JPH08239278A - Brazing between silicon carbide material and metallic material - Google Patents

Brazing between silicon carbide material and metallic material

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Publication number
JPH08239278A
JPH08239278A JP4278695A JP4278695A JPH08239278A JP H08239278 A JPH08239278 A JP H08239278A JP 4278695 A JP4278695 A JP 4278695A JP 4278695 A JP4278695 A JP 4278695A JP H08239278 A JPH08239278 A JP H08239278A
Authority
JP
Japan
Prior art keywords
brazing
metal
sic
thermal expansion
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP4278695A
Other languages
Japanese (ja)
Inventor
Akira Fukushima
明 福島
Takashi Onda
孝 恩田
Tsutomu Fujiwara
力 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP4278695A priority Critical patent/JPH08239278A/en
Publication of JPH08239278A publication Critical patent/JPH08239278A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE: To lower the stress occurring on the boundary face of silicon carbide to inhibit the silicon carbide material from being cracked by inserting a specific metal of low thermal expansion between the silicon carbide material and the metallic material and brazing them. CONSTITUTION: Between a silicon carbide 1 and a metallic material 2, are placed a metal plate 7 which has low thermal expansion close to the linear thermal expansion of the silicon nitride and another soft metal 8, and additionally a brazing filler metal foil 6 30-80μm thick are placed between individual materials 1, 8, 7 and 2, and then they are brazed by heating.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は炭化珪素(SiC)部材
と金属部材のろう付方法に関し、加速管、ガスタービン
部品、原子力部品の製造に有利に適用しうるSiCのろ
う付方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a brazing method for a silicon carbide (SiC) member and a metal member, and more particularly to a SiC brazing method which can be advantageously applied to the production of acceleration tubes, gas turbine parts and nuclear parts.

【0002】[0002]

【従来の技術】従来、SiCと金属とを接合する方法と
しては以下に示す3種類の方法がある。その第1はSi
Cにメタライズ処理を施して銀ろうによりろう付する方
法であり、その第2はメタライズ処理は行わずに、活性
金属入り銀ろうによりSiCを直接接合する方法であ
り、その第3はSiCにメタライズ処理を施してSn−
Au系ろう材等の低融点ろう材にてろう付する方法であ
る。
2. Description of the Related Art Conventionally, there are the following three types of methods for joining SiC and metal. The first is Si
This is a method in which C is metallized and then brazed with silver brazing, the second is a method in which SiC is directly joined by silver brazing containing an active metal without performing metallization, and the third is metallized in SiC. Sn-
This is a method of brazing with a low melting point brazing material such as Au type brazing material.

【0003】第1のSiCにメタライズ処理を施して銀
ろうによりろう付する方法は、SiCに対しTi,M
o,Niの3層のメタライズ処理を行った後、BAg−
8ろう材(組成:Ag−28Cu、融点:約780℃)
を用いてSiCと金属とを約800℃でろう付するもの
であり、第2の活性金属入り銀ろうによりSiCを直接
接合する方法は、Ti入りBAg−8ろう材(組成:A
g−28Cu−2Ti、融点:約790℃)を用いてS
iCと金属とを約820℃でろう付するものであり、ま
たその第3のSiCにメタライズ処理を施してSn−A
u系ろう材等によりろう付する方法は、SiCに対しT
i,Mo,Niの3層のメタライズ処理を行った後、S
n−10Auろう材(融点:約250℃)を用いてSi
Cと金属とを約325℃でろう付するものである。
A method of brazing with silver brazing after metallizing the first SiC is performed by using Ti, M for SiC.
After performing the metallization treatment of three layers of o and Ni, BAg-
8 Brazing material (composition: Ag-28Cu, melting point: about 780 ° C)
Is used to braze SiC and metal at about 800 ° C., and a method of directly joining SiC with a second active-metal-containing silver braze is a Ti-containing BAg-8 brazing material (composition: A
g-28Cu-2Ti, melting point: about 790 ° C.)
iC and a metal are brazed at about 820 ° C., and the third SiC is subjected to a metallizing treatment to Sn-A.
The method of brazing with a u-based brazing material is
After performing the metallization treatment of three layers of i, Mo and Ni, S
Si using n-10Au brazing material (melting point: about 250 ° C.)
C and metal are brazed at about 325 ° C.

【0004】[0004]

【発明が解決しようとする課題】従来の方法の第1、第
2においては、ろう付温度が約800℃と高いために、
SiCの熱膨張率(5×10-6/K)とこれに接合する
金属の熱膨張率(例えば、Cuは18×10-6/K)の
差、及びろう付温度と室温との温度差に起因する過大な
熱応力がろう付温度からの冷却時に接合界面に発生し、
接合界面で剥離が生じたり、比較的もろいSiCに亀裂
が生じやすいという問題がある。また、従来の方法の第
3においては、ろう付温度が約325℃と上記の第1、
第2の方法に比べて低いために、SiC部材と金属部材
との熱膨張差が比較的小さくなることにより、SiC部
材に亀裂等が生じないが、この方法のろう材はろう材自
身の強度が低く、耐熱性に劣る(約250℃で溶融す
る)という問題があり、さらにSiCにメタライズ処理
が不可欠で、コスト高となるという問題がある。
In the first and second conventional methods, since the brazing temperature is as high as about 800 ° C.,
The difference between the coefficient of thermal expansion of SiC (5 × 10 −6 / K) and the coefficient of thermal expansion of the metal bonded to it (for example, Cu is 18 × 10 −6 / K), and the temperature difference between the brazing temperature and room temperature. Excessive thermal stress due to occurs at the joint interface during cooling from the brazing temperature,
There are problems that peeling occurs at the bonding interface and cracks are likely to occur in SiC that is relatively brittle. Moreover, in the third conventional method, the brazing temperature is about 325 ° C.
Since the difference is lower than that of the second method, the difference in thermal expansion between the SiC member and the metal member is relatively small, so that cracks and the like do not occur in the SiC member, but the brazing material of this method has the strength of the brazing material itself. Is low and the heat resistance is poor (melting at about 250 ° C.). Further, there is a problem that the metallization treatment is indispensable for SiC and the cost becomes high.

【0005】本発明は上記技術水準に鑑み、従来法にお
けるような不具合のないSiC部材と金属部材のろう付
方法を提供しようとするものである。
In view of the above-mentioned state of the art, the present invention aims to provide a brazing method for a SiC member and a metal member, which is free from the problems of the conventional method.

【0006】[0006]

【課題を解決するための手段】本発明は 炭化珪素部
材を金属部材にろう付接合する際に、炭化珪素部材と線
膨張率が近い低熱膨張金属を両者の間に挿入してろう付
することを特徴とする炭化珪素部材と金属部材のろう付
方法及び 炭化珪素部材と、該部材と線膨張率が近い
低熱膨張金属の間に、さらに軟かい金属板を挿入するこ
とを特徴とする上記記載の炭化珪素部材と金属部材の
ろう付方法である。
According to the present invention, when a silicon carbide member is brazed to a metal member, a low thermal expansion metal having a linear expansion coefficient close to that of the silicon carbide member is inserted between both members for brazing. A method of brazing a silicon carbide member and a metal member, characterized in that a softer metal plate is inserted between the silicon carbide member and a low thermal expansion metal having a linear expansion coefficient close to that of the member. This is a brazing method for a silicon carbide member and a metal member.

【0007】すなわち、本発明のSiC部材と金属部材
とのろう付法はSiC部材と金属部材の間に低熱膨張金
属を挿入して、SiC部材に発生する応力を緩衝して上
記SiC部材と金属部材をろう付するものであり、さら
に好ましくは挿入する低熱膨張金属とSiC部材の間に
も、軟かい金属を挿入してろう付するものである。
That is, according to the brazing method for the SiC member and the metal member of the present invention, a low thermal expansion metal is inserted between the SiC member and the metal member to buffer the stress generated in the SiC member and the SiC member and the metal member. A member is brazed, and more preferably, a soft metal is also inserted between the low thermal expansion metal to be inserted and the SiC member for brazing.

【0008】本発明において、SiC部材をろう付する
相手金属としては、金属材料であれば何んでもよいが、
例えば後記実施例にあげた無酸素銅のほか、ステンレス
鋼{SUS304:熱膨張率(α)=18.7×10-6
/K、SUS430:α=11.3×10-6/K}、超
合金{インコネル:α=13.0×10-6/K、ハステ
ロイX:α=13.9×10-6/K}、チタン合金{T
i−6Al−4V:α=10.3×10-6/K、純T
i:α=10.4×10-6/K}等があげられる。
In the present invention, the mating metal for brazing the SiC member may be any metallic material,
For example, in addition to oxygen-free copper given in the examples below, stainless steel {SUS304: coefficient of thermal expansion (α) = 18.7 × 10 -6
/ K, SUS430: α = 11.3 × 10 −6 / K}, superalloy {Inconel: α = 13.0 × 10 −6 / K, Hastelloy X: α = 13.9 × 10 −6 / K} , Titanium alloy {T
i-6Al-4V: α = 10.3 × 10 −6 / K, pure T
i: α = 10.4 × 10 −6 / K} and the like.

【0009】また、本発明において用いられる低熱膨張
金属はSiC部材の熱膨張率(α)に近いものが選択さ
れる。例えば純W及びその合金(α=5×10-6
K)、純Mo及びその合金(α=6×10-6/K)、純
Ta及びその合金(α=7×10 -6/K)、純Re及び
その合金(α=7×10-6/K)、純Nb及びその合金
(α=8×10-6/K)などがあげられる。
The low thermal expansion used in the present invention
The metal selected should be close to the coefficient of thermal expansion (α) of the SiC member.
Be done. For example, pure W and its alloy (α = 5 × 10-6/
K), pure Mo and its alloys (α = 6 × 10-6/ K), pure
Ta and its alloys (α = 7 × 10 -6/ K), pure Re and
The alloy (α = 7 × 10-6/ K), pure Nb and its alloys
(Α = 8 × 10-6/ K) and the like.

【0010】さらに本発明で用いられるろう材として
は、Ag−28Cu−2Ti(液相温度:790℃、ろ
う付温度:800〜900℃)、Cu−34Ti(液相
温度:875℃、ろう付温度:890〜920℃)、C
u−50Ti(液相温度:975℃、ろう付温度:99
0〜1000℃)、Cu−57Ti(液相温度:955
℃、ろう付温度:970〜990℃)、Ti−25Ni
(液相温度:942℃、ろう付温度:970〜990
℃)、Ti−15Cu−15Ni(液相温度:920
℃、ろう付温度:950〜990℃)、Ti−20Cu
−20Ni−20Zr(液相温度:800℃、ろう付温
度:820〜900℃)などがあげられるが、Ti入り
BAg−8ろう材が特に好ましい。
Further, as the brazing material used in the present invention, Ag-28Cu-2Ti (liquidus temperature: 790 ° C., brazing temperature: 800 to 900 ° C.), Cu-34Ti (liquidus temperature: 875 ° C., brazing) Temperature: 890 to 920 ° C.), C
u-50Ti (liquidus temperature: 975 ° C, brazing temperature: 99)
0 to 1000 ° C., Cu-57Ti (liquidus temperature: 955)
℃, brazing temperature: 970-990 ℃), Ti-25Ni
(Liquid phase temperature: 942 ° C., brazing temperature: 970-990
C), Ti-15Cu-15Ni (liquidus temperature: 920)
C, brazing temperature: 950-990 C), Ti-20Cu
-20Ni-20Zr (liquidus temperature: 800 ° C., brazing temperature: 820 to 900 ° C.) and the like can be mentioned, but Ti-containing BAg-8 brazing material is particularly preferable.

【0011】なお、挿入する低熱膨張金属とSiC部材
の間に挿入する金属としては銅が好ましい。
Copper is preferable as the metal to be inserted between the low thermal expansion metal and the SiC member to be inserted.

【0012】[0012]

【作用】本発明方法においては、SiC部材と金属部材
の間に低熱膨張金属を挿入してろう付することにより、
金属部材とSiC部材とのろう付時にSiC界面に発生
する熱応力を低下させ、SiC部材に亀裂等を生じるこ
とを防止する。また、本発明方法においてはメタライズ
処理を施す必要がないので、工程短縮、コスト低減が達
成できる。
In the method of the present invention, by inserting a low thermal expansion metal between the SiC member and the metal member and brazing,
The thermal stress generated at the SiC interface during brazing between the metal member and the SiC member is reduced, and cracks and the like are prevented from occurring in the SiC member. Further, in the method of the present invention, it is not necessary to perform the metallizing treatment, so that it is possible to shorten the process and reduce the cost.

【0013】さらに、本発明によって、挿入される低熱
膨張金属とSiC部材の間に銅のような軟かい金属を挿
入することによって、SiC部材に亀裂が発生するのを
一層防止することができる。
Further, according to the present invention, by inserting a soft metal such as copper between the low thermal expansion metal to be inserted and the SiC member, it is possible to further prevent the SiC member from cracking.

【0014】[0014]

【実施例】本発明の一実施例を図1及び図2により説明
する。なお、本実施例のろう付方法は図2に示す加速管
ダミーロードの製作において、無酸素銅(以下、OFC
uと略称する)製の導波管2の内面に大電力マイクロ波
吸収体として優れた作用を示すSiC製のボタン1を接
合する際に適用されたものである。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. The brazing method of the present embodiment is used in the production of the acceleration tube dummy load shown in FIG.
This is applied when the SiC button 1 that exhibits an excellent function as a high-power microwave absorber is bonded to the inner surface of the waveguide 2 made of abbreviated as u).

【0015】図1及び図2に示す本実施例のろう付方法
においては、SiCボタン1とOFCu導波管2の間に
OFCu板8と低熱膨張金属板7(例えばW:熱膨張率
5×10-6/K、Mo:熱膨張率6×10-6/K)を挿
入するとともに各部材間に厚さが30μm〜80μmの
Ti入りBAg−8ろう材箔6(組成:Ag−28Cu
−2Ti、融点:約790℃)を置いて加熱してろう付
する。ここで、ろう付温度は約820℃として5〜30
分間保持し、冷却は剥離や割れを生じないように十分ゆ
っくりと行った。
In the brazing method of this embodiment shown in FIGS. 1 and 2, the OFCu plate 8 and the low thermal expansion metal plate 7 (for example, W: thermal expansion coefficient 5 ×) are provided between the SiC button 1 and the OFCu waveguide 2. 10 −6 / K, Mo: Coefficient of thermal expansion 6 × 10 −6 / K) is inserted, and a Ti-containing BAg-8 brazing filler metal foil 6 (composition: Ag-28Cu) having a thickness of 30 μm to 80 μm between each member.
-2Ti, melting point: about 790 ° C) and heat to braze. Here, the brazing temperature is about 820 ° C. and is 5 to 30.
It was held for a minute, and cooling was performed slowly enough so as not to cause peeling or cracking.

【0016】こゝにおいて、SiCボタン1と低熱膨張
金属板7の間にOFCu板8をさらに挿入しているの
は、SiCボタン1と低熱膨張金属板(W又はMo)7
とを直接接合した場合には低靱性のSiCボタン1に僅
かな熱膨張差によっても亀裂が生じる場合があるので、
これを防止するために軟かい金属板、すなわちOFCu
板8を挿入したものであり、実操業においてはこのよう
にすることが好ましい。すなわち、本発明においては、
低熱膨張金属はSiC部材と金属の間の大きな熱膨張差
による応力を緩和するものであり、軟かい金属はSiC
部材と低熱膨張金属の間の小さい熱応力を緩衝するもの
である。
Here, the OFCu plate 8 is further inserted between the SiC button 1 and the low thermal expansion metal plate 7 because the SiC button 1 and the low thermal expansion metal plate (W or Mo) 7 are inserted.
When the and are directly joined, a crack may occur in the low toughness SiC button 1 due to a slight difference in thermal expansion.
To prevent this, a soft metal plate, namely OFCu
The plate 8 is inserted, and this is preferable in actual operation. That is, in the present invention,
The low thermal expansion metal relaxes stress due to a large thermal expansion difference between the SiC member and the metal, and the soft metal is SiC.
It absorbs a small thermal stress between the member and the low thermal expansion metal.

【0017】本実施例のろう付法による接合において
は、低熱膨張金属板7がSiCボタン1とOFCu導波
管2の熱膨張差に起因する熱応力を緩衝して、接合部で
の熱応力を下げ、SiCボタン1の割れの発生を防ぐ。
これにより高強度かつ耐熱性を有する良好なろう付品質
が得られ、接合界面での剥離が生じなかった。
In the joining by the brazing method of this embodiment, the low thermal expansion metal plate 7 buffers the thermal stress caused by the difference in thermal expansion between the SiC button 1 and the OFCu waveguide 2, and the thermal stress at the joint is increased. To prevent the SiC button 1 from cracking.
As a result, good brazing quality having high strength and heat resistance was obtained, and peeling did not occur at the joint interface.

【0018】本実施例のろう付方法が適用されて製作さ
れた加速管ダミーロードは加速管に生じる不用の大電力
マイクロ波3をSiCボタン1が吸収して熱エネルギに
変換し、変換された熱エネルギはOFCu導波管2を介
して水冷ジャケット4内を流れる冷却水5に伝達されて
除去されるものである。そのため、上記SiCボタン1
とOFCu導波管2の接合部の温度は約100℃に維持
される。この状態で加速管ダミーロードを長時間使用し
たが、SiCボタン1の亀裂や接合部の剥離等の欠陥が
上記加速管ダミーロードには全く生じなかった。
In the acceleration tube dummy load manufactured by applying the brazing method of this embodiment, the SiC button 1 absorbs the unnecessary high-power microwave 3 generated in the acceleration tube and converts it into heat energy. The thermal energy is transferred to the cooling water 5 flowing in the water cooling jacket 4 via the OFCu waveguide 2 and removed. Therefore, the SiC button 1 above
The temperature of the junction between the and the OFCu waveguide 2 is maintained at about 100 ° C. Although the acceleration tube dummy load was used for a long time in this state, defects such as cracks in the SiC button 1 and peeling of the joint portion did not occur at all in the acceleration tube dummy load.

【0019】[0019]

【発明の効果】本発明のSiCのろう付方法はSiC部
材と金属部材の間に低熱膨張金属を挿入することにより
SiC界面に発生する応力を低下させ、SiC部材に亀
裂等を発生させることがない。
The method for brazing SiC according to the present invention can reduce the stress generated at the SiC interface by inserting a low thermal expansion metal between the SiC member and the metal member and cause cracks or the like in the SiC member. Absent.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例のろう付方法の説明図。FIG. 1 is an explanatory diagram of a brazing method according to an embodiment of the present invention.

【図2】本発明の一実施例のろう付方法が適用される加
速管ダミーロードの説明図。
FIG. 2 is an explanatory diagram of an acceleration tube dummy load to which the brazing method according to the embodiment of the present invention is applied.

フロントページの続き (72)発明者 藤原 力 愛知県名古屋市港区大江町10番地 三菱重 工業株式会社名古屋航空宇宙システム製作 所内Front page continuation (72) Inventor Riki Fujiwara 10 Oemachi, Minato-ku, Nagoya, Aichi Mitsubishi Heavy Industries, Ltd. Nagoya Aerospace Systems Works

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 炭化珪素部材を金属部材にろう付接合す
る際に、炭化珪素部材と線膨張率が近い低熱膨張金属を
両者の間に挿入してろう付することを特徴とする炭化珪
素部材と金属部材のろう付方法。
1. When a silicon carbide member is brazed to a metal member, a low thermal expansion metal having a linear expansion coefficient close to that of the silicon carbide member is inserted between both members for brazing. And brazing method for metal members.
【請求項2】 炭化珪素部材と、該部材と線膨張率が近
い低熱膨張金属の間に、さらに軟かい金属板を挿入する
ことを特徴とする請求項1記載の炭化珪素部材と金属部
材のろう付方法。
2. The silicon carbide member and the metal member according to claim 1, wherein a softer metal plate is inserted between the silicon carbide member and the low thermal expansion metal having a linear expansion coefficient close to that of the member. Brazing method.
JP4278695A 1995-03-02 1995-03-02 Brazing between silicon carbide material and metallic material Withdrawn JPH08239278A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4278695A JPH08239278A (en) 1995-03-02 1995-03-02 Brazing between silicon carbide material and metallic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4278695A JPH08239278A (en) 1995-03-02 1995-03-02 Brazing between silicon carbide material and metallic material

Publications (1)

Publication Number Publication Date
JPH08239278A true JPH08239278A (en) 1996-09-17

Family

ID=12645654

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4278695A Withdrawn JPH08239278A (en) 1995-03-02 1995-03-02 Brazing between silicon carbide material and metallic material

Country Status (1)

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