JP3359459B2 - Manufacturing method of chip-shaped electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component.

[0002]

2. Description of the Related Art A conventional chip-shaped electronic component having a frame structure is, for example, a chip-shaped solid electrolytic capacitor.
4 is generally known, and includes a first lead frame which is joined in parallel with an internal element, that is, an anode lead wire 2 implanted in a capacitor element 1, that is, an anode lead frame 3 and the capacitor element 1. As shown in FIG. And a second lead frame connected by a conductive adhesive 5, that is, a cathode lead frame 4, and the capacitor element 1 is covered with a plastic package 6.

However, a conventional chip-shaped electronic component is, for example, in the case of the aforementioned chip-shaped solid electrolytic capacitor,
Since the anode lead wire 2 and the anode lead frame 3 are joined by resistance welding at the overlapped portion, it is necessary to take the overlapping portion, that is, the welding margin, in the direction in which the anode lead wire 2 is drawn out of the capacitor element 1. is there.

Since this welding margin is restricted by the thickness of a welding tip used as a welding electrode at the time of resistance welding, shortening the length of the anode lead wire 2 has been studied.
Practically difficult.

For this reason, as described above, the effective utilization of the volume of the chip-shaped solid electrolytic capacitor (element volume / element volume) is determined by the welding margin between the anode lead wire 2 and the anode lead frame 3 by resistance welding.
Loss occurs in the volume of the entire component), which restricts the size of the capacitor element 1, that is, restricts the effective volume utilization of the chip-shaped solid electrolytic capacitor and hinders the expansion of the storage capacity.

In order to solve the above-mentioned problems, as in the case of a chip-shaped solid electrolytic capacitor shown in FIG. 5, it is joined by laser welding in a direction substantially perpendicular to the anode lead wire 2 implanted in the capacitor element 1. An anode lead frame 3 and a cathode lead frame 4 connected to a capacitor element by a conductive adhesive 5 are formed on a lower surface of a chip-shaped solid electrolytic capacitor by molding a plastic package 6 so that they are exposed. I have.

[0007]

However, in the above-mentioned chip-shaped electronic component, after the anode lead-out line 2 is fixed to the metal bar 7 so that the capacitor element 1 is aligned, the anode lead-out line 2 is attached to the anode lead frame 3 by laser. When performing the step of laser welding and the step of removing the metal bar 7 by cutting the anode lead wire 2 to a fixed size, it is necessary to surely irradiate the spot to the position where the anode lead frame 3 and the anode lead wire 2 are in contact with each other. Therefore, it is necessary to control the pitch of fixing the anode lead-out wire 2 to the metal bar 7 with extremely high accuracy, and the productivity in the element manufacturing process is extremely poor.
Further, the anode lead-out line 2 of the capacitor element 1 fixed to the metal bar 7 may be bent before the welding step with the anode lead frame 3 through the element manufacturing process, and as shown in FIGS. Since the position of the anode lead-out line 2 with respect to the lead frame 3 is not fixed, it is not possible to stably irradiate the spot of the laser to the position of the anode lead-out line 2, causing a cut mistake or poor welding of the anode lead-out line 2, or even more sufficiently. Therefore, there was a problem in that a high welding strength could not be obtained and a disconnection defect occurred during molding of the plastic package 6. For this reason, the position of the anode lead-out line 2 must be recognized by image processing or the like, and extremely strict alignment such as correcting the laser spot position is required.

In addition, the above-mentioned chip-shaped electronic component has a problem that an extremely enormous capital investment is required, for example, it is necessary to newly manufacture a mold package molding die and separately provide a production line.

The present invention solves the above-mentioned conventional problems. Compared to the conventional chip-shaped electronic parts shown in FIG. 4, the present invention achieves an excellent volume effective utilization rate, low cost, and extremely excellent productivity. It is an object of the present invention to provide a manufacturing method capable of performing the following.

[0010]

According to the present invention, there is provided a method of manufacturing a chip-shaped electronic component having a capacitor element having an anode lead wire and an anode lead frame. After the anode lead-out line 2 is fixed so that the capacitor element 1 is aligned, the anode lead frame 3 and the anode lead-out line 2 are joined and the anode lead-out line 2 is fixed.
When the fixed size cut is performed, the anode lead wire 2 is fitted into the cut groove configured so as to gradually narrow inward from the end face of the front end portion of the anode lead frame 3, and the anode lead wire 2,
At least one of the capacitor element 1 and the anode lead frame 3 is pushed in, the cut groove is joined to the anode lead-out line (2), and the anode lead-out line 2 is cut to a fixed size by a laser. The laser welding is performed in the cut groove of the frame 3.

[0011]

According to the above manufacturing method, the anode lead frame 3
A cut groove configured to be gradually narrowed from the end face of the anode lead frame 3 is provided at the tip of the anode lead wire 2, the anode lead wire 2 is fitted into the cut groove, and the cut groove, the anode lead wire 2, the capacitor element 1 By pressing at least one of them, the positioning function of the anode lead wire 2 in the horizontal direction is provided, so that high-precision control of the element fixing pitch dimension to the metal bar 7 becomes unnecessary, and strict laser irradiation spots are required. Positioning is not required, and it is possible to easily and reliably perform fixed-size cutting and welding of the anode lead wire 2,
The welding margin can be extremely short, and a chip-shaped electronic component having an excellent volume effective utilization rate can be obtained.

In addition, the welding point between the cut groove and the anode lead wire 2 is such that the anode lead wire 2 is fitted into the cut groove, and at least one of the cut groove, the anode lead wire 2 and the capacitor element 1 is formed. Since the cut groove and the anode lead-out line 2 are melted and joined by a laser while pushing one or more in the direction of the object to be joined, positioning in the vertical direction is also possible, and the volume of the chip-shaped electronic component is reduced. For the purpose of improving the utilization rate, the anode lead wire 2 is welded in a direction substantially perpendicular to the anode lead frame 3 and a parting line of the mold, that is, a lead is formed by using a conventional mold. Since the position of the capacitor element 1 with respect to the frame can be the same as that of the conventional chip-shaped electronic component, poor appearance in which the capacitor element 1 is exposed from the plastic package occurs. Because there is no Rukoto excellent achieved yield, without further need to provide a production line to a new, can be obtained at low cost superior volume effective utilization rate of the chip electronic component described above.

[0013]

Embodiment 1 Hereinafter, an embodiment of the present invention in which a chip-shaped solid electrolytic capacitor is manufactured will be described with reference to the accompanying drawings.

FIG. 1 is a cross-sectional view showing one embodiment of a chip-shaped solid electrolytic capacitor of a chip-shaped electronic component according to the present invention, FIG. 2 is a perspective view of a main part of the capacitor in the process of being manufactured,
FIG. 3 is a front view of a main part of the capacitor during manufacture.

In FIG. 1 and FIG. 2, the capacitor element 1 has an anode body made of a valve metal having an anode lead wire 2 fixed to a metal bar 7 and a dielectric oxide film, an electrolyte layer, a carbon layer, and a cathode. The layers are sequentially formed.

On the other hand, as shown in FIG. 3, a V-shaped cut groove into which the anode lead wire 2 is fitted is provided at the tip of the anode lead frame 3.

Subsequently, as shown in FIG. 2, the anode lead frame 3 was formed into an L-shape so as to raise the front end portion where the cut groove was provided.

Next, the anode lead wire 2 is fitted into the cut groove, the anode lead wire 2 is pushed in the direction of the anode lead frame 3, and the anode lead wire 2 is cut to a fixed size by a laser to remove the metal bar 7. The anode lead wire 2 and the anode lead frame 3 were laser-welded.

In the welding, the anode lead-out wire 2 is irradiated with laser while pressing the anode lead-out wire 2 in the direction of the anode lead frame 3 so that the position of the anode lead-out wire 2 is positioned on the horizontal plane of the anode lead frame 3. The lead wire 2 and the anode lead frame 3 were melted and joined.

At this time, the anode lead wire 2 is fitted into the cut groove, and is pushed in the direction of the anode lead frame 3 so that
The position correcting action of the anode lead-out line 2 in the lateral direction was obtained, and it was possible to irradiate the laser beam onto the anode lead-out line 2 with certainty. Further, the position of the anode lead wire 2 in the vertical direction can be corrected, and the molding die for the plastic package 6 described below can be a conventional die shown in FIG. 4 as it is.

On the other hand, as shown in FIG. 8, an extremely good bonding strength between the anode lead frame 3 and the anode lead wire 2 was obtained.

Subsequently, after connecting the cathode lead frame 4 to the capacitor element 1 with a conductive adhesive 5, a plastic package 6 was molded to produce a chip-shaped solid electrolytic capacitor.

The chip-shaped solid electrolytic capacitor obtained by the above-described manufacturing method is a plastic package 6
It is possible to extremely reduce the loss volume consumed in the frame welding part and the frame forming part in the inside, and house the capacitor element 1 having a volume about 1.5 times as large as the conventional chip-shaped solid electrolytic capacitor shown in FIG. We were able to.

The cut groove at the tip of the anode lead frame 3 is gradually narrowed inward from the end face of the tip of the lead frame, such as a V-shape or a U-shape.
Should have a shape that does not rattle in the cut groove,
Also, after inserting the anode lead wire 2 into the cut groove, instead of pushing the anode lead wire 2 in the direction of the anode lead frame 3, the capacitor element 1, the anode lead wire 2, or the anode lead frame 3 is appropriately combined, and It goes without saying that the same effect can be obtained even if the member is pushed toward the part to be replaced.

In the above embodiment, the chip-shaped solid electrolytic capacitor has been described. However, the same effect can be obtained with other chip-shaped electronic components.

[0026]

According to the above-described manufacturing method, a cut groove configured to be gradually narrowed from the end surface of the anode lead frame 3 is provided at the tip of the anode lead frame 3, and the anode lead wire 2 is connected to the cut groove. By inserting at least one of the cut groove, the anode lead-out line 2 and the capacitor element 1, the positioning function of the anode lead-out line 2 in the lateral direction is provided. The laser irradiation point of the dimensional cut and the welding to the anode lead frame 3 is to easily and reliably perform the dimensional cut of the anode lead wire 2 and welding with sufficient strength without strict alignment. And the vertical position of the anode lead wire 2 with respect to the anode lead frame 3 is at least one of the cut groove, the anode lead wire 2 and the capacitor element 1 described above.
Since the cut groove and the anode lead-out line 2 are melted and joined by a laser while pushing one, the position of the anode lead frame 3 and the position of the anode lead-out line 2 in the conventional chip-shaped electronic component need to be the same. Since it is possible to use a conventional mold package molding die as it is, a chip-shaped electronic component having excellent productivity and effective volume utilization can be produced at low cost.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a chip-shaped solid electrolytic capacitor of a chip-shaped electronic component according to the present invention.

FIG. 2 is a perspective view of a main part of FIG. 1 during manufacturing.

FIG. 3 is a front view of a main part of FIG. 1 during manufacturing.

FIG. 4 is a cross-sectional view of a conventional chip-shaped solid electrolytic capacitor of a chip-shaped electronic component.

FIG. 5 is a cross-sectional view of another example of a conventional chip-shaped solid electrolytic capacitor of a chip-shaped electronic component.

FIG. 6 is a perspective view of a main part of FIG. 5 during manufacturing.

FIG. 7 is a front view of a main part in the course of manufacturing of FIG. 1;

FIG. 8 is a diagram showing the joining strength between the lead wire and the lead frame in the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 capacitor element 2 anode lead 3 anode lead frame 4 cathode lead frame 5 conductive adhesive 6 plastic package 7 metal bar

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-145310 (JP, A) JP-A-8-188601 (JP, A) JP-A-58-58721 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H01G 9/012 H01G 9/00

Claims (1)

(57) [Claims] 1. A method for manufacturing a chip-type electronic component having a capacitor element (1) having an anode lead-out line (2) and an anode lead frame (3), wherein an end surface of a tip portion of the anode lead frame (3) is provided. The anode lead-out wire (2) is fitted into a cut groove configured so as to gradually narrow inward from, and at least one of the anode lead-out wire (2), the capacitor element (1), and the anode lead frame (3) is pushed in, Joining the cut groove and the anode lead-out line (2) and cutting the anode lead-out line (2) to a fixed size with a laser; and cutting the anode lead-out line (2) with the cut groove of the anode lead frame (3). A method for manufacturing a chip-shaped electronic component, comprising a step of welding.