JPH08293663A - Wiring board and electronic apparatus - Google Patents

Abstract

PURPOSE: To provide a wiring board which can be commonly used for both in the case of mounting an integrated circuit via, for example, an IC socket and in the case of mounting the circuit by directly soldering by effectively avoiding the generation of a bridge and an electronic apparatus using the board. CONSTITUTION: First and second lands 4a and 4b for soldering first and second electronic components 2 and 3 are connected by a connecting wiring pattern, the pattern is covered with a solder resist 5 or formed slender.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board and an electronic device, for example, by enlarging and forming a land shape for soldering a QFP (quad flat package) type integrated circuit, and soldering at a central portion of each land. By selecting the land shape etc. so that the adhesion amount of the integrated circuit is reduced, the generation of the bridge can be effectively performed, for example, when the integrated circuit is mounted via the IC socket and when the integrated circuit is mounted by direct soldering. Avoid and share the wiring board.

[0002]

2. Description of the Related Art Conventionally, in an electronic device equipped with a QFP type integrated circuit, a QFP is connected via an IC socket when designing
Type integrated circuit is mounted on the wiring board, which improves the work efficiency of the design study.

On the other hand, in mass production, a QFP type integrated circuit is directly mounted on a wiring board by soldering, thereby omitting an IC socket to reduce the number of parts and simplify the structure of electronic equipment. It is done like this.

For this reason, in this kind of electronic equipment, a design study is carried out using a wiring board having a different pattern shape from that in mass production so that the IC socket can be mounted on the wiring board, and the wiring board is moved to the mass production stage. Was supposed to be fixed.

[0005]

By the way, it would be convenient if this kind of wiring board could be shared between the case of mounting an IC socket and the case of mounting an integrated circuit by direct soldering. . That is, if the wiring board can be shared, mass production can be performed using the wiring board whose design has been studied, and the modification of the wiring board at the time of shifting to conventional mass production can be omitted. Therefore, an error caused by this correction can be effectively avoided. In addition, since the integrated circuit can be mounted on the wiring board in the mass production stage by using the IC socket, the work efficiency can be improved when the mass production is started and a new examination is made.

In this case, it is considered that the land of the wiring board on which the integrated circuit is directly mounted by soldering can be formed by being extended outward so as to be shared so as to correspond to the terminal position of the IC socket. However, when the land is extended in this way, the shape of the land becomes larger by that amount, so that the amount of cream solder attached increases, and there is a problem that a bridge occurs between terminals of the integrated circuit during soldering.

Particularly in a QFP type integrated circuit, this type of bridge is apt to occur due to the short distance between terminals, and when a wiring board is commonly used in this way, after all,
Stable mass production becomes difficult.

The present invention has been made in consideration of the above points, and it is possible to effectively avoid the occurrence of a bridge and mount an integrated circuit via an IC socket, or to mount the integrated circuit by direct soldering. An attempt is made to propose a wiring board that can be shared and an electronic device using the wiring board.

[0009]

In order to solve such a problem, according to the present invention, the wiring board is formed so as to selectively mount the first or second electronic component at the same mounting position. A first land for soldering the first electronic component, a second land for soldering the second electronic component, and a connection wiring pattern connecting the first and second lands. The connection wiring pattern is covered with solder resist.

Alternatively, the connection wiring pattern is formed narrower than the pattern width of the first and second lands.

Further, in the electronic equipment, a wiring board formed so as to selectively mount the first or second electronic component is provided at the same mounting position, and the first electronic component is mounted on the wiring board. It has a first land for soldering, a second land for soldering a second electronic component, and a connection wiring pattern connecting these first and second lands, and this connection wiring pattern is soldered. Cover with resist.

Alternatively, the connection wiring pattern is formed narrower than the pattern width of the first and second lands.

[0013]

When the wiring board is formed so that the first or second electronic component is selectively mounted at the same mounting position, the first land for soldering the first electronic component, and
If the second land to which the second electronic component is soldered and the connection wiring pattern connecting these first and second lands are formed, the wiring board is shared by the first and second electronic components. be able to. At this time, if this connection wiring pattern is covered with a solder resist, excessive adhesion of solder can be reduced.

Alternatively, if the connection wiring pattern is formed narrower than the pattern width of the first and second lands, excessive adhesion of solder can be reduced accordingly.

Therefore, the wiring board can be shared and mass-produced by applying it to electronic equipment.

[0016]

Embodiments of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is an exploded perspective view showing a mounting state of an integrated circuit in mass production and design study of an electronic device according to an embodiment of the present invention. In this electronic device, at the time of mass production, the QFP type integrated circuit 2 is directly soldered and mounted at the integrated circuit mounting position 1 on the wiring board. On the other hand, at the time of examination, after the IC socket 3 is soldered to the integrated circuit mounting position 1, the integrated circuit 2 is mounted on the IC socket 3.

Therefore, in this wiring board, the integrated circuit mounting position 1 can be soldered to the terminal of the integrated circuit 2 and the terminal of the IC socket 3 at the same position as shown by enlarging the land 4 by the arrow a. Thus, the land 4 is formed by connecting the first land portion at the soldering position 4a of the integrated circuit 2 and the second land portion at the soldering position 4b of the IC socket 3.

Thus, in this embodiment, the integrated circuit 2,
Compared to the wiring board dedicated to the IC socket 3, the shape of the land 4 is extended and enlarged so that the integrated circuit 2 and the IC socket 3 can share the wiring board.

In forming the land 4 in this manner, the land 4 is formed in a rectangular shape on the wiring board, and the soldering position 4 of the integrated circuit 2 is formed at a substantially intermediate position in the longitudinal direction.
A resist layer 5 (shown by hatching with diagonal lines) is formed so as to separate a and the soldering position 4b of the IC socket 3.

As a result, in this embodiment, even when the land is enlarged as compared with the dedicated wiring board, an appropriate amount of cream solder is applied to the soldering position 4a of the integrated circuit 2 and the soldering position 4b of the IC socket 3, respectively. Can be attached,
It is possible to effectively avoid the occurrence of bridges due to excessive solder.

According to the above structure, the land 4 is formed by connecting the soldering position 4a of the integrated circuit 2 and the soldering position 4b of the IC socket 3, and the integrated circuit 2 is formed by the resist layer 5.
Soldering position 4a of IC socket 3 and soldering position 4 of IC socket 3
By separating b from each other, an appropriate amount of cream solder can be attached to each of the soldering position 4a of the integrated circuit 2 and the soldering position 4b of the IC socket 3, whereby the integrated circuit 2 and the IC socket 3 can be attached. Common wiring board,
Moreover, it is possible to effectively avoid the occurrence of bridges due to excessive solder.

In the above embodiment, the case where the soldering position 4a of the integrated circuit 2 and the soldering position 4b of the IC socket 3 are separated by the resist layer 5 has been described, but the present invention is not limited to this. The point is that cream solder does not adhere to the portion connecting the soldering position 4a of the integrated circuit 2 and the soldering position 4b of the IC socket 3, or the amount of cream solder adhered to this portion can be reduced. As shown in FIGS. 2 to 4, the soldering position 4a
It is also possible to reduce the amount of cream solder adhered to this portion by forming a thin pattern that connects 4 and 4b.

In FIG. 2, soldering positions 4a and 4 are shown.
Fig. 3 shows the case where the center of b is connected with a thin long land.
In the case where one end of each of the soldering positions 4a and 4b is connected by a thin long land, FIG. 4 shows a land connecting the soldering positions 4a and 4b in a semi-circular shape.

Further, in the above-mentioned embodiments, the case where the present invention is applied to mount the QFP type integrated circuit has been described, but the present invention is not limited to this, and various surface mount type integrated circuits are mounted. It can be widely applied to cases.

[0026]

As described above, according to the present invention, the first and second lands to which the first and second electronic components are soldered are connected by the connection wiring pattern, and the connection wiring pattern is formed. By being covered with a solder resist or formed into an elongated shape, for example, a first electronic component made of an integrated circuit,
With the second electronic component, which is an IC socket in which this integrated circuit is mounted, it is possible to effectively avoid the occurrence of a bridge and share the wiring board.

[Brief description of drawings]

FIG. 1 is an exploded perspective view showing a mounted state of an integrated circuit according to an embodiment of the present invention.

FIG. 2 is a plan view showing a shape of a land according to a second embodiment.

FIG. 3 is a plan view showing a shape of a land according to a third embodiment.

FIG. 4 is a plan view showing a shape of a land according to a fourth embodiment.

[Explanation of symbols]

 1 Integrated circuit mounting position 2 Integrated circuit 3 IC socket 4 Land

Claims (4)

[Claims] 1. A first land, which is formed at the same mounting position so as to selectively mount the first or second electronic component, and which solders the first electronic component, and the second land. A wiring board comprising: a second land for soldering an electronic component; and a connection wiring pattern connecting the first and second lands, wherein the connection wiring pattern is covered with a solder resist. 2. A first land, which is formed at the same mounting position so as to selectively mount the first or second electronic component, and which solders the first electronic component, and the second land. A second land for soldering an electronic component, and a connection wiring pattern connecting the first and second lands, wherein the connection wiring pattern is narrower than the pattern width of the first and second lands. A wiring board characterized by being formed. 3. A wiring board formed at the same mounting position so as to selectively mount the first or second electronic component, wherein the wiring board solders the first electronic component. A first land, a second land for soldering the second electronic component, and a connection wiring pattern connecting the first and second lands, the connection wiring pattern being a solder resist. An electronic device characterized by being coated with. 4. A wiring board is formed at the same mounting position so as to selectively mount the first or second electronic component, and the wiring board solders the first electronic component. A first land, a second land for soldering the second electronic component, and a connection wiring pattern connecting the first and second lands, the connection wiring pattern being An electronic device characterized by being formed narrower than the pattern width of the first and second lands.