JPH06254768A - Electrodeposition grinding wheel and manufacture thereof - Google Patents

Abstract

PURPOSE:To provide an increased life for a grinding wheel and to stabilize the quality of cutting by uniforming dispersion density of super grinding grains and the thickness of a grinding grain layer and improving a grinding grain holding force, in a multilayer-form grinding grain layer wherein super grinding grains are dispersed in a multilayer-form manner. CONSTITUTION:An electrodeposition grinding wheel is provided with a grinding wheel base substance 1; and a grinding grain layer formed on a grinding grain layer forming surface. The grinding grain layer comprises a first layer 20 wherein super grinding grains 10 are arranged in a dispersed state on a grinding grain layer forming surface and the super grinding grains are orderly fixed at an Ni electrolytic plating phase 12 having thickness being 5-20% of an average grain side and an Ni-P electroless plating phase 14 having thickness being 30-100% of an average grain size; and a second layer 22 wherein the noble super grinding grains 10 having the same average grain size so as to be positioned between the super grinding grains 10 in the first layer 20 and the super grinding grains are orderly fixed in an Ni electrolytic plating phase 16 having thickness being 5-20% of an average grain size and an Ni-P electroless plating phase 18 having thickness being 30-100% of the average grain size. Hardness of the Ni-P electroless plating phases 14 and 18 is set to 450 Hv or more.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electrodeposition grindstone used for various purposes and a method for manufacturing the same, and more particularly to an improvement for extending the life of the grindstone and stabilizing the sharpness.

[0002]

2. Description of the Related Art An electrodeposition grindstone is one in which superabrasive grains such as diamond or CBN are fixed by a metal plating phase on the surface of a grindstone base on which a grindstone layer is formed. The electrodeposited grindstone, resin bond grindstone, and vitrified bond grindstone. In comparison, since the strength of the binder phase is high and the wear of the abrasive grain layer is small, it is suitable for finishing and general-type machining in which shape deterioration due to wear of the abrasive grain layer is not desired.

In the case of manufacturing this kind of electrodeposition grindstone, the following method has been conventionally adopted. First, after masking the surface of the metal grindstone substrate other than the abrasive grain layer forming surface, the grindstone substrate is immersed in a Ni electrolytic plating bath, and the abrasive grain layer forming surface faces upward, and the superabrasive grains are evenly sown thereon. By connecting the grindstone base to a power source cathode and energizing it with an anode arranged in an electrolytic plating bath, a Ni plating phase is deposited on the surface where the abrasive grain layer is formed, and the superabrasive grains are fixed in a single layer. When the abrasive grain layer forming surface has an annular shape, the above operation is performed each time while the grindstone substrate is intermittently rotated by a constant angle, and the superabrasive grains are spread over the entire area of the abrasive grain layer forming surface. Fix it.

[0004]

By the way, in the above-mentioned manufacturing method, the superabrasive grains can be fixed to the surface on which the abrasive grain layer is formed in a substantially single layer, but two or more superabrasive grains are laminated. If an attempt is made to form an abrasive grain layer, segregation of the metal plating phase becomes severe, making it difficult to form an abrasive grain layer having a uniform thickness, and the superabrasive grain distribution inside thereof is disturbed. For this reason, the abrasive grain holding force due to the metal plating phase varies, and problems such as unnecessary loss of superabrasive grains during grinding and variation in sharpness occur, and satisfactory grinding performance cannot be obtained. For this reason, most of the conventional electrodeposition grindstones are limited to those in which superabrasive grains are fixed in a single layer, and the life of the grindstone is short.

The present invention has been made in view of the above circumstances. In a multi-layered electrodeposition grindstone in which super-abrasive grains are dispersed in multiple layers, the thickness of the abrasive grain layer and the super-abrasive grain distribution are made uniform and An object of the present invention is to obtain an electrodeposition grindstone having a long grindstone life and stable sharpness by increasing the abrasive grain holding force for the superabrasive grind.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and is electrodeposition provided with a grindstone base and an abrasive grain layer formed on an abrasive grain layer forming surface of the grindstone base. In the grindstone, the abrasive grain layer has superabrasive grains dispersedly arranged on the abrasive grain layer forming surface, a Ni electrolytic plating phase having a thickness of 5 to 20% of the average grain size of these superabrasive grains, and the average grain. Diameter 30 ~
An Ni-P electroless plating phase having a thickness of 100%, a first layer formed by sequentially fixing the superabrasive grains, and an n-1th layer (n is an integer of 2 or more) on the nth layer. New superabrasive grains having the same average grain size are dispersedly arranged so as to be located between the superabrasive grains in one layer, and the Ni electrolytic plating phase having a thickness of 5 to 20% of the average grain size, and the above Ni with a thickness of 30 to 100% of the average particle size
-P electroless plating phase and the n-th layer which is sequentially fixed, and the hardness of each Ni-P electroless plating phase is 450H.
It is characterized by being set to v or more.

The hardness of each Ni-P electroless plating phase may be set to 600 Hv or more by thermosetting treatment.

On the other hand, the method for producing an electrodeposition grindstone according to the present invention is characterized by including all the following steps a to e. a. An abrasive grain base having an electrically conductive abrasive grain layer forming surface is immersed in a Ni electrolytic plating bath to disperse superabrasive grains on the abrasive grain layer forming surface, and to dispose the superabrasive grains on the abrasive grain layer forming surface. The Ni electroplating phase having a thickness of 5 to 20% of the average grain size is deposited to temporarily fix the superabrasive grains. b. The grindstone substrate is immersed in a Ni electroless plating bath containing P, and Ni having a thickness of 30 to 100% of the average particle diameter is used.
A -P electroless plating phase is deposited on the Ni electroplating phase and embedded with superabrasive grains to form a first layer. c. The whetstone substrate is again immersed in the Ni electrolytic plating bath to
Superabrasive grains having the same average particle diameter are newly dispersed and arranged between one layer (n is an integer of 2 or more) of superabrasive grains,
On the Ni-P electroless plating layer of the layer,
A 20% thick Ni electroplating phase is deposited to temporarily fix the superabrasive grains. d. The grindstone substrate is immersed again in a Ni electroless plating bath containing P, and Ni having a thickness of 30 to 100% of the average particle diameter is used.
The -P electroless plating phase is deposited on the Ni electrolytic plating phase of the (n-1) th layer and embedded with superabrasive grains to form the nth layer. e. The above steps c and d are repeated until n reaches a desired number.

After finishing steps a to e, the grindstone substrate may be heated to harden the Ni-P electroless plating phase of each layer.

[0010]

In the electrodeposition grindstone according to the present invention, since the superabrasive grains of the respective layers which are vertically stacked are alternately and adjacently arranged, during grinding, the superabrasive grains of the upper layer are directly or directly adhered to the superabrasive grains of the lower layer. It indirectly supports through the metal plating phase to enhance the abrasive grain holding force.

Further, since the superabrasive grains are dispersed in multiple layers, when the superabrasive grains in the upper layer are worn out, the superabrasive grains in the lower layer are sequentially exposed and are in charge of grinding, so that stable sharpness can be obtained over a long period of time. Can be maintained. Further, by providing a hardness difference between the electrolytic plating phase and the Ni-P electroless plating phase, when the superabrasive particles are worn to some extent by grinding, the proportion supported by the Ni electrolytic plating phase having a relatively low hardness increases. Although it does not easily come off while it is sharp, when it is worn to some extent, the abrasive holding force for the abrasive drops sharply. By this action, superabrasive grains that have advanced wear easily fall off, not only promote the exposure of the lower layer superabrasive grains, but also form a chip pocket after falling off,
These chip pockets improve the chip discharge property and prevent clogging of the grinding surface, and from this point also the grinding performance can be improved.

On the other hand, in the method for producing an electrodeposition grindstone according to the present invention, after superabrasive grains of each layer are embedded by the Ni electrolytic plating phase and the Ni-P electroless plating phase to 35 to 120% of the average grain size, the Since the superabrasive grains are dispersed again on the top and the same embedding process is repeated, there is a high probability that the superabrasive grains of the upper layer will be dispersed and arranged at the intermediate position between the superabrasive grains of the lower layer, and a super-abrasive structure with no order A multi-layered abrasive grain layer having a uniform grain distribution can be easily formed.

Further, the superabrasive grains dispersed in each layer are first temporarily fixed with a Ni electrolytic plating phase having a thickness of 5 to 20% of the average grain size, and then a uniform plating thickness of 30 to 100% of the average grain size is obtained. It is possible to form an abrasive grain layer having a uniform thickness and a high overall grain holding force because it is embedded by a Ni-P electroless plating phase having a.

[0014]

FIG. 1 is a vertical sectional view showing a drill bit for forming a through hole in a plate glass or the like as an embodiment of an electrodeposition grindstone according to the present invention. In the figure, reference numeral 1 is a metal grindstone base, and this grindstone base 1 is formed by integrally forming a cylindrical head portion 1A and a shaft portion 1B coaxial with the head portion 1A.
A center hole 1C is formed along the axis. Head 1
A tapered portion 2 that narrows toward the tip and an annular portion 4 that protrudes from the tip surface of the tapered portion 2 are concentrically formed at the tip portion of A.

A single-layer abrasive grain layer 6 is formed on the outer peripheral surface of the tapered portion 2, the outer peripheral surface and the inner peripheral surface of the annular portion 4, while the tip surface of the annular portion 4 (abrasive grain layer forming surface). Has a multi-layered abrasive grain layer 8.

The multi-layered abrasive grain layer 8 at the tip of the bit is a feature of the present invention, and FIG. 2 is an enlarged sectional view thereof. Superabrasive grains 10 are dispersed and fixed on the tip surface of the annular portion 4 by a thin Ni electroplating phase 12, and further, relatively thick Ni-P electroless plating so as to fill the spaces between the superabrasive grains 10. Phase 1
4 is formed, and the first layer 20 is formed.

On the first layer 20, superabrasive grains 10 are dispersed and fixed by a thin Ni electrolytic plating phase 16, and a relatively thick Ni-P electroless plating phase is filled so as to fill each superabrasive grain 10. 18 is formed and becomes the second layer 22.

The Ni electrolytic plating phases 12 and 16 are both
The thickness is set to 5 to 20% of the average particle diameter of the superabrasive particles 10. If it is less than 5%, the superabrasive grains 10 cannot be temporarily fixed at a sufficient strength during production, and if it is more than 20%, the effect of segregation becomes large and the thickness of the abrasive grain layer becomes uneven.

On the other hand, the Ni-P electroless plating phase 14, 18
Is 30 to 100% of the average particle size of the superabrasive grains 10. If it is less than 30%, the holding power of the abrasive grains will be reduced to 100.
%, The amount of protrusion of the abrasive grains on the ground surface becomes insufficient, the sharpness decreases, and it becomes difficult to uniformly disperse the superabrasive grains 10 at the stage of stacking each layer.

Ni electrolytic plating phase 12 (or 16) and N
The total thickness of the i-P electroless plating phase 14 (or 18) is 1/3 to 1/2 of the average particle diameter of the superabrasive particles 10, and particularly 1
It is desirable that it is / 2. Thinner than 1/3 or 1 /
If the thickness is more than 2, the tendency of the arrangement of the superabrasive grains 10 in the upper layer to be disturbed increases in any case.

The Ni electrolytic plating phases 12 and 16 are formed of Ni or a Ni alloy, and particularly, the Co content is 1
A Ni—Co based alloy of 0 to 60 wt% has a high hardness after heat treatment and is suitable. When the Co content is less than 10 wt%,
While the heat resistance and fatigue resistance decrease and the abrasive grain holding power decreases, if it is more than 60 wt%, Co is expensive and the cost becomes high.

On the other hand, the single-layer abrasive grain layer 6 is formed by forming only the above-mentioned first layer 20 on the grindstone substrate 1, as shown in FIG. 3, and the material and dimensions of each part are multi-layered abrasive grains. It may be similar to layer 8.

Next, a method of manufacturing the above-mentioned punching bit will be described. After masking the entire surface of the grindstone base 1 excluding the surface on which the abrasive grain layers 6 and 8 are formed, the grindstone base 1 is immersed in a Ni electrolytic plating bath having a known composition to form the abrasive grain layers 6 and 8. Place part of the power side facing upward. Superabrasive grains 10 are sown on the portion facing upward, and an electric current is applied between the superabrasive grains 10 and the anode immersed in the electrolytic plating bath to precipitate the Ni electrolytic plating phase 12 to temporarily fix the superabrasive grains 10.

After the temporary fixing of a part is completed, the grindstone base 1
Change the position of and move another part upward, and again
The superabrasive grain 10 is temporarily fixed in a single layer on the entire surface where the abrasive grain layers 6 and 8 are to be formed. When a Ni-Co alloy is used as the electrolytic plating phase 16, for example, Co sulfamate may be added to a known Ni electrolytic plating bath.

Next, after the grindstone base 1 is washed with water, Ni-P is used.
The Ni-P electroless plating phase 14 is deposited between the temporarily fixed superabrasive grains 10 by transferring the electroless plating bath to the first layer 20.
To complete. By embedding the superabrasive grains 10 by using the electroless plating method as described above, segregation does not occur unlike the case of the electrolytic plating method, and an abrasive grain layer having a uniform thickness can be formed.

Of the formed first layer 20, the portion to be the single-layered abrasive grain layer 6 is masked and immersed again in the electrolytic plating bath so that the front end surface of the annular portion 4 faces upward, and the first portion of the portion is formed. The superabrasive grains 10 are sown on the layer 20. The seeded superabrasive grains 10 are contained between the superabrasive grains 10 of the first layer 20,
The super-abrasive grains 10 are uniformly dispersed according to the dispersed state. The grindstone base 1 and the anode are energized again, and Ni on the tip surface of the annular portion 4 is applied.
The Ni electrolytic plating phase 16 is deposited on the -P electroless plating phase 14, and the newly-sown superabrasive grains 10 are temporarily fixed in a single layer.

The grindstone substrate 1 is washed with water and returned to the electroless plating bath, and the Ni-P electroless plating phase 18 is again deposited on the Ni electrolytic plating phase 16 between the superabrasive particles 10 to form the superabrasive particles 10. The second layer 22 is formed by embedding it to a predetermined depth. When the embedding is completed, stop energizing, remove all masking and wash with water. When heat treatment is performed after washing with water, the Ni-P electroless plating phase, which is 450 Hv or more after precipitation, can be hardened to 600 Hv or more.

The Ni electrolytic plating phases 12 and 16 are replaced with Ni-Co.
When formed from a system alloy, its hardness is 525H in the precipitated state.
v, 300 to 400 Hv after heat treatment (400 ° C. or less), which is higher in hardness than the conventional Ni plating phase is reduced to 200 Hv or less by heat treatment, and the grain holding power can be further improved.

In order to use the punching bit having the above structure, the shaft portion 1B is fixed to the grinder, and while rotating at a high speed around the axis line, the tip is vertically contacted with a work material such as plate glass. Then, the work material is hollowed out in a circular shape by the multilayer abrasive grain layer 8 at the tip of the drilling bit, and the peripheral edge of the opening is chamfered by the single layer abrasive grain layer 6 of the taper portion 2.

The punching bit of this embodiment has the following excellent effects. The abrasive grain layer 8 at the tip of the bit, which is mainly used for grinding, has a multi-layered shape, and when the superabrasive grains 10 of the second layer 22 are worn, the superabrasive grains 10 of the first layer 20 are sequentially exposed. The sharpness can be maintained and the life of the grindstone can be extended.

In the multi-layered abrasive grain layer 8, the superabrasive grains 10 of each of the layers 20 and 22 that are vertically stacked are alternately and adjacently arranged. Therefore, during grinding, the superabrasive grains 1 of the second layer 22 are
0 is directly supported by the superabrasive grains 10 of the first layer 20 or indirectly through the metal plating phases 16 and 18, and
Ni-P electroless plating phase 1 in which each superabrasive grain 10 is embedded
Since Nos. 4 and 18 are strengthened by the heat effect treatment, the synergistic effect of these effects greatly enhances the abrasive grain holding force in the second layer 22. Therefore, the same grinding performance as the superabrasive grains 10 of the first layer 20 can be obtained by the superabrasive grains 10 of the second layer 22.

In the multi-layered abrasive grain layer 8, the second layer 22
When the superabrasive grains 10 are worn to some extent by grinding, the ratio of being supported by the Ni electrolytic plating phase 16 having a relatively low hardness increases, so that they are hard to drop while being sharp,
After a certain amount of wear, the abrasive grain holding force drops sharply. Due to this action, the superabrasive grains 10 of the second layer 22 that have been worn away easily fall off, and the exposure (blazing) of the superabrasive grains 10 of the first layer 20 is promoted. Further, since the chip pockets are formed after the superabrasive grains 10 have fallen off, these chip pockets improve the chip discharging property and prevent the grinding surface from being clogged, and from this point also the grinding performance can be improved.

On the other hand, with the method for manufacturing a grindstone of the above embodiment, the following excellent effects can be obtained. Superabrasive grains 10 are Ni electrolytic plating phase 12 and Ni-P
After the electroless plating phase 14 is embedded to 35 to 120% of the average grain size, the superabrasive grains 10 are dispersed again thereon and the same embedding treatment is repeated.
There is a high probability that the upper layer superabrasive grains 10 will be dispersedly arranged at an intermediate position between them, and a multi-layered abrasive grain layer having an orderly layered structure and uniform abrasive grain distribution can be easily formed.

When forming the layers 20 and 22, the superabrasive grains 10 are first temporarily fixed by the Ni electrolytic plating phases 12 and 16, and then embedded by the Ni—P electroless plating phases 14 and 18, so that the abrasive grain retaining force is improved. The super-abrasive grains 10 can be mainly supported by the Ni-P electroless plating phases 14 and 18 which are highly resistant to segregation, and an abrasive grain layer having a uniform thickness and a high abrasive retaining force can be obtained.

FIG. 4 is a vertical sectional view showing another embodiment of the present invention. In this embodiment, a full-form grindstone for chamfering an edge of a plate glass or the like, 30 is a disk-shaped grindstone base made of metal, 30A is a central hole, and 30B is a mounting hole to a grinder. On the outer peripheral surface of the grindstone base 30, the groove portion 3 is formed over the entire circumference.
2 is formed, and the entire surface of the outer peripheral surface including the groove 32 is provided with a multi-layered abrasive grain layer 8 in which superabrasive grains are dispersed in two layers similar to those in the embodiment.

To use this full-form grindstone, while being fixed to a grinding machine and being rotated, an edge of plate glass or the like is applied to the concave portion of the multilayer abrasive grain layer 8 and the grindstone is moved along the edge. Also in this embodiment, the same excellent effects as in the above embodiment can be obtained. Furthermore, the present invention is not limited to the illustrated embodiment, but may be applied to any other shape of grindstone such as a simple wheel-type grindstone or a cup-type grindstone.

[0037]

[Experimental Example] Next, the effect of the present invention will be demonstrated with reference to an experimental example. (Experimental example) Outer diameter 150 mm × inner diameter 50 mm × thickness 10 m
m of the flat base metal except the surface where the abrasive grain layer is formed is masked, the base metal is immersed in an electrolytic plating bath having the following composition, and while superabrasive grains having an average particle size of 200 μm are sown on the surface of the base metal. A Ni layer was deposited to a thickness of 10 μm (corresponding to 5% of the average grain size), and superabrasive grains were temporarily fixed in a single layer.

Ni electrolytic plating bath Ni sulfamate: 450 g / l Boric acid: 30 g / l Ni chloride: 10 g / l Brightening agent: small amount pH: 4.2 Temperature: 50 ° C.

Next, the base metal is immersed in an electroless plating solution (manufactured by Nippon Kanigen Co., Ltd., trade name "Blue Sumer") and electroless plated at 90 ° C. to form Ni-P on the Ni layer.
A system alloy layer was formed and the temporarily fixed superabrasive grains were embedded to 50% of the average grain size. Again, the above electrolytic plating and electroless plating were repeated under the same conditions to form a two-layer abrasive grain layer. FIG. 5 is a copy of a cross-sectional enlarged photograph of a corner portion of the obtained grindstone. The super-abrasive grains are almost regularly distributed in two layers.

(Comparative Example) The same base metal as in the above experimental example was used, and the same superabrasive grains were electrodeposited as described above using the same electrolytic plating bath. Then, a metal plating phase having a thickness of 60% of the average grain size of the superabrasive grains was formed.

(Comparative Experiment) Using the grindstone of the above-mentioned experimental example and the grindstone of the comparative example, surface grinding was performed under the following conditions. Then, the relationship between the ground work volume and the spindle power for driving the grindstone is shown in the graph of FIG.

Surface grinding conditions Wheel peripheral speed: 1500 m / min Table feed: 10 m / min Cross feed: 2 mm / pass Depth of cut: 0.015 mm Work material: cemented carbide "UT120T" Work material cutting surface dimensions: 90 x 40 mm

As is clear from the graph of FIG. 6, the grinding wheel of the experimental example provided a life of 4 times or more that of the grinding wheel of the comparative example. In addition, the spindle power of the grindstone of the experimental example was almost constant at all times even though the abrasive grain layers were multi-layered, and stable sharpness was obtained.

[0044]

As described above, in the electrodeposition grindstone according to the present invention, since the superabrasive grains of the upper and lower layers are alternately arranged adjacent to each other, the superabrasive grains of the upper layer are arranged at the lower layer during grinding. The super-abrasive grains directly support or indirectly support through the metal plating phase. At the same time, Ni- which mainly supports each superabrasive grain
Since the P electroless plating phase is strengthened by the thermal effect treatment, the synergistic effect of these increases the abrasive grain holding power significantly, and the superabrasive grains in the upper layer also perform the same grinding as the superabrasive grains in the lower layer. Performance is obtained.

Further, since the superabrasive particles are dispersed in multiple layers, when the superabrasive particles in the upper layer are worn out, the superabrasive particles in the lower layer are sequentially exposed and are in charge of grinding, so that stable sharpness is achieved over a long period of time. Not only can it be maintained, but when the superabrasive grains wear to some extent due to grinding,
Since the proportion supported by the Ni electroplating phase having a relatively low hardness is high, it does not easily come off while it is sharp, but when it is worn to some extent, the abrasive grain holding force for the abrasive grains drops sharply. By this action, superabrasive grains that have advanced wear easily fall off, not only promote the exposure of the superabrasive grains of the lower layer, but also form a chip pocket after falling off, these chip pockets enhance the chip discharge performance, Prevents clogging of the grinding surface,
Also from this point, the grinding performance can be improved.

On the other hand, in the method for producing an electrodeposition grindstone according to the present invention, after superabrasive grains of each layer are embedded by the Ni electrolytic plating phase and the Ni-P electroless plating phase to 35 to 120% of the average grain size, the Since the superabrasive grains are dispersed again on the top and the same embedding process is repeated, there is a high probability that the superabrasive grains of the upper layer will be dispersed and arranged at the intermediate position between the superabrasive grains of the lower layer, and a super-abrasive structure with no order A multi-layered abrasive grain layer having a uniform grain distribution can be easily formed.

Further, the superabrasive grains dispersed in each layer are first temporarily fixed with a Ni electroplating phase having a thickness of 5 to 20% of the average grain size, and then having a thickness of 30 to 100% of the average grain size. Since it is embedded by the Ni-P electroless plating phase in which segregation does not easily occur, the electroless plating phase having high abrasive grain holding force can be formed with a uniform thickness, and the entire thickness is uniform and the abrasive grain holding force is high. A high-abrasive grain layer can be formed.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional view showing a drill bit as an embodiment of an electrodeposition grindstone of the present invention.

FIG. 2 is an enlarged cross-sectional view showing a multilayer abrasive grain layer of the same punching bit.

FIG. 3 is an enlarged cross-sectional view showing a single-layer abrasive grain layer of the punched bit.

FIG. 4 is a vertical sectional view showing a full-scale grindstone as another embodiment of the present invention.

FIG. 5 is a copy of a cross-sectional photograph of a grindstone of an experimental example.

FIG. 6 is a graph comparing grinding performances of a grinding stone of an experimental example and a grinding stone of a comparative example.

[Explanation of symbols]

 1 Grindstone Base 2 Tapered Part 4 Annular Part 6 Single Layer Abrasive Grain Layer 8 Multilayer Abrasive Grain Layer 10 Super Abrasive Grains 12, 16 Ni Electrolytic Plating Phase 14, 18 Ni-P Electroless Plating Phase 20 First Layer 22 Second Layer 30 Grindstone base

Claims (4)

[Claims] 1. An electrodeposition grindstone comprising a grindstone base and an abrasive grain layer formed on the abrasive grain layer forming surface of the grindstone substrate, wherein the abrasive grain layer is superabrasive on the abrasive grain layer forming surface. Are dispersedly arranged, and Ni having a thickness of 5 to 20% of the average particle diameter of these superabrasive particles is
An electrolytic plating phase and a Ni-P electroless plating phase having a thickness of 30 to 100% of the average particle diameter, the first layer formed by sequentially fixing the superabrasive particles, and the n-1th layer (n is 2 or more), new superabrasive grains having the same average grain size are dispersedly arranged so as to be located between the superabrasive grains in the (n-1) th layer, and the average grain size is 5 to 20. % Ni electroplating phase, and 30 to 30% of the average particle size
A Ni-P electroless plating phase having a thickness of 100% and sequentially fixed by an n-th layer, wherein the hardness of each Ni-P electroless plating phase is 450 Hv or more. An electroplated whetstone. 2. The hardness of each Ni-P electroless plating phase is
The electroplated grindstone according to claim 1, wherein the electroplated grindstone is set to 600 Hv or more by heat curing treatment. 3. A method for manufacturing an electrodeposition grindstone, which comprises all of the following steps a to e. a. An abrasive grain base having an electrically conductive abrasive grain layer forming surface is immersed in a Ni electrolytic plating bath to disperse superabrasive grains on the abrasive grain layer forming surface, and to dispose the superabrasive grains on the abrasive grain layer forming surface. The Ni electroplating phase having a thickness of 5 to 20% of the average grain size is deposited to temporarily fix the superabrasive grains. b. The grindstone substrate is immersed in a Ni electroless plating bath containing P, and Ni having a thickness of 30 to 100% of the average particle diameter is used.
A -P electroless plating phase is deposited on the Ni electroplating phase and embedded with superabrasive grains to form a first layer. c. The whetstone substrate is again immersed in the Ni electrolytic plating bath to
Superabrasive grains having the same average particle diameter are newly dispersed and arranged between one layer (n is an integer of 2 or more) of superabrasive grains,
On the Ni-P electroless plating layer of the layer,
A 20% thick Ni electroplating phase is deposited to temporarily fix the superabrasive grains. d. The grindstone substrate is immersed again in a Ni electroless plating bath containing P, and Ni having a thickness of 30 to 100% of the average particle diameter is used.
The -P electroless plating phase is deposited on the Ni electrolytic plating phase of the (n-1) th layer and embedded with superabrasive grains to form the nth layer. e. The above steps c and d are repeated until n reaches a desired number. 4. The production of an electrodeposition grindstone according to claim 3, wherein after the steps a to e are completed, the grindstone base is heated to harden the Ni-P electroless plating phase of each layer. Method.