JPH08255729A - Manufacture of chip electronic component - Google Patents

Abstract

PURPOSE: To provide a method for manufacturing a chip electronic component having a frame structure with excellent productivity while obtaining an excellent volume effective utilization rate. CONSTITUTION: When an anode lead wire 2 is connected to a lead frame 3, a cut grove so formed as to gradually narrow the end face of the end of the frame 3 toward the inside is provided, the wire 2 is engaged with the groove, at least one of the wire 2, a capacitor element 1 and the frame 3 is pressed, the wire 2 is sized to be cut by a laser and the frame 3 of the wire 2 is welded in the groove.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component.

[0002]

2. Description of the Related Art A chip-shaped electronic component having a conventional frame structure is, for example, a chip-shaped solid electrolytic capacitor,
The one shown in FIG. 4 is generally known, and the first lead frame, that is, the anode lead frame 3 and the capacitor element 1 which are joined to the internal element, that is, the anode lead wire 2 implanted in the capacitor element 1 in a parallel direction. And a second lead frame, that is, a cathode lead frame 4 connected by a conductive adhesive 5, and the capacitor element 1 was covered with a plastic package 6.

However, the conventional chip-shaped electronic component is, for example, in the case of the chip-shaped solid electrolytic capacitor described above,
Since the anode lead-out wire 2 and the anode lead frame 3 are joined by resistance welding at the overlapped portion, it is necessary to take the above-mentioned overlapped portion, that is, the welding margin in the direction in which the anode lead-out wire 2 is pulled out from the capacitor element 1. is there.

Since this welding margin is restricted by the thickness of the welding tip used as a welding electrode in resistance welding, it has been considered to shorten the length of the anode lead wire 2.
It was practically difficult.

Therefore, as described above, the effective volume utilization ratio of the chip-shaped solid electrolytic capacitor (element volume / element volume /
There is a problem in that a loss occurs in the volume of the entire component, and the size of the capacitor element 1 is restricted, that is, the effective volume utilization rate of the chip solid electrolytic capacitor is restricted, and expansion of the storage capacity is hindered.

In order to solve the above-mentioned problems, as in the chip-shaped solid electrolytic capacitor shown in FIG. 5, it is joined by laser welding in a direction substantially perpendicular to the anode lead wire 2 implanted in the capacitor element 1. A molded plastic package 6 is shown so that the anode lead frame 3 and the cathode lead frame 4 connected to the capacitor element by a conductive adhesive 5 are exposed on the lower surface of the solid electrolytic capacitor. There is.

[0007]

However, in the above-mentioned chip-shaped electronic component, the anode lead wire 2 is fixed to the metal bar 7 so that the capacitor elements 1 are aligned, and then the anode lead wire 2 is connected to the anode lead frame 3 by a laser. Laser welding and the step of removing the metal bar 7 by cutting the anode lead-out wire 2 to a certain size, it is necessary to surely irradiate the laser with a spot at a position where the anode lead frame 3 and the anode lead-out wire 2 are in contact with each other. Therefore, it is necessary to control the fixed pitch dimension of the anode lead-out wire 2 to the metal bar 7 with extremely high precision, and the productivity in the element manufacturing process is extremely poor.
Further, the anode lead-out wire 2 of the capacitor element 1 fixed to the metal bar 7 may be bent before the welding process with the anode lead frame 3 through the element manufacturing process. As shown in FIGS. Since the position of the anode lead-out wire 2 with respect to the lead frame 3 is not fixed, it is not possible to stably irradiate the spot on the position of the anode lead-out wire 2 with a laser, resulting in a cut error or welding failure of the anode lead-out wire 2, or even more However, there is a problem in that a sufficient welding strength cannot be obtained and a disconnection failure occurs when the plastic package 6 is molded. Therefore, it is necessary to perform extremely strict alignment such as recognizing the position of the anode lead wire 2 by image processing and correcting the laser spot position.

In addition, the above-mentioned chip-shaped electronic component has a problem that an extremely enormous capital investment is required, for example, it is necessary to newly manufacture a mold package molding die and separately provide a production line.

The present invention solves the above-mentioned problems of the prior art, and is superior to the conventional chip-shaped electronic component shown in FIG. 4 in volume effective utilization rate, low cost, and extremely excellent productivity. It is an object of the present invention to provide a manufacturing method capable of producing the same.

[0010]

In order to achieve the above object, the present invention provides a method for manufacturing a chip-shaped electronic component having a capacitor element 1 having an anode lead wire 2 and an anode lead frame 3, in which a metal bar 7 is used. After fixing the anode lead-out wire 2 so that the capacitor element 1 is aligned, the joining of the anode lead frame 3 and the anode lead-out wire 2 and the anode lead-out wire 2 are performed.
When the constant size cut is performed, the anode lead-out wire 2 is fitted into the cut groove which is configured to be gradually narrowed inward from the end surface of the tip portion of the anode lead frame 3,
At least one of the capacitor element 1 and the anode lead frame 3 is pushed in, the cut groove is joined to the anode lead wire (2), the anode lead wire 2 is cut to a certain size by a laser, and the anode lead wire 2 is connected to the anode lead. Laser cutting is performed in the cut groove of the frame 3.

[0011]

According to the above manufacturing method, the anode lead frame 3
A cut groove configured to be gradually narrowed from the end surface of the anode lead frame 3 is provided at the tip end of the anode lead frame 3, the anode lead wire 2 is fitted in the cut groove, and further, the cut groove, the anode lead wire 2, and the capacitor element 1 By pressing at least one of the two, the anode lead-out wire 2 has a lateral positioning function, which eliminates the need for high-precision control of the element fixing pitch dimension to the metal bar 7, and makes the laser irradiation spot strict. Positioning is also unnecessary, and it is possible to easily and reliably cut the anode lead wire 2 to a certain size and perform welding.
The welding margin can be extremely shortened, and a chip-shaped electronic component having an excellent volume effective utilization rate can be obtained.

Moreover, at the welding point between the cut groove and the anode lead wire 2 described above, the anode lead wire 2 is fitted in the cut groove, and at least one of the cut groove, the anode lead wire 2 and the capacitor element 1 is formed. Since the cut groove and the anode lead-out wire 2 are melted and joined by the laser while pushing one or more toward the article to be joined, positioning in the vertical direction is also possible, and the volume of the chip-shaped electronic component is effective. For the purpose of improving the utilization rate, the anode lead wire 2 is welded to the anode lead frame 3 in a direction substantially perpendicular to the anode lead frame 3, and the mold parting line, that is, the lead, is formed by using a conventional mold. Since the position of the capacitor element 1 with respect to the frame can be made the same as that of the conventional chip-shaped electronic component, there is a defect in appearance such that the capacitor element 1 is exposed from the plastic package. Because there is no Rukoto excellent achieved yield, without further need to provide a production line to a new, can be obtained at low cost superior volume effective utilization rate of the chip electronic component described above.

[0013]

[Embodiment 1] An embodiment of the present invention, in which a chip solid electrolytic capacitor is manufactured, will be described below with reference to the accompanying drawings.

FIG. 1 is a sectional view showing an embodiment of a chip-shaped solid electrolytic capacitor of a chip-shaped electronic component according to the present invention, and FIG. 2 is a perspective view of an essential part of the capacitor during manufacturing.
FIG. 3 is a front view of a main part of the capacitor during manufacturing.

In FIG. 1 and FIG. 2, the capacitor element 1 has an anode body made of a valve metal provided with an anode lead wire 2 fixed to a metal bar 7, and a dielectric oxide film, an electrolyte layer, a carbon layer, and a cathode. The layers are sequentially formed.

On the other hand, the tip of the anode lead frame 3 was provided with a V-shaped cut groove into which the anode lead wire 2 was fitted, as shown in FIG.

Subsequently, as shown in FIG. 2, the anode lead frame 3 was formed into an L shape so as to cause the tip end portion provided with the cut groove.

Then, the anode lead-out wire 2 is fitted into the cut groove, the anode lead-out wire 2 is pushed in the direction of the anode lead frame 3, and the anode lead-out wire 2 is sized and cut by a laser to remove the metal bar 7. The anode lead wire 2 and the anode lead frame 3 were laser-welded.

In the welding process, the laser is irradiated while pressing the anode lead wire 2 toward the anode lead frame 3 so that the anode lead wire 2 is positioned on the horizontal plane of the anode lead frame 3. The lead wire 2 and the anode lead frame 3 were melted and joined.

At this time, by fitting the anode lead wire 2 into the cut groove and pushing it toward the anode lead frame 3,
It was possible to obtain the function of laterally correcting the anode lead-out wire 2 and reliably irradiate the anode lead-out wire 2 with the laser beam, and it was possible to perform the sizing cut and the welding process extremely easily. Further, it is possible to correct the position of the anode lead wire 2 in the vertical direction, and the conventional mold shown in FIG. 4 can be used as it is as the molding die of the plastic package 6 described below.

On the other hand, regarding the bonding strength between the anode lead frame 3 and the anode lead wire 2, as shown in FIG. 8, extremely good strength could be obtained.

Subsequently, the cathode lead frame 4 was connected to the capacitor element 1 with a conductive adhesive 5, and then a plastic package 6 was molded to manufacture a chip solid electrolytic capacitor.

The chip-shaped solid electrolytic capacitor obtained by the above manufacturing method is a plastic package 6
The loss volume consumed in the frame welding part and the frame forming part inside can be made extremely small, and the capacitor element 1 of about 1.5 times the volume is stored as compared with the conventional chip-shaped solid electrolytic capacitor shown in FIG. We were able to.

The cut groove at the tip of the anode lead frame 3 is not only V-shaped but also U-shaped, etc., and is gradually narrowed inward from the end face of the tip of the lead frame.
Should have a shape that does not rattle in the cut groove,
Instead of fitting the anode lead-out wire 2 in the cut groove and then pushing the anode lead-out wire 2 in the direction of the anode lead frame 3, the capacitor element 1, the anode lead-out wire 2, or the anode lead frame 3 is appropriately combined to form a relative structure. It goes without saying that the same effect can be obtained by pushing it toward the part to be processed.

Further, in the above embodiment, the chip-shaped solid electrolytic capacitor is described, but the same effect can be obtained in other chip-shaped electronic parts.

[0026]

According to the above manufacturing method, a cut groove is formed at the tip of the anode lead frame 3 so as to be gradually narrowed from the end face of the anode lead frame 3, and the anode lead wire 2 is provided in the cut groove. Since the anode lead-out wire 2 is provided with a lateral positioning function by fitting at least one of the cut groove, the anode lead-out wire 2 and the capacitor element 1, the anode lead-out wire 2 is fixed by the laser. At the laser irradiation point of the dimensional cut and the welding with the anode lead frame 3, the dimensional cut of the anode lead-out wire 2 and the welding with sufficient strength are performed easily and surely without strict alignment. And the position of the anode lead wire 2 with respect to the anode lead frame 3 in the vertical direction is at least 1 of the cut groove, the anode lead wire 2, and the capacitor element 1 described above.
Since the cut groove and the anode lead-out wire 2 are melted and joined by a laser while pushing in one, the positions of the anode lead frame 3 and the anode lead-out wire 2 in the conventional chip-shaped electronic component can be made the same. Since it is possible to use the conventional mold package molding die as it is, a chip-shaped electronic component having excellent productivity and effective volume utilization can be produced at low cost.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an embodiment of a chip solid electrolytic capacitor of a chip electronic component according to the present invention.

FIG. 2 is a perspective view of a main part of the manufacturing process shown in FIG.

3 is a front view of the main part of the manufacturing process shown in FIG. 1. FIG.

FIG. 4 is a cross-sectional view of a conventional chip-shaped solid electrolytic capacitor of a chip-shaped electronic component.

FIG. 5 is a cross-sectional view of another example of a conventional chip-shaped solid electrolytic capacitor for a chip-shaped electronic component.

FIG. 6 is a perspective view of a main part during the manufacturing of FIG.

FIG. 7 is a front view of the main part during the manufacturing of FIG. 1.

FIG. 8 is a diagram showing a joint strength between a lead wire and a lead frame in the present invention.

[Explanation of symbols]

 1 Capacitor Element 2 Anode Lead Wire 3 Anode Lead Frame 4 Cathode Lead Frame 5 Conductive Adhesive 6 Plastic Package 7 Metal Bar

Claims (1)

[Claims] 1. A method for manufacturing a chip-shaped electronic component having a capacitor element (1) having an anode lead wire (2) and an anode lead frame (3), wherein an end face of a tip portion of the anode lead frame (3). Fit the anode lead wire (2) into the cut groove that is gradually narrowed from the inside to the inside, and press at least one of the anode lead wire (2), the capacitor element (1), and the anode lead frame (3), A step of joining the cut groove and the anode lead wire (2) and cutting the anode lead wire (2) to a predetermined size with a laser, and the step of cutting the anode lead wire (2) with a laser in the cut groove of the anode lead frame (3). A method of manufacturing a chip-shaped electronic component, which comprises a step of welding.