JPH08306730A - Wire bonder - Google Patents

Abstract

PURPOSE: To provide a wire bonder in which the coordinate of bonding point can be taught easily without taking account of the order of bonding by controlling the movement of a capillary according to a bonding order being determined based on edition result information stored in an edition result storing section. CONSTITUTION: The wire bonder comprises a section 20 for storing the teaching coordinate of each bonding point, and a section 19 for storing edition information related to the order of bonding. The wire bonder further comprises a controller 17 for editing the teaching coordinate of each bonding point stored in the coordinate storing section 20 based on the edition information stored in the edition information storing section 19 and setting the bonding order for each bonding point, and a section 21 for storing the edition result information. The controller 17 controls the movement of a capillary 8 according to a bonding order being determined based on edition result information stored in the edition result storing section 21 thus effecting the wire bonding sequentially at respective bonding points.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire bonding apparatus, and more particularly to a wire bonding apparatus capable of suitably teaching a bonding point.

[0002]

2. Description of the Related Art A wire bonding apparatus for bonding each of a plurality of electrodes of a semiconductor pellet, each electrode of a lead frame, and a lead of a lead frame corresponding to each electrode with a wire is used during a bonding operation. The movement order, that is, the bonding order, is preset so that the capillaries do not come into contact with the already bonded wires, and the position coordinates of each bonding point on the electrode and the lead are also set. Teaching is performed according to the bonding order.

[0003]

However, when teaching the coordinates of the bonding points in the bonding order, the teaching can be performed only after the bonding order is determined.

In addition, when a bonding point is added, the teaching of the added bonding point is not performed unless the bonding order of which bonding point is to be bonded next is determined. In addition to being impossible to carry out, the position coordinates of all the bonding points including this additional bonding point had to be re-teached according to the bonding order.

Further, when there are many bonding points and the bonding sequence is complicated, teaching of the coordinates of the bonding points becomes a complicated work.

The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide a wire bonding apparatus capable of easily teaching the position coordinates of a bonding point for bonding without considering the bonding order. And

[0007]

According to a first aspect of the present invention, there is provided a wire bonding apparatus in which a plurality of pairs of bonding points on a body to be bonded are sequentially wire-bonded for each pair using a capillary. A coordinate storage unit that stores teaching coordinates of each bonding point, an edit information storage unit that stores edit information regarding the bonding order of each bonding point, and the coordinate storage based on the edit information stored in the edit information storage unit. A controller for editing the teaching coordinates of each bonding point stored in the unit and giving a bonding order to each bonding point, and an edit result storage unit for storing the edit result information edited by this controller, Further, the control device is configured to perform a bonding function based on the editing result information stored in the editing result storage unit. Move controlling the capillary at the order is obtained by so applying successively wire bonding to each bonding point.

According to a second aspect of the present invention, in addition to the first aspect of the invention, a plurality of types of edit information are stored in the edit information storage section, and the edit by the control device is performed by the edit information storage section. This is based on the editing information selected from the editing information stored in.

[0009]

According to the present invention, there are the following actions. The teaching coordinates stored in the coordinate storage unit are edited based on the editing information regarding the bonding order stored in the editing information storage unit, and the bonding order is given to each bonding point, and the editing result information is stored in the editing result storage unit. Memorized in. During actual bonding, the capillaries are controlled to move in the bonding order based on the editing result information stored in the editing result storage unit, and wire bonding is sequentially performed at each bonding point.

When a plurality of types of edit information are stored in the edit information storage section, the control device edits based on the edit information selected from the edit information.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing an embodiment of the wire bonding apparatus according to the present invention. FIG. 2 is a flowchart showing a teaching operation in the wire bonding apparatus of FIG. FIG. 3 is a plan view of the semiconductor pellet showing a bonding sequence when the semiconductor pellet is divided into two blocks and bonded. FIG. 4 is a plan view of a semiconductor pellet showing a bonding sequence when the semiconductor pellet is divided into four blocks and bonded.

The wire bonding apparatus 1 has a pair of guide rails 4 for guiding the conveyance of the lead frame 3 on which the semiconductor pellets 2 are mounted in the previous step, and on the side of this guide rail 4 corresponding to the bonding area. , X that is movable in the direction of conveyance of the guide rail 4 and in the direction orthogonal to this
The Y table 5 is arranged, and the bonding head 6 is placed on the XY table 5.

A bonding arm 9 and a torch electrode 10 are supported by the bonding head 6, and a capillary 8 through which a wire 7 is inserted is attached to the tip of the bonding arm 9. The bonding arm 9 is moved up and down by an arm driving mechanism (not shown). Further, the torch electrode 10 has its tip movable immediately below the capillary 8 to generate an electric discharge between the wire 7 protruding from the capillary 8 and the torch electrode 10 to form a ball 11 at the tip of the wire 7. To do.

The bonding head 6 has a camera 1
2 is fixedly supported. This camera 12 has a capillary 8
Of the semiconductor pellet 2 and the lead frame 3 can be imaged, and is used for detecting the displacement of the bonding point and teaching the bonding point, as described later. The image captured by the camera 12 is the image processing apparatus 1
It is output to 5.

The image processing device 15 performs image processing of the image captured by the camera 12. Then, this processed image is displayed on the monitor 16 and stored in an image memory (not shown). Further, in the image processing device 15,
Based on the stored data in the image memory and the reference image data set in the reference image memory (not shown) in advance, the positional deviation between the semiconductor pellet 2 and the lead frame 3 is detected by a known pattern matching method or the like.

The control device 17 controls the XY table 5, the bonding arm 9 and the image processing device 15. That is, the control device 17 controls the XY table 5 to move the camera 12, and controls the image processing device 15,
The positional deviation between the semiconductor pellet 2 and the lead frame 3 is detected, and the XY table 5 and the bonding arm 9 are further detected.
Is controlled to wire-bond the corresponding electrode 13 and the bonding point on the lead 14 by the capillary 8.

The control unit 17 is also connected to an operation unit 18, an edit information storage unit 19, a coordinate storage unit 20 and an edit result storage unit 21, and the control unit 17 teaches the bonding order of each bonding point. It has a bonding order editing function that edits together with the coordinates.

The operation unit 18 is operated by an operator and is used for moving the XY table 5 based on the operation amount thereof, and the bonding position coordinates at the time of teaching are stored as coordinates through the control unit 17. The edit information is stored in the unit 20, the edit information described later is stored in the edit information storage unit 19, and a selection signal of the edit information is output to the control device.

The edit information storage unit 19 stores edit information for determining the bonding order to each bonding point so that the capillary 8 during the bonding operation does not contact the already bonded wire. In addition, the editing information storage unit 19 in the present embodiment stores a plurality of types of editing information for each product type such as a semiconductor integrated circuit, so that the editing information used this time is selected by the operation unit 18. Has become.

For example, as shown in FIG. 3, when the number of electrodes 13 of the semiconductor pellet 2 is small, the editing information is divided into two parts, that is, the M area on the left side and the N area on the right side. Based on the teaching coordinates of the respective bonding points of the lead 14 and the lead 14, in the electrode where the position coordinates of the bonding points are in the M region,
When the bonding between the one electrode 13 and the corresponding lead 14 is completed, the adjacent electrodes 13 in the clockwise direction are
In the electrode where the position coordinates of the bonding point exist in the N region, the lead 14 corresponding to the lead 14 corresponding to one
When the bonding is completed, the bonding sequence for sequentially bonding the electrodes 13 adjacent to each other in the counterclockwise direction, such as the lead 14, is shown. Also,
As shown in FIG. 4, when there are a large number of electrodes 13 of the semiconductor pellet 2, the editing information is that the semiconductor pellet 2 is divided into four areas A, B, C and D by orthogonal x and y axes. Based on the teaching coordinates, the bonding points of the electrodes 13 and the leads 14 are divided into equal parts and the position coordinates of the bonding points are set in the order of A area, B area, C area, and D area. The electrodes that are present are sequentially counterclockwise, the electrodes that are present in the B region are sequentially clockwise, the electrodes that are present in the C region are sequentially anticlockwise, and the electrodes that are present in the D region are sequentially clockwise. The bonding order for each bonding is shown in FIG.

The coordinate storage unit 20 stores the position coordinates of the taught bonding points for the bonding points on the electrodes 13 of the semiconductor pellet 2 and the leads 14 of the lead frame 3. The storage of the position coordinates of the bonding points is performed by the operator operating the operation unit 18 to teach (designate) the position coordinates of the bonding points.

The bonding order editing function of the control device 17 starts when the operator selects the editing information in the editing information storage section 19 using the operating section 18, and the coordinate storage section is started according to the selected editing information. A bonding order is given to each bonding point whose position coordinates are stored in 20.

The edit result storage unit 21 stores the edit result information of each bonding point to which the bonding order is added as described above.

Next, the bonding action of the wire bonding apparatus 1 will be described. First, an operator teaches the wire bonding apparatus 1 the position coordinates of bonding points. Explaining with reference to FIG. 2, in this teaching work, the XY table 5 is driven under the control of the control device 17, and the bonding points on each electrode 13 and each lead 14 are based on the designed position coordinates of each bonding point. The camera 12 is sequentially positioned above, and images of the electrodes 13 and the leads 14 (bonding portions thereof) are displayed on the monitor 16. Therefore, every time the operator positions the camera 12 above each bonding point,
If necessary, the operation unit 18 is operated to finely move the XY table 5, thereby specifying the bonding point position on the monitor 16 and teaching the position coordinate of the bonding point (step). Here, the order of the images of the bonding portions projected on the monitor 16, that is, the teaching order is not limited at all, but in this example, the bonding portions are sequentially projected in the clockwise direction for convenience. The position coordinates of the bonding points are taught in order, and the teaching coordinates are stored in the coordinate storage unit 20. The position coordinates of each bonding portion designated on the monitor are obtained based on a detection signal from a movement amount detector (not shown) attached to the XY table 5, for example.

Next, the operator operates the operation unit 18 to
From the edit information stored in advance in the edit information storage unit 19, one optimum edit information is selected (step). Then, the control device 17 edits the teaching coordinates of each bonding point stored in the coordinate storage unit 20 according to the selected editing information and gives a bonding order to each bonding point (step). The control device 17 stores the teaching coordinates with the bonding order in the edit result storage unit 21. This ends the teaching work.

Therefore, in the actual bonding operation, when the lead frame 3 is positioned in the bonding area, the XY table 5 under the control of the controller 17 is used.
Movement of the camera 12 moves the semiconductor pellet 2
The predetermined portion (for example, a corner portion) above and the specific lead 14 of the lead frame 3 are sequentially imaged, the image is processed by the image processing device 15, and the semiconductor pellet 2 and the lead are processed by a known pattern matching method or the like. The displacement of the frame 3 is detected. Therefore, the control device 17 corrects the position coordinates of the edited bonding point stored in the editing result storage unit 21 and having the bonding order added, based on this deviation.

The controller 17 edits and determines at the corrected bonding point position on the electrode 13 of the semiconductor pellet 2 and the lead 14 of the lead frame 3 obtained as described above, and based on the editing information. Wire bonding is performed by moving the XY table 5 and the bonding arm 9 so that the capillaries 8 move in order.

In this wire bonding operation, the capillary 8 having the wire 7 having the ball 11 formed at its tip is inserted.
On the electrode 13 of the semiconductor pellet 2 and the wire 7
The ball 11 at the tip of is bonded to the electrode 13 by applying ultrasonic vibration while pressing the electrode 13, and then the capillary 8 is moved onto the lead 14 of the lead frame 3 in accordance with a predetermined movement trajectory, and the wire 7 is moved. The lead 14 is joined by applying ultrasonic vibration while being pressed against the lead 14, and thereafter,
This is done by raising the capillary 8 by a predetermined amount and cutting the wire 7.

According to the above embodiment, the editing information storage unit 19
, A plurality of types of editing information indicating the bonding sequence regarding the bonding points on the electrodes 13 of the semiconductor pellet 2 are stored in advance, and the controller 17 is stored in the editing information storage unit 19 in advance and selected by the operator. Bonding order editing in which the bonding order of the bonding points on the electrode 13 of the semiconductor pellet 2 stored in the coordinate storage unit 20 is taught together with the teaching coordinates in accordance with one editing information and the teaching coordinates in each electrode stored in the coordinate storage unit 20. Since the function is provided, when teaching the position coordinates of the bonding points, the operator may teach the position coordinates without any consideration of the bonding order and store the position coordinates in the coordinate storage unit 20. Therefore, the teaching of the coordinates of the bonding point for bonding can be performed very easily.

By the way, even if the same semiconductor pellet 2 is bonded to the same lead frame 3 and the same body to be bonded, the electrodes 13 and the leads 14 to be wire-bonded may be different due to the difference in required functions. is there. In this way, if there is a bonding point that is added or deleted in this type of product compared to the previous type, conventionally all bonding positions must be completely new and must be reset in the bonding order. However, it can be easily dealt with by applying the above embodiment.

As shown by the broken line in the flow chart of FIG. 2, this is to set a branch point of "new?" Before the step, and if the previous and the bonded object are the same.
Only for the bonding point of the part different from the previous time, the position coordinates are added or deleted and corrections are made, and the above-mentioned embodiment is applied to all position coordinate data obtained by adding the position coordinates corrected this time to the position coordinates of the previous time. This is because the editing may be performed in the same manner as described above and the bonding may be performed based on the edited coordinate data. By doing so, the teaching work in this step may be performed only for the bonding points on the added or deleted electrode 13 and lead 14, and the same teaching point as the previous time is adopted as the previous teaching coordinates. Therefore, it is possible to deal with the product type in a short time.

In the above-described embodiment, two types of editing information for determining the bonding order to be stored in the editing information storage unit 19, that is, the entire bonding area is divided into two equal parts and four parts are divided into respective parts. In the above description, the one in which the bonding direction is designated is set and one is selected by the operation unit 18. However, for the purpose of facilitating the teaching of the position coordinates of the bonding points without considering the bonding order, only one type of edit information may be stored.

Further, as edit information, for example, when a straight line connecting both bonding points of the corresponding electrode 13 and lead 14 is assumed to be a wire loop, the position of this virtual wire loop obtained based on teaching coordinates and the capillary 8 It is also possible to set an arithmetic expression or the like that mathematically obtains a bonding order in which the capillary 8 during the bonding operation does not contact the virtual wire loop based on the diameter.

In the above embodiment, the case where the bonding order is edited based on the position information of the bonding point on the electrode 13 has been described. However, the bonding order is edited based on the position information of the bonding point on the lead 14 of the lead frame 3. May be edited, or based on the positional information of the bonding points on both the electrode 13 and the lead 14.

Further, in the above embodiment, in the actual bonding operation, the position correction using the camera was performed on the position coordinates stored in the editing result storage section 21,
The teaching coordinates stored in the coordinate storage unit 20 may be corrected and the corrected teaching coordinates may be edited based on the editing information.

[0036]

As described above, according to the wire bonding apparatus of the present invention, the position coordinates of the bonding point for bonding can be easily taught without considering the bonding order.

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of a wire bonding apparatus according to the present invention.

2 is a flowchart showing a teaching operation in the wire bonding apparatus of FIG.

FIG. 3 is a plan view of a semiconductor pellet showing a bonding sequence when the semiconductor pellet is divided into two blocks and bonded.

FIG. 4 is a plan view of the semiconductor pellet showing a bonding sequence when the semiconductor pellet is divided into four blocks and bonded.

[Explanation of symbols]

 1 Wire Bonding Device 2 Semiconductor Pellet 3 Lead Frame 12 Camera 13 Electrode 14 Lead 17 Control Device 18 Operation Unit 19 Edit Information Storage Unit 20 Coordinate Storage Unit 21 Edit Result Storage Unit

Claims (2)

[Claims] 1. A coordinate storage unit for storing teaching coordinates of each bonding point in a wire bonding apparatus for sequentially wire-bonding a plurality of pairs of bonding points on a body to be bonded by using a capillary for each pair. An edit information storage unit that stores edit information relating to the bonding order of each bonding point, and edits the teaching coordinates of each bonding point stored in the coordinate storage unit based on the edit information stored in the edit information storage unit. A controller for giving a bonding order to each bonding point, and an edit result storage section for storing edit result information edited by the controller, and the control apparatus stores in the edit result storage section. The capillaries are moved and controlled in the bonding order based on the edited result information. Wire bonding apparatus characterized by performing successively wire bonded to the bonding point. 2. The edit information storage section stores a plurality of types of edit information, and the edit by the control device is based on the edit information selected from the edit information stored in the edit information storage section. The wire bonding apparatus according to claim 1, wherein