JPH08283964A - Production of etched parts - Google Patents

Abstract

PURPOSE: To minimize the sheared etching of a metallic base material and to improve the dimensional accuracy of an etching pattern by etching the surface of a metallic base material having a resist film on which a fine pattern is formed with a high-temp. and high-sp.gr. liq. etchant and then washing the etched surface with hot water. CONSTITUTION: The exposed part of metal is etched with a high-temp. and high-sp.gr. ferric chloride soln. kept at 75-90 deg.C and having 1.50-1.61 sp.gr., and a resist film is released in this photoetching method. When the etched parts are produced by this method, hot water is used in washing after etching. In this case, when the sp.gr. of the liq. etchant is denoted by (d), the temp. of the used in washing is higher than the temp. obtained from the approximate expression, 103, 7543d=136, 5597 and lower than 60 deg.C. Besides, inexpensive well water passed through a filter can be used as the washing water.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an etching part, and more particularly to a method for manufacturing an etching part using an etching solution having a high temperature and a high specific gravity.

[0002]

2. Description of the Related Art Conventionally, an etching component typified by a shadow mask used for a color picture tube or a lead frame for a semiconductor device is generally manufactured by a photoetching method. For example, a shadow mask used for a color picture tube or the like is manufactured by the process shown in the example of FIG. 5 below. That is, as a metal material (shadow mask material) to be a shadow mask, for example, a plate thickness of 0.13
mm low carbon steel sheet, degreasing, surface conditioning, cleaning treatment on both sides, and then water-soluble photosensitive resin consisting of casein or polyvinyl alcohol and ammonium dichromate is applied to both sides and dried to form a resist film To form. Next, the negative pattern of the small hole image is exposed on one surface of the shadow mask material and the negative pattern of the large hole image is exposed on the other surface through the exposure pattern mask. After that, a developing process for dissolving the unexposed and uncured resist film is performed with warm water, and then, as shown in FIG.
As shown in (a), a resist film 13 having small holes and large holes on the front and back of the shadow mask material 12 is obtained.

After that, the resist film 13 is subjected to a film hardening process and a burning process, and the first stage etching is performed from both front and back surfaces of the shadow mask material 12 to form the shadow mask material 12 as shown in FIG. Form small and large hole depressions. At that time, a general method is to use ferric chloride solution as an etching solution and bring the ferric chloride solution into contact with the shadow mask material, that is, the metal material surface exposed from the resist film 13 by a spray method.

Next, after washing and drying the shadow mask material 12 with water, a resin is applied to the small hole side to completely fill the small hole side concave portion formed by the previous etching as shown in FIG. 5 (c). An exhaustion prevention layer 14 is formed. Subsequently, a second etching step of etching the shadow mask material only from the large hole side is performed, and washing with water is performed, as shown in FIG.
As shown in FIG. 5, an opening is formed from the large hole side to the small hole. Finally, the etching prevention layer 14 and the resist film 13 are peeled off, washed with water and dried to obtain the flat shadow mask 7 shown in FIG.

In recent years, there has been an increasing demand for fine patterning in etching parts as represented by high-definition shadow masks used in color picture tubes or lead frames used in highly integrated semiconductor devices. .

Therefore, as a means for obtaining an etched part having a fine pattern formed to meet the demand, a high temperature and a high specific gravity, for example, a liquid temperature of 75 to 90 ° C. and a specific gravity of 1.
It is a known fact that it is effective to use a ferric chloride solution of 50 to 1.61 as an etching solution. That is, by quickly etching a metal material using an etching solution of high temperature and high specific gravity, the side etching phenomenon of the metal material that cannot be avoided during the etching process is minimized, and the dimensional accuracy of the etching pattern is reduced. This is because it is possible to name

However, in the method of manufacturing an etching component using an etching solution of high temperature and high specific gravity, pattern unevenness which is assumed to be caused by washing with water as described below,
Occurrence of defective shape was a problem.

As shown in FIG. 3, the metal material 1 etched by bringing the etching liquid 4 into contact with the inside of the etching chamber 2 by a spray method using the spray 3 is transferred to the washing chamber 5. To be done. In addition,
The metal material 1 is assumed to be transported from left to right. In the washing chamber 5, the washing water 6 is brought into contact with the metal material 1 by, for example, a spray method to wash away the etching liquid remaining on the surface of the metal material 1 after leaving the etching chamber 2. With this, the etching process with the etching solution is completely completed.

Since washing with water in the washing chamber 5 requires a large amount of water, it is common to use inexpensive well water as a washing water after passing the foreign matter removing filter to remove the foreign matters. Has become. Therefore, it can be said that the liquid temperature of the washing water 6 used in the washing chamber 5 is as low as about 18 ° C.

Since the metal material 1 is also heated to a high temperature in the etching chamber 2 by being etched with the etching liquid 4 having a high temperature and a high specific gravity, the low temperature washing water 6 in the washing chamber 5 is used. When the metal material 1 comes into contact with the metal material 1, the temperature of the metal material 1 decreases, and similarly, the temperature of the etching solution remaining on the surface of the metal material also decreases.

In general, it is known that when the temperature of an aqueous solution in which a solute is dissolved close to the saturation limit is lowered, a part of the solute in the aqueous solution is precipitated as a solid. Even in a high-temperature, high-specific-gravity etching solution, when a large amount of ferric chloride (FeCl ₃ ) is dissolved in the etching solution and the temperature of the high-temperature etching solution decreases, the chloride two part iron solid (FeCl ₃ · 2H ₂ O)
Can be said to be deposited. Therefore, the etching liquid remaining on the surface of the metal material 1 that has left the etching chamber 2 is removed by washing in the washing chamber 5, but the liquid temperature is lowered by the washing water before the washing removal. ,
It can be said that ferric chloride deposited from the etching solution partially adheres to the surface of the metal material 1.

As described above, the portion of the metal material 1 on which ferric chloride is deposited and adhered on the surface during the washing and washing in the washing chamber 5 is different from the other portions in the progress difference of the chemical reaction due to the etching solution, and the final result is different. It is assumed that the desired etching is not performed. As a result, for example, an etching defect such as a hole diameter defect occurs in the shadow mask 7, pattern unevenness such as a black spot defect 8 occurs as illustrated in the example of FIG. 4, and a lead frame has a shape such as a dimensional accuracy defect. There was a defect. It should be noted that the above black spot defect 8 is normal on the shadow mask when a visual check is performed at a distance from the shadow mask 7 because a large number of holes cause a hole diameter defect in a certain area on the shadow mask 7. It means that the defective area of the hole appears as a black spot-like pattern with respect to the large area of the hole.

Further, the temperature of the metal material 1 that is rapidly cooled by being contacted with the wash water 6 in the water washing chamber 5 becomes non-uniform depending on the metal material site, which also causes a difference in progress of etching which is a chemical reaction depending on the site. Will be different,
It can be said that defects such as the above-described black spot defect and shape defect occur, but in a method of manufacturing an etching component using an etching solution of high temperature and high specific gravity, pattern unevenness, shape defect, etc., which are assumed to be caused by washing with water, Occurrence was a problem.

[0014]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and particularly in a method of manufacturing an etching component for etching a metal material using an etching solution of high temperature and high specific gravity, An object of the present invention is to provide a method for manufacturing an etched component that does not cause the above-mentioned problems in washing with water after etching.

[0015]

That is, according to the present invention, there is provided a resist film forming step of forming a resist film by applying a photosensitive resin on at least one surface of a plate-shaped metal material, and a predetermined pattern is formed on the resist film. A pattern exposure step of exposing, a developing step of developing the metal material to expose a part of the metal surface from the resist film according to a predetermined pattern,
Liquid temperature is 75 ~ 90 ℃, specific gravity is 1.50 ~ 1.61 high temperature, etching the metal material using a ferric chloride solution of high specific gravity, a step of etching the metal exposed portion, and a resist film after the etching step. In a method for producing an etched component using a photo-etching method having at least a film-peeling step, a means for heating the washing water used for washing with water after the etching step is provided, and washing with warm water is performed. The above problems are solved by providing a method for manufacturing an etched component characterized by the following.

First, the present inventors have conducted studies to solve the above-mentioned problems, and have proposed to raise the temperature of washing water used for washing with water after the etching step. That is, as described in the section (Prior Art) above, it is assumed that the temperature of the washing water is low, which may cause pattern irregularities, defective shapes, etc. on the etched parts. Therefore, use high-temperature washing water. Is proposed. For example, as shown in the example of FIG. 2, the washing water 6 in the tank 10 is heated by using a heater 9 or the like, and the washing water whose temperature has risen is supplied to the washing chamber 5 by the pump 11 to remove the metal after etching. The material 1 is washed. However, this method still has the following problems.

That is, when the temperature of the washing water 6 is raised to a high temperature, the manufacturing and installation costs of the heating device are high. High energy costs for heating. By the water vapor flowing out of the washing chamber and dew condensation,
Water droplets may drop and adhere to the metal material during the manufacturing process, causing rust and the like. It can be said that the water on the surface of the metal material evaporates rapidly because the temperature of the metal material leaving the washing chamber remains high. Therefore, the surface of the metal material is partially dried, which causes a problem in the next step. For example, in a shadow mask,
The problem is that the film thickness of the resin applied in the etching prevention layer forming step becomes uneven.

Therefore, the present inventors have made further studies in order to solve the above problems of excessively raising the temperature of the washing water. That is, solids (FeC
It found l ₃ · 2H ₂ O) Minimum temperature of the washing water does not cause precipitation of, in which attempts to solve the above problems, such as ~. At that time, actually, etching was performed using an etching solution having a high temperature and a high specific gravity, the temperature and the specific gravity of which were changed, and the washing with water after the etching was performed by changing the temperature of the washing water used.

As a result, as described in the above section (Prior Art), solids (FeCl ₃ .2H) due to temperature decrease
_As an example of the temperature condition of the washing water that does not cause the precipitation of ₂ O), the graph of FIG. 1 is empirically obtained from the examples shown below. Incidentally, the horizontal axis of FIG. 1 shows the specific gravity (d) of the ferric chloride solution used for etching at a liquid temperature of 80 ° C., and the vertical axis shows the solid (FeCl ₃ .2H) in the etching solution of each specific gravity during washing with water. ₂ O) indicates the minimum temperature (° C.) of washing water that does not cause precipitation. For example, liquid temperature 80 ℃, specific gravity
When etching with a ferric chloride solution of 1.510, the washing water used for washing with water is solid (FeCl ₃
It can be said that no precipitation of 2H ₂ O) occurs.

From the graph of FIG. 1, the present inventors derived the following temperature calculation formula. That is, the liquid temperature is 75
~ 90 ℃, high specific gravity of 1.50 ~ 1.61 at high temperature, high specific gravity In the washing with water after etching with ferric chloride solution, when the specific gravity of the etching solution used is d, the washing water used It is proposed to solve the above problems by setting the temperature to be equal to or higher than the value obtained by the approximate expression of 103.7543d-136.55597 obtained from the graph of FIG.

The above formula represents the minimum temperature of the washing water suitable for washing with water, but the upper limit of the temperature of the washing water is to prevent the above-mentioned problems (1), (2), (3), etc. from occurring. Therefore, the present inventors propose to set the temperature to 60 ° C. or lower.

That is, the present inventors have found that the liquid temperature is 75 to 90.
When the specific gravity of the etching solution used is d in the washing with water after etching with ferric chloride solution of high temperature and high specific gravity of 1.50 to 1.61 at ℃, as shown in the example of FIG. Heated by such means as 103.7543d-136.55
It is proposed to solve the above-mentioned problems by using hot water whose temperature is equal to or higher than the value calculated by the approximation formula of 97 and lower than or equal to 60 ° C. Note that the embodiment of the present invention is not necessarily limited to the example of FIG. For example, in FIG. 2, a heating means such as a heater 9 is provided in the tank 10 to control the temperature of the washing water.
It can be said that the temperature of the washing water may be controlled by providing a heating means such as the heater 9 in the washing water supply pipe itself without using 10. Further, it can be said that the washing with water may be an immersion method.

[0023]

In the method of manufacturing an etched part according to the present invention,
In washing with water after etching with a ferric chloride solution of high temperature and high specific gravity, when the specific gravity of the etching solution used is d, the temperature of the washing water used is 103.7543d-136.55.
The value is not less than the value calculated by the approximation formula of 97 and not more than 60 ° C. For this reason, during washing with water, it is possible to prevent ferric chloride from depositing and adhering to the surface of the metal material from the etching liquid remaining on the surface of the metal material after leaving the etching chamber. Further, since the wash water is warm water, the metal material is not cooled rapidly in the water wash chamber, and the temperature nonuniformity at the metal material site is eliminated. This makes it possible to prevent a difference in progress of etching, which is a chemical reaction, depending on the metal material site.

[0024]

EXAMPLES Examples in which the present invention is used for manufacturing a shadow mask will be described below. <Example> As the shadow mask material, that is, the metal material 1, a long-sized metal plate supplied from the winding roll and having a low expansion coefficient of 0.13 mm was used. Then, according to the steps described in the section (Prior Art) described above,
A metal material 1 having a small-hole resist film and a large-hole resist film on the front and back sides after performing a hardening process and a burning process after the developing process.
Is what you are getting.

Next, as shown in FIG. 2, the metal material 1 was subjected to the first etching in the first etching chamber 2 to form small holes and large hole recesses on the front and back of the metal material 1, respectively. At this time, the etching was performed by a spray method in which a ferric chloride solution having a liquid temperature of 80 ° C., a high specific gravity of 1.525, and a high specific gravity was sprayed onto the metal material 1 by spraying 3. Next, the metal material 1 that came out of the first etching chamber 2 was washed with water in the water washing chamber 5 by a spray method. At this time, according to the present invention, as shown in FIG. 2, the rinsing water 6 used for rinsing is warm water heated to a liquid temperature of 22 ° C. by a heater 9 and rinsing and rinsing at a spray pressure of 1.2 Kg / cm ^2. It was

Next, after the metal material 1 after washing with water is dried, a resin is applied to the small-hole resist film side in accordance with the steps described in the above (Prior Art), and the former etching is performed. An etching preventive layer was formed so as to completely fill the recesses on the small hole side. Subsequently, the second etching step of etching the metal material 1 only from the large hole side is performed using the ferric chloride solution having the same high temperature and high specific gravity as the first etching, and penetrates the small hole from the large hole side. An opening was formed. Next, the metal material 1 was washed with water, and in this case, as in the above-described washing with water, hot water with a liquid temperature of 22 ° C. was used and the washing with water was performed at a spray pressure of 1.2 Kg / cm ² .

Finally, the etching prevention layer and the resist film were peeled off from the metal material 1 and washed with water and dried as usual to obtain a flat type shadow mask.

The shadow masks obtained in the above examples were examined for pattern unevenness, shape defects and the like caused by washing with water after etching with an etching solution of high temperature and high specific gravity, but no problems were found. It was

[0029]

In the method for producing an etched part according to the present invention, when the specific gravity of the etching solution used is d in the washing with water after etching with the ferric chloride solution of high temperature and high specific gravity, The liquid temperature of water is 103.7543d-
It is above the value calculated by the approximation formula of 136.5597 and below 60 ° C. For this reason, during washing with water, it is possible to prevent ferric chloride from depositing and adhering to the surface of the metal material from the etching liquid remaining on the surface of the metal material after leaving the etching chamber. In addition, since the washing water is warm water, the metal material is not cooled rapidly in the washing chamber, and the unevenness of the temperature at the metal material portion is eliminated. Can be prevented from being different.

As a result, it is possible to prevent defective pore diameter and the like caused by the difference in the progress of chemical reaction due to etching at the metal material portion in the conventional washing with water. Therefore, for example, in the shadow mask, it is possible to prevent the occurrence of black spot defects and the like, and in the lead frame, it is possible to prevent the occurrence of dimensional accuracy defects and the like due to the difference in etching progress. It can be said that it is practically excellent in obtaining the required etching parts.

[0031]

[Brief description of drawings]

FIG. 1 is a graph showing an example of liquid temperature of rinsing water used in a method for manufacturing an etched part of the present invention.

FIG. 2 is an explanatory view showing a main part of one embodiment of the method for manufacturing an etched component of the present invention.

FIG. 3 is an explanatory diagram showing a main part of an embodiment of a conventional method for manufacturing an etched component.

FIG. 4 is a plan view showing an example of pattern unevenness that has occurred in a conventional method of manufacturing an etched component.

5A to 5E are explanatory views showing an example of a method of manufacturing a shadow mask in the order of steps.

[Explanation of symbols]

 1 Metallic Material 2 Etching Chamber 3 Spray 4 Etching Solution 5 Rinsing Chamber 6 Rinsing Water 7 Shadow Mask 8 Bad Black Spot 9 Heater 10 Tank 11 Pump 12 Shadow Mask Material 13 Resist Film 14 Etch Prevent Layer

Claims (2)

[Claims] 1. A resist film forming step of forming a resist film by applying a photosensitive resin on at least one surface of a plate-shaped metal material, a pattern exposing step of exposing a predetermined pattern to the resist film, and the metal. A development process of developing a material to expose a part of the metal surface from the resist film according to a predetermined pattern, a liquid temperature of 75 to 90 ° C., a high specific gravity of 1.50 to 1.61, and a high specific gravity ferric chloride solution In a method of manufacturing an etching component using a photo-etching method, which comprises at least a step of etching a material and etching a metal exposed portion, and a film peeling step of peeling a resist film after the etching step, A method for producing an etching part, characterized in that a means for heating washing water used for washing with water is provided, and the washing with water is performed with warm water. 2. When the specific gravity of the etching solution is d, the temperature of the hot water used for washing with water is in the range of not less than the value obtained by the approximate expression of 103.7543d-136.5597 and not more than 60 ° C. Of manufacturing etched parts of.