JPH083021Y2 - 密着型画像読取り装置 - Google Patents

密着型画像読取り装置

Info

Publication number
JPH083021Y2
JPH083021Y2 JP1989106086U JP10608689U JPH083021Y2 JP H083021 Y2 JPH083021 Y2 JP H083021Y2 JP 1989106086 U JP1989106086 U JP 1989106086U JP 10608689 U JP10608689 U JP 10608689U JP H083021 Y2 JPH083021 Y2 JP H083021Y2
Authority
JP
Japan
Prior art keywords
layer
common electrode
led
image reading
original
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989106086U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0345659U (pt
Inventor
雅彦 村山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stanley Electric Co Ltd
Original Assignee
Stanley Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Stanley Electric Co Ltd filed Critical Stanley Electric Co Ltd
Priority to JP1989106086U priority Critical patent/JPH083021Y2/ja
Publication of JPH0345659U publication Critical patent/JPH0345659U/ja
Application granted granted Critical
Publication of JPH083021Y2 publication Critical patent/JPH083021Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Facsimile Scanning Arrangements (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
JP1989106086U 1989-09-09 1989-09-09 密着型画像読取り装置 Expired - Lifetime JPH083021Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989106086U JPH083021Y2 (ja) 1989-09-09 1989-09-09 密着型画像読取り装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989106086U JPH083021Y2 (ja) 1989-09-09 1989-09-09 密着型画像読取り装置

Publications (2)

Publication Number Publication Date
JPH0345659U JPH0345659U (pt) 1991-04-26
JPH083021Y2 true JPH083021Y2 (ja) 1996-01-29

Family

ID=31654833

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989106086U Expired - Lifetime JPH083021Y2 (ja) 1989-09-09 1989-09-09 密着型画像読取り装置

Country Status (1)

Country Link
JP (1) JPH083021Y2 (pt)

Also Published As

Publication number Publication date
JPH0345659U (pt) 1991-04-26

Similar Documents

Publication Publication Date Title
US4446364A (en) Photoelectric converter on a transmissive substrate having light shielding
US4707747A (en) Hand held scanning input device and system
US7209268B2 (en) Line illuminating device
US6496285B1 (en) Image reading apparatus
JPH03224354A (ja) 照明系の改良された光電変換装置及び該装置を搭載した情報処理装置
JP2001245113A (ja) 光導波路を備えた接触型イメージセンサ
JPH11506381A (ja) 指紋センサ装置
US4682040A (en) Image pickup apparatus for a printed wiring board
JPH03201767A (ja) 画像読み取り装置
JPH09219768A (ja) イメージセンサ
JPH083021Y2 (ja) 密着型画像読取り装置
JPH07162586A (ja) 発光装置とそれを用いた密着型イメージセンサユニット
US7206102B2 (en) Image reading apparatus with partially shielded light-receiving elements
JPH0514600A (ja) 原稿読み取り装置
JPS62279775A (ja) 密着型イメ−ジセンサ
JPS61188964A (ja) 密着型イメ−ジセンサ
JP3263271B2 (ja) 画像読取装置
JP2558471B2 (ja) 読取り装置
JPH0586105B2 (pt)
JP3307978B2 (ja) イメージセンサ
JPH071650U (ja) 原稿読み取り装置
JP3810928B2 (ja) 画像読み取り装置
KR0161468B1 (ko) 밀착형 이미지 센서
JPS5941629B2 (ja) 文字図形読取装置
JPS63288560A (ja) 密着型イメ−ジセンサ