JPH08293406A - Manufacture of electronic part - Google Patents

Abstract

PURPOSE: To perform soldering by using cream solder in a short time and with less energy by moving an electronic part element assembly through the inside of an induction heating equipment under a condition where a lead terminal touches an electrode portion via cream solder. CONSTITUTION: A silver electrode 1a is formed on both the surfaces of a ceramic electronic part element assembly 1 constituted by a varistor sintered body having zinc oxide as main component. Cream solder 2 is screen-printed on this silver electrode 1a and is dried. Flat plate-shaped lead terminals 3 clamp both the surfaces and are temporarily bonded together under pressure; and cream solder 2 is melted by passing through an induction heating equipment and the lead terminal 3 is soldered to the silver electrode 1a. By doing this, working time can be shortened and the amount of energy used can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing electronic parts used in various electronic devices.

[0002]

2. Description of the Related Art In a conventional ceramic electronic component such as a ceramic varistor, cream solder is sometimes used when a flat lead terminal is soldered to its electrode portion.

As such a soldering method, cream solder is printed and dried on an electrode portion of a ceramic electronic component element body in a predetermined shape by a screen printing method or the like, and then a flat lead terminal is used as an appropriate method. Then, the cream solder was temporarily pressure-bonded and passed through a heating device using a nichrome wire or a heating device using a sheath heater to melt the cream solder, thereby soldering the lead terminal to the electrode part. .

[0004]

According to the above-described conventional method of manufacturing an electronic component, the ceramic electronic component element body having a heat capacity much larger than that of the lead terminal or the electrode is simultaneously heated at the time of soldering, It takes a long time to heat the cream solder to a temperature at which it is melted, and a large amount of energy is required for heating that much, resulting in a problem of high production cost.

It is an object of the present invention to eliminate the above-mentioned conventional problems and provide a method of manufacturing an electronic component which can be soldered using cream solder in a short time and energy saving.

[0006]

In order to achieve this object, the present invention is to pass the inside of an induction heating device in a state where a lead terminal is in contact with an electrode portion of an electronic component element body via cream solder. Is.

[0007]

With the above method, only the cream solder and the electrodes and the lead terminals sandwiching the cream solder are heated by the generation of the eddy current, so that the time for melting the cream solder can be shortened and the heating energy is also minimized. Therefore, the production cost can be reduced.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for manufacturing a ceramic electronic component of the present invention will be described below with reference to the drawings. 1 to 3 are views showing manufacturing steps of the ceramic electronic component of the present invention. 1 (a) and 1 (b) show a ceramic electronic component body 1, which is made of, for example, a varistor sintered body having a diameter of 32 mm and a thickness of 5 mm and containing zinc oxide as a main component.
This varistor sintered body is already formed with silver electrodes 1a having a diameter of 25 mm on both surfaces. In the next step, Fig. 2 (a)
As shown in (b), the silver electrode 1a has a diameter of 15 m.
The cream solder 2 having a thickness of m and a thickness of about 50 μm is screen-printed and dried. This is performed in the next step as shown in FIG.
As shown in (b), a plate-shaped lead terminal 3 was sandwiched on both sides using a jig (not shown) having an appropriate shape such as a binder clip, and temporarily pressure-bonded. This is applied to the induction heating device with a frequency of 400 kHz and an output of 3 kW for 20
The cream solder 2 was melted by passing for 2 seconds, and the lead terminal 3 was soldered on the silver electrode 1a as shown in FIG.

For comparison with one embodiment of the present invention,
The cream solder 2 was melted and soldered by using a nichrome heater heating device (15 kW) which is a conventional example, but in the case of this conventional example, it took 8 minutes to complete the soldering.

With these two methods, the temperature of the lead terminal 3 and the ceramic electronic component element body 1 immediately after the completion of soldering was measured. As a result, in the case of one embodiment according to the present invention, the temperatures were about 195 ° C. and 80 While the temperature was 0 ° C, in the case of the conventional example, it was about 200 ° C and 190 ° C.

Table 1 shows the energy usage (power usage) of one embodiment of the present invention and the conventional example as an index with the conventional example being 100.

[0012]

[Table 1]

As is clear from this (Table 1), in one embodiment of the present invention, the amount of electric power used could be reduced to 15% of the conventional amount.

As is apparent from the above-described embodiment, the use of the induction heating device can significantly reduce the working time and the amount of energy used, resulting in low cost. It becomes possible to produce ceramic electronic components.

In the above embodiment, the electrode is the silver electrode 1.
However, an electrode formed by spraying an electrode of aluminum / copper or the like may be used. Further, although the varistor element containing zinc oxide as a main component is taken as an example of the ceramic electronic component body 1, the same effect can be obtained by using a ceramic body or another electronic component constituting a ceramic capacitor or thermistor. .

[0016]

As described above, according to the method for manufacturing an electronic component of the present invention, the electrode portion of the electronic component element body is passed through the induction heating device while the lead terminal is in contact with the electrode portion via cream solder, This induction heating device generates an eddy current by electromagnetic induction in at least one of the lead terminal, the electrode and the cream solder, and the heat generated by this causes the cream solder to melt,
Since it is soldering, the working time can be greatly shortened, the amount of energy used can be greatly reduced, and as a result, inexpensive electronic components can be provided, which is an industrial value. Is a great thing.

[Brief description of drawings]

FIG. 1A is a plan view of a ceramic electronic component body 1 in an embodiment of a method for manufacturing a ceramic electronic component of the present invention, and FIG. 1B is the same sectional view.

FIG. 2A is a diagram in which cream solder 2 is printed on the electrodes of FIG.
A plan view in a dry state (b) is the same cross-sectional view

3 (a) is a plan view of the ceramic electronic component to which the lead terminals 3 are soldered in FIG. 2 (b) is a sectional view thereof.

[Explanation of symbols]

 1 Ceramic electronic component body 1a Silver electrode 2 Cream solder 3 Lead terminal

Claims (1)

[Claims] 1. A method of manufacturing an electronic component, wherein a lead terminal is brought into contact with an electrode portion of an electronic component element body via a cream solder, and the lead terminal is passed through the induction heating device.