 |
Family
ID=14761584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11944595A Withdrawn JPH08311164A (en) | 1995-05-18 | 1995-05-18 | Epoxy resin composition for sealing |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08311164A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005187800A (en) * | 2003-12-01 | 2005-07-14 | Hitachi Chem Co Ltd | Resin composition, and prepreg, metal-clad laminated sheet, and printed-wiring board using the composition |
| JP2007302904A (en) * | 2007-08-09 | 2007-11-22 | Hitachi Chem Co Ltd | Flame-retardant halogen-free epoxy resin composition, prepreg using the same and laminated plate for electric wiring board |
| JP2008013773A (en) * | 2007-08-09 | 2008-01-24 | Hitachi Chem Co Ltd | Flame-retardant non-halogen epoxy resin composition, prepreg using it and laminate for electric wiring boards |
| JP2008195752A (en) * | 2007-02-08 | 2008-08-28 | Nitto Denko Corp | Resin-coated inorganic powder composition for sealing electronic element and tablet for sealing electronic element obtained using the same, and electronic element device |
-
1995
- 1995-05-18 JP JP11944595A patent/JPH08311164A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005187800A (en) * | 2003-12-01 | 2005-07-14 | Hitachi Chem Co Ltd | Resin composition, and prepreg, metal-clad laminated sheet, and printed-wiring board using the composition |
| JP2008195752A (en) * | 2007-02-08 | 2008-08-28 | Nitto Denko Corp | Resin-coated inorganic powder composition for sealing electronic element and tablet for sealing electronic element obtained using the same, and electronic element device |
| JP2007302904A (en) * | 2007-08-09 | 2007-11-22 | Hitachi Chem Co Ltd | Flame-retardant halogen-free epoxy resin composition, prepreg using the same and laminated plate for electric wiring board |
| JP2008013773A (en) * | 2007-08-09 | 2008-01-24 | Hitachi Chem Co Ltd | Flame-retardant non-halogen epoxy resin composition, prepreg using it and laminate for electric wiring boards |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020806 |