JPH08267362A - Electrodeposition grinding wheel and manufacture thereof - Google Patents

Abstract

PURPOSE: To provide an electrodeposition grinding wheel with good dischargeability for cutting chips, and manufacture of the same. CONSTITUTION: The technique on an electrodepositiop whetstone and an process for manufacturing the same is characterized in the below. The electrodeposition whetstone comprises uniformly dispersed many water supplying cavities having openings of small diameter and large chip pockets formed on the water supplying cavities, while abrasive grains are uniformly and dispersively disposed among the chip pockets, and fitted on the base metal of a whetstone. Then, the openings of water supplying cavities over the base metal of the whetstone are filled with a solvent soluble resin so that the openings are covered, and the abrasive particles are fixed by an electroplating method followed by embedding of them by means of an electrolessplating method, thereafter the solvent soluble resin is dissolved out.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention mainly relates to an electrodeposition grindstone excellent in chip discharge used for cutting, boring and chamfering difficult-to-cut materials such as super alloys and a method for producing the same. It is about.

[0002]

2. Description of the Related Art Conventionally, an abrasive grain is suspended in a plating solution,
An electrodeposition grindstone manufactured by a method of depositing abrasive grains and a plating metal component (Ni or Ni-P, etc.) corresponding to a binder of the abrasive grains on the grindstone base metal and fixing them on the grindstone base metal is known. There is.

[0003]

However, in the above-mentioned conventional method, the abrasive grains tend to be electrodeposited excessively in part, and the distribution of the abrasive grains becomes non-uniform. Also, the grinding load of each abrasive grain becomes non-uniform, and as a result, for example, in the case of processing such as cutting, drilling and chamfering of super alloy, the chip discharge performance deteriorates and a clogging phenomenon occurs, which results in grinding. There is a problem that the resistance becomes high and the grinding performance deteriorates.

[0004]

From the above point of view, even under the processing conditions where chip discharging performance is particularly required, such as cutting, drilling, chamfering of difficult-to-cut materials such as super alloys. As a result of repeated research to develop an electrodeposition grindstone that exhibits excellent grinding performance without causing clogging, etc., a large number of evenly distributed small-diameter openings are formed on the surface of the grindstone base metal to be ground. An electrodeposition grindstone manufactured by holding a water supply hole and a large chip pocket on the opening of the water supply hole, by uniformly disposing abrasive grains between the chip pockets and fixing the abrasive grains to a whetstone base metal. .

Further, in the above-mentioned case, before the dispersed arrangement of the abrasive grains, the opening holes are filled with a solvent-soluble resin, the lid is covered, and the dispersed grains are electroplated on the grinding stone base metal. The electro-deposited grindstone manufactured by fixing by the method, followed by embedding by the electroless plating method, and then forming the chip pocket by dissolving the solvent-soluble resin in the solvent is a super-hard material that is difficult to machine. -We have obtained the knowledge that it exhibits excellent grinding performance even in the grinding of alloys and the like.

The present invention has been made based on the above findings, and in an electrodeposition grindstone, a water supply having a large number of small-diameter open holes uniformly distributed on the surface of a grindstone base metal on which a grinding surface is formed. An electrodeposition grindstone having holes and a large chip pocket on the opening of the water supply hole, in which abrasive grains are uniformly distributed and fixed to the grindstone base metal, and the grindstone base metal The opening of the water supply hole on the surface is embedded with a solvent-soluble resin and the lid is closed, and then the abrasive grains are first fixed to the whetstone base metal by electroplating, and subsequently embedded by electroless plating, and then the solvent-soluble The method is characterized in that the resin is dissolved in a solvent to produce the above electrodeposition grindstone.

In the production of the above electrodeposition grindstone, it is possible to control the abrasive grain density (concentration) by adjusting the hole diameter, position and the number of holes of the water supply hole, and by making this density uniform. If the grinding load is uniform, the grinding resistance is low, and the hole diameter and position of the water supply holes are uniform, it is possible to even out the abrasive particles and evenly supply the grinding fluid during grinding. It is possible to prevent clogging of the grain layer and heating, and since it has a large chip pocket, it is possible to obtain good chip discharge performance and excellent grinding performance.

The above-mentioned combinations of soluble and soluble resin and solvent include polystyrene resin and acetone, polyvinyl resin and warm water, acetyl cellulose resin and acetone, polystyrene resin and benzene, polyethylene resin and xylene, and polychlorination. A combination of vinyl resin and acetone is used, but a combination of polystyrene resin and acetone is common.

[0009]

EXAMPLES The electrodeposition grindstone of the present invention and the method for producing the same will be described in detail with reference to specific examples. [Example 1] A grindstone base metal was prepared, and after degreasing, marking was performed on the plated surface of the base metal at a location where holes were first formed in a rectangular array with a spacing of 1.5 mm. A hole was drilled at this marking location by laser processing. The hole diameter is 1 mm. Then, this hole was filled with a polystyrene resin and covered with a lid, and then the surface of the base metal other than the surface to be plated was masked and then subjected to chemical treatment, and this whetstone base metal was immersed in a plating solution,
Diamond abrasive grains having an average particle size of 60 μm were dispersed and fixed by nickel electroplating. Fixed plating layer thickness is 15μ
It was m. Subsequently, embedded plating was performed by nickel electroless plating. The thickness of the buried layer was 25 μm. Then, the grindstone in this state was immersed in acetone to remove the resin and then washed to manufacture the electrodeposited grindstones 1 and 2 of the present invention.

Example 2 Next, the electrodeposited grindstone 3 of the present invention was prepared under the same conditions as in Example 1 except that cBN abrasive grains having an average particle size of 60 μm were used instead of the diamond abrasive grains of Example 1 above.
And 4 were produced.

[Example 3] Further, after preparing a grindstone base metal and degreasing, parts other than the surface to be plated are masked and subjected to pretreatment (chemical treatment), and the grindstone base metal is dipped in a plating tank. After that, diamond abrasive grains having an average particle diameter of 60 μm were dispersed on the surface of the base metal to be plated, and at the same time, a DC power source was energized to grow a nickel plating layer and fix the abrasive grains to the base metal. The thickness of the fixed plating layer was 15 μm. Then, embedding was performed by electroless plating. The thickness of the embedded plating layer was 25 μm. In this way, the conventional electrodeposition grindstone 1 was produced.

Example 4 Next, a conventional electrodeposition grindstone 2 was prepared under the same conditions as in Example 3 except that cBN abrasive grains having an average particle size of 60 μm were used instead of the diamond abrasive grains of Example 3 above. .

A grinding test was carried out for the evaluation of the grinding performance under the following grinding conditions for the above-mentioned electrodeposition grindstones 1 to 4 of the present invention and the conventional electrodeposition grindstones 1 to 2, and the grinding conditions were used. Grinding machine shape 1A1 φ200 / 6 ^T / 50.8 ^H Grinding wheel peripheral speed 1500 m / min Work feed speed 10 m / min Cross feed 4 mm Set depth of cut 100 μm Workpiece Inconel 713C Grinding fluid W1 Grinding amount 100 [CC] each Grinding resistance in grinding wheel, roughness of workpiece surface, and grinding back force 200
The amount of grinding in each grindstone when [N] was reached was measured. Table 1 shows the results.

[0014]

[Table 1]

[0015]

As is clear from the results shown in Table 1, the electrodeposition grindstones 1 to 4 of the present invention are the conventional electrodeposition grindstones 1 to 2.
In comparison with the above, it has significantly superior grinding performance. This is because the whetstone base has a water supply hole, and the openings of the water supply hole are properly dispersed and a solvent-soluble resin is used to easily form a large chip pocket on the opening of the water supply hole. In addition, since it is possible to uniformly disperse the abrasive grains and adjust the density, there is no excessive electrodeposition of the abrasive grains and a uniform dispersion distribution is obtained.
Further, by appropriately adjusting the conditions of fixing the abrasive grains by the electroplating method and subsequently embedding plating by the electroless plating method, the holding force of the abrasive grains is set optimally. Even if used under processing conditions with large chip discharge such as alloy cutting, drilling and chamfering, the uniform supply of grinding fluid from the properly arranged water supply holes and the existence of large chip pockets make chips Since it can be easily discharged, the clogging phenomenon does not occur, and the grinding resistance can be reduced, and excellent grinding performance is exhibited, which is extremely useful industrially.

Front Page Continuation (72) Inventor Koji Akada 1-297 Kitabukurocho, Omiya City, Saitama Prefecture Central Research Laboratory, Mitsubishi Materials Co., Ltd.

Claims (2)

[Claims] 1. In an electrodeposition grindstone, a water supply hole having a large number of small-diameter openings uniformly distributed on the surface of a grinding wheel base metal on which a grinding surface is formed, and a large chip on the opening of the water supply hole. An electrodeposition grindstone having pockets, in which abrasive grains are uniformly dispersed and arranged between the chip pockets and fixed to a grindstone base metal. 2. After filling the opening of the water supply hole on the surface of the whetstone base with a solvent-soluble resin, the abrasive grains are fixed to the whetstone base by electroplating, and subsequently embedded by electroless plating. The method for producing an electrodeposition grindstone according to claim 1, wherein the solvent-soluble resin is dissolved in a solvent.