JP3092468B2 - Manufacturing method of shadow mask - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a shadow mask by a photoetching method, and more particularly to a method of manufacturing a high-definition shadow mask having a small number of openings and a large number of openings.

[0002]

2. Description of the Related Art Conventionally, a shadow mask used for a color picture tube or the like is manufactured by a process as shown in FIG. That is, for example, a low-carbon steel sheet having a thickness of 0.13 mm is used as the shadow mask material 1, and both sides are degreased, leveled, and washed, and then, on both sides, a water-soluble photosensitive solution comprising casein, polyvinyl alcohol, and ammonium bichromate. Is applied and dried to form a photoresist film 2. Next, one side of the shadow mask material 1 is exposed to the negative pattern of the small hole image, and the other side is exposed to the negative pattern of the large hole image. Thereafter, if a development process for dissolving the unexposed and uncured photoresist film with hot water is performed, as shown in FIG. 3A, a shadow mask having a small-hole resist film 2a and a large-hole resist film 2b on the front and back is formed. Material 1 is obtained.

After that, a hardening process and a burning process are performed on the resist film 2, and a first stage etching is performed from both front and back surfaces. The etching solution is generally performed by spray etching with a Baume concentration of ferric chloride of 35 to 50 and a spray pressure of 1.5 to 3.5 kg / cm ² . In the first etching step, as shown in FIG. 3B, it is important to stop the etching progress halfway. In the first etching step, there is also a method of attaching a protective film to the surface of the shadow mask material 1 having the large hole resist film 2b and etching the shadow mask material 1 only from the small hole side.

Next, after washing and drying the shadow mask material 1 with water, as shown in FIG. 3 (c), an etching prevention layer 4 is formed which completely fills the concave portion 3a on the small hole side formed by the preceding etching. I do. If a photo-curable resin is used as a means for forming the etching prevention layer 4 and the target surface is coated by a gravure coating method or the like, for example, the resin is irradiated with light after application. It is possible to quickly cure the resin, and there are advantages such as improvement of working efficiency and quality improvement by preventing bubbles from being mixed into the etching prevention layer. Therefore, it is common to use a photo-curable resin, for example, an ultraviolet-curable resin. It has become a target. The surface on which the etching prevention layer 4 is formed may be on the small hole side or on the large hole side, but is often formed on the small hole side. Subsequently, as shown in FIG. 3D, a second etching step of etching the shadow mask material 1 only from the large hole side is performed, and an opening 5 penetrating from the large hole side to the small hole is formed. Finally, the etching prevention layer 4 and the resist film 2 are peeled off, washed with water and dried to obtain a flat type shadow mask 6 shown in FIG.

In the conventional method using the etching prevention layer 4, it can be said that the side etching phenomenon which cannot be avoided by the photo etching method is suppressed on the small hole side. That is, the recess 3a on the small hole side is filled with the etching prevention layer 4, and the small holes are not side-etched in the second etching step, so that a precise small hole pattern in the first etching step can be maintained. Therefore, for example, it is possible to form a hole having a hole diameter smaller than the thickness of the material metal plate.

However, the above-mentioned side etching phenomenon also occurs in the first etching step.
As shown in (b), the shadow mask material 1 around the opening of the resist film 2 is subjected to side etching, and has a hollow shape. As a result, an overhang eave 13 is formed around the opening of the resist film 2 with respect to the shadow mask material 1.

Since the etchant is brought into contact with the shadow mask material in the first etching step, the etchant adheres to the shadow mask material surface after the first etching step. Although a part of the attached etching liquid drops from the surface when the shadow mask material is transported, it can be said that the etching liquid remains in the concave portions of the shadow mask material formed by etching. In particular, it can be said that a large amount of the etching liquid remains due to the surface tension in a portion where the eaves 13 of the resist film and the shadow mask material are in contact with each other.

[0010] As described above, the shadow mask material after the first etching step is washed with water in order to remove the etchant attached to the shadow mask material.
Generally, as shown in FIG. 2, this washing with water is performed with respect to the shadow mask material 1 which is conveyed in the horizontal direction, that is, in the horizontal direction, with the nozzles 14 arranged vertically in the cleaning chamber 8.
This is performed by spraying more washing water onto the shadow mask material 1. However, in this cleaning method, since the shadow mask material is transported in the horizontal direction, the eaves 13 of the resist film become shadows and the flow of water is obstructed, so that the etching solution remaining under the eaves 13 is not sufficiently removed and remains. It can be said that. Further, the cleaning water that has entered through the opening of the resist film comes into contact with the shadow mask material 1 near the opening of the resist film 2, but the shadow mask material near the eaves 13 of the resist film contacts the shadow mask material 1 near the opening of the resist film. Since 13 parts reach a dead end and there is no place to go, the water flow is hindered and the washing water does not circulate sufficiently, so that it can be said that the etching solution in the 13 eaves also remains without being sufficiently removed.

In the manufacturing process of the shadow mask, the etching prevention layer is formed after drying in the drying unit 9 after washing with water, and as described above, the etching is performed on the eaves 13 of the resist film as described above. When the resin for the etching prevention layer is applied and filled with the liquid remaining, the formation of the etching prevention layer is poor. That is, even if the resin for the etching prevention layer is applied and filled in the recesses of the shadow mask material and the resin is cured, the etchant and the resin remaining in the eaves are mixed, and the resin is not cured or cured. It does not harden sufficiently.

As a result, when the second etching is performed on the shadow mask material 1 having the uncured or insufficiently cured etching prevention layer 4 shown in the X part of FIG. At the stage where the opening 5 penetrates through the side, the etchant uncured or the insufficiently cured resin X portion is washed away. Then, the etchant invades the vacant portion and unnecessary etching is performed, resulting in a problem that a hole shape defect as shown in FIG. 4B occurs.

[0011]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a method of manufacturing a shadow mask which does not cause etching defects such as defective holes in the obtained shadow mask. Is what you do.

[0012]

That is, according to the present invention, at least one surface of a plate-shaped shadow mask metal material on which a resist film partially exposing a metal surface is formed in accordance with a predetermined pattern on both surfaces. Then, a first etching step of forming a concave portion in the metal exposed portion of at least one of the surfaces, and applying a resin to the other surface having the concave portion formed in the first etching step, and inside the concave portion A step of filling and curing a resin to form an etching prevention layer, and etching a surface opposite to the surface provided with the etching prevention layer, and leading from the opposite surface to the concave portion formed on the one surface. The method of manufacturing a shadow mask, comprising: a second etching step for forming a concave hole; and a stripping step for removing the etching prevention layer and the resist film. After the shadowing process, at least the shadow mask metal material is washed vertically by a spray method in which cleaning water is sprayed while the shadow mask metal material is transported vertically upward, and then the shadow mask metal material is dried and then subjected to the etching. The object of the present invention has been achieved by providing a method for manufacturing a shadow mask, which comprises forming an prevention layer.

An explanation will be given below with reference to the drawings showing examples of the present invention. In FIG. 1, a shadow mask material 1 is a long metal plate supplied from a take-up roll, and is completed up to a pattern exposure and development process in accordance with the process described in the section (prior art) described above. As shown in FIG. 3A, it is assumed that a small-hole resist film 2a and a large-hole resist film 2b are provided on the front and back, and in the example of FIG. The small hole side and the lower surface are the large hole side. Next, the shadow mask material 1 is sprayed with a ferric chloride solution in a first etching chamber 7 as shown in FIG.

Next, the shadow mask material 1 after the first etching step is washed with water. In the present invention, the shadow mask material 1 is washed vertically while being conveyed vertically upward. And That is, as shown in FIG. 1, the shadow mask material 1 that has left the first etching chamber 7 enters the cleaning chamber 8. For example, after the shadow mask material 1 is conveyed in the cleaning chamber 8 in the horizontal direction as shown in part A, the conveying roller 11 for changing the direction is used to move the conveyance path upward in the vertical direction as shown in part B. Then, the sheet is returned to the transport path in the horizontal direction again at the portion C.

The cleaning of the shadow mask material 1 is performed in the cleaning chamber 8 having the above-described transfer path.
A spray nozzle 14 is provided so as to sandwich the shadow mask material 1 in each of the regions, and the shadow mask material 1 is washed with water by a spray method. By the way, part A and C
Water is jetted substantially vertically from the spray nozzles of section B, and washing water is jetted substantially horizontally from the spray nozzles of section B.

According to the present invention, when cleaning is performed while transporting the shadow mask material 1 vertically upward, the cleaning water that has hit the shadow mask material 1 finally flows down.
For this reason, the cleaning water 12 moves, for example, as shown by the arrow in FIG. That is, the cleaning water 12 entering the concave portion 3 of the shadow mask material 1 is divided in all directions, and the cleaning water 12 divided in the upward direction shown by D in FIG. 5 goes to the eaves 13 of the resist film. After hitting, it flows down.
Further, the cleaning water 12 divided downward as indicated by E in FIG. 5 also reaches the eaves 13 of the resist film and then flows downward. Similarly, the washing water divided in other directions hits the eaves of the resist film and then flows downward.

Next, the cleaning water flowing downward and the shadow mask material 1 transported upward have opposite flows. As a result, the cleaning water that comes into contact with the shadow mask material 1 and is contaminated with the etching solution can be removed by quickly spilling over the shadow mask material 1. It can be said that the rate of contact with water increases.

As described above, since the cleaning water 12 finally flows down, the old cleaning water does not accumulate in the eaves 13 of the resist film, and fresh cleaning water is always circulated and spread. The etching solution remaining on the eaves 13 of the film can be efficiently cleaned and removed.

Next, after the washing and washing of the shadow mask material 1 is passed through the drying unit 9 to be dried, the light is applied to the etching prevention layer forming means 10 by, for example, a resin coating roll by a roll coating method or the like. After a resin such as a curable resin is applied to the side of the small holes, the resin is cured by means such as irradiation of ultraviolet rays or the like to form an etching prevention layer 4 on the side of the small hole resist film 2a of the shadow mask material 1.

Next, after performing the second etching step as described in the section (Prior Art), a step of removing the etching prevention layer and the resist film is performed to obtain a shadow mask.

The present invention is not limited to the embodiment shown in FIG. For example, in the above-described example, the shadow mask material 1 that is being horizontally transported is cleaned at two locations A and C in order to improve the cleaning effect. Can be a single place. In short, the shadow mask material 1 after the first etching process
On the other hand, it can be said that it is only necessary to adopt a configuration in which cleaning water is applied to the shadow mask material 1 by, for example, a spray method while being transported at least vertically upward.

Next, as a modification of the present invention, the water washing and cleaning after the second etching step and the film removing step are also shown in FIG.
As shown in (1), while the shadow mask material 1 is conveyed at least vertically upward, cleaning is performed by spraying cleaning water on the shadow mask material 1 by, for example, a spray method or the like. This can be said to be effective in efficiently cleaning and removing the membrane liquid. Here, in the water washing after the second etching step, it can be said that the etching solution can be efficiently washed and removed for the reason described above.

Also, in the washing and washing after the step of removing the resist film and the etching prevention layer, it can be said that the washing water is once dammed in the concave portions formed on the surface of the shadow mask material 1. If the surface of the shadow mask material conveyed in the vertical direction is smooth, it can be said that the applied washing water spills quickly from the shadow mask material surface. However, in practice, since there is a concave portion on the surface of the shadow mask material 1, the cleaning water temporarily stops on the surface of the shadow mask material and then flows downward, so that the cleaning water can efficiently come into contact with the shadow mask material. It is possible to efficiently wash and remove the film removing solution remaining on the substrate.

[0024]

In the method of manufacturing a shadow mask according to the present invention,
In the washing process, the washing water is washed by the spray method while the shadow mask material 1 is conveyed vertically upward, so that the washing water hitting the shadow mask material 1 flows down.
In this way, the washing water flows downward, and it can be said that fresh washing water is always distributed without old washing water remaining on the surface of the shadow mask material. It can be efficiently washed and removed.

[0025]

Embodiments of the present invention will be described below. <Embodiment> As a shadow mask material 1, a long metal plate having a thickness of 0.13 mm and a low expansion property was used, which is a long metal plate supplied from a winding roll. Next, in accordance with the process described in the section of (prior art) described above, the development process is performed, and the shadow mask material 1 having the small-hole resist film 2a and the large-hole resist film 2b on the front and back shown in FIG. Obtained.

Next, as shown in FIG. 1, the first etching was performed on the shadow mask material 1 in the first etching chamber 7. Next, the shadow mask material 1 that has left the first etching chamber 7 is cleaned in the cleaning chamber 8.
Washing and washing were performed. At this time, as shown in FIG. 1, the cleaning is performed by spraying the cleaning water by spraying while the shadow mask material 1 is transported 60 cm in the horizontal direction, and then the shadow mask material 1 is transported 2 m in the vertical direction. Washing was performed by a spray method. Thereafter, the transport direction was returned to the horizontal direction, and the shadow mask material 1 was further washed by a spray method at a distance of 60 cm. At the time of spraying, the water temperature was set to 20 ° C., the spray pressure was set to 1.2 kg / cm ² , and the shadow mask material 1 was washed from both sides.

Next, drying was performed in the drying unit 9. Next, in the etching prevention layer forming means 10, a UV-curable resin is rolled by a roll coating method to form a recess on the side of the small hole.
After coating and filling 3a, ultraviolet rays were irradiated to form an etching prevention layer 4 on the side of the small holes of the shadow mask material. Then
Etching was performed on the large hole side in the second etching chamber, and an opening 5 penetrating from the large hole side to the small hole was formed as shown in FIG. Next, the etching prevention layer 4 and the resist film 2 were peeled off, washed with water and dried to obtain a flat type shadow mask 6 shown in FIG.

[0028]

In the method of manufacturing a shadow mask according to the present invention, in the cleaning step after the first etching, the cleaning is performed while transporting the shadow mask material 1 vertically upward, so that the cleaning water that has hit the shadow mask material 1 is obtained. Flows down. As the cleaning water flows down in this manner, it can be said that fresh cleaning water always circulates and spreads without the old cleaning water remaining in the eaves of the resist film. It can be efficiently washed and removed. As a result, the formation failure of the etching prevention layer caused by the conventional shadow mask manufacturing method, that is, the resin for the etching prevention layer becomes uncured due to the etching solution remaining in the eaves of the resist film, or It is possible to prevent a defect of insufficient curing. Thereby, it is possible to prevent a defective etching shape of the shadow mask due to a defective formation of the etching prevention layer.

In the water washing after the second etching step and the film removing step, the cleaning is performed while the shadow mask material 1 is conveyed vertically upward, so that the etching solution or the peeling-off liquid remaining on the shadow mask material surface is removed. The membrane liquid can be efficiently washed and removed. As a result,
It is possible to prevent the generation of rust generated due to the etching solution or the film removing solution remaining on the shadow mask material surface. Thus, it can be said that the present invention is practically excellent in obtaining a high quality shadow mask.

[0030]

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a main part of one embodiment of a method of manufacturing a shadow mask of the present invention.

FIG. 2 is an explanatory view showing a cleaning example of a conventional shadow mask manufacturing method.

FIGS. 3A to 3E are explanatory views showing an example of a conventional method of manufacturing a shadow mask in the order of steps.

FIGS. 4A and 4B are cross-sectional explanatory diagrams showing an example of an etching hole shape defect due to an etching prevention layer formation defect.

FIG. 5 is an explanatory view showing an example of washing and washing in the shadow mask manufacturing method of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 shadow mask material 2 resist film 3 concave portion 4 etching prevention layer 5 opening 6 shadow mask 7 first etching chamber 8 cleaning chamber 9 drying unit 10 etching prevention layer forming means 11 transport roller 12 cleaning water 13 eaves 14 nozzle

Claims (2)

(57) [Claims] At least one surface of a plate-shaped shadow mask metal material on which a resist film partially exposing a metal surface is formed in accordance with a predetermined pattern on both surfaces is etched, and at least one surface of the metal is removed. A first etching step of forming a concave portion in the exposed portion, and applying a resin to the other surface having the concave portion formed in the first etching step, filling the inside of the concave portion with the resin, curing and forming an etching prevention layer. A forming step, and a second etching step of etching a surface opposite to the surface provided with the etching prevention layer to form a concave hole communicating from the opposite surface to the concave portion formed on the one surface. A method of manufacturing a shadow mask, comprising: a step of removing the etching prevention layer and a resist film; and a step of removing a shadow mask after the first etching step. Washing and cleaning the shadow mask metal material by a spray method of spraying cleaning water while transporting the metal material vertically upward, and then drying the shadow mask metal material, and then forming the etching prevention layer. A method for manufacturing a shadow mask, comprising: 2. The method of claim 1, wherein in the washing and cleaning after the second etching step and the film removing step, at least the shadow mask metal material is washed by a spray method of spraying cleaning water while conveying the shadow mask metal material vertically upward. The method for manufacturing a shadow mask according to claim 1, wherein cleaning is performed.