JPH08310025A - Manufacture of glazed ceramic board - Google Patents

Abstract

PURPOSE: To enhance printing quality by a method wherein the accuracy of the surface of a glass glazing layer is enhanced. CONSTITUTION: This manufacturing method includes a process for forming a glass layer on the surface of a ceramic board, a process for forming a resist at a predetermined position of the glass layer, a process for etching the glass layer, a process for immersing the board after being etched in a polarized organic solvent having the vapour pressure at 25 deg.C of 200mmHg or higher, a process for drying the board immersed in the organic solvent in the air, a process for washing the board after being dried and a process for treating the washed board under heat at 900-1,200 deg.C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a glazed ceramic substrate, and more particularly to a method for manufacturing a glazed ceramic substrate coated with a glaze layer having partial protrusions.

[0002]

2. Description of the Related Art A glazed ceramic substrate having a ceramic substrate coated with a glass layer is used as an electronic circuit substrate for a thermal printer head. Particularly for high-performance printing machines such as high printing quality and high-speed printing, a glazed ceramic substrate coated with a glaze layer having convex portions with a constant curvature is used.

The above substrate is manufactured by the following procedure.
First, a glass layer is formed on the surface of a ceramic substrate such as alumina by a printing method or the like, and the glass layer is heated to form a smooth glass layer. Then, a resin is applied to a predetermined position on the surface of the glass layer to form a resist film. Etching is performed by immersing this substrate in an etchant made of hydrofluoric acid or a mixed acid containing hydrofluoric acid to corrode the glass layer other than the portion where the resist film is formed. After etching, a corroded etching residue remains, which is soaked in water or an organic solvent for several minutes and then removed by ultrasonic cleaning or the like.

After removing the etching residue, it is further washed with an organic solvent or ultrapure water. After washing, dry it to 900
By performing heat treatment at a temperature of up to 1200 ° C., a glaze ceramic substrate coated with a glaze layer having convex portions with a constant curvature is produced.

[0005]

However, in the method of removing the etching residue after the immersion in water or the organic solvent, the etchant remaining in the residue is eluted in the water or the organic solvent. The eluted etchant peels off the resist film, corrodes up to the glass layer on the lower surface of the resist film, and causes unevenness with a thickness of several μm on the surface of the glaze layer after heat treatment. These irregularities cause a curvature accuracy defect, which in turn leads to a deterioration in print quality when the substrate is used in a printing machine.

[0006]

Therefore, as a result of repeated studies to solve the above problems, the substrate after being immersed in the etchant is immersed at 25 ° C. in an organic solvent having a polarity with a vapor pressure of 200 mmHg or more for several seconds. Then, it was found that the etching residue can be completely removed by drying it in the air.

Therefore, when this method is used, the resist does not peel off when the etchant is removed with water or an organic solvent, so that the glass layer is not corroded and the glass surface after heat treatment is not uneven.

That is, the gist of the present invention is to provide a method for forming a partial protrusion by chemically etching a part of a glass layer formed smoothly on a ceramic substrate, wherein the substrate after etching is vapor-pressured at 25 ° C. Is immersed in an organic solvent having a polarity of 200 mm or more and then dried in the atmosphere to completely remove the etching residue.

[0009]

According to the present invention, after the etched substrate is taken out from the etchant, the vapor pressure is 20 at 25 ° C.
By soaking in an organic solvent having a polarity of 0 mmHg or more for a few seconds, the etchant which is an acid and the organic solvent become a uniform phase, and when exposed to the atmosphere, it rapidly dries,
The etching residue can be destroyed and removed by the pressure of the steam during the drying.

Vapor pressure of organic solvent at 25 ° C. is 200 mm
The reason why it is Hg or higher is that the drying is slow and the removal of the etching residue is not complete under the Hg.

The reason why the organic solvent needs to be polar is that since a non-polar solvent has no affinity with the etchant, only the organic solvent dries and the etchant cannot be dried sufficiently.
As a result, the etching residue remains as it is.

[0012]

EXAMPLES Examples of the present invention will be described below together with comparative examples. The invention is not limited to this example.

Example 1 285 mm × 60 mm × 1.
A glass layer having a thickness of 60 μm was formed on a 2 mm 96% alumina substrate by a printing method.

The surface of the substrate has a width of 0.2.
mm, 0.5 mm, 0.8 mm, 1.1 mm, 1.4 m
A resist was formed by applying an acid-resistant resist-forming resin in a rectangular shape having m, 1.7 mm, and 2.0 mm and a length of 223 mm. The resist interval was 5 mm. This substrate was etched using hydrofluoric acid as an etchant. After etching, this substrate was immersed in acetone for 5 seconds. Then, when this was taken out into the air and dried, the etching residue could be completely removed. After removing the base resist from which the etching residue has been removed, wash with acetone,
Furthermore, as a finish, cleaning with ultrapure water was performed.

Then, it was heated at 1050 ° C. to give the convex portion a curvature. The surface of the glaze layer after the heat treatment was observed with an optical microscope, but no unevenness was found. <Example 2> Diethyl ether and ethyl methyl ether were used as etching residue removers, the same test as in Example 1 was conducted, and similar results were obtained.

Comparative Example 1 The same test as in Example 1 was conducted using ethyl alcohol, methyl alcohol, isopropyl alcohol and propyl acetate as etching residue removers, but the removal of etching residues was not sufficient.
The surface of the glaze layer had irregularities of about 5 μm.

Comparative Example 2 The same test as in Example 1 was conducted using petroleum benzine as an etching residue removing agent, but the etching residue was not sufficiently removed.

Table 1 shows the saturated vapor pressures of the organic solvents used in the above Examples and Comparative Examples at 25 ° C. In addition,
Only petroleum benzine has no polarity. <Table 1> Acetone 231 mmHg Diethyl ether 534 mmHg Ethyl methyl ether 1465 mmHg Ethyl alcohol 59 mmHg Methyl alcohol 127 mmHg Isopropyl alcohol 45 mmHg Propyl acetate 33 mmHg Petroleum benzine 320 mmHg

[0019]

According to the present invention, the etching residue is completely removed after the glass layer is etched, and as a result, no unevenness is generated on the surface of the glaze layer, and a high-performance glaze ceramic substrate can be obtained.

Claims (1)

[Claims] 1. A method for producing a glaze ceramic substrate by forming a partial convex portion by chemically etching a part of a glass layer formed on a ceramic substrate, and removing the residue after the chemical etching at 25 ° C. Vapor pressure is 20
A method for producing a glaze ceramic substrate, which comprises removing with an organic solvent having a polarity of 0 mmHg or more.