JPH08235530A - Production of thin-film magnetic head device - Google Patents

Abstract

PURPOSE: To prevent the chipping of thin-film magnetic head elements in a grinding and cutting stage, to assure a cutting speed and to improve productiv ity. CONSTITUTION: After the plural thin-film magnetic head elements are formed on one main surface of a substrate, this substrate is cut to form a row bar 13 in which the plural thin-film magnetic head elements line up in one row in the track width direction of the magnetic gaps. Next, this low bar 13 is fixed to a jig 14 with the surface exclusive of the one main surface 13a formed with the thin-film magnetic head elements as an placing surface and thereafter, dummy bars 16 are arranged on the one main surface 13a formed with the thin-film magnetic head elements at the time of grinding and cutting the row bar 13 by a grinding wheel 26a in correspondence to the individual thin-film magnetic head elements.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a thin film magnetic head device. More specifically, by arranging a dummy member on the thin film magnetic head element formation surface, chipping of the thin film magnetic head element in the grinding and cutting process is prevented, the grinding speed is secured, and the productivity of the thin film magnetic head device is improved. It relates to a manufacturing method.

[0002]

2. Description of the Related Art For example, a magnetic head device used in a magnetic recording / reproducing apparatus such as a hard disk drive for recording / reproducing information on / from a hard disk is constructed by mounting a magnetic head element for recording / reproducing information on a slider. It is what is done.

The slider contacts the surface of the hard disk when recording / reproducing is not performed, and when the information is recorded / reproduced, the slider is lifted by an upward lift caused by an air flow generated by the rotation of the hard disk. Further, the slider will slide on the hard disk immediately after the start operation and immediately after the stop operation.

Therefore, in the slider as described above, a protrusion or a groove is provided on the surface facing the hard disk to shorten the sliding time with the hard disk, improve the durability, and adjust the upward lift force received by the slider. Then
The slider ascent distance is adjusted.

In the above slider, for example, rail processing is performed on the hard disk facing surface side to project and form a slider rail which is a projecting portion having a substantially rectangular cross section, and the air flow generated on the hard disk surface is formed on the hard disk facing surface of the slider rail. The air bearing that is the receiving surface
As a surface, a groove portion called an air groove into which an air flow flows is provided between the slider rails to adjust the slider flying distance. The formation of such protrusions and grooves is performed by machining.

In the above magnetic head device, a thin film magnetic head element has been used as a magnetic head element. The thin-film magnetic head element is a vacuum thin-film forming technique such as vapor deposition or sputtering of a magnetic thin film or a conductor coil forming a magnetic circuit section, photoengraving,
It is formed by using a method such as etching.

The thin film magnetic head device as described above is manufactured through the following steps, for example. That is, first, the thin film magnetic head element is formed on the substrate made of the slider constituent material by the above-described means, and a so-called wafer is formed. Next, the wafer is cut into blocks in which a plurality of thin film magnetic head elements are arranged in a line in the track width direction of these magnetic gaps to form so-called row bars. At this time, the wafer may be cut after cutting and removing various thin films on the cutting line.

Next, the row bar is fixed to a jig with a surface other than the thin film magnetic head element forming surface as a mounting surface. Next, the surface of the row bar thin film magnetic head element facing the magnetic gap is ground to roughly regulate the depth length of the magnetic gap.

Next, a slider rail is formed by grooving the surface facing the hard disk, which is the surface facing the magnetic gap of the low-bar thin film magnetic head element.

Next, the row bar is cut by grinding corresponding to each thin film magnetic head element to form a plurality of thin film magnetic head devices in which the thin film magnetic head element is mounted on the slider.

Further, the surface of each of the plurality of thin film magnetic head devices facing the magnetic gap is polished to regulate the depth length of the magnetic gap to a predetermined length.

Then, the slider rail end portion of the slider of the thin film magnetic head device is tapered.

Next, a groove is formed between the slider rails of the slider of the thin film magnetic head device to form an air groove, which is then removed from the jig to complete the thin film magnetic head device.

[0014]

When the thin film magnetic head device is formed as described above, various cutting processes and various grooving processes are mechanically performed using a rotating grindstone.

However, at the time of processing using the above-mentioned rotary grindstone, chipping (chipping) is likely to occur at the end of the workpiece, resulting in a reduction in manufacturing yield. The chipping as described above is particularly likely to occur in the step of cutting the row bar into a plurality of thin film magnetic head devices.

In the above cutting step, the row bar is ground and cut in the gap length direction of the magnetic gap in order to cut the row bar corresponding to each thin film magnetic head element. That is, in this step, as shown in FIGS. 19 and 20, the grinding depth L ₂ of the rotary grindstone 101 is set to the low bar 1
It is necessary to make it deeper than the height L ₁ of the magnetic gap of _No. 02 in the depth length direction, and the resistance during grinding is often greater than the resistance during the grooving process.

In the cutting step, the row bar 102 is placed on the jig 106 as described above, and the jig 106 is placed at the cutting position of the row bar 102 at the grinding depth L _2. Has a relief groove 107 for cutting.

The rotary grindstone 101 is a low bar 1
No. 02 is the upper surface in the film thickness direction of the thin film portion 104 on which the thin film magnetic head element 103 is formed, and normally, the film surface 104a on which the protective film is formed is penetrated and cut in the horizontal direction.

At this time, the film surface 10 of the thin film portion 104.
Ends 104b, 104 contacting the rotary grindstone 101 of 4a
C, 104d, and 104e correspond to the grinding start portion, and a large grinding resistance is applied.

Further, the rotary grindstone 101 is suitable for a material which is difficult to grind such as an AlTiC material (Al ₂ O ₃ —TiC) which is a constituent material of the substrate 105 which constitutes the majority of the row bar 102. It is composed of a grindstone having grindability.

For these reasons, the film 105 is in contact with the rotary grindstone 101 on the film surface 104a of the thin film portion 104 which is softer than the material forming the substrate 105 and is made of a material such as an alumina film which is generally used as a protective film forming material. End 1
Chips 04b, 104c, 104d, and 104e are likely to be chipped as shown by black portions in FIGS. 19 and 20, which causes a reduction in manufacturing yield. Also, the end 1
In 04b, 104c, 104d, and 104e, film peeling of the thin film portion 104 may occur, which also reduces the manufacturing yield.

In order to eliminate such an inconvenience, as the rotary grindstone 101, as shown in FIG. 21, for example, the one in which the grain size of the abrasive grain 108 such as diamond abrasive grain is relatively small is used, and the grinding speed is set. Need to be slow. Further, as described above, the rotary grindstone 1 in which the grain size of the abrasive grains 108 is relatively small
When 01 is used, the grinding speed at the time of grinding, for example, a calcium aluminatitanate material (Al ₂ O ₃ —TiC material, so-called altic material) that constitutes the substrate 105 becomes large, and therefore the grinding speed must be low. Absent.

Then, for example, as described above, the substrate 105
Is made of an AlTiC material (Al ₂ O ₃ —TiC material), and the film surface 104a of the thin film portion 104 is made of an alumina film, the grain size of the abrasive grains 108 of the rotary grindstone 101 is about 5 to 12 μm. And the grinding speed is 20
It is said that it is preferable to set it to about mm / min.

However, in recent years, not only the manufacturing yield is improved, but also the grinding speed at the time of cutting or the like is required to be improved in order to improve the productivity. It is impossible to meet.

However, if the grinding speed is increased by using the above-described rotary grindstone 101 having a relatively small grain size of the abrasive grains 108, the grinding resistance increases, and the life of the rotary grindstone is shortened. However, it is difficult to improve the grinding speed while suppressing the occurrence of chipping.

Further, in order to reduce the grinding resistance, when the rotating grindstone 101 having abrasive grains 109 having a relatively large grain size as shown in FIG. 22 is used, the grinding resistance is reduced and the grinding speed is increased. However, since the amount of the abrasive grains 109 protruding from the surface 101a of the rotary grindstone 101 is large, chipping is likely to occur, and it is difficult to improve the grinding speed while suppressing the occurrence of chipping.

Therefore, the present invention has been proposed in view of the conventional circumstances, and suppresses the occurrence of chipping in the row bar cutting step to improve the manufacturing yield and to make the grinding speed sufficient in the step. An object of the present invention is to provide a method of manufacturing a thin film magnetic head device capable of improving productivity.

[0028]

In order to achieve the above object, the present invention forms a plurality of thin film magnetic head elements on one main surface of a substrate, and the substrate corresponds to each thin film magnetic head element. In a method of manufacturing a thin film magnetic head device, which is cut by grinding to obtain a plurality of thin film magnetic head devices, a dummy member is arranged on the thin film magnetic head element forming surface when the substrate is cut.

Further, in the method of manufacturing a thin film magnetic head device of the present invention, after forming a plurality of thin film magnetic head elements on one main surface of the substrate, the substrate is cut to obtain a plurality of thin film magnetic head elements. After forming blocks that are arranged in a line in the track width direction of the magnetic gap and fixing the blocks to a jig with a surface other than the thin film magnetic head element forming surface as a mounting surface, the thin film magnetic head element forming surface of the block The block may be cut by grinding corresponding to each thin film magnetic head element with a dummy member provided on the block.

The material forming the dummy member may be one having the same grindability as the substrate or a material having the same grindability as the substrate, and is a general AlTiC as a constituent material of ceramics and substrates. Material (Al ₂ O ₃
-TiC) and the like. Other examples include white alumina-based and green carbide-based dress boards that have the effect of whetstone.

Further, it is preferable that the dummy member has substantially the same height as the block in the depth direction of the magnetic gap of the block.

At this time, the length of the magnetic gap of the dummy member in the track width direction may be made substantially equal to that of the block, and the length in the gap length direction is determined when the block is cut under predetermined grinding conditions. It is preferable to make the size larger than the size of chipping in the gap length direction that is considered to occur, and it may be about 50 to 300 μm.

Further, in the method of manufacturing a thin film magnetic head device of the present invention, it is preferable to dispose a dummy member when fixing the block to the jig.

[0034]

In the method of manufacturing the thin film magnetic head device of the present invention, when the substrate on which the plurality of thin film magnetic head elements are formed is cut by grinding corresponding to each thin film magnetic head element, the dummy member is thin film magnetic. Since the thin film portion is arranged on the head element formation surface, the thin film portion is sandwiched between the substrate and the dummy member.

That is, the end of the thin film portion does not become the grinding start portion. Further, even if chipping occurs at the start of grinding, this will occur at the dummy member arranged at the grinding start portion.

Therefore, chipping hardly occurs at the end of the thin film portion during grinding, and the manufacturing yield is improved.

Further, in the present invention, since the grinding conditions can be determined without considering the occurrence of chipping at the start of grinding, a grindstone using abrasive grains having a relatively large grain size is used as the grindstone used at the time of grinding. Then, the grinding speed may be increased.

[0038]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings.

In the method of manufacturing the thin film magnetic head device of this embodiment, first, the AlTiC material (Al ₂ O ₃ --Ti) is used.
A plurality of thin film magnetic head elements are formed on one main surface of a disk-shaped substrate made of C) or the like by using a vacuum thin film forming technique such as vapor deposition or sputtering, a method such as photoengraving or etching.
A so-called wafer is formed.

Next, as shown in FIG. 1, a disk-shaped wafer 1 (substrate) having a plurality of thin film magnetic head elements 2 formed on one main surface 1a is ground by grindstones 3a and 3b, and unnecessary. The outer peripheral portions 1b and 1c are cut off. At this time, as shown in FIG. 1, the grinding device 6 is configured by arranging annular grindstones 3a, 3b having a predetermined interval on the side surface 5a of the cylindrical shaft 5 and having the side surfaces as grinding surfaces. Just do it. And
The shaft 5 is rotated in the direction indicated by the arrow M ₁ in the figure, and the grindstone 3a,
It suffices to perform grinding with 3b.

Next, the wafer 1 is cut into blocks in which a plurality of thin film magnetic head elements are arranged in a line in the track width direction of these magnetic gaps to form a so-called row bar. At this time, in the present embodiment, in order to prevent the thin film portion from being chipped in the above process, as shown in FIG. 2, the thin film formed on the predetermined cutting line of the one main surface 1a of the wafer 1. The protective film of the magnetic head element is ground and removed by a grindstone 7. That is,
As shown in FIG. 3, a portion other than the thin film magnetic head element 2 forming portion formed on one main surface 1a of the wafer 1 is ground by a grindstone 7 so as to form a groove portion formed in the thickness direction of the thin film. Then, the protective film on this portion is removed.

At this time, as shown in FIG. 2, the grinding device 9 is constituted by arranging an annular grindstone 7 whose side surface is a grinding surface on the side surface 8a of the cylindrical shaft 8. 8 may be rotated in the direction indicated by arrow M ₂ in the figure, and grinding may be performed with the grindstone 7.

Then, as shown in FIG. 4, the wafer 1 is cut by grinding with a grindstone 10 along a predetermined cutting line. That is, as shown in FIG. 5, the wafer 1 is moved to a depth equal to or greater than the height of the thin film magnetic head element 2 in the gap length direction.
The wafer 1 is divided by cutting with.

At this time, as shown in FIG. 4, the grinding device 12 is constructed by arranging an annular grindstone 10 whose side surface is a grinding surface on the side surface 11a of the cylindrical shaft 11. 11 may be rotated in the direction indicated by arrow M ₃ in the figure, and grinding may be performed by the grindstone 10.

As a result, one main surface 13a as shown in FIG.
A plurality of row bars 13, which are blocks in which a plurality of thin film magnetic head elements 2 are arranged in a line in the track width direction of these magnetic gaps, are formed. Note that only one row bar is shown in FIG.

Next, as shown in FIGS. 7 and 8, the thin film is formed by using the row bar 13 with the main surface 13a adjacent to the main surface 13a on which the thin film magnetic head element 2 is formed as a mounting surface. The magnetic head element 2 is fixed on a substantially plate-shaped jig 14 by fixing wax so that the magnetic gap of the magnetic head element 2 faces the upper surface. An escape groove 15 used in a cutting process of the row bar 13 which is a post-process is formed at a predetermined position on the row bar mounting surface 14a of the jig 14.

In the present embodiment, the row bar 13 is fixed to the jig 14 as described above, and at the same time, the chipping of the thin film portion of the row bar 13 is generated in the cutting step of the row bar 13 in the subsequent step. The dummy bar 16 which is a dummy member for preventing is also fixed to the jig 14.

That is, as shown in FIG. 8, on the one main surface 13a of the row bar 13 on which the thin film magnetic head element 2 is formed, the row bar 13 in the depth direction of the magnetic gap of the thin film magnetic head element 2 is formed. A dummy bar 16 having a height h ₂ approximately equal to the height h ₁ of the bar 13 is joined by fixing with wax or the like, and the dummy bar 16 is also attached to the low bar mounting surface 14a of the jig 14. It is joined by fixing wax or the like.

The length of the magnetic gap of the thin film magnetic head element 2 of the dummy bar 16 in the track width direction may be substantially equal to that of the row bar 13, and the length W in the gap length direction is predetermined. Depending on the grinding conditions, the low bar 13
It is preferable to make the size larger than the size in the gap length direction of chipping that is considered to occur when cutting
It may be about 50 to 300 μm.

The dummy bar 16 may be made of any material having the same grindability as the substrate of the row bar 13 or a material having grindability similar to that of the substrate, such as ceramic or substrate. As a constituent material, a general altic material (Al ₂ O ₃ —TiC) and the like can be mentioned. Furthermore, white alumina type and green carbide type dress boards, which have the effect of sharpening the grindstone, can also be mentioned.

Next, the depth length of the magnetic gap of the thin film magnetic head element of the row bar 13 is roughly regulated to several μm. That is, as shown in FIG. 9, the jig 14 to which the dummy bar and the row bar are joined as described above is fixed on the processing jig 18 so that the row bar side is the upper surface, and the jig 14 is placed sideways. Fix it on the fixture 19 in the tilted state,
The surface of the bar facing the magnetic gap of the thin film magnetic head element is opposed to the grinding surface 20a of the diamond cup wheel 20. Then, the diamond cup wheel 20 is rotated in the direction of the arrow M ₄ in the figure, and the jig 14 is moved in the direction of the arrow M _{5 in the} figure together with the fixture 19 to grind the surface of the row bar facing the magnetic gap, thereby magnetizing the magnet. The depth of the gap is roughly regulated to a few μm.

Further, as described above, a plurality of jigs 14 on which the row bar 13 and the dummy bar 16 are mounted are prepared,
As shown in FIG.
To form.

Subsequently, as shown in FIG. 11, one main surface 13c, which is the upper surface of the row bar 13 of the assembly 17, that is, the surface facing the magnetic gap of the thin film magnetic head element formed on the one main surface 13a. A slider rail is formed by grinding with a grindstone 21 and grooving. Incidentally, at this time, as a matter of course, one main surface 16a which is an upper surface of the dummy bar 16 fixed on the jig 14 together with the row bar 13
Also, a part of the slider rail will be formed.

The grindstone 21 is composed of a first grindstone 21a, a second grindstone 21b, a third grindstone 21c, and a fourth grindstone 21d. When grinding is performed by this, as shown in FIG. On one main surface 13c, 16a of the bar 13 and the dummy bar 16, one slider rail 22a is formed between the first whetstone 21a and the second whetstone 21b, and the second whetstone 21b, the third whetstone A gap 23 for forming an air groove is formed between 21c, and the other slider rail 22b is formed between the third grindstone 21c and the fourth grindstone 21d.

At this time, as shown in FIG. 11, an annular first grindstone 21a, a second grindstone 21b, and a third grindstone whose side surfaces are grinding surfaces are formed on the side surface 24a of the cylindrical shaft 24. Two
The grinding device 25 is configured by arranging 1c and the fourth grindstone 21d with a predetermined interval, and the shaft 24 is rotated in the direction shown by an arrow M ₆ in the drawing to grind with the grindstone 21. You can do it.

Next, as shown in FIG. 13, the row bar 13 of the aggregate is grindstone 2 in the gap length direction of the magnetic gap so as to correspond to each thin film magnetic head element at a predetermined position.
Grinding and cutting by 6 to obtain a plurality of thin film magnetic head device blocks 27.

At this time, as shown in FIG. 13, an annular first grindstone 26a, a second grindstone 26b, and a third grindstone whose side surfaces are grinding surfaces are formed on the side surface 28a of the cylindrical shaft 28. Two
The grinding device 29 is configured by arranging the plurality of grinding stones 6c of 6c at intervals equal to the length of the magnetic gap of the thin film magnetic head device to be formed in the track width direction. It is sufficient to rotate in the direction indicated by arrow M ₇ in the figure and grind with the grindstone 26.

At this time, in this embodiment,
As shown in FIG. 14, in order to grind and cut the row bar 13 in the gap length direction of the magnetic gap so as to correspond to each thin film magnetic head element, only the grindstone 26 (in FIG. 14, only the grindstone 26a is cut). (Shown in FIG. 3) in the direction of arrow M _{7 in the} figure, that is, in the direction indicated by arrow M ₈ in the figure, that is, from the side of one main surface 16b that is orthogonal to one main surface 16a that is the upper surface of dummy bar 16 and that is the side surface. The bar 13 is intruded toward the side and ground to cut.

In the step of cutting the row bar 13, the grinding depth D ₂ of the grindstone 26 (only the grindstone 26a is shown in FIG. 14) is set to the magnetic gap of the row bar 13 and the dummy bar 16. It is necessary to make it deeper than the height D _{1 in} the depth length direction, and the grindstone 26a penetrating in the depth length direction rotates in the clearance groove 15 of the jig 14.

That is, in this embodiment, one main surface 13a of the row bar 13 on which the thin film magnetic head element is formed.
Side thin film portion 2 on the dummy bar 16 side with respect to the broken line in the figure
8 is sandwiched between the substrate 29 which is the remaining portion of the row bar 13 and the dummy bar 16, and the end portion of the thin film portion 27 does not become the grinding start portion. further,
Even if chipping occurs at the start of grinding, this will occur at the dummy bar 16 arranged at the grinding start portion.
Therefore, in this embodiment, chipping is less likely to occur at the end of the thin film portion 28 during grinding.

Further, the surface of the thin film magnetic head element 2 of the plurality of thin film magnetic head device blocks 27 facing the magnetic gap is polished to regulate the depth length of the magnetic gap to a predetermined length.

Next, the dummy bar is removed from each of the thin film magnetic head device blocks 27 and attached to the grinding jig 30 via the jig 14 as shown in FIG. The main surface 27 on which the slider rail is formed
The end of a in the slider rail forming direction of a is ground by a surface plate 31 and tapered. That is, as shown in FIG. 15, the grinding jig 30 is tilted so as to have a predetermined angle θ with respect to a line a perpendicular to the grinding surface 31 a of the surface plate 31, and the surface plate 31 is indicated by an arrow M. _It is rotated in _nine directions, and the end of the main surface 27a in contact with the grinding surface 31a of the surface plate 31 in the slider rail forming direction is ground and tapered.

The taper process is performed to prevent the thin film magnetic head device from damaging the hard disk or the like when the thin film magnetic head device contacts the hard disk or the like.

Next, as shown in FIG. 16, in the gap between the slider rails of each thin-film magnetic head device block 27, the grindstone 32 is rotated in the direction indicated by arrow M ₁₀ in the figure and is indicated by arrow M ₁₁ in the figure. Grooves are made by running in the direction shown and grinding to form groove portions called air grooves. Note that the slider rails are not shown in FIG.

As a result, as shown in FIG. 17, one main surface 2
The slider rails 22a and 22b are formed on the slider 7a, and the thin film magnetic head device 34 in which the air groove 33 is formed is formed between these slider rails 22a and 22b.

Finally, as shown in FIG. 18, the thin film magnetic head device 34 is removed from the jig 14 to complete the thin film magnetic head device.

In this embodiment, when the row bar 13 is cut into the thin film magnetic head device block 27, the thin film portion 28 of the row bar 13 is unlikely to be chipped, so that the manufacturing yield is improved and the productivity is improved. Also improves.

Further, in the present embodiment, the grinding conditions can be determined without considering the occurrence of chipping at the start of grinding, so that the grindstone 26 used for grinding has a relatively large particle size of, for example, 10 to 30 μm. It is possible to increase the grinding speed to, for example, about 40 mm / min or more by using a grindstone using abrasive grains, and it is possible to perform the grinding at a grinding speed about twice or more that of the conventional thin film magnetic head device manufacturing method. Become.

Further, in this embodiment, the row bar 1
When fixing 3 to the jig 14, the dummy bar 16 is also fixed, and the thin film magnetic head device is manufactured without significantly changing the manufacturing process of the conventional thin film magnetic head device. Value is very high.

[0070]

As is apparent from the above description, in the method of manufacturing a thin film magnetic head device of the present invention, the substrate on which a plurality of thin film magnetic head elements are formed is associated with each thin film magnetic head element. When cutting by grinding, since the dummy member is arranged on the thin film magnetic head element forming surface, the thin film portion is sandwiched between the substrate and the dummy member.

That is, the end of the thin film portion does not become the grinding start portion. Further, even if chipping occurs at the start of grinding, this will occur at the dummy member arranged at the grinding start portion.

Therefore, chipping hardly occurs at the end of the thin film portion during grinding, the manufacturing yield is improved, and the productivity is also improved.

Further, in the present invention, since the grinding conditions can be determined without considering the occurrence of chipping at the start of grinding, a grindstone using a relatively large grain is used as the grindstone used at the time of grinding. Then, the grinding speed can be increased and the productivity is improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a method of manufacturing a thin film magnetic head device to which the present invention is applied in the order of steps, showing steps for cutting off an outer peripheral portion of a wafer.

FIG. 2 is a perspective view showing a method of manufacturing a thin film magnetic head device to which the present invention is applied, in order of steps, and showing steps of cutting and removing a protective film on a cutting line of a wafer.

FIG. 3 is a magnified perspective view of an essential part showing a method of manufacturing a thin film magnetic head device to which the present invention is applied, in the order of steps, showing a step of cutting and removing a protective film on a cutting line of a wafer.

FIG. 4 is a perspective view showing a method of manufacturing a thin film magnetic head device to which the present invention is applied, in order of steps, and showing steps of cutting a wafer.

5A and 5B are enlarged perspective views of a main part showing a method of manufacturing a thin film magnetic head device to which the present invention is applied, in order of steps, and showing a step of cutting a wafer.

FIG. 6 is an enlarged perspective view of a main part showing a formed row bar, showing a method of manufacturing a thin film magnetic head device to which the present invention is applied in order of steps.

FIG. 7 is a perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied in the order of steps, and showing the step of fixing the row bar and the dummy bar to the jig.

FIG. 8 is a main part enlarged perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied in the order of steps, and showing a step of fixing the row bar and the dummy bar to the jig.

FIG. 9 is a schematic perspective view of a main part showing a method of manufacturing a thin film magnetic head device to which the present invention is applied, in order of steps, and showing a step of roughly restricting a depth length of a magnetic gap.

FIG. 10 is a perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied in the order of steps, and showing the step of forming an aggregate.

FIG. 11 is a perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied, in the order of steps, and showing steps of forming a slider rail.

FIG. 12 is a main part enlarged perspective view showing a step of forming a slider rail, showing a method of manufacturing the thin film magnetic head device to which the present invention is applied in order of steps.

FIG. 13 shows a method of manufacturing a thin film magnetic head device to which the present invention is applied in the order of steps, in which a row bar is cut,
It is a perspective view showing a process of forming a thin film magnetic head device block.

FIG. 14 shows a method of manufacturing a thin film magnetic head device to which the present invention is applied in the order of steps, in which a row bar is cut,
FIG. 6 is an enlarged perspective view of a main part showing a step of forming a thin film magnetic head device block.

FIG. 15 shows a method of manufacturing a thin film magnetic head device to which the present invention is applied in the order of steps, and is a schematic view showing a step of tapering an end portion of the thin film magnetic head device block in the slider rail direction.

FIG. 16 is a perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied in the order of steps, and showing the step of forming air grooves in the thin film magnetic head device block.

FIG. 17 shows a method of manufacturing a thin film magnetic head device to which the present invention is applied in the order of steps, which is an enlarged perspective view of an essential part showing a process of forming an air groove in a thin film magnetic head device block to obtain a thin film magnetic head device. It is a figure.

FIG. 18 is a main part enlarged perspective view showing the method of manufacturing the thin film magnetic head device to which the present invention is applied in the order of steps, showing the step of removing the thin film magnetic head device from the jig.

FIG. 19 is an enlarged perspective view of an essential part showing a step of cutting a row bar in a conventional method of manufacturing a thin film magnetic head device.

FIG. 20 is an enlarged plan view of an essential part showing a step of cutting a row bar in a conventional method of manufacturing a thin film magnetic head device.

FIG. 21 is a schematic view showing an example of a rotary grindstone.

FIG. 22 is a schematic view showing another example of the rotary grindstone.

[Explanation of symbols]

 1 ... Wafer 2 ... Thin film magnetic head element 13 ... Low bar 14 ... Jig 16 ... Dummy bar 26 ... Grinding stone 27 ... Thin film magnetic head device block

Claims (4)

[Claims] 1. A thin film magnetic head in which a plurality of thin film magnetic head elements are formed on one main surface of a substrate and the substrate is cut by grinding corresponding to each thin film magnetic head element to obtain a plurality of thin film magnetic head devices. A method of manufacturing a thin-film magnetic head device, characterized in that a dummy member is arranged on a thin-film magnetic head element formation surface when the substrate is cut. 2. A block in which a plurality of thin film magnetic head elements are formed on one main surface of a substrate and then the substrate is cut so that the plurality of thin film magnetic head elements are arranged in a line in the track width direction of these magnetic gaps. And fixing the block to a jig with the surface other than the thin film magnetic head element forming surface as a mounting surface, and then individually placing the blocks on the thin film magnetic head element forming surface of the block with dummy members. 2. The method for manufacturing a thin film magnetic head device according to claim 1, wherein the thin film magnetic head element is cut by grinding so as to correspond to the thin film magnetic head element. 3. The method of manufacturing a thin film magnetic head according to claim 2, wherein the dummy member has substantially the same height as the block in the depth direction of the magnetic gap of the block. 4. A method of manufacturing a thin film magnetic head device according to claim 1, wherein a dummy member is also provided when the block is fixed to the jig.