JPS6090879A - Ceramic and metal bonding method - Google Patents

Ceramic and metal bonding method

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Publication number
JPS6090879A
JPS6090879A JP19922883A JP19922883A JPS6090879A JP S6090879 A JPS6090879 A JP S6090879A JP 19922883 A JP19922883 A JP 19922883A JP 19922883 A JP19922883 A JP 19922883A JP S6090879 A JPS6090879 A JP S6090879A
Authority
JP
Japan
Prior art keywords
ceramic
metal
insert material
treatment
joining
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19922883A
Other languages
Japanese (ja)
Inventor
深谷 保博
章三 平井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Heavy Industries Ltd
Original Assignee
Mitsubishi Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Heavy Industries Ltd filed Critical Mitsubishi Heavy Industries Ltd
Priority to JP19922883A priority Critical patent/JPS6090879A/en
Publication of JPS6090879A publication Critical patent/JPS6090879A/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【発明の詳細な説明】 本発明は、セラミックと金属を接合する方法に関し、特
にセラミックの割れを防止して金属と接合することので
きる方法に関する。
DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for joining ceramics and metals, and particularly to a method that can prevent ceramics from cracking and join them to metals.

従来、セラミックと金属の接合方法として、(1)接着
剤法、(2)メタライジング法、(3)溶射法等が知ら
れているが、それぞれ次のような欠点がある。
Conventionally, as methods for joining ceramics and metals, (1) an adhesive method, (2) a metallizing method, and (3) a thermal spraying method are known, but each has the following drawbacks.

(1)接着剤法は最も簡便々方法であるが、高温におけ
る接着強度が低い。
(1) The adhesive method is the simplest method, but has low adhesive strength at high temperatures.

(2) メタライジング法はM□ 、 Mo−Mn等の
金属粉末をセラミック上にメタライジングし、その上に
N1 メッキを施した後、ろう付で金属と接合するとい
った方法であるが、セラミックの種類によって適用が難
しい欠点がある。
(2) The metallizing method involves metallizing metal powder such as M□, Mo-Mn, etc. on ceramic, applying N1 plating on top of it, and then joining it to the metal by brazing. Some types have drawbacks that make them difficult to apply.

(3) 溶射法はセラミック粉末を溶融し、金属に吹き
つけて接着させるが、接合強度が低く、セラミックが多
孔質になるという欠点がある。
(3) Thermal spraying melts ceramic powder and sprays it onto metal to bond it, but it has the drawbacks of low bonding strength and the ceramic becoming porous.

この様に従来法では接合強度が低く、適用セラミック材
質に制約がある等の欠点がおった。
As described above, the conventional method has drawbacks such as low bonding strength and restrictions on the ceramic material that can be used.

本発明は、斯る欠点を排除するためになされたもので、
81sN4.810系セラミツクと金属を接合する方法
において、前記セラミックにN1、N1 を50%以上
含有するN1 合金、Ou、Ouを50−以上含有する
Ou 合金のいずれか1つをインサート材としてイオン
ブレーティング又は溶射法で密着固定した後、加熱反応
促進処理して両者を強固に冶金的接合させ、次いで該イ
ンサート材面と前記金属とを該インサート材の融点よシ
低い融点をもつろう材を用いてろう付することを特徴と
するセラミックと金属を接合する方法に関するものであ
る。
The present invention was made to eliminate such drawbacks.
81sN4. In the method of joining metal to 810 series ceramic, one of N1, an N1 alloy containing 50% or more of N1, Ou, an Ou alloy containing 50% or more of O, is added to the ceramic as an ion beam as an insert material. After closely fixing them by rating or thermal spraying, heat reaction acceleration treatment is performed to firmly bond them metallurgically, and then the insert material surface and the metal are bonded using a brazing filler metal whose melting point is lower than that of the insert material. The present invention relates to a method for joining ceramic and metal, which is characterized by brazing.

本発明方法によれば、セラミックと金属を良好に接合し
、且つセラミックの接合で常に問題となるセラミックの
割れ防止に極めて有効である。
According to the method of the present invention, it is extremely effective in bonding ceramic and metal well and in preventing cracking of ceramic, which is always a problem in bonding ceramics.

本発明は、ガスタービン部品、車両部品、その他各種の
ものに適用でき、例えば、セラミックと金属の平面重ね
継手溶接はもとより、スリーブ継手溶接、金属内筒の内
外面へのセラミック溶接、その他複雑形状の接合に適用
できる。
The present invention can be applied to gas turbine parts, vehicle parts, and various other items, such as welding of flat lap joints between ceramic and metal, sleeve joint welding, ceramic welding to the inner and outer surfaces of metal inner cylinders, and other complex shapes. Applicable to joining.

第1図(A)〜(C)は本発明方法の一実施態様例を工
程順に示す図である。
FIGS. 1(A) to 1(C) are diagrams showing an embodiment of the method of the present invention in order of steps.

図中、1はSi3N、 、 SiO系セラミック、2は
接合金属、5はN1 又はN1 を50チ以上含有する
N1 合金(例えば、Ni−0r 、 Ni −Ou 
、 N1−P 。
In the figure, 1 is Si3N, SiO-based ceramic, 2 is a joining metal, and 5 is N1 or an N1 alloy containing 50 or more units of N1 (e.g., Ni-0r, Ni-Ou
, N1-P.

N1−B 、 Ni−0r−B等)又はOu 又はOu
 を504以上含有するOu 合金(例えば、ou−p
、 0u−Ni 。
N1-B, Ni-0r-B, etc.) or Ou or Ou
Ou alloy containing 504 or more (for example, ou-p
, 0u-Ni.

0u−At 、 Nu−Zn 、0u−8i 等) +
7)f 7f−)材、4はインサート材の融点より低融
点のろう材(ハンダ、At ろう、Ag ろう、au 
ろう、N1ろう等)である。
0u-At, Nu-Zn, 0u-8i, etc.) +
7) f 7f-) material, 4 is a brazing material whose melting point is lower than that of the insert material (solder, At wax, Ag wax, au
wax, N1 wax, etc.).

先ず、第1図(A)において、セラミック1上にインサ
ート金属5をイオングレーライングまたは溶射し、サブ
アセンブリを作る。次いで、第1図(B)において、ア
センブリを加熱反応促進処理したあと、第1図(0)に
おいて接合金M2とろう材4でろう付する。
First, in FIG. 1(A), an insert metal 5 is ion-grayed or thermally sprayed onto a ceramic 1 to form a subassembly. Next, in FIG. 1(B), the assembly is subjected to heating reaction acceleration treatment, and then, in FIG. 1(0), it is brazed with the joining metal M2 and the brazing material 4.

その際、第1図(A)のイオングレーティングは、イン
サート材5がN1 又はCu の単金属の場合はるつぼ
一個で、N1 金属又はOu 合金の場合は構成元素を
各々別個のるつぼで蒸発させ、既知のイオンブレーティ
ング施工条件で行い、セラミック1上に密着固定させる
。一方、溶射の場合は、プラズマ溶射等を採用するが、
その際は非酸化雰囲気中で上記インサート材5を浴射し
、セラミック1上に密着固定させる。
At that time, the ion grating shown in FIG. 1(A) is produced by evaporating the constituent elements in one crucible when the insert material 5 is a single metal of N1 or Cu, and in the case of an N1 metal or an O alloy, each constituent element is evaporated in a separate crucible. It is carried out under known ion blating construction conditions and is tightly fixed onto the ceramic 1. On the other hand, in the case of thermal spraying, plasma spraying etc. are used.
At that time, the insert material 5 is sprayed in a non-oxidizing atmosphere to tightly fix it on the ceramic 1.

第1図(B)の加熱反応促進処理はイオンブレーティン
グ又は溶射されたインサート材5とセラミック1の接合
強度を上昇させるために行うもので、インサート材の融
点の115以上の温度(上限はインサートの融点)で不
活性ガス又は真空中で5分以上加熱する。また、熱間静
水圧加圧処理(以下、H工P処理)を行うこともでき、
その際は上記温度、時間で、Ar 等のガス圧CL 0
1 kg/wm”以上を負荷する。
The heating reaction acceleration treatment shown in Fig. 1 (B) is performed to increase the bonding strength between the insert material 5 and the ceramic 1, which have been ion-blated or thermally sprayed. (melting point) for at least 5 minutes in an inert gas or vacuum. In addition, hot isostatic pressure treatment (hereinafter referred to as H-P treatment) can also be performed,
In that case, at the above temperature and time, the gas pressure of Ar etc. CL 0
Load more than 1 kg/wm.

尚、温度をインサート材の融点の15以上とするのは、
これ以下ではインサート材とセラミックの接合反応が極
めて緩やかで長時間の処理が必要となり、工業的に好ま
しくないためである。上限はインサート材が溶融すると
流出してしまうため、その防止の点よりインサート材の
融点以下としている。
In addition, setting the temperature to 15 or more of the melting point of the insert material is
This is because if it is less than this, the bonding reaction between the insert material and the ceramic will be extremely slow, requiring a long treatment time, which is not industrially preferable. The upper limit is set below the melting point of the insert material to prevent it from flowing out when it melts.

処理時間を5分以上とするのは、5分以下では同様にイ
ンサート材とセラミックの接合が不十分であるためであ
る。
The reason why the treatment time is set to 5 minutes or more is because if the treatment time is 5 minutes or less, the bonding between the insert material and the ceramic is similarly insufficient.

次に、第1図(0)のろう付であるが、インサート材3
の融点よシ低融点のろう材4を用い、インサート材と接
合金属2をろう付する。低融点のろう材(4を用いるの
は、ろう付施工時にセラミック1と接合金属2間の熱膨
張係数差によシ発生する熱応力を小さくし、セラミック
1の割れを防止するためである。
Next, as shown in Fig. 1 (0), the insert material 3 is brazed.
The insert material and the joining metal 2 are brazed using a brazing filler metal 4 having a melting point lower than that of . The reason why the low melting point brazing filler metal (4) is used is to reduce the thermal stress generated due to the difference in thermal expansion coefficient between the ceramic 1 and the joining metal 2 during brazing, and to prevent the ceramic 1 from cracking.

以上詳述した本発明方法による作用効果′f:まとめる
と、次の通りである。
The effects 'f' of the method of the present invention detailed above are summarized as follows.

(Il 811N4 、 EIIOと金属は物質構造が
異なるため(1llt、N4. B10は共有結合金I
JJ4は金属結合)、その接合は極めて困難を伴う。
(Il 811N4, EIIO and metal have different material structures (1llt, N4. B10 is a covalent gold I
JJ4 is a metal bond), and its bonding is extremely difficult.

本発明はインサート材としてNl 、 Nj金合金Ou
 、 Ou 合金を用いることにより、S’1N4s8
10と本インサート材がすぐれた冶金的接合性を示し、
良好な継手を得ることができる。
The present invention uses Nl and Nj gold alloys Ou as insert materials.
, By using Ou alloy, S'1N4s8
10 and this insert material shows excellent metallurgical bonding properties,
A good joint can be obtained.

即ち、8i、N、 、 810には遊離81 が存在す
るが、その81 とMl、 Ml 合金、cu、cu金
合金高温高圧下で互いに拡散すると共に、SlはMl 
、 N1 合金、au、cu 合金中に固溶しく Hl
 中の81 およびOu 中の81 の固静度はいずれ
も常温において約5 wt%ある)、脆化層を生成せず
、良好な継手を生成する。
That is, free 81 exists in 8i, N, , 810, but 81 and Ml, Ml alloy, cu, cu gold alloy diffuse into each other under high temperature and high pressure, and Sl and Ml
, N1 alloy, au, cu alloy as solid solution Hl
The stiffness of 81 in O and 81 in O are both about 5 wt% at room temperature), and they do not form a brittle layer and produce a good joint.

一方、インサート材のN4 、 N4 合金、at、。On the other hand, the insert material N4, N4 alloy, at.

Ou 合金と接合金属2はいずれも金属でちゃ、その溶
接性は基本的に極めてすぐれておシ、良好な継手を形成
する。
Since the Ou alloy and the joining metal 2 are both metals, their weldability is basically extremely good and a good joint is formed.

(2) 本発明は本インサート材を先ずイオンブレーテ
ィング又は溶射によシセラミックに密着せしめるが、イ
オンブレーティング、溶射を採用することによシ、セラ
ミックの形状が如何に複雑でも、これにインサート材を
密着固定することができる(箔等では困lI)。
(2) In the present invention, the present insert material is first brought into close contact with the ceramic by ion blasting or thermal spraying, but by employing ion blasting or thermal spraying, no matter how complex the shape of the ceramic, the insert material can be attached to the ceramic. Materials can be tightly fixed (it is difficult to use foil etc.).

(3)本発明は上記(2)の後に加熱反応促進処理(前
述した加熱処理またはH工P処理)を行うが、これによ
シ、下記のような作用効果がある。
(3) In the present invention, after the above-mentioned (2), a heating reaction acceleration treatment (the above-mentioned heating treatment or H-P treatment) is performed, which has the following effects.

■ 81.N4. SiOに含有される81 とインサ
ート材が高温加熱によシ十分拡散し、冶金的接合が成就
する。特に、H工P処理を行う際は圧力負荷(3次元の
ガス圧負荷)により、本インサート材のセラミック界面
での微少ボイド(イオンブレーティング又は溶射時に生
成する微少ボイド)をクリープ変形および塑性変形で消
滅させ、接合性をよシ高める。
■ 81. N4. 81 contained in SiO and the insert material are sufficiently diffused by high-temperature heating, and metallurgical bonding is achieved. In particular, when performing H-P treatment, the pressure load (three-dimensional gas pressure load) is used to remove creep deformation and plastic deformation of minute voids (minute voids generated during ion blasting or thermal spraying) at the ceramic interface of this insert material. to extinguish it and improve zygosity.

■ セラミックの形状が如何に複雑でもH工P処理が可
能で、本インサート材をセラミックに冶金的拡散反応で
強固に接合しうる。
(2) No matter how complicated the shape of the ceramic is, H-P treatment is possible, and this insert material can be firmly bonded to the ceramic through a metallurgical diffusion reaction.

即ち、H工P処理の場合においては、高温でガス圧が5
次元に均等にかかるため、セラミック界面が如何に複雑
でも施工が可能で、ツクの割れが全く生じないしく一次
元加圧の場合は、偏加圧が発生しやすく、緻密な施工管
理を行って靭性のないセラミックの割れを防止する必要
がある)、また単なる加熱処理は当然加圧しないので、
当該セラミック割れの懸念はない。更に、インサート材
は溶融させないので、インサート材厚に大きな減肉がな
いという利点も有している。
In other words, in the case of H-P treatment, the gas pressure is 5 at high temperature.
Because the pressure is applied evenly across all dimensions, it can be applied no matter how complex the ceramic interface is, and no cracks will occur.If pressure is applied in one dimension, uneven pressure tends to occur, so careful construction management is required. It is necessary to prevent cracking of ceramics that lack toughness), and since mere heat treatment does not naturally apply pressure,
There is no concern about ceramic cracking. Furthermore, since the insert material is not melted, there is also the advantage that there is no large reduction in the thickness of the insert material.

(4)上記の(3)で、加熱反応促進処理されたサブア
センブリのインサート材面と接合金属を、インサート材
の融点よシ低い融点を持つろう材を用いて、ろう付し、
接合を完了するが、この際の作用効果として以下の事項
が皐げられる。
(4) In (3) above, the surface of the insert material of the subassembly subjected to the heat reaction acceleration treatment and the joining metal are brazed using a brazing material having a melting point lower than that of the insert material,
Although the joining is completed, the following effects are noted at this time.

■ 一般に、セラミック1と接合金属2は両者の熱膨張
係数差によシ、接合後の冷却過程で発生する熱応力でセ
ラミックに割れを発生する。これに対し、本発明は低融
点ろう材を用いることによシ、冷却温度幅が減少し、発
生熱応力を低減せしめて、セラミックの割れ防止効果が
著しい。
(2) Generally, due to the difference in thermal expansion coefficient between the ceramic 1 and the bonding metal 2, cracks occur in the ceramic due to thermal stress generated during the cooling process after bonding. In contrast, in the present invention, by using a low melting point brazing filler metal, the cooling temperature range is reduced, the generated thermal stress is reduced, and the effect of preventing ceramic cracking is remarkable.

■ インサート材と接合金属2はいずれも金属であシ、
当然ながら金属間の溶接は基本的に極めてすぐれており
、前述のろう材を用いて良好な継手を形成することがで
きる。
■ Insert material and bonding metal 2 are both metal,
Naturally, metal-to-metal welding is basically very good, and good joints can be formed using the aforementioned filler metals.

実施例1 板厚2111+の8j、N4中にN1 を20μイオン
ブレーテイングしたあと、温度1200℃、Arガス圧
20kg/sw”、処理時間50分のHIP処理を行っ
た。次いで、接合金属である板厚3101の8841板
を、上記Ni 面と対向させ、その間をAg ろうを用
い、ろう付温度850℃、ろう何時間10分でAr 雰
囲気でろう付した。
Example 1 8J with a plate thickness of 2111+ was ion blasted with 20μ of N1 in N4, and then subjected to HIP treatment at a temperature of 1200°C, an Ar gas pressure of 20kg/sw'', and a treatment time of 50 minutes.Next, the bonding metal An 8841 plate having a thickness of 3101 mm was placed opposite the above Ni surface, and brazed therebetween using Ag solder in an Ar atmosphere at a brazing temperature of 850° C. for several hours and 10 minutes.

その結果、8i、N4に割れ発生がなく、全面に亘って
非接合部のない良好な継手が得られた。
As a result, a good joint with no cracks in 8i and N4 and no non-bonded parts over the entire surface was obtained.

実施例2 10日φ×20■長さのSi3N、丸棒にその外面にN
i−50tS%Ou i50 /Jイオンプレーテイン
クしたあと、温度1050℃、Ar ガス圧20に9/
■冨、処理時間15分のH工P処理を行った。次いで、
接合金属である内径1α25鱈φ、外径16.25mφ
、20目長さのコバール円筒に、ペースト状Ag ろう
を塗布した上記Si、N、丸棒を挿入し、ろう付温度8
00℃、ろう何時間10分で、Ar 雰囲気でろう付し
た。
Example 2 Si3N with a length of 10 days φ x 20 mm, N on the outer surface of a round bar
After i-50tS%Ou i50 /J ion plate ink, the temperature was 1050℃ and the Ar gas pressure was 20℃.
■Tofu, H-P treatment was performed for 15 minutes. Then,
Welding metal: inner diameter 1α25mmφ, outer diameter 16.25mφ
The Si, N, round rod coated with paste-like Ag solder was inserted into a Kovar cylinder with a length of 20 mm, and the brazing temperature was 8.
Brazing was performed at 00°C for 10 minutes in an Ar atmosphere.

その結果、813N4に割れ発生がなく、円筒継手金面
に亘って非接合部のない良好な継手が得られた。
As a result, there was no cracking in 813N4, and a good joint with no non-bonded parts over the metal surface of the cylindrical joint was obtained.

実施例3 内径20■φ、外径25簡φ、長さ50mのSiC円筒
にその外径表面にNi−15%Or−!i、5%B合金
を10μイオンプレーテイ/グしたあと、温度1000
℃、Ar ガス圧20に97m”、処理時間10分のH
工P処理を行った。次いで、接合金属である内径25.
25+o+φ、外径4525覇φ、長さ50鱈のAt 
円筒に、ノーンダ(5n−Pb−Zn系)を塗布した上
記s1c円筒を挿入し、ノ・ンダ付温度550℃、時間
1分でノ・ンダ付した。
Example 3 A SiC cylinder with an inner diameter of 20 mm, an outer diameter of 25 mm, and a length of 50 m was coated with Ni-15% Or-! on its outer diameter surface. i. After 5% B alloy was plated with 10μ ions, the temperature was 1000.
℃, Ar gas pressure 20 to 97 m'', processing time 10 minutes H
Processing was performed. Next, the inner diameter 25. which is the joining metal.
25+o+φ, outer diameter 4525cmφ, length 50mm At
The above s1c cylinder coated with solder (5n-Pb-Zn system) was inserted into the cylinder, and soldered at a soldering temperature of 550° C. for 1 minute.

その結果、slcに割れ発生がなく、円筒継手全面に亘
って非接合部のない良好な継手が得られた。
As a result, a good joint with no cracks in the slc and no non-bonded parts over the entire surface of the cylindrical joint was obtained.

実施例4 内径20mφ 、外径25w+Iφ、長さ20.のs、
lc円筒にその外径表面にcu−10% Az合金を1
00μプラズマ溶射したあと、Ar 雰囲気中で温度1
000℃、時間60分の加熱反応処理を行った。次いで
、接合金属である内径25.25蝉φ、外径45.25
畷φ、長さ20■のAt 円筒(内面にAt ろう(A
z−sI系)を塗布)に前記SaC円筒を挿入し、ろう
付温度600℃、時間2分で真空ろう付した。
Example 4 Inner diameter 20mφ, outer diameter 25w+Iφ, length 20. s,
Cu-10% Az alloy is applied to the outer diameter surface of the LC cylinder.
After 00μ plasma spraying, the temperature was 1 in an Ar atmosphere.
A heating reaction treatment was performed at 000° C. for 60 minutes. Next, welded metal with an inner diameter of 25.25 mm and an outer diameter of 45.25 mm.
At cylinder with ridge φ and length 20mm (with At wax on the inner surface)
The SaC cylinder was inserted into the sample (coated with z-sI system) and vacuum brazed at a brazing temperature of 600° C. for 2 minutes.

その結果、slaに割れ発生がなく、円筒継手全面に亘
って非接合部のない良好な継手が得られた。
As a result, a good joint was obtained with no cracking in the sla and no non-bonded parts over the entire surface of the cylindrical joint.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(A)〜(0)は本発明方法の一実施態様例を工
程順に示す図である。 復代理人 内 1) 明 復代理人 萩 原 亮 −
FIGS. 1(A) to 1(0) are diagrams showing an embodiment of the method of the present invention in order of steps. Sub-agents 1) Meifuku agent Ryo Hagiwara -

Claims (1)

【特許請求の範囲】[Claims] 811N4.810系セラミツクと金属を接合する方法
において、前記セラミック11(Ml、N1 を50−
以上含有するN1 合金、Ou ’% Ou を50チ
以上含有するOu 合金のいずれか1つをインサート材
としてイオンブレーティング又は溶射法で密着固定した
後、加熱反応促進処理して両者を強固に冶金的接合させ
、次いで該インサート材面と前記金属とを該インサート
材の融点より低い融点をもつろう材を用いてろう付する
ことを特徴とするセラミックと金J4を接合する方法。
811N4. In the method of joining 810 series ceramic and metal, the ceramic 11 (Ml, N1 is 50-
After closely fixing either the N1 alloy containing the above or the Ou alloy containing Ou '% Ou of 50 or more as an insert material by ion blasting or thermal spraying, heat reaction acceleration treatment is performed to firmly bond both metallurgically. A method for joining ceramic and gold J4, characterized in that the surfaces of the insert material and the metal are then brazed using a brazing material having a melting point lower than the melting point of the insert material.
JP19922883A 1983-10-26 1983-10-26 Ceramic and metal bonding method Pending JPS6090879A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19922883A JPS6090879A (en) 1983-10-26 1983-10-26 Ceramic and metal bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19922883A JPS6090879A (en) 1983-10-26 1983-10-26 Ceramic and metal bonding method

Publications (1)

Publication Number Publication Date
JPS6090879A true JPS6090879A (en) 1985-05-22

Family

ID=16404277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19922883A Pending JPS6090879A (en) 1983-10-26 1983-10-26 Ceramic and metal bonding method

Country Status (1)

Country Link
JP (1) JPS6090879A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183179A (en) * 1985-02-06 1986-08-15 株式会社東芝 Method of joining silicon nitride ceramic to metal
US4730765A (en) * 1984-12-06 1988-03-15 Tomlinson Peter N Method of bonding by use of a phosphorus containing coating
JPS63103874A (en) * 1986-10-21 1988-05-09 北海道 Method of joining metal to ceramic with flame spaying film
US4801067A (en) * 1986-08-29 1989-01-31 Ngk Spark Plug Co., Ltd. Method of connecting metal conductor to ceramic substrate
US4942999A (en) * 1987-08-31 1990-07-24 Ngk Insulators, Inc. Metal-ceramic joined composite bodies and joining process therefor
JPH0333090A (en) * 1989-06-27 1991-02-13 Toshiba Tungaloy Co Ltd Composite chip made of ceramics for circular saw blade and production thereof
US5035959A (en) * 1987-04-20 1991-07-30 Ngk Spark Plub Co., Ltd. Steel body having ceramic tip soldered thereto

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4730765A (en) * 1984-12-06 1988-03-15 Tomlinson Peter N Method of bonding by use of a phosphorus containing coating
JPS61183179A (en) * 1985-02-06 1986-08-15 株式会社東芝 Method of joining silicon nitride ceramic to metal
JPH0329028B2 (en) * 1985-02-06 1991-04-22 Tokyo Shibaura Electric Co
US4801067A (en) * 1986-08-29 1989-01-31 Ngk Spark Plug Co., Ltd. Method of connecting metal conductor to ceramic substrate
JPS63103874A (en) * 1986-10-21 1988-05-09 北海道 Method of joining metal to ceramic with flame spaying film
JPH0455147B2 (en) * 1986-10-21 1992-09-02 Hokkaido
US5035959A (en) * 1987-04-20 1991-07-30 Ngk Spark Plub Co., Ltd. Steel body having ceramic tip soldered thereto
US4942999A (en) * 1987-08-31 1990-07-24 Ngk Insulators, Inc. Metal-ceramic joined composite bodies and joining process therefor
JPH0333090A (en) * 1989-06-27 1991-02-13 Toshiba Tungaloy Co Ltd Composite chip made of ceramics for circular saw blade and production thereof

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