JPH08294892A - Chucking device - Google Patents

Abstract

PURPOSE: To provide a chucking device which grasps simulaneously a plurality of covers accommodated in a recess and transports to another recess precisely. CONSTITUTION: Chucking pawls 16, 17 to grasp covers 4, 6 are slidably installed on a pair of chuck members 14, 15 which can move in the opposing directions, and energizing means to energize the pawls 16, 17 in the cover grasping direction are installed also on the chuck members 14, 15. The pawls 16, 17 are contacted with the mating side face of the covers 4, 6 by moving the chuck members 14, 15 in the cover grasping direction, and the covers 4, 6 are grasped by moving the chuck members 14, 15 further in the cover grasping direction against the energizing forces of the energizing means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor sensor manufacturing apparatus which is formed by covering a sensor chip mounted on a lead frame with an upper cover and a lower cover, and an upper cover or a lower cover housed in a recess. The present invention relates to a chucking device that grips and transfers to a predetermined position.

[0002]

2. Description of the Related Art FIG. 9 is a plan view of a semiconductor sensor used for detecting gas pressure, and FIG. 10 is a side sectional view of the semiconductor sensor. In the figure, 1 is a sensor chip which is a semiconductor element, 3 is a plurality of leads which are connected to the sensor chip 1 through a thin metal wire 2, and 4 is a back surface side of the sensor chip 1 (hereinafter referred to as a lower surface side). , A concave lower cover attached to the lower surface side of the lead 3 via an adhesive 5. The adhesive 5 is a thermosetting type which is cured by heating. An upper cover 6 is attached to the upper surface side of the lead 3 via an adhesive 5 so as to cover the front surface side (hereinafter referred to as the upper surface side) of the sensor chip 1. The upper cover 6 is formed with an opening 6a for introducing air upward.

In this semiconductor sensor, for example, when the opening 6a of the upper cover 6 is connected to the detection gas side, the resistance value of a predetermined portion of the sensor chip 1 changes due to the fluid pressure, and the gas pressure is detected.

FIG. 11 is an explanatory view of a method of manufacturing a semiconductor sensor, and FIG. 12 is a sectional view taken along the line II of FIG.
In the figure, reference numeral 10 denotes a lead frame in which a plurality of sensor chips 1 have been wire-bonded by the fine metal wires 2, and a lower cover 4 and an upper cover are provided to cover the sensor chips 1 on the lower surface side and the upper surface side of the lead frame 10. 6
And are joined via the adhesive 5. Reference numeral 7 is a lower jig having a plurality of recesses 7a for positioning the lower cover 4 and recesses 7b for positioning the lead frame 10, and 8 is a lower jig 7.
The upper jig 6 is provided with a hole 8a for positioning the upper cover 6 so as to correspond to the concave portion 7a of the upper cover 6, and 9 is a weight jig which is supported by the frame 9a and the frame 9a so as to be vertically movable. , A weight 9b for pressing the upper cover 6 through the hole 8a of the upper jig 8.

Next, a manufacturing method for manufacturing a semiconductor sensor using the lower jig 7 and the upper jig 8 will be described with reference to FIG. In the figure, 30 is a lower cover 4.
And a pallet 31 for supplying the upper cover 6, and 31 is the lower cover 4 and the upper cover 6 in the pallet 30 on the printing jig 32 in the cover mounting position B as many as the sensor chips 1 in the lead frame 10. It is a first transport device as a first transport means for transporting and arranging, and has a chucking device 31a of the lower cover 4 and a chucking device 31b of the upper cover 6.

In this case, the lower cover 4 and the upper cover 6 on the printing jig 32 are arranged so that the coated surface (printing surface) of the adhesive 5 faces upward. Reference numeral 33 is a second transfer device as a second transfer device that transfers the printing jig 32 to the cover mounting position B and the cover removal position B via the printing device 34 which is a printing device.

Reference numeral 35 is a printing jig 3 located at the cover take-out position B.
The lower cover 4 and the upper cover 6 are conveyed from 2 to the lower jig 7 and the upper jig 8 at the preparation position c on the hot plate (not shown), and the lower jig 7 and the upper jig 8 are placed on the lower jig 7 and the upper jig 8. Lower cover 4 and upper cover 6
Is a third transfer device as a third transfer means for positioning and mounting the device, and has a chucking device 35a.

Reference numeral 36 is a pusher for taking out the lead frames 10 having the sensor chips 1 mounted thereon one by one from the lead frame storage magazine 37 onto the stage 38, and 39.
Conveys the lead frame 10 on the stage 38 onto the lower jig 7, drops the sensor chip 1 in the lead frame 10 into the lower cover 4 positioned by the lower jig 7, and lowers the lead frame 10 downward. Adhesive 5 for cover 4
4 is a fourth transport device as a fourth transport unit that is brought into contact with the printing surface of.

Reference numeral 40 indicates that the upper jig 8 holding the upper cover 6 is lifted and inverted by vacuum suction, and the upper jig 8 is placed on the lower cover 4 and the lower jig 7 having the lead frame 10. With the upper cover 6 in contact with the printed surface of the adhesive 5 on the upper surface side of the lead frame 10,
Is an up / down reversing device as an up / down reversing means for positioning so as to cover the sensor chip 1 above.

Reference numeral 41 denotes a lower jig 7 and an upper jig 8 (hereinafter referred to as a stacking jig A) which are superposed at a preparation position C on the hot plate.
Is a fifth transfer device as a fifth transfer means for transferring and loading the weight jig 43 on the stacking jig A after transferring the and to the heating position D on the heating plate 42.

The fifth conveying device 41 also conveys the stacking jig A onto a separating device (not shown), and then prepares the separated lower jig 7 and upper jig 8 on the hot plate. In addition to being transported to the position c, it also has a function of transporting the semiconductor sensor linked body 11 (shown in FIG. 24) completed by heating on the heating plate 42 for a predetermined time to the next step. Here, the fifth transfer device 41 includes a jig transfer tool 41a for transferring the lower jig 7 and the upper jig 8 alone or in a state of being overlapped with each other, and a cover transfer tool 41b for transferring the semiconductor sensor connected body 11. have. Reference numeral 44 is an apparatus base.

The semiconductor sensor is manufactured by the apparatus configured as described above, but the following conditions are required as conditions for transporting and loading the lower cover and the upper cover from the printing jig to the lower jig and the upper jig. 1) High accuracy is required for the bonding position accuracy of the upper cover and the lower cover to the lead frame. 2) It is necessary to securely grasp the upper cover and the lower cover, remove them from the printing jig, and transfer them to the upper jig and the lower jig. 3) It is necessary to transfer the upper cover and the lower cover at a time so that there is no difference in the heat history of the adhesive. It is necessary to process the holes and recesses of the printing jig and the upper and lower jigs at the same pitch in order to transfer them all at once.

Among these, the transfer to the upper jig and the lower jig is particularly important, and if there is a defect in this, the following problems occur, so that reliable transfer is required. 1) If the upper cover and lower cover are removed, it is a fatal defect. 2) If the lower cover is not set securely in the recess of the lower jig and a part of the lower cover is lifted up, a defective joint with the lead frame occurs, resulting in a defective product. 3) If the upper cover is not securely set in the concave portion of the upper jig, the vacuum suction force is reduced and the upper cover falls when it is reversed by the lifting / reversing device. 4) Even if a defective setting in the upper jig and the lower jig is detected by some method, it is necessary to stop the device and manually store it in the concave portion of the jig. In this case, the thermal history of the adhesive changes, which affects the quality of the semiconductor sensor.

On the other hand, a chucking device 35a for transporting the lower cover 4 and the upper cover 6 on the conventional printing jig 32 to the lower jig 7 or the upper jig 8 is constructed as shown in FIGS. 14 and 15. It had been. FIG. 15 is a sectional view taken along the line II-II of FIG.

In the drawing, reference numeral 51 is a chuck mounting metal fitting to which a chuck device 52 is mounted, 52a and 52b are movable elements having the same size in opposite directions (arrow directions) when the chuck device 52 is operated, and 53 and 54 are chuck metal fittings. , The movers 52a and 52b, and the chuck mounting bracket 51.
Slide along the guide groove 51a. The chuck fittings 53 and 54 are provided with chuck claws 53a and 54a for holding the lower cover 4 or the upper cover 6 as many as the sensor chips 1 in the lead frame 10.

The printing jig 32 has recesses 32a and 32b for accommodating the lower cover 4 and the upper cover 6, and the chuck claws 53a and the chuck claws 54a are inserted so that the lower cover 4 and the upper cover 6 are gripped by grooves. 32c and 32d
Is being processed.

The chucking device 35a is the third transfer device 3.
It is attached to 5.

Next, the operation of the chucking device 35a will be described. The lower cover 4 and the upper cover 6 on which the adhesive 5 has been printed are housed in the recesses 32a and 32b of the printing jig 32, and are transported to the cover removal position B by the second transport device 33. Subsequently, the chucking device 35a is moved by the third transfer device 35 so that the center of the recess 32a for accommodating the lower cover 4 on the printing jig 32 and the center of the chuck coincide. At this time, the chuck claws 53a and 54a are open. Next, the chucking device 35a is the third transfer device 35.
It is lowered to the chucking position by the lifting device. This state is shown in FIG. FIG. 17 is a sectional view taken along the line III-III in FIG. Next, when the chuck device 52 operates, the movers 52a and 52b move in the closing direction. As a result, the chuck fittings 53, 54 engaged with the movers 52a, 52b
Since it is also closed, the lower cover 4 is gripped by the chuck claws 53a and 54a. This state is shown in FIG. 19 is a sectional view taken along the line IV-IV in FIG.

Next, the chucking device 35a is raised,
The chuck center is moved so as to coincide with the center of the recess 7a of the lower jig 7 at the preparation position C. Subsequently, the chucking device 35a is lowered to the chucking open position of the lower jig 7 by the lifting device of the third transfer device 35. Like the printing jig 32, the lower jig 7 is processed with a groove into which a chuck claw is inserted. Next, the chuck device 52 is activated to operate the chuck claw 53.
The lower cover 4 is transferred to the recess 7a of the lower jig 7 by opening a and 54a. Similarly, the upper cover 6 is also transferred to the hole 8a of the upper jig 8.

[0020]

Since the conventional chucking device is configured as described above, it has the following problems.

In order to improve the accuracy of the cover storage position, it is common to reduce the clearance between the cover storage recess and the cover. When the cover housed in the concave portion is gripped and lifted by the chucking device, it becomes more difficult to align the center of the chuck device with the center of the concave portion as the clearance becomes smaller. 16 to 19 show a state in which the positional deviation between the center of the chuck and the center of the recess is within the clearance. 20 to 23 show a state where there is a positional deviation equal to or larger than the clearance. 21 is a sectional view taken along the line VV of FIG. 23 is a sectional view taken along the line VI-VI of FIG. In the case of FIGS. 16 to 19, even if chucking is performed,
Since the cover and the side surface of the concave portion do not come into contact with each other, the cover is securely gripped and lifted. In the case of FIGS. 20 to 23, at the time of chucking, the cover moves by one of the opposing chuck claws and comes into contact with the side surface of the recess. When the chucking device is raised in this state, the clamping pressure of the chuck device 52 acts on the side surface of the cover and the side surface of the concave portion to generate contact resistance, and the chucking device is lifted along the side surface of the concave portion. For this reason, the cover is tilted and gripped, or when the frictional force is large, a chuck error occurs and forgetting to remove the cover occurs. On the contrary, when the cover is stored in the recess, a mistake in inserting the cover into the recess occurs.

In view of the above problems, it is an object of the present invention to provide a chucking device for simultaneously gripping a plurality of covers housed in a recess and accurately transferring the covers to another recess. .

[0023]

In order to achieve the above object, the invention according to claim 1 of the present application (hereinafter referred to as the first invention) includes at least a pair of chuck members that are movable in mutually opposite directions. At least a pair of chuck claws that are slidably attached to each of the chuck members and that grip the work, and biasing means that are attached to the chuck member and that bias the chuck claws in the work gripping direction. By moving the chuck member in the workpiece gripping direction, the chuck claws are brought into contact with the corresponding side surfaces of the workpiece, and the chuck member is moved in the workpiece gripping direction against the biasing force of the biasing means. It is characterized in that the work is gripped by further moving.

The invention according to claim 2 of the present application (hereinafter,
In a second invention), in the first invention, the urging means includes first and second compression springs attached to the at least one pair of chuck members, respectively.
By moving the work to a position where the spring pressures of the first and second compression springs are balanced, the center of the work held by the chuck claws and the center of the at least one pair of chuck members are made to coincide with each other. It was done.

The invention according to claim 3 of the present application (hereinafter,
A third invention) is the first invention for detecting the spring pressures of the first and second compression springs, while providing a servo mechanism for simultaneously moving the at least one pair of chuck members in the same direction in the second invention. And a second pressure detector are attached to the at least one pair of chuck members respectively, and the differential pressure of the spring pressure detected by the first and second pressure detectors is transmitted to the servo mechanism to move the chuck members. The differential pressure is reduced.

The invention according to claim 4 of the present application (hereinafter,
According to a fourth invention), in the first invention, at least a pair of chuck members movable in a direction orthogonal to the moving direction of the at least pair of chuck members are further attached, and the work is grasped from four directions. It is characterized by having done.

The invention according to claim 5 of the present application (hereinafter,
A fifth invention) is a pair of first chuck members movable in mutually opposite directions, and a pair of second chucks movable in mutually opposite directions in a direction orthogonal to the moving direction of the first chuck members. A member, a chuck claw that is slidably attached to each of the first and second chuck members and that grips the work from four sides, and a chuck claw that is attached to each of the first and second chuck members. A compression spring for urging in the gripping direction, a servo mechanism for simultaneously moving the pair of first chuck members or the pair of second chuck members in the same direction, and a servo mechanism attached to each of the first and second chuck members. And a pressure detector for detecting the spring pressure of the compression spring. In the above structure, by moving the first and second chuck members in the work gripping direction, the chuck claws are brought into contact with corresponding side surfaces of the work, and the urging force of the compression spring is resisted. While holding the work by further moving the first and second chuck members in the work holding direction, the differential pressure of the spring pressure detected by the pressure detector corresponding to the first chuck member or the second chuck. By transmitting the differential pressure of the spring pressure detected by the pressure detector corresponding to the member to the servo mechanism to move the first or second chuck member, the differential pressure is reduced and the spring of the compression spring is reduced. The work is moved to a position where the pressure is balanced, and the center of the work held by the chuck claw and the center of the pair of first chuck members are Characterized in that as allowed to coincide with the center of the pair of second chuck member.

[0028]

According to the first aspect of the present invention, when the pair of chuck members move in the work gripping direction, the chuck claws attached to the respective chuck members first contact the corresponding side surfaces of the work. When the chuck member further moves in the work gripping direction against the biasing force of the biasing means, the chuck claw is pressed against the work by the biasing means and acts to grip the work.

Further, according to the second invention of the present application, since the urging means is composed of the first and second compression springs respectively attached to the pair of chuck members, when the chuck jaws grip the work. Even if the center of the work and the center of the pair of chuck members are deviated, the work moves to a position where the spring pressures of the first and second compression springs are balanced, and the center of the work and the center of the pair of chuck members match. To do.

Further, according to the third invention of the present application, when the chuck claws grip the work, if the spring pressures of the first and second compression springs are different, the differential pressure is detected by the servo mechanism by the pressure detector. And the servo mechanism simultaneously moves the pair of chuck members holding the work piece in the same direction, so that the work piece moves to a position where the spring pressures of the first and second compression springs are balanced.

Further, according to the fourth invention of the present application, a pair of chuck members and another pair of chuck members are orthogonal to each other.
Since it is provided so as to be movable in any direction, the work is gripped by the chuck member from four directions.

Further, according to the fifth invention of the present application, a pressure detector is attached to each of the two pairs of chuck members which are movable in two directions orthogonal to each other, and the difference in spring pressure detected by the corresponding pressure detectors. Since the servo mechanism that reduces the pressure and moves the work to a position where the spring pressure is balanced is provided, the center of the work gripped by the chuck claws and the center of the two pairs of chuck members match.

[0033]

【Example】

[First Embodiment] A first embodiment of the present invention will be described below with reference to FIGS. 1 is a partial sectional front view of the chucking device, and FIG. 2 is a sectional view taken along the line VII-VII of FIG. FIG. 3 is a chuck state view of the cover, and FIG. 4 is a detailed chuck state view of the cover. FIG. 5 shows a sectional view taken along the line VIII-VIII in FIG. Note that the same or corresponding parts as those of the semiconductor sensor or the semiconductor sensor connected body 11 shown in FIGS. 9 to 24 are denoted by the same reference numerals, and the description thereof will be omitted.

In the figure, reference numeral 12 is a chuck mounting metal fitting to which the chuck device 13 is mounted, and 13a and 13b are a pair of moving elements extending below the chuck device 13. The movers 13a and 13b are provided so as to be movable in the same dimension in the opposite directions (arrow directions) by the operation of the chuck device 13, and above the corresponding chuck metal fittings 14 and 15 arranged below the chuck device 13. It is engaged with the protruding portion. The upper protruding portions of the chuck fittings 14 and 15 are housed in the guide groove 12a formed in the lower portion of the chuck mounting fitting 12, and along with the movement of the movers 13a and 13b,
The chuck fittings 14 and 15 slide along the guide groove 12a.

A plurality (for example, five) of spaced inner walls 14a, 15a and outer wall 1 are provided on each of the chuck fittings 14, 15.
4b and 15b are formed to face each other, and the guide shaft 1 extends parallel to the sliding direction of the chuck fittings 14 and 15.
Both ends of 8 and 19 are supported by corresponding inner walls 14a and 15a and outer walls 14b and 15, respectively. Each guide shaft 18,1
9 is an inner wall 14a, 15a and an outer wall 14b, 15 that face each other.
It is loosely fitted to the chuck claws 16 and 17 mounted between the chuck c and b, and the chuck claws 16 and 17 are slidably attached along the corresponding guide shafts 18 and 19. The compression springs 20 and 21 are wound around the guide shafts 18 and 19, respectively, and are interposed between the rear surfaces of the chuck claws 16 and 17 and the outer walls 14b and 15b of the chuck fittings 14 and 15 and have the same characteristics. Then, the corresponding chuck claw 1
6, 17 are the inner walls 14a, 15 of the chuck fittings 14, 15.
It is biased toward a.

The pair of chuck claws 16 and 1 facing each other
Reference numeral 7 is for gripping the lower cover 4 or the upper cover 6 corresponding to the sensor chip 1 in the lead frame 10, and as shown in FIG. The chuck jaws 16 and 17 are provided in the same number as the upper cover 6.

The printing jig 32 has recesses 32a and 32b for accommodating the lower cover 4 and the upper cover 6, and the chuck claw 16 and the chuck claw 17 are inserted into the printing jig 32 to form a groove in the direction in which the lower cover 4 and the upper cover 6 are gripped. 32c and 32d are processed.

The chucking device 22 having the above structure is attached to the third transfer device 35.

Next, the operation of the chucking device 22 will be described. The lower cover 4 and the upper cover 6 on which the adhesive 5 has been printed are housed in the recesses 32a and 32b of the printing jig 32, and are transported to the cover removal position B by the second transport device 33. Subsequently, the chucking device 22 is moved by the third transport device 35 so that the center of the recess 32a for accommodating the lower cover 4 on the printing jig 32 and the center of the chuck coincide with each other.

At this time, the chuck fittings 14 and 15 are open. Then, the chucking device 22 is lowered to the chucking position by the elevating device of the third transfer device 35, and the lower ends of the chuck claws 16 and 17 are the recesses 32 a of the printing jig 32.
Is inserted into.

Next, when the chuck device 13 is operated, the movers 13a and 13b move in the closing direction to move the movers 13a and 13b.
The chuck fittings 14 and 15 engaged with 13b also move in the closing direction. As a result, the lower ends of the chuck claws 16 and 17 first come into contact with the corresponding side surfaces of the lower cover 4, and resist the urging force of the compression springs 20 and 21 and the chuck fittings 14 and 1.
By moving 5 further in the closing direction, the chuck claws 16 and 17 grip the lower cover 4 while sliding along the guide shafts 18 and 19. This state is shown in FIGS. 3 and 4.

FIG. 4 shows a state in which the chucking device center Y1-Y1 is displaced to the right with respect to the cover storage recess center Y2-Y2 of the printing jig 32, and the center shift amount is greater than the cover storage clearance. In the gripping operation in this case, the chuck claw 17 first contacts the side surface of the lower cover 4,
Since the lower cover 4 is moved to the right, the lower cover 4 is recessed 3
It comes into contact with the side e of 2a. Further, a chuck operation is performed and the lower cover 4 is gripped by the chuck claws 16 and 17. In this case, the amount of deflection of the compression springs 20 and 21 is larger than that of the compression spring 21.

Next, when the chucking device 22 moves up, since the compression springs 20 and 21 have the same characteristics, the chuck claws 16 and 17 are moved to the load balance position, so that the center of the lower cover 4 and the center of the chucking device. Match.

Subsequently, the center of the chuck moves so as to coincide with the center of the recess 7a of the lower jig 7 at the preparation position C, and the chucking device 22 is chucked by the lower jig 7 by the elevating device of the third transfer device 35. Lower to open position. Like the printing jig 32, the lower jig 7 is provided with grooves into which the lower ends of the chuck claws 16 and 17 are inserted. Next, the chuck device 13 is actuated and the chuck claws 16 and 17 are opened, whereby the lower cover 4 is transferred to the recess 7 a of the lower jig 7. Similarly, the upper cover 6 is also transferred to the hole 8a of the upper jig 8.

As described above, according to the chucking device 22, only one chuck claw does not act like the conventional chucking device of FIG. 23, and the chuck is always gripped by both chuck claws. To do. Further, by adjusting the spring pressure of the compression springs 20 and 21, the contact resistance between the cover and the side surface of the concave portion can be reduced and gripping can be performed. Therefore, the cover may be gripped at an angle, or forgetting to remove due to a chuck error. Can be prevented.

Since the cover after chucking is balanced and held by the spring pressure of the compression springs 20 and 21, the center of the cover moves to the center of the chucking device. further,
Since the spring pressure is balanced, it moves in the chucking direction with a slight force while securing the gripping force. As a result, even when the cover is transferred to the recess of the upper and lower jigs, the cover can be surely loaded as long as the insertion surface of the cover fits into the recess of the upper and lower jigs.

[Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIG. In the figure, 23 is a pressure detector mounted between the outer wall 14b of the chuck metal fitting 14 and the compression spring 20, and 24 is a pressure detector mounted between the outer wall 15b of the chuck metal fitting 15 and the compression spring 21. Is. Reference numeral 25 denotes a servo mechanism attached to the chuck mounting member 12, which transmits its rotation to the screw shaft 26 to move the chuck device 13 back and forth in the same direction as the sliding direction of the chuck members 14 and 15.

In this embodiment, chuck jaws 16 and 17 are used.
When the cover is gripped by, the pressure forces of the compression springs 20 and 21 are detected by the pressure detectors 23 and 24, respectively. The differential pressure detected by the pressure detectors 23 and 24 is the servo mechanism 25.
The screw shaft 26 is rotated so that the detected differential pressure decreases and becomes zero, for example. When the compression force of the compression spring 20 is larger than that of the compression spring 21, the chuck device 13 is moved to the right in the figure, while when the compression force of the compression spring 20 is smaller than that of the compression spring 21, the chuck device 13 is moved. Device 13
By moving the to the left in the figure, the chuck metal fitting 1
4 and 15 simultaneously move in the same direction and stop when the compression spring pressures are balanced.

Therefore, according to this embodiment, when the center of the chuck does not coincide with the center of the recess, the contact resistance generated on the side surfaces of the cover and the recess can be reduced and the cover can be gripped and transferred.

In the case of a chucking device for simultaneously gripping a plurality of covers and transferring them to other recesses, pressure detectors are provided at the chuck claws at both ends and the generated differential pressure is calculated to move the chuck device. By doing so, the contact resistance generated on the side surface of the cover and the concave portion can be reduced, and the cover can be gripped and transferred.

[Third Embodiment] A third embodiment of the present invention will be described with reference to FIGS. 7 and 8. 7 is a partial sectional side view of a chucking device according to a third embodiment of the present invention, and FIG. 8 is a plan view taken along the line IX-IX of FIG.

In the figure, 28 is a chuck mounting metal fitting to which a chuck device 27 is mounted. The chuck device 27 has four moving elements 27a to 27d which extend downward from the main body and are movable in directions orthogonal to each other. Have The movers 27a and 27b are configured to be movable in the same dimension in the opposite directions (for example, the X direction) by the operation of the chuck device 27, while the movers 27c and 27d are moved by the operation of the chuck device 27. Orthogonal to the direction, and
It is configured to be movable in the same dimension in directions (for example, the Y direction) opposite to each other. 14 is a chuck metal fitting, which is a mover 27a
Guide groove 28a of the chuck mounting member 28 by engaging with 27d
Slide along. Reference numeral 16 is a chuck claw that is supported by a guide shaft 18 attached to the chuck fitting 14 and is slidable in the guide shaft direction. A compression spring 20 is attached between the chuck metal fitting 14 and the chuck claw 16 as shown in the figure. In the present embodiment, the chuck claws are arranged on two orthogonal axes, and the cover can be gripped from four directions to improve the center positioning accuracy of the cover for transfer.

Further, the pressure detector shown in FIG. 6 may be attached to each chuck fitting 14 and a servo mechanism corresponding to each pair of chuck fittings in two directions orthogonal to each other may be provided. In this case, the differential pressure of the spring pressure detected by the pressure detector corresponding to the pair of chuck metal fittings in the first direction (for example, the X direction) or the pair of chuck metal fittings in the second direction (for example, the Y direction) orthogonal to the first direction. The differential pressure of the spring pressure detected by the pressure detector is transmitted to the servo mechanism to move the pair of chuck metal fittings to reduce the differential pressure of the pressure detector to the position where the spring pressure of the compression spring is balanced. The cover can be moved. As a result, the cover can be gripped and transferred in a state where the center of the chuck and the center of the recess are aligned in two directions orthogonal to each other.

In the first to third embodiments, the case where the upper cover and the lower cover that cover the upper and lower sides of the sensor chip are gripped has been described as an example. However, the chucking device of the present invention only covers the sensor chip cover. The present invention is not limited to this, and is applicable to a case where another work stored in the recess is gripped and transferred to a predetermined position.

[0055]

Since the present invention is constituted as described above, it has the following effects.

Since the upper cover and the lower cover are gripped by the urging force of the urging means via the pair of chuck claws, the upper cover and the lower cover can be reliably transferred from the printing jig to the upper and lower jigs. It is possible to eliminate a fatal defect caused by dropping. Further, until the lower cover is securely set in the concave portion of the lower jig, it is possible to prevent the occurrence of a defective joint with the lead frame due to the floating of the lower cover. Further, by providing a plurality of pairs of chuck claws, a plurality of covers can be collectively transferred to the upper jig and the lower jig, so that a stable semiconductor sensor with a constant heat history of the adhesive can be obtained. be able to.

A compression spring is used as the urging means, and after the upper cover or the lower cover is gripped by the chuck claws, the cover is moved to a position where the spring pressures of the pair of compression springs are balanced. The center of the chuck can be matched, and the upper cover and the lower cover can be reliably transferred to the upper and lower jigs. Further, since the upper cover is reliably set in the concave portion of the upper jig, the vacuum suction force is surely exerted so that the upper cover does not drop when it is reversed by the lifting / reversing device.

A pressure detector for detecting the spring pressure of the compression spring is attached to each chuck fitting, and the differential pressure between the spring pressures detected by the two pressure detectors is transmitted to the servo mechanism to move the chuck fitting by the servo mechanism. Since the differential pressure is reduced to, for example, zero, the center of the cover and the center of the chuck are surely aligned with each other, and the upper cover and the lower cover are reliably transferred to the upper and lower jigs.

By attaching a pair of chuck metal fittings in each of the two directions orthogonal to each other, the upper cover and the lower cover can be reliably gripped from four directions, and a fatal defect due to the cover falling off can be avoided.

A pair of chuck metal fittings are attached to each of the two orthogonal directions, and a pressure detector is attached to each chuck metal fitting, and the corresponding metal fitting pair is moved via the servo mechanism in the direction in which the differential pressure decreases. Therefore, the reliability of transferring the cover to the upper and lower jigs is improved.

[Brief description of drawings]

FIG. 1 is a partial sectional front view of a chucking device according to a first embodiment of the present invention.

FIG. 2 is a sectional view taken along the line VII-VII in FIG.

FIG. 3 is a partial cross-sectional front view showing a chucked state of the cover.

FIG. 4 is a partially enlarged cross-sectional view showing a chuck state of a cover.

5 is a sectional view taken along the line VIII-VIII in FIG.

FIG. 6 is a partial cross-sectional side view of a chucking device according to a second embodiment of the present invention.

FIG. 7 is a partial cross-sectional side view of a chucking device according to a third embodiment of the present invention.

8 is a bottom view taken along the line IX-IX in FIG.

FIG. 9 is a partially cutaway plan view of the semiconductor sensor.

FIG. 10 is a side sectional view of a semiconductor sensor.

FIG. 11 is a side sectional view of a lower jig on which an upper jig and a weight jig are placed.

12 is a cross-sectional view taken along the line II of FIG.

FIG. 13 is an explanatory diagram of the method for manufacturing the semiconductor sensor.

FIG. 14 is a front view of a conventional chucking device.

15 is a sectional view taken along the line II-II of FIG.

FIG. 16 is a detailed view of a conventional chucking device before chucking.

17 is a cross-sectional view taken along the line III-III of FIG.

FIG. 18 is a detailed view of the conventional chucking device during chucking.

19 is a sectional view taken along the line IV-IV in FIG.

FIG. 20 is a detailed view of a conventional chucking device before chucking.

21 is a cross-sectional view taken along the line VV of FIG.

FIG. 22 is a detailed view of the conventional chucking device when chucking.

23 is a cross-sectional view taken along the line VI-VI of FIG.

FIG. 24 is a perspective view of a semiconductor sensor assembly.

[Explanation of symbols]

1 sensor chip, 4 lower cover, 6 upper cover, 7
Lower jig, 7a concave portion, 8 Upper jig, 8a hole portion, 10
Lead frame, 12, 28 Chuck mounting bracket, 1
2a, 28a guide groove, 13, 27 chuck device,
13a, 13b, 27a-27d mover, 14, 15
Chuck fittings, 16,17 Chuck claws, 18,19
Guide shaft, 20, 21 compression spring, 22 chucking device, 23, 24 pressure detector, 25 servo mechanism,
32 printing jig, 32a, 32b recess, 35 third transfer device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Toshitaka Shiro, 4-chome, Mizuhara, Itami City, Hyogo Prefecture Mitsubishi Electric Corporation Kita Itami Works

Claims (5)

[Claims] 1. A chucking device for gripping a work contained in a recess and transferring it to a predetermined position, and at least a pair of chuck members movable in opposite directions, and slidable on each of the chuck members. A chuck claw that is attached and holds the work,
Urging means attached to the chuck member for urging the chuck claw in the work gripping direction, and moving the at least one pair of chuck members in the work gripping direction causes the chuck claw to correspond to the work. A chucking device, wherein the chucking device grips the work by abutting against the side surface and further moving the chuck member in the work gripping direction against the biasing force of the biasing means. 2. The biasing means comprises first and second compression springs respectively attached to the at least one pair of chuck members, and the biasing means is moved to a position where the spring pressures of the first and second compression springs are balanced. The chucking device according to claim 1, wherein the center of the work gripped by the chuck claw and the center of the at least one pair of chuck members are made to coincide with each other by moving the work. 3. A servo mechanism for simultaneously moving the at least one pair of chuck members in the same direction is provided.
The first and second pressure detectors for detecting the spring pressures of the first and second compression springs are attached to the at least one pair of chuck members, respectively, and the differential pressure of the spring pressures detected by the first and second pressure detectors. 3. The chucking device according to claim 2, wherein the differential pressure is reduced by transmitting to the servo mechanism to move the chuck member. 4. The chucking device according to claim 1, further comprising at least a pair of chuck members that are movable in a direction orthogonal to a moving direction of the at least one pair of chuck members, the work being gripped from four sides. . 5. A chucking device for gripping a work stored in a recess and transferring it to a predetermined position, a pair of first chuck members movable in opposite directions, and a moving direction of the first chuck member. A pair of second chuck members that are movable in mutually opposite directions in the orthogonal direction, chuck claws that are slidably attached to each of the first and second chuck members and that grip the work from four sides, A compression spring attached to each of the first and second chuck members for urging the chuck claws in the workpiece gripping direction and a servo for simultaneously moving the pair of first chuck members or the pair of second chuck members in the same direction. A mechanism and a pressure detector attached to each of the first and second chuck members for detecting the spring pressure of the compression spring. , The first and second chuck members are moved in the work gripping direction to bring the chuck claws into contact with the corresponding side surfaces of the work and to resist the biasing force of the compression spring. While gripping the workpiece by further moving the second chuck member in the workpiece gripping direction, it corresponds to the differential pressure of the spring pressure detected by the pressure detector corresponding to the first chuck member or the second chuck member. By transmitting the differential pressure of the spring pressure detected by the pressure detector to the servo mechanism to move the first or second chuck member, the differential pressure is reduced and the spring pressure of the compression spring is balanced. To move the work to a position where it is held, the center of the work gripped by the chuck claw, the center of the pair of first chuck members, and the pair of second chuck members. A chucking device characterized in that the center of the chuck member is made to coincide.