JPH083018Y2 - 半導体パッケージ用連結型リードフレーム - Google Patents
半導体パッケージ用連結型リードフレームInfo
- Publication number
- JPH083018Y2 JPH083018Y2 JP4284489U JP4284489U JPH083018Y2 JP H083018 Y2 JPH083018 Y2 JP H083018Y2 JP 4284489 U JP4284489 U JP 4284489U JP 4284489 U JP4284489 U JP 4284489U JP H083018 Y2 JPH083018 Y2 JP H083018Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- metal layer
- insulating
- lead frame
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4284489U JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4284489U JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02132958U JPH02132958U (cs) | 1990-11-05 |
| JPH083018Y2 true JPH083018Y2 (ja) | 1996-01-29 |
Family
ID=31554742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4284489U Expired - Lifetime JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083018Y2 (cs) |
-
1989
- 1989-04-12 JP JP4284489U patent/JPH083018Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02132958U (cs) | 1990-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |