CN115229698A - Preparation method for preparing tool for orderly arranging abrasive particles by mask method - Google Patents
Preparation method for preparing tool for orderly arranging abrasive particles by mask method Download PDFInfo
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- CN115229698A CN115229698A CN202210781585.XA CN202210781585A CN115229698A CN 115229698 A CN115229698 A CN 115229698A CN 202210781585 A CN202210781585 A CN 202210781585A CN 115229698 A CN115229698 A CN 115229698A
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- 239000002245 particle Substances 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 55
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 239000002985 plastic film Substances 0.000 claims abstract description 20
- 229920006255 plastic film Polymers 0.000 claims abstract description 20
- 239000004033 plastic Substances 0.000 claims abstract description 14
- 238000005406 washing Methods 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 239000004576 sand Substances 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 239000003082 abrasive agent Substances 0.000 claims abstract description 5
- 238000012546 transfer Methods 0.000 claims abstract description 5
- 239000011230 binding agent Substances 0.000 claims abstract description 4
- 238000013461 design Methods 0.000 claims abstract description 4
- 238000011049 filling Methods 0.000 claims abstract description 4
- 239000010432 diamond Substances 0.000 claims description 18
- 229910003460 diamond Inorganic materials 0.000 claims description 15
- 230000008719 thickening Effects 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 6
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 238000003892 spreading Methods 0.000 claims description 4
- 230000007480 spreading Effects 0.000 claims description 4
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 3
- 230000008859 change Effects 0.000 claims description 2
- 239000003638 chemical reducing agent Substances 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 238000000227 grinding Methods 0.000 abstract description 10
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 12
- 229920002120 photoresistant polymer Polymers 0.000 description 7
- 238000012545 processing Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- 239000006061 abrasive grain Substances 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000005219 brazing Methods 0.000 description 2
- 239000013064 chemical raw material Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000005087 graphitization Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/0018—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by electrolytic deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
The invention discloses a preparation method for preparing an ordered abrasive particle arrangement tool by a mask method, which belongs to the field of abrasive grinding tools and comprises the following steps: s1: cutting the mask by laser: utilizing laser to cut mask micropores with ordered set patterns on a plastic film; s2: mask transfer: the plastic film adopts the design of a film covering and a main film, and the surface of the main film is provided with a binder. Tearing off a film covered by a plastic mask prepared by laser and then adhering the film covered by the plastic mask to the surface of the pretreated substrate; s3: electroplating an abrasive material: filling abrasive particles into the mask by adopting a sand burying method and then electroplating; s4: taking down the mask plate: taking out the electroplated matrix, and tearing off the mask plate after washing off redundant abrasive particles; the method can be realized, solves the problem of being applicable to the abrasive particles of 50-400 mu m, greatly shortens the process flow and obviously reduces the production cost.
Description
Technical Field
The invention relates to the field of abrasive tools, in particular to a method for preparing a tool for orderly arranging abrasive particles by using a mask method.
Background
Single layer superabrasive tools, particularly single layer diamond abrasive tools, are still irreplaceable in the field of precision grinding. The excellent grinding performance of the grinding tool is widely applied to precision grinding processing of materials such as semiconductors, precision glass, optical crystals and the like. The abrasive particles on the traditional superhard abrasive tool are irregularly and randomly arranged, so that the abrasive particles actually participating in grinding in the using process occupy a small area, the effective utilization rate of the abrasive particles is greatly reduced, and the service life of the tool is also shortened.
The tool for orderly arranging the abrasive particles has the advantages of high abrasive particle utilization rate, high grinding efficiency, long service life of the tool and the like, so that how to realize the orderly arrangement of the abrasive particles becomes a hot spot pursued by the industry of the superhard abrasive material grinding tools at home and abroad. At present, a brazing method and a sintering method are mainly used for realizing the ordered arrangement of the abrasive particles, but the abrasive particles move due to the fluidity of the solder or the sintered metal in the processing process, so that the order of the processed product is reduced. In addition, the problems of high-temperature graphitization and hardness reduction of the diamond and the like exist due to higher brazing and sintering temperatures.
Although the mask plating method can avoid the above problems, the related patents mostly adopt the techniques around the photoresist method. However, the mask thickness is difficult to exceed 50 μm due to the limitation of the photoresist itself, so the size of the processed abrasive particles is mostly below 100 μm, the production process is long, and the use of the photoresist greatly increases the production cost.
In order to solve the problems, a method for preparing a tool for orderly arranging abrasive particles by using a mask method is provided.
Disclosure of Invention
1. Technical problem to be solved
Aiming at the problems in the prior art, the invention aims to provide a preparation method for preparing an ordered abrasive particle arrangement tool by a mask method, which can be realized, solves the problem of being applicable to abrasive particles of 50-400 mu m, greatly shortens the process flow and obviously reduces the production cost.
2. Technical scheme
In order to solve the above problems, the present invention adopts the following technical solutions.
A preparation method for preparing a tool for orderly arranging abrasive particles by a mask method comprises the following steps:
s1: cutting the mask by laser:
utilizing laser to cut mask micropores with ordered set patterns on a plastic film;
s2: mask transfer:
the plastic film adopts the design of a film covering and a main film, and the surface of the main film is provided with a binder. Tearing off a film covered by a plastic mask prepared by laser and then adhering the film covered by the plastic mask to the surface of the pretreated substrate;
s3: electroplating an abrasive material:
filling abrasive particles into the mask by adopting a sand burying method and then electroplating;
s4: taking down the mask plate:
taking out the electroplated matrix, and tearing off the mask plate after washing off redundant abrasive particles;
s5: thickening the plating layer:
and (4) placing the substrate with the orderly-arranged abrasive particles, from which the mask plate is removed, into electroplating solution for electroplating and thickening to obtain the tool for orderly-arranged abrasive particles.
Further, the preparation of the plastic mask plate in the step S1 comprises the following steps:
a1: drawing a pattern of a required graph by using a CAD tool, and guiding the drawn pattern into external laser cutting equipment;
a2: placing the selected PVC or PET plastic film with the thickness of 30-500 mu m in a laser working area to start laser cutting;
a3: the shape of the cut plastic film is consistent with that of the substrate, and the size of the plastic film and the distance between the mask micropores can be determined according to the arrangement condition of the abrasive particles on the substrate.
Further, in S3, electroplating the abrasive grains specifically includes the following steps:
b1: putting the substrate adhered with the mask into HCL solution, ultrasonically cleaning for 1-2min to remove an oxide layer on the surface of the substrate in the micropore, and then washing with deionized water to remove residual acid liquor on the surface of the material and in the micropore;
the HCL solution can be adjusted according to the indoor temperature, and when the indoor temperature is less than 10 ℃, the HCL solution is preheated in advance, so that the temperature range of the HCL solution is kept between 15 ℃ and 26 ℃ and is consistent with the indoor temperature;
b2: immersing the activated substrate into electroplating solution, and uniformly spreading the diamond on the substrate;
b3: starting a power supply, and electroplating for 15-180min under the condition of 0.2-5A/dm 2;
b4: and after the electroplating is finished, taking out the matrix, detecting the performance of the HCL solution by using ph test paper, and if the performance of the HCL solution is changed, adding a corresponding reducing agent or replacing with a new HCL solution to keep the electroplating effect consistent under the same condition.
Further, in the step S4, the abrasive particles on the outermost layer can be directly washed away, the abrasive particles at the edges of the mask pores need to be repeatedly washed and cannot be directly removed, so that the abrasive particles electroplated in the mask pores are not removed, and the electroplated abrasive particles in the mask pores are retained after washing;
then, heating the mask plate on the substrate at a low temperature of 30-40 ℃, and softening the bonding layer on the mask plate after heating;
at the moment, the mask plate is pulled obliquely, and the angle between the mask plate and the abrasive particles on the base body is larger than 45 degrees.
Further, in S5, a specific method for electroplating and thickening the entire surface of the substrate is as follows: placing the substrate with the mask removed in electroplating solution, and electroplating for 20-400min under the condition of 0.2-5A/dm 2.
During electroplating, the temperature of the electroplating solution is heated along with the change of room temperature, and the heating temperature is less than 30 ℃.
Further, the thickness of the plastic mask is 30-500 μm, and the aperture in the ink pattern is 80-500 μm.
Further, the abrasive grains have a particle size of 50 to 400 μm.
Furthermore, the power is 10-40W during ultrasonic cleaning.
3. Advantageous effects
Compared with the prior art, the invention has the advantages that:
(1) The mask can effectively limit the movement of the abrasive particles, ensure the spacing distribution among the abrasive particles and improve the orderliness of the abrasive particles.
(2) Compared with a photoresist method, the plastic mask in the method has low cost, is beneficial to large-scale popularization and has the effect of saving resources.
(3) Compared with a photoresist method, the method can be used for processing and manufacturing the abrasive particles with the particle size of 50-400 microns in an ordered arrangement mode, and the application range is wide.
Drawings
FIG. 1 is a schematic diagram of laser cutting a thick mask plate;
FIG. 2 isbase:Sub>A schematic sectional view taken along the direction A-A in FIG. 1, in which FIG. 2 isbase:Sub>A mask hole, FIG. 3 isbase:Sub>A mask plate, FIG. 4 is an adhesive layer, and FIG. 5 isbase:Sub>A coating film;
FIG. 3 is a schematic view of a plane structure of a mask plate bonded to a substrate and then subjected to sand distribution by a sand burying method, wherein 1 is the substrate and 6 is a diamond;
FIG. 4 is a schematic view showing the state of the diamond and the nickel plating layer after the mask is removed;
FIG. 5 is a three-dimensional image of a finished tool with ordered arrangement of abrasive particles made according to the present invention;
fig. 6 is a photomicrograph of a finished tool having an ordered arrangement of abrasive particles made according to the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.
Example 1:
a preparation method for preparing a tool for orderly arranging abrasive particles by a mask method comprises the following steps:
s1: cutting the mask by laser:
utilizing laser to cut mask micropores with ordered set patterns on a plastic film;
s2: mask transfer:
the plastic film adopts the design of a film covering and a main film, and the surface of the main film is provided with a binder. Tearing off a film covered by a plastic mask prepared by laser and then pasting the film covered on the surface of the pretreated substrate;
s3: electroplating an abrasive material:
filling abrasive particles into the mask by adopting a sand burying method and then electroplating;
s4: taking down the mask plate:
taking out the electroplated matrix, and tearing off the mask plate after washing off redundant abrasive particles;
s5: thickening the plating layer:
and (4) placing the substrate with the orderly-arranged abrasive particles, from which the mask plate is removed, into electroplating solution for electroplating and thickening to obtain the tool for orderly-arranged abrasive particles.
The preparation of the plastic mask plate in the S1 comprises the following steps:
a1: drawing a pattern of a required graph by using a CAD tool, and guiding the drawn pattern into external laser cutting equipment;
a2: placing the selected PVC or PET plastic film with the thickness of 30-500 mu m in a laser working area to start laser cutting;
a3: the shape of the cut plastic film is consistent with that of the substrate, and the size of the plastic film and the distance between the mask micropores can be determined according to the arrangement condition of the abrasive particles on the substrate.
Compared with a photoresist method, the plastic mask in the method has low cost, is beneficial to large-scale popularization and has the effect of saving resources.
In S3, electroplating the abrasive particles specifically comprises the following steps:
b1: putting the substrate adhered with the mask into HCL solution, ultrasonically cleaning for 1-2min to remove an oxide layer on the surface of the substrate in the micropore, and then washing with deionized water to remove residual acid liquor on the surface of the material and in the micropore;
b2: immersing the activated substrate into electroplating solution, and uniformly spreading the diamond on the substrate;
b3: and (3) starting a power supply, electroplating for 15-180min under the condition of 0.2-5A/dm < 2 >, and selecting electroplating time according to the specification of the diamond to ensure the effectiveness of electroplating.
Further, in S4, the abrasive particles on the outermost layer can be directly washed away, the abrasive particles at the edges of the mask micropores need to be repeatedly washed and cannot be directly removed, so that the abrasive particles electroplated in the mask micropores are prevented from being removed, and the electroplated abrasive particles in the mask micropores are reserved after washing is finished;
at the moment, the mask plate is pulled obliquely, and the angle between the mask plate and the abrasive particles on the base body is larger than 45 degrees.
The mask can effectively limit the movement of the abrasive particles, ensure the distance distribution among the abrasive particles and improve the orderliness of the abrasive particles.
In S5, the specific method for electroplating and thickening the whole surface of the substrate comprises the following steps: placing the substrate with the mask removed in electroplating solution, and electroplating for 20-400min under the condition of 0.2-5A/dm 2.
In this embodiment, the electroplating solution may be electrolyzed after adding the brightener, especially the main salt, because the added main salt is generally a plating-grade chemical raw material, and the plating-grade chemical raw material contains a lot of heavy metal impurities, such as copper, magnesium, lead, etc., which may be deposited on the surface of the plated part (especially in a low current density region) during the electroplating process, thereby affecting the brightness or other properties of the plating layer, so the electroplating solution is subjected to cathode electrolysis after adding the brightener and the main salt (especially after adding the main salt), and the impurities are electrolyzed with a small current, so as to ensure the cleanness of the solution, thereby ensuring the surface brightness of the normal electroplating and the electroplating quality.
Wherein the thickness of the plastic mask is 30-500 μm, and the aperture in the ink pattern is 80-500 μm.
Compared with a photoresist method, the method can be used for processing and manufacturing the abrasive particles with the particle size of 50-400 microns in an ordered arrangement mode, and the application range is wide.
Wherein the grain diameter of the abrasive grains is 50-400 μm.
Wherein the power is 10-40W during ultrasonic cleaning.
Example 2:
the preparation method of the grinding dresser with the orderly arranged diamonds comprises the following steps:
s1, cutting a mask by laser:
utilizing laser to cut out ordered mask micropores with set patterns on the plastic film;
the specific method comprises the following steps:
s11, guiding the specific pattern designed by the CAD into a laser cutting machine;
s12, cutting a mask hole with the aperture of 400 mu m on the PET plastic film with the thickness of 400 mu m by a laser cutting machine according to a set pattern;
s2, mask transfer:
the specific operation is as follows: tearing off the coating film on the back of the PET plastic film to expose the adhesive layer, and then adhering a mask to the surface of the cleaned substrate;
s3, electroplating diamond:
electroplating diamond on the substrate with the mask attached to the surface by adopting a sand burying method; the specific method comprises the following steps:
s31, putting the substrate with the mask attached to the surface into 1mol/l HCL solution, ultrasonically cleaning for 1-2min to remove an oxide layer on the surface of the substrate in the micropores 2, and then washing for 3 times by using deionized water to thoroughly remove the residual acid liquor on the surface of the material and in the micropores;
s32, immersing the activated substrate into electroplating solution (the composition is NiSO4180g/L, niCl230g/L, H3BO320g/L, and pH = 3), and uniformly spreading the diamond 6 on the substrate 1 (refer to figure 3);
s23, starting a power supply, electroplating for 200min under the condition of 2.5A/dm2, and forming a nickel-plated layer 7 on the surface of the substrate and the diamond in the micropores to obtain a sample with a mask layer and orderly arranged diamond;
s4, taking down the mask plate:
taking the substrate with the electroplated diamonds out of the electroplating solution, washing away floating sand on the surface by using deionized water, and slowly tearing off the mask plate to obtain the substrate with the orderly arranged diamonds (refer to fig. 4);
s5, electroplating and thickening the whole surface of the matrix:
and putting the substrate with the mask removed into the electroplating solution again, and electroplating the whole surface for 400min under the condition of 3A/dm < 2 > to obtain the final grinding tool with the diamond orderly distributed (refer to figures 5 and 6).
The abrasive tools obtained in this example had highly ordered diamond arrangements.
The above are merely preferred embodiments of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.
Claims (8)
1. A preparation method for preparing a tool for orderly arranging abrasive particles by a mask method is characterized by comprising the following steps:
s1: cutting the mask by laser:
utilizing laser to cut mask micropores with ordered set patterns on a plastic film;
s2: mask transfer:
the plastic film adopts the design of a film covering and a main film, and the surface of the main film is provided with a binder. Tearing off a film covered by a plastic mask prepared by laser and then pasting the film covered on the surface of the pretreated substrate;
s3: electroplating an abrasive material:
filling abrasive particles into the mask by adopting a sand burying method and then electroplating;
s4: taking down the mask plate:
taking out the electroplated matrix, and tearing off the mask plate after washing off redundant abrasive particles;
s5: thickening the plating layer:
and (4) placing the substrate with the orderly-arranged abrasive particles, from which the mask plate is removed, into electroplating solution for electroplating and thickening to obtain the tool for orderly-arranged abrasive particles.
2. The method for preparing the tool for orderly arranging the abrasive particles by using the mask method according to claim 1, wherein the step of preparing the plastic mask plate in the step S1 comprises the following steps:
a1: drawing a pattern of a required graph by using a CAD tool, and guiding the drawn pattern into external laser cutting equipment;
a2: placing the selected PVC or PET plastic film with the thickness of 30-500 mu m in a laser working area to start laser cutting;
a3: the shape of the cut plastic film is consistent with that of the substrate, and the size of the plastic film and the distance between the mask micropores can be determined according to the arrangement condition of the abrasive particles on the substrate.
3. The method for preparing the tool for orderly arranging the abrasive particles by using the mask method according to claim 1, wherein in the step S3, electroplating the abrasive particles specifically comprises the following steps:
b1: putting the substrate adhered with the mask into HCL solution, ultrasonically cleaning for 1-2min to remove an oxide layer on the surface of the substrate in the micropore, and then washing with deionized water to remove residual acid liquor on the surface of the material and in the micropore;
the HCL solution can be adjusted according to the indoor temperature, and when the indoor temperature is less than 10 ℃, the HCL solution is preheated in advance, so that the temperature range of the HCL solution is kept between 15 ℃ and 26 ℃ and is consistent with the indoor temperature;
b2: immersing the activated substrate into electroplating solution, and uniformly spreading the diamond on the substrate;
b3: turning on power supply, and electroplating for 15-180min under the condition of 0.2-5A/dm 2;
b4: and after the electroplating is finished, taking out the matrix, detecting the performance of the HCL solution by using ph test paper, and if the performance of the HCL solution is changed, adding a corresponding reducing agent or replacing the HCL solution with a new HCL solution to keep the electroplating effect consistent under the same condition.
4. The method for preparing the tool for orderly arranging the abrasive particles by the mask method according to claim 1, which is characterized by comprising the following steps: in the step S4, the abrasive particles on the outermost layer can be directly washed away, the abrasive particles at the edges of the mask micropores need to be repeatedly washed and cannot be directly removed, so that the abrasive particles electroplated in the mask micropores are not removed, and the electroplated abrasive particles in the mask micropores are reserved after washing is finished;
then, heating the mask plate on the matrix at a low temperature of 30-40 ℃, and softening the bonding layer on the mask plate after heating;
at the moment, the mask plate is pulled obliquely, and the angle between the mask plate and the abrasive particles on the base body is larger than 45 degrees.
5. The method for preparing the tool for orderly arranging the abrasive particles by the mask method according to claim 4, wherein in S5, the specific method for electroplating and thickening the whole surface of the substrate comprises the following steps: placing the substrate with the mask removed in electroplating solution, and electroplating for 20-400min under the condition of 0.2-5A/dm 2;
during electroplating, the temperature of the electroplating solution is heated along with the change of room temperature, and the heating temperature is less than 30 ℃.
6. The method for preparing the tool with the orderly arranged abrasive particles by the mask method according to claim 1, wherein the thickness of the plastic mask is 30-500 μm, and the pore diameter in the ink pattern is 80-500 μm.
7. The method for preparing the tool with the orderly arranged abrasive particles by the mask method according to claim 1, wherein the grain diameter of the abrasive particles is 50-400 μm.
8. The method for preparing the tool for orderly arranging the abrasive particles by the mask method according to claim 1, wherein the power is 10-40W during ultrasonic cleaning.
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| CN108527182A (en) * | 2018-05-10 | 2018-09-14 | 上海交通大学 | The method that the diamond abrasive tool of abrasive grain ordered arrangement is prepared using mask plate |
| CN113427411A (en) * | 2020-03-23 | 2021-09-24 | 镇江韦尔博新材料科技有限公司 | Brazing diamond grinding wheel for casting polishing and preparation method thereof |
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2022
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| JP2004358640A (en) * | 2003-06-09 | 2004-12-24 | Goei Seisakusho:Kk | Method for manufacturing electroplated tool and electroplated tool |
| CN102240984A (en) * | 2011-05-30 | 2011-11-16 | 沈阳理工大学 | Columnar ultra-hard abrasive grinding wheel for phyllotactic arranged abrasive and production method thereof |
| CN103042375A (en) * | 2013-01-08 | 2013-04-17 | 中国人民解放军装甲兵工程学院 | Machining method for manufacturing regular microtexture on surface of metal matrix or coating |
| CN108527182A (en) * | 2018-05-10 | 2018-09-14 | 上海交通大学 | The method that the diamond abrasive tool of abrasive grain ordered arrangement is prepared using mask plate |
| CN113427411A (en) * | 2020-03-23 | 2021-09-24 | 镇江韦尔博新材料科技有限公司 | Brazing diamond grinding wheel for casting polishing and preparation method thereof |
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