JPS59117101A - Method of connecting terminal of positive temperature coefficient thermistor - Google Patents
Method of connecting terminal of positive temperature coefficient thermistorInfo
- Publication number
- JPS59117101A JPS59117101A JP22592182A JP22592182A JPS59117101A JP S59117101 A JPS59117101 A JP S59117101A JP 22592182 A JP22592182 A JP 22592182A JP 22592182 A JP22592182 A JP 22592182A JP S59117101 A JPS59117101 A JP S59117101A
- Authority
- JP
- Japan
- Prior art keywords
- temperature coefficient
- positive temperature
- coefficient thermistor
- thermistor
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Thermistors And Varistors (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Resistance Heating (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、正特性サーミスタを利用して、発熱体、セン
サ、無接点スイッチ等を構成する時の端子板の接続方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method of connecting terminal boards when constructing a heating element, a sensor, a non-contact switch, etc. using a positive temperature coefficient thermistor.
(従来例の構成とその問題点)
正特性サーミスタは、ある温度で抵抗値が急激に上昇す
る性質を持った半導体セラミックで、定温発熱体や、温
度センサや、無接点スイッチなどに利用出来る有角な素
子であることはよく知られている。これらの用途に使う
だめには、当然この正特性サーミスタに電圧を印加し、
たり、その抵抗値の変化を感知するために電極を付与し
、その電極に、端子板やリード線を簡単な構造で取付け
る必要がある。(Conventional structure and its problems) A positive temperature coefficient thermistor is a semiconductor ceramic whose resistance value increases rapidly at a certain temperature, and is an effective material that can be used in constant temperature heating elements, temperature sensors, non-contact switches, etc. It is well known that it is a square element. Naturally, to use it for these purposes, a voltage is applied to this positive characteristic thermistor,
It is necessary to provide an electrode to detect the change in resistance value, and to attach a terminal plate and a lead wire to the electrode with a simple structure.
従来、この種の端7接続方法としては、第1図に示すよ
うに、銀等を焼料けた電極1,2が両面に形成された正
特性サーミスタ3に、銅のリード線6,7を半1]]=
I、5を用いて取(=Jける方法があっ/乙。捷/こ別
の従来の方法としては、第2図に示すように、片側に開
口¥S1へを有し、底部には端子板]2.1:3の引出
リード部の通る穴のあいた絶縁ケース8の中に☆J1:
子板]:4、電極10,1.1を治する11:、特性サ
ーミスタ9、端子板12の順に挿入し、絶縁板1/lを
介して金属のふた15を被せ、絶縁ケース8にかしめて
全体を固定しである。端子板13は一部がわん曲してハ
オ性を++与しその力で正特性サーミスタを−4−に押
し上げ、電極1.0.11と端子板12,132がそれ
ぞれ接触するようKなっている。さらに別の従来の方法
として第3図に示ず」=うに、正特性サーミスタ16を
バネ性のある端子板19.20で挾持し、電極17..
18と端子板1.9 、20とをそれぞれ圧接させてい
る。これらを絶縁ケース21に挿入し、絶縁性のふた2
2を上記ケースに接着しである。Conventionally, as shown in FIG. 1, this type of end 7 connection method involves connecting copper lead wires 6 and 7 to a positive temperature coefficient thermistor 3, which has electrodes 1 and 2 made of fired silver or the like formed on both sides. Half 1]] =
There is a method of removing (=J) using I, 5. As shown in Figure 2, the conventional method of removing (=J) is to have an opening to S1 on one side and a terminal on the bottom. Board] 2. Inside the insulating case 8 with a hole for the 1:3 drawer lead part to pass through ☆J1:
11: Insert the characteristic thermistor 9 and the terminal board 12 in this order, cover with the metal lid 15 through the insulating plate 1/l, and then fix the electrodes 10 and 1.1. Tighten it to fix the whole thing. A part of the terminal plate 13 is bent to give it a positive property, and the force pushes the positive temperature coefficient thermistor to -4-, so that the electrodes 1, 0, 11 and terminal plates 12, 132 are in contact with each other. There is. In yet another conventional method, as shown in FIG. ..
18 and terminal plates 1.9 and 20 are pressed into contact with each other. Insert these into the insulating case 21 and cover the insulating lid 2.
2 is glued to the above case.
以上述べたように従来の方法は、大きくわけて■ 半田
でリード線や端子板を正特性サーミスタの電極に固着す
る。As mentioned above, the conventional method can be broadly divided into (1) fixing lead wires and terminal plates to the electrodes of a positive temperature coefficient thermistor using solder;
■ バネ端子を押し付け、端子板と正特性サーミスタの
電極とを導通させる。■ Press the spring terminal to establish continuity between the terminal board and the positive temperature coefficient thermistor electrode.
の2つがあった。これらの方法では次に述べるような欠
点があった。すなわち半田付で端子板をとり出す方法で
に1、半田何時にフラックスを使用するため、半田イづ
の後で抵抗値が低下し、正特性サーミスタの耐電圧が低
]する。畦だ、ステンレスが正特性サーミスタの微小な
穴に入り込んた14使用すると熱のためにフラックスが
炭化し、/ヨードの危険性/べある。これらのことを防
ぐためには半田何時のステンレスの量を十分に管理する
必要があり、寸だ半田付後はステンレス残渣の十分な洗
浄が必要となる。そのため工程が複雑になり量産性の乏
1.いものであった。才た半U−J3刊をする時は半田
の溶融温度より少なくとも50゛C〜80℃以上に正特
性サーミスタを加熱する必要があり、その時の熱@づy
で正特性サーミスタに微小なりラック が/1じ、ひい
ては破壊に至ることがある。これを防ぐKは、l正特性
ザーミス′りを急激に加熱L7ないように事前に低い温
度で予熱シフ、徐々に半田イー1(□11A度1であげ
ていく心安がある。そのため、これも工率7を蝮何1に
し、かつ時間がかかり量産性の乏1.いものであった。There were two. These methods had the following drawbacks. That is, in the method of taking out the terminal board by soldering, flux is used during soldering, so the resistance value decreases after soldering, and the withstand voltage of the positive temperature coefficient thermistor is low. 14 If the stainless steel gets into the minute hole of the positive temperature coefficient thermistor, the flux will carbonize due to the heat and / danger of iodine / will be exposed. In order to prevent these things, it is necessary to sufficiently control the amount of stainless steel during soldering, and it is necessary to thoroughly clean the stainless steel residue after soldering. As a result, the process becomes complicated and mass production is poor.1. It was a good thing. When printing Saitahan U-J3, it is necessary to heat the positive temperature coefficient thermistor to at least 50°C to 80°C higher than the melting temperature of the solder, and the heat at that time is
In this case, the positive temperature coefficient thermistor may have a small rack of 1/1 inch, which may even lead to its destruction. To prevent this, K should be preheated at a low temperature in advance to avoid sudden heating L7 of the positive characteristic thermistor, and then gradually raise the solder temperature to 1 degree (□11A).Therefore, this also applies. The manufacturing efficiency was 7, but it was also time consuming and difficult to mass produce.
上記の欠点は半田の融点が高1i!であれはあるほど顕
著にあられれてくる。つ廿り、フラックスの幅1νを−
にければ上げるほどその作用は強くなり、耐電圧の低下
は太きくなる。The above disadvantage is that the melting point of the solder is high 1i! The more this happens, the more noticeable it becomes. In this case, the flux width 1ν is −
The higher the value, the stronger the effect and the greater the drop in withstand voltage.
捷/こ、〃(衝撃の大きさも当然大きくなり破壊しやす
くなる。従って用4田付の方法では、用いられろ半1−
1)の融点か制限されてし1つ。(Naturally, the magnitude of the impact will be larger and it will be easier to break. Therefore, in the method of 4-tadatsuki, 1-
1) The melting point is limited.
さらに使用する端子板の利質も、半田イー1の容易々鉄
や銅系の金属に限られ、アルミニウムやステンレス等の
ように半[T]付しにぐい金属を端子板に使用するこ占
は困ω11で、役割に大きな制限がある。Furthermore, the quality of the terminal boards used is limited to iron and copper metals, which can be easily soldered. It is difficult ω11, and there are major restrictions on its role.
↓
寸だ、ハネ端子でサーミスタ挾持する方法ではステンレ
スや加熱の影響はないが、バネ端子を保持するケース状
のものが不可欠であり、たとえ単純に端イ板を固定する
たけでも部品点数が多くなり高価なものになる。才だ、
端二r板としては・・不仁を有するものしか使えず、こ
の点でも役割に制限がある。↓ By the way, the method of holding the thermistor with spring terminals is not affected by stainless steel or heating, but a case-like thing to hold the spring terminals is essential, and even if you simply fix the end plate, there are many parts. It becomes expensive. He's talented.
As an edge board, only those with bad faith can be used, and there are limits to its role in this respect as well.
(発明の目的)
本発明は、以上に述べたような従来の問題を解消し、部
品点数が少なく、簡単な工程で、端子板の材質の制限も
ない正特性サーミスタの端子接続方法を捉供するもので
ある。(Objective of the Invention) The present invention solves the conventional problems as described above, and provides a method for connecting terminals of a positive temperature coefficient thermistor using a small number of parts, a simple process, and no restrictions on the material of the terminal board. It is something.
(発明の構成)
本発明の正特性サーミスタの端子接続方法は、正特性サ
ーミスタの電極面に絶縁性接着剤を塗布し、この」二に
金属端子板を押圧しながら前記接着剤を硬化17て端子
板と正特性サーミスタの電極とを電気的に導通させ、か
つ端子板を機械的に固゛着させるようにしたものである
。(Structure of the Invention) The terminal connection method of a PTC thermistor of the present invention involves applying an insulating adhesive to the electrode surface of the PTC thermistor, and curing the adhesive while pressing a metal terminal plate. The terminal plate and the electrode of the positive temperature coefficient thermistor are electrically connected, and the terminal plate is mechanically fixed.
(実施例の説明)
以下雄側図面に基づいて本発明の一実施例について説明
する。第4図において銀等の焼イ1は電極26.27が
設けられた正特性サーミスタ23に、ンリコン系の接着
剤28が塗布され/こステンレス等の金属端子板24.
25を、上記電極の面に配し、図の矢印の方向に力を
加えたまま、シリコン接着剤を硬化させる。このように
して得られた正特性ツーミスタは、第4図(C)の拡大
図でわかるように、加圧しながら硬化させているので端
子板24が微小の凹凸のある電極26の凸部と確実に接
触し電気的漕通が得られる。さらに凹部Kfd、シリコ
ン接着剤28が充填されて硬化しているので金属端子板
24.25が強固に固着される。(Description of Embodiment) An embodiment of the present invention will be described below based on the male side drawings. In FIG. 4, a metal terminal plate 24 made of stainless steel or the like is coated with adhesive 28 based on a positive temperature coefficient thermistor 23 provided with electrodes 26 and 27.
25 is placed on the surface of the electrode, and the silicone adhesive is cured while applying force in the direction of the arrow in the figure. As can be seen in the enlarged view of FIG. 4(C), the thus obtained positive characteristic two-mister is hardened while being pressurized, so that the terminal plate 24 is firmly aligned with the convex portion of the electrode 26, which has minute irregularities. Electrical communication is obtained by contacting the Further, since the recess Kfd is filled with the silicon adhesive 28 and hardened, the metal terminal plates 24 and 25 are firmly fixed.
さらに別の実施例として、正特性サーミスタの電11f
tに金属の溶、!11電伶を用いた例について説明する
。金11コ、特にアルミ−ラムは正特性サーミスタとオ
ーツ、伯の接触が得られるため、溶射法による電極とし
てよく用いられる。本発明は絶縁性接着;)ilのみに
よりて端r板を機械的に固着し、[7かも1[L気的j
?i通をC6イ呆するものであるが、1肥に説明[7た
溶射量4ij I/Cよ)1ばその表面あらさが20〜
]、 00ミク1−Iン程Iしとなり、電極表面の凹凸
が銀電極に比べ適1埃に1’i2 (なるので、本発明
の端子接続方法(lこVり耀1ニーJ′を接続すると、
導通が銀電極に比−乏てさらに確実(C々り信頼性が高
する。As yet another example, the voltage 11f of a positive temperature coefficient thermistor is
Metal melting in t! An example using No. 11 Denrei will be explained. Gold metal, especially aluminum laminate, is often used as an electrode by thermal spraying because it provides close contact with a positive temperature coefficient thermistor. The present invention mechanically fixes the end plate using only insulating adhesive;
? I'm disappointed in C6, but I explained to him that the surface roughness of the 1st case is 20~20cm.
], 00 micrometers 1-Iin, and the unevenness of the electrode surface becomes 1'i2 (1'i2) (compared to a silver electrode). When connected,
Continuity is poorer than that of silver electrodes, and it is more reliable (higher reliability than silver electrodes).
第5図は、さらに別の実施例で、正特性ヤーーミスタ2
9にあらかじめ凸凹を規則正しく形成しておき、その上
に銀電極30等を焼き(=jけた正特性サーミスタを用
いて、本発明の端子接続方法により、端子を接続すれば
、凸凹の状態が確実に管理でき、金属溶射電極の表面よ
りさらに規則正しい凸凹が得られ、信頼性が高する。−
1′だ、この時、正特性サーミスタの表面ではなく、金
属端子板の表面にあらかじめ凸凹を設けておいても同様
の効果が期待できる。FIG. 5 shows yet another embodiment of the positive characteristic YAMISTER 2.
9, and then bake a silver electrode 30, etc. on top of it (= If you connect the terminals using the terminal connection method of the present invention using a j order positive characteristic thermistor, the uneven state will be ensured. The surface of the metal sprayed electrode can be controlled to have even more regular irregularities than the surface of the metal sprayed electrode, resulting in high reliability.
1'. At this time, the same effect can be expected even if unevenness is provided in advance on the surface of the metal terminal plate instead of on the surface of the PTC thermistor.
さらに、別の実施例として、絶縁性接着剤に正特性サー
ミスタのキュリ一温度側近で硬化する熱硬化性接着剤を
用いた例を説明する。この接着剤を正特性サーミスタの
電極面に塗布し、その」−に端子板を重ねて加圧しなが
ら正特性サーミスタに電圧を印加して硬化する。正特性
サーミスタに電圧を印加すると、正特性サーミスタは発
熱し、その表面温度はキ・−リ一温度(”I近で平衡に
達し安定する。接着剤はその熱で硬化する。正特性サー
ミスタに電H−を印加する場合、正特性サーミスタの’
FIN 4身に直イど印加してもよいが、端子板を通し
て印加(7だ場合、所定時間に硬化が完了したことを確
認することによって、端子板と]E特性サーミスタの電
極とのノ、9通が十分であるということが確認出来、品
質の確保が各局になる吉いう利点がある。Furthermore, as another example, an example will be described in which a thermosetting adhesive that hardens near the Curie temperature of a positive temperature coefficient thermistor is used as the insulating adhesive. This adhesive is applied to the electrode surface of the positive temperature coefficient thermistor, and a terminal plate is stacked on top of the adhesive, and a voltage is applied to the positive temperature coefficient thermistor while applying pressure to cure it. When a voltage is applied to a positive temperature coefficient thermistor, the positive temperature coefficient thermistor generates heat, and its surface temperature reaches equilibrium near the Ki-ri temperature (I) and becomes stable.The adhesive hardens with the heat. When applying the electric current H-, the positive temperature coefficient thermistor's
FIN 4 You can apply the voltage directly to the body, but you can apply it through the terminal board (if it is 7, make sure that curing is completed within the specified time, then apply the voltage between the terminal board and the electrode of the E-characteristic thermistor). This has the advantage that it can be confirmed that nine letters are sufficient, and quality can be ensured by each station.
本実施例の効果さして、正特性サーミスタそのものが発
〃(するので、最も加熱しだい部分、すなわち接着剤の
塗布面のみを効果的に加熱することができる。すなわち
、乾燥機等を使用して、外部から加〃1したものに比へ
、加熱エネルギーの節約、加ρ(114間の旬縮庖図る
ことができる。The effect of this embodiment is that the positive temperature coefficient thermistor itself generates heat, so that only the part that is most heated, that is, the surface where the adhesive is applied, can be effectively heated. It is possible to save heating energy and reduce the amount of heat added (114 times) compared to that applied externally.
(発明の効果)
実施例の、説明から明らかなように、本発明は、絶縁何
接了i i’illのみにJ、って、金属端子板と正特
性−リーーミスタとの、2*通と1・も」着を同時にし
てしまう方法て、フラックスを用いないので、
(1) 市?肖1つ1ザ−ミスタの抵抗値変化がない
。(Effects of the Invention) As is clear from the description of the embodiments, the present invention has two connections between a metal terminal plate and a positive characteristic leakage resistor. 1. The method of wearing both clothes at the same time does not use flux, so (1) City? There is no change in the resistance value of the resistor.
■ 2−’f−ンレスやγノしミニラム等の半ITI何
の困竹(な金1fiでも(ltIらit’ll限される
ことなぐ、端子板として使用できる。■ Any type of semi-ITI, such as a 2-'f-less or a gamma-shaped miniram, or a metal 1fi can be used as a terminal board without being limited.
■ 正特性サーミスタを必要以上に加熱しなくても端子
板が接続できるので、正特性サーミスタに対する熱衝撃
が少・なく、従って破壊が起らず、品質、歩留が向上す
る。■ Since the terminal board can be connected without heating the positive temperature coefficient thermistor more than necessary, there is little thermal shock to the positive temperature coefficient thermistor, which prevents damage and improves quality and yield.
■ さらにバネ端子等を用いていないので部品点数が少
なく、工程が簡単で安価に端子板を接続することができ
る。■ Furthermore, since spring terminals and the like are not used, the number of parts is small, the process is simple, and terminal boards can be connected at low cost.
等の効果がある。There are other effects.
なお本発明は正特性サーミスタの電極の形状や位置、端
子板の形状について何ら制限を加えるものではなく、同
一平面上の電極や、円筒状正特性サーミスタの外壁や内
壁につけられた電極などでもよい。Note that the present invention does not impose any restrictions on the shape and position of the electrodes of the PTC thermistor or the shape of the terminal plate, and electrodes on the same plane or electrodes attached to the outer or inner wall of a cylindrical PTC thermistor may be used. .
第1図、第2図および第3図は、それぞれ従来例の断面
図、第4図は、本発明の一実施例の構成図、第5図は、
本発明の他の実施例の要部オIへ4図である。
23、29 ・・−正時1′IEツーミスク、 24
.25端子板、 26.27.30 ・・・ 正特性
サーミスタの電極、 28 ・−絶縁性接着剤。1, 2, and 3 are sectional views of conventional examples, FIG. 4 is a configuration diagram of an embodiment of the present invention, and FIG. 5 is a sectional view of a conventional example.
FIG. 4 is a diagram illustrating the main part of another embodiment of the present invention. 23, 29...-1'IE two misc on the hour, 24
.. 25 Terminal board, 26.27.30... Electrode of positive temperature coefficient thermistor, 28 - Insulating adhesive.
Claims (4)
塗布し、その上から金属端子板を押圧L=だ状態、で前
記絶縁性接着剤を硬化させ、前記金属端子板と正特性サ
ーミスタの電極とを電気的に導通させることを特徴とす
る特性サーミスタの端子接続力法。(1) Apply an insulating adhesive to the electrode surface of the PTC thermistor, press the metal terminal plate on top of it in the L = state to harden the insulating adhesive, and bond the metal terminal plate and the PTC thermistor together. A terminal connection force method for a characteristic thermistor, which is characterized by electrical continuity with an electrode.
射電極を用いたことを特徴とする特許請求の範囲第(]
)項記載の正特性サーミスタの端子接続方法。(2) Claim No. (2) characterized in that a metal sprayed electrode is used as the electrode of the positive temperature coefficient thermistor.
Terminal connection method of positive temperature coefficient thermistor described in ).
子板にあらかじめ凹凸が設けられていることを特徴とす
る特許請求の範囲第(1)項記載の正特性サーミスタの
端子接続方法。(3) The terminal connection method for a PTC thermistor according to claim (1), wherein the electrode surface or metal terminal plate of the PTC thermistor is provided with irregularities in advance.
のキュリ一温度付近で硬化する熱硬化性接着剤であシ、
前記金属端子板を電極面に押圧した状態で前記正特性サ
ーミスタに電圧を印加して発熱させ、前記キュリ一温度
付近で接着剤を硬化させることを特徴とする特許請求の
範囲第(1)項記載の正特性サーミスタの端子接続方法
。(4) the insulating adhesive is a thermosetting adhesive that hardens near the Curie temperature of the positive temperature coefficient thermistor;
Claim (1) characterized in that, with the metal terminal plate pressed against the electrode surface, a voltage is applied to the positive temperature coefficient thermistor to generate heat, and the adhesive is cured at around the Curie temperature. How to connect the terminals of the positive temperature coefficient thermistor described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22592182A JPS59117101A (en) | 1982-12-24 | 1982-12-24 | Method of connecting terminal of positive temperature coefficient thermistor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22592182A JPS59117101A (en) | 1982-12-24 | 1982-12-24 | Method of connecting terminal of positive temperature coefficient thermistor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS59117101A true JPS59117101A (en) | 1984-07-06 |
Family
ID=16836970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22592182A Pending JPS59117101A (en) | 1982-12-24 | 1982-12-24 | Method of connecting terminal of positive temperature coefficient thermistor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59117101A (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63138702A (en) * | 1986-11-29 | 1988-06-10 | 日本メクトロン株式会社 | Ptc device |
JPH04206492A (en) * | 1990-11-30 | 1992-07-28 | Matsushita Electric Ind Co Ltd | Heating body with positive resistance temperature coefficient |
JP2002098666A (en) * | 2000-06-30 | 2002-04-05 | Ngk Spark Plug Co Ltd | Board |
JP2003125492A (en) * | 2001-10-16 | 2003-04-25 | Taiyo Yuden Co Ltd | Piezoelectric acoustic device |
WO2018073902A1 (en) * | 2016-10-19 | 2018-04-26 | 三菱電機株式会社 | Liquid level sensor and refrigeration cycle system |
WO2020111196A1 (en) * | 2018-11-29 | 2020-06-04 | 京セラ株式会社 | Heater |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51132454A (en) * | 1975-05-13 | 1976-11-17 | Murata Manufacturing Co | Method of mounting electronic parts with leads |
-
1982
- 1982-12-24 JP JP22592182A patent/JPS59117101A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51132454A (en) * | 1975-05-13 | 1976-11-17 | Murata Manufacturing Co | Method of mounting electronic parts with leads |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63138702A (en) * | 1986-11-29 | 1988-06-10 | 日本メクトロン株式会社 | Ptc device |
JPH04206492A (en) * | 1990-11-30 | 1992-07-28 | Matsushita Electric Ind Co Ltd | Heating body with positive resistance temperature coefficient |
JP2002098666A (en) * | 2000-06-30 | 2002-04-05 | Ngk Spark Plug Co Ltd | Board |
JP2003125492A (en) * | 2001-10-16 | 2003-04-25 | Taiyo Yuden Co Ltd | Piezoelectric acoustic device |
WO2018073902A1 (en) * | 2016-10-19 | 2018-04-26 | 三菱電機株式会社 | Liquid level sensor and refrigeration cycle system |
CN109863373A (en) * | 2016-10-19 | 2019-06-07 | 三菱电机株式会社 | Liquid level sensor and refrigerating circulatory device |
JPWO2018073902A1 (en) * | 2016-10-19 | 2019-06-24 | 三菱電機株式会社 | Liquid level detection device and refrigeration cycle device |
US11493248B2 (en) | 2016-10-19 | 2022-11-08 | Mitsubishi Electric Corporation | Liquid level detection device and refrigeration cycle apparatus |
WO2020111196A1 (en) * | 2018-11-29 | 2020-06-04 | 京セラ株式会社 | Heater |
JPWO2020111196A1 (en) * | 2018-11-29 | 2021-09-30 | 京セラ株式会社 | heater |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4818823A (en) | Adhesive component means for attaching electrical components to conductors | |
JPH10335579A (en) | High power semiconductor module device | |
US20100066482A1 (en) | Electronic component with lead wire | |
JPH0455339B2 (en) | ||
JPS5985123A (en) | Air-tight base for piezoelectric oscillator | |
JPS59117101A (en) | Method of connecting terminal of positive temperature coefficient thermistor | |
JPH09297069A (en) | Temperature detecting sensor | |
JPH0312446B2 (en) | ||
JPH039282Y2 (en) | ||
JP2827460B2 (en) | Method for manufacturing positive temperature coefficient thermistor heating element | |
JPS6318335B2 (en) | ||
JPH0671026B2 (en) | Semiconductor mounting method | |
JPH0517870Y2 (en) | ||
JPS5852641Y2 (en) | Positive characteristic thermistor | |
JPH0644090Y2 (en) | Feedthrough capacitor device | |
JPH01226162A (en) | Connection of semiconductor chip | |
JPH0122260Y2 (en) | ||
JP2739167B2 (en) | Film capacitor and mounting method thereof | |
JPH0142353Y2 (en) | ||
JPS60123010A (en) | Chiplike film capacitor | |
JPS62183105A (en) | Manufacture of chip-type film capacitor | |
JPH0410709Y2 (en) | ||
JPS60123011A (en) | Chiplike film capacitor | |
JPH0935987A (en) | Ceramic capacitor | |
JP2570131B2 (en) | Bipolar solid electrolytic capacitor with built-in fuse |