JPH08311159A - Epoxy resin composition, its production and semiconductor device using the same - Google Patents

Abstract

PURPOSE: To produce the subject composition, containing an epoxy resin, a curing agent, a curing accelerator and an inorganic filler and further a specific silicone compound and having hygroscopic solder resistance, a high fluidity, good moldability and low thermal expansibility. CONSTITUTION: This epoxy resin composition comprises (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator and (D) an inorganic filler and contains 70-90vol.% component (D) based on the total amount of the composition. In the resin composition, (E) a silicone compound having <=400 epoxy equiv., <=1000cP viscosity at ambient temperature and epoxy functional groups is further contained in an amount of 0.1-2wt.% based on the total amount of the composition. Furthermore, the component (E) is preferably a compound of formula I [R is H, CH3 or benzyl; m denotes the polymerization degree and an integer of 1-3] or a compound of formula II [n denotes the polymerization degree and an integer of 1 or 2]. The composition is obtained by stirring and mixing the component (E) with the components (A) and/or (B) at 90-150 deg.C and then mixing and kneading the resultant mixture with the residual raw polymer components.

Description

Detailed Description of the Invention

[0001]

The present invention relates to electric parts, electronic parts,
Epoxy resin composition for encapsulating semiconductor elements, etc., a method for producing the same, and a semiconductor device using the same, in detail, good moisture absorption solder resistance and high fluidity, good moldability, low thermal expansion The present invention relates to an epoxy resin composition that can have three characteristics at the same time.

[0002]

2. Description of the Related Art Conventionally, an epoxy resin composition used for protecting and encapsulating a semiconductor element mainly contains an epoxy resin, a curing agent, a curing accelerator and an inorganic filler.
This inorganic filler is used for the purpose of reducing the coefficient of thermal expansion and moisture absorption of the epoxy resin composition molded article and improving the solder resistance, but in recent years the concentration of functions of integrated circuits has progressed,
Due to the necessity of increasing the degree of integration, the effect of increasing the size of the element and the like has led to a demand for an epoxy resin composition molded body that further improves the above characteristics and is more excellent in soldering resistance. In order to meet this demand, a method of increasing the content of the amorphous silica powder, which itself has a low coefficient of thermal expansion and a low coefficient of moisture absorption, to reduce the coefficient of thermal expansion and the coefficient of moisture absorption has been investigated. On the other hand, apart from this method, for example, JP-A-61-61
As disclosed in JP-79245-A, a method of reducing stress in an epoxy resin composition by adding a stress reducing agent such as a silicone compound having a low elastic modulus to suppress cracks due to thermal shock, and JP-A-6-220160
As disclosed in Japanese Patent Publication, a silicone-modified epoxy resin obtained by reacting a biphenyl type epoxy resin and a naphthalene type epoxy resin with a silicone compound,
By using an epoxy resin composition containing a dicyclopentadiene type phenolic resin and a naphthalene type novolac resin as a curing agent, improvement of moisture resistance reliability has been studied. However, in the case of the method using a stress reducing agent, if the addition amount is increased, the trade-off of moisture absorption soldering resistance of the semiconductor device and deterioration of moisture resistance reliability occurs, so the addition amount is limited, and the above requirement is satisfied. Had no choice but to increase the content rate of the inorganic filler. However, in the highly filled epoxy resin composition for encapsulation in which the content of the inorganic filler is increased, when the content of the inorganic filler in the epoxy resin composition becomes high, the volume fraction of the resin component is increased. As a result, the wettability of the inorganic filler with respect to the resin component decreases. In addition, the inorganic filler also contains submicron fine particles of 1 μm or less, and since these fine particles have high surface energy, they have a considerably high cohesive property and tend to coagulate and exist in the epoxy resin composition. That is, when the content rate of the inorganic filler is high, the dispersibility of the inorganic filler particles in the epoxy resin composition is lowered, the viscosity at the time of molding is increased, the fluidity is lowered, and voids are formed in the molding package. However, there is a drawback that the moldability is deteriorated. As a result, there arises a problem that the moisture absorption soldering resistance of the semiconductor device, which is supposed to be improved by increasing the filling amount, is impaired. Further, the problems relating to the deterioration of fluidity and moldability could not be solved even by adding a stress reducing agent.

Therefore, even if the content of the inorganic filler is increased, the viscosity of the epoxy resin composition at the time of molding is lowered and a void is not generated in the epoxy resin composition molding package. Has become necessary.
In order to reduce the viscosity at the time of molding the epoxy resin composition, methods for reducing the viscosity of the resin component in the epoxy resin composition have been studied so far. For example, JP-A-3-
As disclosed in Japanese Patent No. 166220, there is seen an example in which a bifunctional or trifunctional epoxy resin having a biphenyl skeleton or a naphthalene skeleton is used as a basic skeleton of the resin. However, in this case, the viscosity during molding is reduced,
Although the resistance to moisture solder was improved, the effect of reducing the occurrence of voids in the molded package was not observed.

[0004]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to maintain good flowability and moldability and to obtain a thermal expansion coefficient of the molded body. A low epoxy resin composition, a method for producing the same, and a semiconductor device using the same are provided.

[0005]

The epoxy resin composition according to claim 1 of the present invention contains an epoxy resin, a curing agent, a curing accelerator and an inorganic filler, and the content of the inorganic filler is an epoxy resin. 70 to 90% by volume based on the total amount of the composition
In the epoxy resin composition, the silicone resin also has a silicone compound having an epoxy functional group having an epoxy group equivalent of 400 or less and a viscosity at room temperature of 1000 centipoise or less, and the content of the silicone compound is relative to the total amount of the epoxy resin composition. And 0.1 to 2% by weight.

An epoxy resin composition according to a second aspect of the present invention is characterized in that the silicone compound is a silicone compound represented by the following general formula and having glycidyl groups at both ends.

[0007]

Embedded image

An epoxy resin composition according to a third aspect of the present invention is characterized in that the silicone compound is a trifunctional or tetrafunctional silicone compound having a glycidyl group in a side chain, which is represented by the following general formula. To do.

[0009]

[Chemical 4]

The method for producing an epoxy resin composition according to claim 4 of the present invention is the method for producing an epoxy resin composition according to any one of claims 1 to 3, wherein: It is characterized in that a pre-mixed product obtained by stirring and mixing a silicone compound and an epoxy resin and / or a curing agent at 90 to 150 ° C. is mixed and kneaded with the remaining raw material of the epoxy resin composition containing an inorganic filler.

A method for producing an epoxy resin composition according to a fifth aspect of the present invention is the method for producing an epoxy resin composition according to any one of the first to third aspects, wherein: It is characterized by mixing and kneading an inorganic filler, which has been surface-treated by adding a silicone compound, together with an epoxy resin, a curing agent and a curing accelerator.

A semiconductor device according to claim 6 of the present invention uses the epoxy resin composition according to any one of claims 1 to 3 to seal a semiconductor element mounted on a lead frame. It is characterized by

The present invention will be described in detail below. The epoxy resin used in the present invention is an epoxy resin having at least two epoxy groups in one molecule, and includes, for example, cresol novolac type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, novolac type epoxy resin, Examples of the epoxy resin include triphenol methane type epoxy resin, biphenyl type epoxy resin, naphthalene ring-containing epoxy resin, brom-containing epoxy resin and glycidyl ester type epoxy resin. The epoxy resin used in the present invention is not particularly limited, but one having a low melt viscosity is preferable. For example, a bifunctional or trifunctional epoxy resin having a biphenyl skeleton or a naphthalene skeleton in the basic skeleton of the resin is used. be able to.

The curing agent used in the present invention is not particularly limited, and a phenol type curing agent, an amine type curing agent, an acid anhydride curing agent and the like can be used, but an epoxy resin composition having a low moisture absorption rate and high reliability. For this purpose, it is desirable to use a phenolic curing agent having two or more phenolic hydroxyl groups in the molecule and having a low melt viscosity, and examples thereof include phenol novolac resin, cresol novolac resin and polyfunctional phenol resin.

In the present invention, as the curing accelerator, for example, triphenylphosphine and its derivative, imidazole and its derivative, diazabicycloundecene, tetraphenylphosphonium, tetraphenylborate, and 3 are used.
A primary amine or the like can be used.

The material of the inorganic filler used in the present invention is not particularly limited, but amorphous silica such as fused silica, crystalline silica, alumina and silicon nitride can be exemplified. It is desirable to use amorphous silica in order to reduce the coefficient of thermal expansion of the molded product of the epoxy resin composition. In addition, the content of the inorganic filler is 70 to 70% with respect to the total amount of the epoxy resin composition.
It must be 90% by volume. That is, the content of the inorganic filler is 70% with respect to the total amount of the epoxy resin composition.
If it is less than 90% by volume, the effect of lowering the coefficient of linear expansion and lowering of moisture absorption of the obtained molded article cannot be sufficiently obtained, and if it exceeds 90% by volume, the viscosity at the time of molding increases and the fluidity Tends to decrease, the number of voids in the molded package increases, and the moldability tends to decrease.

In the epoxy resin composition of the present invention, in addition to the above components, if necessary, a release agent such as carnauba wax, stearic acid, a flame retardant such as brominated epoxy resin and antimony trioxide, carbon black, etc. The pigment, the coupling agent such as epoxy silane, or the like may be added. In the case of adding a coupling agent, it is also possible to use the one in which only the inorganic filler is surface-treated in advance with the coupling agent.

The epoxy resin composition for encapsulation according to the present invention has an epoxy group equivalent of 400 or less and room temperature (about 25 ° C.).
It is also necessary to include a silicone compound having an epoxy functional group, the viscosity of which is 1000 centipoise or less. This is because this silicone compound not only lowers the viscosity of the entire composition but also dissolves in the resin component and reduces the interfacial tension between the amorphous silica particles in the composition and the epoxy resin. Is. That is,
When the epoxy group equivalent exceeds 400, the silicone chain portion becomes large, the affinity with the resin component decreases, and the surface active effect decreases. Therefore, it is desirable that the epoxy group equivalent is small and the affinity with the resin component is high. When the viscosity exceeds 1000 centipoise, the silicone compound itself has a high molecular weight, the dispersibility in the resin component is lowered, and the viscosity of the entire resin component is increased.

It is necessary that the content of this silicone compound is 0.1 to 2% by weight based on the total amount of the epoxy resin composition. That is, when the content of the silicone compound is less than 0.1% by weight based on the total amount of the epoxy resin composition, the effect as a surfactant or a viscosity reducing agent is small, and when it exceeds 2% by weight. The excess component that does not contribute to the surfactant effect remains nonuniformly as a liquid component. The presence of such a heterogeneous phase causes an increase in the moisture absorption rate of the epoxy resin composition molded article, a decrease in the glass transition temperature and a decrease in bending strength, and a semiconductor device using such an epoxy resin composition has a moisture absorption rate. The solder resistance and the like will be reduced.

The silicone compound used in the present invention is a silicone compound represented by the above general formula and having a glycidyl group at both ends, or a trifunctional or tetrafunctional silicone having a glycidyl group in the side chain represented by the above general formula. It is preferably a compound. For example, the epoxy group equivalent represented by the above general formula is 180, the silicone compound having a glycidyl group at both ends having a viscosity of 10 centipoise at room temperature, the epoxy group equivalent represented by the above general formula is 200, and the viscosity at room temperature is A silicone compound having a glycidyl group in the side chain of 70 centipoise is particularly desirable.

The method for producing an epoxy resin composition according to the present invention is an epoxy resin composition containing an inorganic filler in a premixed product prepared by stirring and mixing the silicone compound, the epoxy resin and the curing agent at 90 to 150 ° C. It is preferable to mix and knead with the rest of the raw materials. That is, in the epoxy resin composition, for example, only the epoxy resin, which is a part of the raw material of the epoxy resin composition, the curing agent, and the silicone compound having a glycidyl group are preliminarily rotated and sheared at 90 to 150 ° C. After melting with a disper, a homomixer, etc., the premixed product that has been uniformly mixed and processed is cooled and solidified, crushed to 16 mesh under, and then added to the remaining raw material of the epoxy resin composition containing an inorganic filler,
By mixing and kneading to obtain an epoxy resin composition,
The melt viscosity during molding of the epoxy resin composition can be further reduced. This is because the compatibilized state of the silicone compound having a glycidyl group in the epoxy resin component can be further enhanced. That is, when the epoxy resin, the curing agent and the silicone compound having a glycidyl group are mixed by stirring at less than 90 ° C., it is difficult to melt, and when the temperature exceeds 150 ° C., heat mixing causes the epoxy resin and the curing agent to be mixed. This is not preferable because the reaction is accelerated and the melt viscosity of the heated mixture increases.

In the method for producing an epoxy resin composition according to the present invention, it is preferable to mix and knead the inorganic filler surface-treated with the silicone compound, together with the epoxy resin, the curing agent and the curing accelerator. That is, based on the total amount of the epoxy resin composition, for example, 0.1 to 2% by weight
The melt viscosity at the time of molding the epoxy resin composition can be further reduced by spraying the silicone compound having a glycidyl group on the inorganic filler and using the surface-treated inorganic filler. By previously treating the inorganic filler surface with a silicone compound having a glycidyl group forcibly, the affinity between the epoxy resin and the inorganic filler can be improved, and the dispersibility of the inorganic filler particles themselves can be improved. is there.

A semiconductor device according to the present invention is formed by encapsulating a semiconductor element mounted on a lead frame using the epoxy resin composition, and the content of the inorganic filler in terms of true specific gravity. 7 for the total amount of epoxy resin composition
Since an epoxy resin composition having a high flowability of 0 to 90% by volume is used, voids are less likely to occur during molding, and the semiconductor device has high resistance to moisture solder.

[0024]

The epoxy resin composition according to claims 1 to 3 of the present invention also contains a silicone compound having an epoxy functional group, which has an epoxy group equivalent of 400 or less and a viscosity at room temperature of 1000 centipoise or less, Since the content of the silicone compound is 0.1 to 2% by weight based on the total amount of the epoxy resin composition, not only the viscosity of the entire composition is reduced, but also the resin is dissolved in the resin component and It reduces the interfacial tension between the amorphous silica particles and the epoxy resin.

In the method for producing an epoxy resin composition according to a fourth aspect of the present invention, a premixed product prepared by stirring and mixing a silicone compound, an epoxy resin and / or a curing agent at 90 to 150 ° C. contains an inorganic filler. Since the other raw materials of the epoxy resin composition are mixed and kneaded, the compatibilized state of the silicone compound having a glycidyl group in the epoxy resin component can be increased, and therefore the melt viscosity at the time of molding the epoxy resin composition can be reduced. . That is, when considering the reactivity of the epoxy group in the epoxy compound, generally, the epoxy group in the epoxy resin that binds to the aromatic ring reacts more than the epoxy group in the silicone compound that has a glycidyl group that binds to silicon (Si). It is thought to be highly effective.
Therefore, when the epoxy resin composition is preliminarily reacted (B-staged) in the kneading step during production, the epoxy resin reacts with the curing agent, and the silicone compound having a glycidyl group remains unreacted. It will remain in the thing. The silicone compound having a glycidyl group which remains unreacted in the epoxy resin composition is composed of a silicon main chain portion and an epoxy functional group portion, which plays a role of a surfactant between the silica particles and the epoxy resin. Thought to fulfill. It is presumed that this surface-active effect can improve the wettability of the inorganic filler with respect to the resin component and suppress the aggregation of the submicron fine particles, and can reduce the voids in the molded product of the epoxy resin composition.

In the method for producing an epoxy resin composition according to claim 5 of the present invention, the inorganic filler surface-treated with the silicone compound is mixed and kneaded together with the epoxy resin, the curing agent and the curing accelerator. Since the affinity between the epoxy resin and the inorganic filler can be improved and the dispersibility of the inorganic filler particles themselves can be improved, the melt viscosity at the time of molding the epoxy resin composition can be further reduced.

A semiconductor device according to claim 6 of the present invention uses the epoxy resin composition according to any one of claims 1 to 3 to seal a semiconductor element mounted on a lead frame. Therefore, since the content of the inorganic filler is as high as 70 to 90% by volume based on the total amount of the epoxy resin composition in terms of true specific gravity and the epoxy resin composition having good fluidity is used, voids are formed at the time of molding. Is less likely to occur, and the semiconductor device has high resistance to moisture.

[0028]

EXAMPLES The present invention will be specifically described below with reference to examples.

(Examples 1 to 6 and Comparative Examples 1 to 8) The following raw materials were used in the amounts shown in Tables 1 and 2. As an epoxy resin, epoxy equivalent 190,15
Bifunctional biphenyl type epoxy resin having a melt viscosity of 0.2 poise at 0 ° C. (manufactured by Yuka Shell Epoxy Co .; product number YX-4
000H) or an epoxy equivalent of 195, a polyfunctional orthocresol novolac type epoxy resin having a melt viscosity of 6 poises at 150 ° C. (Sumitomo Chemical Co., Ltd .; product number ESCN-195).
XL4) as a curing agent, hydroxyl equivalents 175, 150
A phenol aralkyl type curing agent having a melt viscosity of 2 poises at 0 ° C. (manufactured by Mitsui Toatsu Co., Ltd .; product number XL225-3L) and triphenylphosphine (hereinafter referred to as TPP) manufactured by Kitako Chemical Co., Ltd. as a curing accelerator, As a coupling agent
Epoxysilane-based coupling agent (manufactured by Nippon Unicar;
The product number A-187) is used as a silicone compound and has a epoxy equivalent of 180 and a viscosity of 10 centipoise at room temperature (25 ° C.) and a bifunctional dimethyl silicone compound having glycidyl groups at both ends (manufactured by Shin-Etsu Chemical Co., Ltd .; product number X22-20).
62), a methyl silicone compound having a glycidyl group in the side chain having an epoxy equivalent of 200 and a viscosity of 70 centipoise at room temperature (Shin-Etsu Chemical Co., Ltd .; product number X22-2070),
Polymethoxypolysiloxane with a viscosity of 10 centipoise at room temperature (Mitsubishi Chemical Co .; product number MS51), polydimethylsiloxane having an alicyclic epoxy in the side chain with an epoxy equivalent of 340 and a viscosity of 6000 centipoise at room temperature (Shin-Etsu Chemical Co., Ltd.) ; Part number KF103) or epoxy equivalent 950
At room temperature, a polydimethylsiloxane having a glycidyl group at both ends and a viscosity of 30 centipoise (manufactured by Shin-Etsu Chemical Co., Ltd .; product number X22-163A) was used.

As the inorganic filler, an amorphous silica powder having a true specific gravity of 2.2 (manufactured by Denki Kagaku Kogyo; product number FB60) is wet-classified to 20 μm or more (hereinafter referred to as S1). Amorphous silica powder having a true specific gravity of 2.2 (manufactured by Denki Kagaku Kogyo Co., Ltd .; product number FB60) was wet classified to 5 μm or more and 30 μm or less (hereinafter referred to as S2), true specific gravity of 2.2. Amorphous silica powder (hereinafter referred to as S3) obtained by wet classification of amorphous silica powder (product number: FB48, manufactured by Denki Kagaku Kogyo Co., Ltd.) to 3 μm or less in a weight ratio of S1: S.
The mixture used in advance at a ratio of 2: S3 = 70: 20: 10 was used.

As the flame retardant, 4 parts by weight of antimony trioxide (manufactured by Mitsubishi Materials; product number Sb ₂ O ₃ -LS) is used, 1.2 parts by weight of natural carnauba wax is used as the release agent, and the pigment is used. , Carbon black (manufactured by Mitsubishi Materials; product number 750-B) was used at a ratio of 0.8 parts by weight. The respective raw materials were blended in a ratio of parts by weight shown in Table 1 and Table 2, the resulting blends were mixed, further kneaded at 90 ° C. for 6 minutes using a mixing roll, pulverized after cooling, An epoxy resin composition for sealing was obtained.

In Example 5, a silicone compound (manufactured by Shin-Etsu Chemical Co., Ltd .; product number X22-2062), an epoxy resin and a curing agent were mixed by stirring at 100 ° C. to obtain a premixed product. Is mixed with the remaining raw materials of the epoxy resin composition containing an inorganic filler, and further,
Knead for 6 minutes at 90 ° C using a mixing roll,
After cooling, it was pulverized to obtain a sealing epoxy resin composition. In Example 6, an inorganic filler which was surface-treated by adding a silicone compound (manufactured by Shin-Etsu Chemical Co., Ltd .; product number X22-2062) was used.

The obtained epoxy resin composition for sealing was transfer-injected into a mold heated to 175 ° C. and cured, and a molded product was obtained by transfer molding.

Using each of the above-obtained sealing epoxy resin compositions and molded articles, gel time, melt viscosity, spiral flow, coefficient of thermal expansion, 72-hour moisture absorption rate, glass transition temperature,
Formability (number of voids with poor molding), wet solder resistance (wet solder resistance peeling occurrence count and wet solder resistance crack occurrence count)
Was measured and the results are shown in the evaluation columns of Tables 1 and 2.
The gel time was adjusted to about 25 ± 5 seconds.

[0035]

[Table 1]

[0036]

[Table 2]

The measured values shown in Tables 1 and 2 are
By the following method. (1) Gel time The gel time was measured at a mold surface temperature of 175 ° C. using a gel time measuring machine (manufactured by Orientec Co., Ltd .; trade name: Curalastometer V type). (2) Melt viscosity flow tester (manufactured by Shimadzu Corporation; trade name CFT500)
A type) was used to determine the minimum melt viscosity at a temperature of 175 ° C., a load of 10 kgf, and a nozzle size φ1 mm × 10 mm. (3) Spiral flow In conformity with the EMMI standard, a mold for exclusive use of spiral flow was used to measure the flow length of the sample during transfer molding at 175 ° C. (4) Coefficient of thermal expansion Dedicated mold for making JIS test pieces, 175 ° C, 90
After transfer molding for 2 seconds, after-curing was performed at 175 ° C. for 6 hours to obtain a test piece. About this test piece, using a TMA device (manufactured by Rigaku Denki Co., Ltd .; TAS100 system, trade name), it was measured under a compressive load of 1 g at a temperature rising rate of 5 ° C./min. The thermal expansion coefficient (α1) was calculated. (5) Moisture absorption rate of 72 hours The moisture absorption rate of the composition molded body is 175 with a dedicated mold for disk molding.
After transfer molding at 90 ℃ for 90 seconds, diameter 50
mm, thickness 3 μm disk-shaped sample, 85 ℃ /
It was calculated from the weight increase rate of the sample after 85% / 72 hours. (6) Glass transition temperature The glass transition temperature of the molded composition was determined from the temperature at the inflection point of the expansion curve using the above thermal expansion coefficient measurement chart. (7) Moldability The moldability was evaluated by determining the number of voids generated in the molded package. The evaluation package consists of a 42 alloy frame with a silicon chip mounted and an external dimension of 1
The material was prepared by transfer molding using a mold for an 8 × 14 × 3.0 mm thick 60QFP package. The molding conditions are a temperature of 175 ° C., an injection time of 12 seconds, and a pressurization time of 9
The injection pressure is 70 kg / cm ² for 0 seconds. Molded product 17
After curing at 5 ℃ for 6 hours, 60Q for performance evaluation
FP was obtained. Voids inside the package are ultrasonic probe (Canon;
Observed under the trade name M-700), and the diameter was 1 in the chart obtained.
The number of void images of mm or more was counted. (8) Moisture resistance Solder 6 on a 42 alloy frame with silicon chips
Transfer molding was performed using a mold for a 0QFP package. The molding conditions are a temperature of 175 ° C., an injection time of 12 seconds,
The pressing time is 90 seconds and the injection pressure is 70 kg / cm ² . The molded product was after-cured at 175 ° C. for 6 hours to obtain 4 packages of 60QFP for performance evaluation. 60 QFP to 85
After leaving it under the conditions of 165 hours for 85 ° C., the composition molded body was peeled off from the chip, the frame, and the die pad, and the number of packages in which cracks were generated in the composition molded body was counted and evaluated.

As a result of Tables 1 and 2, Examples 1 to 6 are shown.
As described above, according to the present invention, as compared with Comparative Examples 1 to 8, an epoxy resin composition was obtained which can provide a molded product having excellent moldability and moisture-resistant soldering property.

[0039]

According to the epoxy resin composition of the first to third aspects of the present invention, not only the viscosity of the entire composition is lowered, but also the resin composition is dissolved in the resin component to be amorphous. Since the interfacial tension between the silica particles and the epoxy resin is reduced, it is possible to obtain a molded product that maintains good fluidity and moldability and has a low thermal expansion coefficient of the molded product.

According to the method for producing an epoxy resin composition according to the fourth aspect of the present invention, the melt viscosity at the time of molding the epoxy resin composition can be reduced, and the wettability of the inorganic filler with respect to the resin component can be improved by the surface action. Since the aggregation of the submicron fine particles can be suppressed and the voids in the molded product of the epoxy resin composition can be reduced, the epoxy resin composition having more excellent moldability can be obtained.

According to the method for producing an epoxy resin composition according to claim 5 of the present invention, the affinity between the epoxy resin and the inorganic filler can be improved, and the dispersibility of the inorganic filler particles themselves can be improved. Since the melt viscosity at the time of molding the resin composition can be further reduced, an epoxy resin composition having further excellent moldability can be obtained.

According to the semiconductor device of the sixth aspect of the present invention, the content of the inorganic filler is as high as 70 to 90% by volume based on the total amount of the epoxy resin composition in terms of true specific gravity, and the fluidity is good. Since the epoxy resin composition is used, voids are unlikely to occur during molding, and the moisture resistance is excellent.

Claims (6)

[Claims] 1. An epoxy resin composition containing an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler, the content of the inorganic filler being 70 to 90% by volume based on the total amount of the epoxy resin composition. In addition, it also contains a silicone compound having an epoxy functional group having an epoxy group equivalent of 400 or less and a viscosity at room temperature of 1000 centipoise or less, and the content of the silicone compound is 0.1 to 0.1% with respect to the total amount of the epoxy resin composition. The epoxy resin composition is 2% by weight. 2. The epoxy resin composition according to claim 1, wherein the silicone compound is a silicone compound represented by the following general formula and having glycidyl groups at both ends. Embedded image 3. The trifunctional or tetrafunctional silicone compound having a glycidyl group in a side chain represented by the following general formula:
The epoxy resin composition according to claim 1, which is a functional silicone compound. Embedded image 4. The method for producing an epoxy resin composition according to any one of claims 1 to 3, wherein the silicone compound and the epoxy resin and / or the curing agent are contained at 90 to 150 ° C. A method for producing an epoxy resin composition, which comprises mixing and kneading the premixed product obtained by stirring and mixing in step 1) with the remaining raw material of the epoxy resin composition containing an inorganic filler. 5. The method for producing an epoxy resin composition according to any one of claims 1 to 3, wherein the inorganic filler surface-treated by adding the silicone compound is epoxy. A method for producing an epoxy resin composition, which comprises mixing and kneading with a resin, a curing agent and a curing accelerator. 6. A semiconductor device, comprising a semiconductor element mounted on a lead frame, which is encapsulated with the epoxy resin composition according to any one of claims 1 to 3.