JPH09157867A - Production of shadow mask - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a process for producing a shadow mask by which the shadow mask having good quality can be obtained without the occurrence of an opening defect in the process for producing the shadow mask by using a photoetching method. SOLUTION: The photoetching method is used in this process for producing the shadow mask. The one surface of a shadow mask metallic blank 1 is positioned as a front surface and this one surface is subjected to first etching and, thereafter, a means 12 for inverting the front and rear surfaces of the shadow mask metallic blank 1 to be transferred horizontally is disposed to put another surface as the front surface and this another surface is subjected to second etching.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a shadow mask having a plurality of openings penetrating a metal material by a photo-etching method, and particularly to a high-definition device having a small opening diameter and a large number of openings. The present invention relates to a method for manufacturing a shadow mask.

[0002]

2. Description of the Related Art Conventionally, a shadow mask used for a color picture tube or the like has generally been manufactured by a process using a photoetching method. For example, FIG. 6 shows an example of a process using a photoetching method. That is, for example, a low carbon steel sheet having a thickness of 0.13 mm is used as a shadow mask metal material (shadow mask material 1), and both sides are degreased, leveled, and cleaned, and then both sides are treated with casein or polyvinyl alcohol and ammonium bichromate. A photoresist film 2 is formed by applying and drying a water-soluble photosensitive solution consisting of Next, one side of the shadow mask material 1 is exposed to the negative pattern of the small hole image and the other side is exposed to the negative pattern of the large hole image via an exposure mask having a predetermined pattern. After that, a developing process for dissolving the unexposed and uncured photoresist film is performed with warm water, and then a hardening process and a burning process are applied to the resist film 2.
As shown in (1), the shadow mask material 1 having the small-hole resist film 2a and the large-hole resist film 2b exposing the shadow mask material 1 through the openings 6 on the front and back sides is obtained.

Next, as shown in FIG. 6B, a first-stage etching is performed from the small hole resist film 2a surface side to form a small hole concave portion 3a on the small hole resist film 2a side. As the etching solution 7, a Baume concentration of ferric chloride solution of 35 to 52 is used, and spray etching is generally performed at a spray pressure of 1.5 to 3.5 kg / cm ² . In this first etching step, as shown in FIG.
As shown in (b), it is important to stop the etching progress on the way. In addition, prior to the first etching step,
A protective film is attached to the surface of the large-pore resist film 2b, and the etching liquid is used as the etching liquid in the first etching step.
In some cases, contact with the 2b surface side is prevented, and unnecessary etching on the large hole resist film 2b surface side may be prevented.

Next, after the shadow mask material 1 is washed and washed with water and dried, for example, a photo-curing resin is applied by a gravure coating method or the like, and then the resin is irradiated with light, so that FIG.
As shown in (c), an etching prevention layer 4 is formed to completely fill the small hole side recess 3a formed by the preceding etching. Before forming the etching prevention layer 4,
The small hole resist film 2a may be stripped.

Subsequently, before the first etching step, when a protective film is attached to the large-hole resist film 2b surface side, the protective film is peeled off, and then, as shown in FIG. A second etching step of etching the shadow mask material 1 from the surface of the large hole resist film 2b is performed to form a concave portion 3b on the large hole side and an opening 5 penetrating from the large hole side to the small hole. Finally, after performing a peeling process of peeling off the etching prevention layer 4 and the resist film 2, after obtaining FIG. 6E,
A flat type shadow mask is obtained by cutting unnecessary portions.

In the above manufacturing method, the first etching and the second etching are performed for each one side of the shadow mask material 1. However, in addition to this, as another method for manufacturing the shadow mask, both sides of the shadow mask material 1 are processed. There is also a method of performing the second etching on only one surface after performing the first etching.

That is, the shadow mask material 1 from the opening 6
The shadow mask material 1 having the exposed small-hole resist film 2a and the large-hole resist film 2b on the front and back sides is subjected to the first etching from both surfaces to the middle to obtain FIG. Then, FIG.
As shown in FIG. 7B, after forming the etching prevention layer 4 on the small hole side, the second etching is performed from the large hole side.
As shown in (c), the opening 5 penetrating from the large hole side to the small hole
To form Then, after performing a film removing step of removing the etching prevention layer 4 and the resist film 2, the unnecessary portion is cut to obtain a flat type shadow mask.

[0008]

In the conventional manufacture of the shadow mask, as described above, the shadow mask material 1 is used.
Spray etching is used as an etching means for the above, and spray etching is performed at least from below the shadow mask material 1. Further, generally, the shadow mask material 1 is in the form of a long strip supplied from a winding roll, and is horizontally transported on a transport means, for example, a plurality of transport rollers 9 provided.

Therefore, in the conventional shadow mask manufacturing method, the following problems occur when the shadow mask material 1 is etched. That is, when spray etching is performed from below the shadow mask material 1, when the shadow mask material 1 transported by the transport roller 9 passes through the transport roller 9, as shown in FIG. The etching liquid 7 is blocked, and the contact between the etching liquid 7 and the shadow mask material 1 is blocked by the transport roller 9. It should be noted that the resist film 2 in FIG. 5 has an opening 6 that exposes the shadow mask material 1, but it is omitted from the drawing.

The desired etching is not performed on the portion of the shadow mask material 1 where the contact with the etching liquid 7 is blocked, and therefore, the lower surface of the shadow mask material 1 is not etched uniformly, and the portion is not etched. There was uneven etching, which caused uneven etching. As a result, there is a problem in that the shape of the opening 5 formed by etching does not have a desired shape and the opening becomes defective. By the way, examples of types of opening defects include a small hole defect in which the opening is smaller than a desired opening diameter, and a chipping defect in which a broken portion is formed in the planar shape of the opening.

Further, as shown in FIG. 5, since the shadow mask material 1 is carried on the carrying roller 9, there is a problem that the lower surface of the shadow mask material 1 is scratched. For example, on the surface of the transport roller 9, the shadow mask material 1
When the generated resist film pieces and metal pieces adhere as foreign matter, the foreign matter and the lower surface of the shadow mask material 1 rub against each other, and the surface of the transport roller 9 and the lower surface of the shadow mask material 1 rub against each other. Therefore, scratches are generated on the shadow mask material 1 and the resist film 2 formed on the shadow mask material 1.

When scratches occur on the resist film 2 part,
Since the metal surface is exposed from the resist film 2 or the resist film thickness becomes thin, the etching liquid 7 should come into contact with the shadow mask material 1 at a site that should not come into contact with the etching liquid 7 during etching. Therefore, the shadow mask material 1 is subjected to unnecessary etching. As a result, when scratches are formed on the resist film 2 portion, particularly on the opening 6 portion of the resist film 2, there is a problem that the opening 5 formed by etching becomes defective.

The present invention has been made in view of the above circumstances, and in a shadow mask manufacturing method using a photo-etching method, a shadow mask which does not cause defective openings and is of high quality can be obtained. It is intended to provide a manufacturing method.

[0014]

In order to achieve the above object in the present invention, first, in claim 1, a resist film having a metal surface partially exposed according to a predetermined pattern is formed on both surfaces, and the resist film is conveyed. A first etching step of performing a spray etching from one surface of a plate-shaped shadow mask metal material conveyed in a substantially horizontal direction on the means, and forming a concave portion in the metal exposed portion of this one surface; A step of applying a resin to the concave portion formed in the step, filling the concave portion with the resin, and curing the resin to form an etching prevention layer; and a shadow mask metal material on the side opposite to the surface on which the etching prevention layer is provided. Spray etching from the other side of the metal to form a recessed hole that leads from the other side to the recess formed in the one side. In the method for producing a shadow mask obtained by performing at least a etching step and a film removing step of removing the etching prevention layer and the resist film, the one surface of the shadow mask metal material is the upper surface, and the one of the After performing the first etching from the surface, a means for reversing the upper and lower surfaces of the transported shadow mask metal material is provided, and the second surface is subjected to the second etching after making the other surface the upper surface. This is a method for manufacturing a shadow mask characterized by the above.

Further, in the second aspect of the present invention, the etching preventing layer is formed on the one surface after the first etching step, and thereafter, the upper and lower surfaces of the shadow mask metal material are inverted. The shadow mask manufacturing method according to claim 3, wherein
The method of manufacturing a shadow mask according to claim 1, wherein the upper and lower surfaces of the shadow mask metal material are inverted after the first etching step, and then an etching prevention layer is formed on the one surface. It is a thing.

Further, in a fourth aspect of the present invention, in the shadow mask manufacturing method according to the first aspect, after the protective film is attached to the other surface side before the first etching step, each of the steps is performed. And the second etching step is performed after the protective film is peeled off. The shadow mask manufacturing method according to claim 1, wherein the one surface The method for manufacturing a shadow mask according to claim 2 or 3, wherein an etching prevention layer is formed on the one surface after removing the resist film on the side.

[0017]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In FIG. 1, the shadow mask material 1 is a long strip-shaped metal material supplied from a winding roll, and as shown in FIG. 6 (a) according to the steps described in the above-mentioned (prior art). In addition, a small-hole resist film 2a and a large-hole resist film 2b exposing the shadow mask material 1 through the opening 6 are formed on the front and back sides. Further, in this embodiment, the shadow mask material 1 is transported from the left side to the right side of the drawing on the transport roller 9 in a substantially horizontal direction. In addition,
The transport roller 9 transports the shadow mask material 1 placed on the transport roller 9 by rotating it by a driving means (not shown), and a plurality of shadow mask materials 1 are provided, but for convenience of description, The numbers are omitted.

Here, in the present invention, first, the resist film 2 is formed, and the large-hole resist film 2b side of the shadow mask material 1 is conveyed on the conveying roller 9 with the large-hole resist film 2b side facing down. Then, as shown in FIGS. 1 and 2A, a long strip-shaped protective film 8 is attached. The protective film 8 is left attached to the shadow mask material 1 before the second etching described later, and the protective film 8 is used for the large-hole resist film 2b during the first etching.
This prevents the etching liquid 7 from coming into contact with the side and prevents unnecessary etching from being performed on the large-hole resist film 2b side, and protects the shadow mask material 1 described later.

As a material for the protective film 8, a flexible material having resistance to a stripping solution used for resist stripping in a first stripping step 11 described later, for example, a high temperature alkaline solution, for example, It can be said that it is desirable to use polypropylene or polyethylene or the like, and at least the surface facing the shadow mask material 1 has adhesiveness. By the way, in this example, as the protective film 8, a polypropylene film having an adhesive (manufactured by Nitto Denko Corporation, trade name “N360”) on one side was used, and a long film supplied from a supply roll (not shown) or the like. A strip-shaped protective film 8 is attached to the large-hole resist film 2b side of the shadow mask material 1 with an adhesive. In order to improve the close contact between the protective film 8 and the shadow mask material 1, a pressure roller (not shown) or the like is provided on the protective film 8 side, and the protective film 8 is attached to the shadow mask material 1 while applying pressure. Can be said to be desirable.

Subsequently, as shown in FIGS. 1 and 2B, a small hole resist film is formed in the first etching chamber 10.
Spray etching using a ferric chloride solution or the like as an etching solution 7 is performed from the 2a side, that is, from above the shadow mask material 1 to form a small hole concave portion 3a on the small hole resist film 2a side.
It is the first etching.

Next, as shown in FIG. 1, the first film stripping step
At 11, for example, a caustic soda aqueous solution having a concentration of 30% at 90 ° C. is used as a stripping solution, and the stripping solution is brought into contact with the small-hole resist film 2a by using a spray method or the like to strip the small-hole resist film 2a, Two
(C) is obtained. At this time, the protective film 8 adhered to the large-pore resist film 2b side has the large-pore resist film 2b side contacted with the large-pore resist film 2b when the small-pore resist film 2a is peeled off.
It also has a function of preventing unnecessary peeling on the side.

Although the etching prevention layer 4 to be described later may be formed without stripping off the small hole resist film 2a, it is possible to prevent etching after the small hole resist film 2a is peeled off for the following reasons. It may be desirable to form layer 4.

That is, in the first etching step,
As shown in FIG. 6B, the shadow mask material 1 around the opening 6a of the small-hole resist film 2a is side-etched to have a hollowed shape, and the area around the opening 6a of the small-hole resist film 2a is a small hole recess. An overhang-shaped eave 16 is formed on 3a. This eaves 16 of the resist film prevents the resin from filling the recess 3a when the shadow mask material 1 is filled with the resin for the etching prevention layer, and bubbles 17 are generated as shown in FIG. 4 (a). This is a cause of the formation of the etching prevention layer 4.

When the second etching is performed on the surface of the large-hole resist film 2b described below in the state where the bubbles 17 are generated in the etching prevention layer 4, when the opening 5 penetrating the shadow mask material 1 is formed. The etching liquid 7 flows into the bubbles 17 to perform unnecessary etching, resulting in poor opening as shown in FIG. 4 (b). Therefore, the small-hole resist film
If the etching prevention layer 4 is formed after the film 2a is peeled off, the bubbles 17 due to the above-mentioned eaves 16 do not occur, and as a result, the opening failure due to the bubbles 17 does not occur in the second etching, and as a means for achieving this object, It will be effective.

Next, the shadow mask material 1 from which the small-hole resist film 2a has been stripped is first subjected to first etching by a known means such as a gravure coating method in an etching prevention layer forming means 13 as shown in FIG. The small hole concave portion 3a formed by etching is filled with a resin and cured to form an etching prevention layer 4, as shown in FIG.
(D) is obtained. If a photo-curable resin is used as the resin for the etching prevention layer 4, the resin can be cured by irradiating the resin with light after filling the small hole recess 3a, and the time required for forming the etching prevention layer is reduced. It can be said that

Next, in the present invention, after the step of forming the etching prevention layer 4, as shown in FIG. 1, a reversing means 12 for reversing the upper and lower surfaces of the shadow mask material 1 conveyed in a substantially horizontal direction is provided. It is a thing. That is, the shadow mask material 1 transported in a substantially horizontal direction with the small-hole resist film 2a surface side as the upper surface is inverted by the reversing means 12, and thereafter the large-hole resist film 2b surface side is substantially the upper surface. It is conveyed in the horizontal direction and the second etching described below is performed, which is a feature of the present invention.

First, as shown in FIGS. 1 and 2 (e), the shadow mask material 1 which has left the reversing means 12 and has become the upper surface.
The protective film 8 attached before the first etching is peeled off from the large-hole resist film 2b surface side. Then, as shown in FIGS. 1 and 2 (f), the second etching chamber 14
At the large-hole resist film 2b side, that is, the shadow mask material 1
From above, spray etching using ferric chloride solution or the like as etching solution 7 is performed to perform second etching to form a large hole recess communicating with small hole recess 3a, and opening 5 penetrating shadow mask material 1 is formed. obtain.

Then, the shadow mask material 1 having the through-opening 5 formed therein is subjected to a film removing process in the conventional manner to form a resist film 2.
After the removal of the etching prevention layer 4, the unnecessary portion is cut and the like to obtain a flat shadow mask.

Here, as the inverting means 12 described above, for example, as shown in FIG. 8, first etching is performed from above the shadow mask material 1 on the second floor of the building to move the shadow mask material 1 from the second floor to the first floor. It is conceivable that the upper and lower surfaces of the shadow mask material 1 are bent in a U-shape during transportation and the second etching is performed from above the shadow mask material 1 on the first floor.
However, the method of dividing the equipment on the first floor and the second floor of this building is
It requires a lot of space and is poor in workability.

Therefore, the present inventors propose, for example, the reversing means 12 shown in FIG. 3 below. Initially, the shadow mask material 1 is conveyed with the small hole side facing upward. Next, the shadow mask material 1 is twisted along the reversing roller 15a provided at an angle of 45 ° with the conveying direction of the shadow mask material 1 so as to come into contact with the surface below the shadow mask material 1, The transport direction of the shadow mask material 1 is bent, and as shown in the figure, the shadow mask material 1 is transported in a direction at an angle of 90 ° from the original transport direction. Next, as shown in the figure, the shadow mask material 1 is transported by the reversing roller 15b provided in parallel with the original transport direction of the shadow mask material 1 and in contact with the surface below the shadow mask material 1. The direction is bent 180 ° in the opposite direction. Next, below the reversing roller 15a, an angle of 90 ° was formed between the reversing roller 15a and the reversing roller 15b, and the conveying direction was 180 °. The shadow mask material 1 is twisted along the reversing roller 15c provided so as to come into contact with the surface, whereby the shadow mask material 1 is bent by 90 °, and as shown in the figure, is substantially the same as the original transport direction. The shadow mask material 1 faces in the direction of. This 3
The small mask surface side and the large hole surface side of the shadow mask material 1 are vertically inverted by a series of operations in the inversion means 12 using a book-like cylindrical inversion roller 15, and the shadow mask exiting the inversion means 12 The material 1 is conveyed in the subsequent steps with the large hole side being the upper surface.

The three reversing rollers shown in FIG. 3 above.
If the inverting means 12 using 15 is used, it is extremely easy and
It is possible to reverse the small hole surface side and the large hole surface side of the shadow mask material 1 without taking space.

The embodiment of the present invention is not limited to the above drawings and description, and it goes without saying that various modifications may be made based on the spirit of the present invention.

For example, in the above description, the upper and lower surfaces of the shadow mask material 1 are reversed by the reversing means after the etching prevention layer 4 is formed.
The etching prevention layer 4 may be formed after the upper and lower surfaces of the shadow mask material 1 are inverted by the inversion means.

Another embodiment of the present invention will be described below with reference to process drawings. That is, as shown in FIG.
A small-hole resist film 2a and a large-hole resist film 2b, which expose the shadow mask material 1 through the openings 6, are formed on the front and back surfaces, and the shadow mask material 1 is conveyed with the large-hole resist film 2b side as the lower surface.
The large-hole resist film of the shadow mask material 1 that has become the lower surface of
As shown in FIG. 9A, a long strip-shaped protective film 8 is attached to the 2b side.

Then, as shown in FIG. 9 (b), in the first etching chamber 10, spray etching is performed from the small hole resist film 2a side, that is, from above the shadow mask material 1 to the small hole resist film 2a side. The small hole concave portion 3a is formed and the first etching is performed.

Next, a stripping solution is brought into contact with the small-hole resist film 2a by using a spray method or the like to remove the small-hole resist film 2a,
FIG. 9C is obtained.

Next, the shadow mask material 1 from which the small-hole resist film 2a has been stripped is inverted between the upper and lower surfaces of the shadow mask material 1 using the above-described inversion means, and then the etching prevention layer forming means is used. 9 (d), the small hole recess 3a formed by the first etching is filled with a resin by a known means such as a gravure coating method and cured to form an etching prevention layer 4.
Get.

Next, as shown in FIG. 9E, the protective film 8 attached before the first etching is peeled off from the large-hole resist film 2b surface side of the shadow mask material 1, and then, as shown in FIG.
As shown in (f), spray etching is performed from the large-hole resist film 2b side, that is, from above the shadow mask material 1, and second etching is performed to form a large-hole concave portion communicating with the small-hole concave portion 3a. Aperture 5 is obtained through.

Next, after removing the resist film 2 and the etching prevention layer 4 from the shadow mask material 1 in which the opening 5 penetrating is formed in the conventional film peeling process, the unnecessary portion is cut and the like to flatten the flat type. To get the shadow mask of.

As shown in FIG. 2 and FIG. 9 which show the main part of the above-described method of manufacturing the shadow mask according to the present invention in the order of steps, both the first etching and the second etching are carried in a substantially horizontal direction. It is performed from above the mask material 1. As a result, as before,
The etching liquid 7 is not blocked by the transport roller 9, and the etching liquid is brought into uniform contact with the upper surface of the shadow mask material 1, so that desired etching is performed.

As shown in FIGS. 2 and 9, the shadow mask material 1 is formed during the steps from the formation of the resist film 2 to the removal of the resist film and the etching prevention layer and the etching prevention layer 4. The underside is almost protected. That is, as shown in FIGS. 2A to 2D and FIGS. 9A to 9C, the protective film 8 is attached to the lower surface of the shadow mask material 1 up to the reversing means 12, and 2 (e)-
As shown in (f) and FIGS. 9D to 9F, the etching prevention layer 4 is formed on the surface below the shadow mask material 1. The protective film 8 and the etching prevention layer 4 protect the surface below the shadow mask material 1. Thereby, the shadow mask material 1
And the foreign material adhering to the surface of the transport roller 9 and the shadow mask material 1 rub against each other, and the shadow mask material 1, particularly the shadow mask material 1
The protective film 8 or the etching prevention layer 4 prevents the resist film 2 formed on the substrate from being scratched.

[0042]

As described above, in the method for manufacturing a shadow mask according to the present invention, both the first etching and the second etching are performed from above the shadow mask material 1 which is conveyed in a substantially horizontal direction. . Therefore, unlike the conventional case, the etching liquid is not blocked by the transfer roller, and the upper surface of the shadow mask material 1 is
The etching liquid comes into uniform contact with each other, and desired etching is performed.

For this reason, since the transport roller blocks the etching liquid, which occurs in the conventional shadow mask manufacturing method, the lower surface of the shadow mask material 1 is not uniformly etched, and the etching is partially uneven. It is possible to prevent the problem that the etching becomes uneven and, as a result, the shape of the opening formed by the etching does not have the desired shape and the opening becomes defective.

In the method for manufacturing a shadow mask according to the present invention, the lower surface of the shadow mask material 1 is not removed until the resist film and the etching prevention layer are removed after the resist film 2 is formed. It is almost protected by a protective film or an etching prevention layer. Therefore, the conveying roller provided below the shadow mask material 1 and the foreign matter adhering to the surface of the conveying roller and the shadow mask material 1 rub against each other to form the shadow mask material 1, particularly the shadow mask material 1. The protective film or the etching preventive layer prevents the resist film from being scratched.

For this reason, the shadow mask material 1, particularly the resist film 2, is attached by contact with the carrying roller and the foreign matter adhering to the surface of the carrying roller, which has occurred in the conventional method for producing a shadow mask. It is possible to prevent the problem that the etching liquid comes into contact with the shadow mask material 1 at a portion where the etching liquid should not come into contact with the shadow mask material 1 due to scratches and causes poor opening. As described above, it can be said that the present invention is practically excellent in obtaining a high-quality shadow mask without defective openings.

[0046]

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a main part of an embodiment of a method for manufacturing a shadow mask of the present invention.

2A to 2F are cross-sectional explanatory views showing a main part of a method of manufacturing a shadow mask according to an embodiment of the present invention in the order of steps.

FIG. 3 is an explanatory diagram showing an embodiment of a shadow mask material inverting means used in the present invention.

4A to 4B are cross-sectional explanatory views showing an example of opening defects due to bubbles generated in the etching prevention layer in the order of steps.

FIG. 5 is an explanatory view showing an example of a main part of a conventional shadow mask manufacturing method.

6A to 6E are explanatory views showing an example of a conventional shadow mask manufacturing method in the order of steps.

7A to 7C are explanatory views showing another example of a conventional shadow mask manufacturing method in the order of steps.

FIG. 8 is an explanatory view showing another embodiment of the inversion means of the shadow mask material.

9A to 9F are cross-sectional explanatory views showing a main part of another embodiment of the method for manufacturing a shadow mask of the present invention in the order of steps.

[Explanation of symbols]

 1 Shadow Mask Material 2 Resist Film 3 Recess 4 Etching Prevention Layer 5 Opening 6 Opening Hole 7 Etching Liquid 8 Film 9 Transport Roller 10 First Etching Chamber 11 First Film Stripping Process 12 Reversing Means 13 Etching Prevention Layer Forming Means 14 Second Etching chamber 15 Inversion roller 16 Eaves 17 Bubbles

Claims (5)

[Claims] 1. A resist film having a metal surface partially exposed according to a predetermined pattern is formed on both surfaces, and spray etching is performed from one surface of a plate-shaped shadow mask metal material which is carried on a carrying means in a substantially horizontal direction. The first etching step of forming a concave portion on the metal exposed portion of this one surface, and the resin is applied to the concave portion formed in the first etching step, the resin is filled inside the concave portion, and the resin is hardened and etched. The step of forming an anti-reflection layer and spray etching from the other side of the shadow mask metal material on the side opposite to the side provided with the anti-etching layer were performed from the other side to the one side. The number of the second etching step of forming a concave hole communicating with the concave portion to obtain an opening penetrating the metal material and the film removing step of removing the etching preventing layer and the resist film is reduced. In the method of manufacturing a shadow mask obtained by also performing, the one side of the shadow mask metal material as the upper surface, after performing the first etching from the one surface, the upper and lower surfaces of the shadow mask metal material to be transported. A method of manufacturing a shadow mask, comprising means for reversing, making the other surface the upper surface, and performing second etching from the other surface. 2. The shadow mask according to claim 1, wherein an etching prevention layer is formed on the one surface after the first etching step, and thereafter, the upper and lower surfaces of the shadow mask metal material are inverted. Production method. 3. The shadow mask according to claim 1, wherein after the first etching step, the upper and lower surfaces of the shadow mask metal material are reversed, and then an etching prevention layer is formed on the one surface. Manufacturing method. 4. The method of manufacturing a shadow mask according to claim 1, wherein a protective film is attached to the other surface side before the first etching step, and then the steps are performed to obtain the protective film. The method for manufacturing a shadow mask according to claim 1, wherein the second etching step is performed after peeling off. 5. The method of manufacturing a shadow mask according to claim 2, wherein an etching prevention layer is formed on the one surface after removing the resist film on the one surface side. .