JPH0823196A - Method and device for correcting position of mounter - Google Patents

Abstract

PURPOSE:To contrive to enhance mounting precision by a method wherein an off-line amount of electronic parts for a predetermined mounting position is measured, and a correction amount corresponding to a position error caused by a correction arm is operated on the basis of it and stored, and at the time of mounting operations, a target mounting position of electronic parts is corrected on the basis of correction data stored. CONSTITUTION:In the case where electronic parts are detected in a main operation part 42 when performing position correction, the image data are output into a correction operation part 44. In the correction operation part 44, on the basis of an image position of the electronic parts from the input image data, the correction amount for a target mounting position of electronic parts is operated at the time of mounting operations, and operated results are stored in a memory part 45. At the time of mounting, the correction data are read out to the operation part 42, and the target mounting position of electronic parts. namely the target transfer position of a head unit at the time of mounting, is corrected on the basis of these data. Shortly, the main operation 42 also functions as correcting means in addition to function of drive controlling means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting machine for mounting an electronic component on a printed circuit board, and more particularly to a mounting machine position correcting method for mounting an electronic component sucked by a suction nozzle after positioning it by a correction arm. And the device.

[0002]

2. Description of the Related Art Conventionally, a suction nozzle which is mounted on a movable head unit and which can be moved up and down and rotated, sucks a predetermined electronic component from a component supply section and transfers it onto a printed circuit board that is positioned. A mounting machine that is mounted and mounted is known.

In such a mounting machine, when an electronic component is picked up, there may be a case where the electronic component shifts to the suction nozzle and is sucked. Therefore, in order to correct this, for example, A correction arm that is openable and closable is provided at the portion that holds the suction nozzle on all four sides of the suction nozzle, and the correction arm is linked to the lifting and lowering of the suction nozzle, and when the suction nozzle descends, the correction arm opens. An apparatus has been proposed in which, when the suction nozzle rises after suctioning a component, the correction arm is closed so that the electronic component is pinched, and thereby the electronic component is positioned.

[0004]

In the mounting machine as described above, the mounting operation is repeated for a long period of time, and as a result, the mounting misalignment of electronic components may occur due to wear of the correction arm or the like. There is. That is, when the repair arm is repeatedly opened and closed, wear occurs in the support portion (rotating shaft, etc.) of the repair arm and the contact portion with the electronic component, and the position where the electronic component should be originally positioned, for example, the center of the suction nozzle (rotation) It becomes impossible to position the electronic component at the position where the center) and the center of the electronic component match, and as a result,
Misalignment of electronic parts occurs. In addition, an initial positioning error may occur due to a manufacturing error or an assembly error of the correction arm.

Therefore, in such a mounting machine, before the mounting machine is operated, components are experimentally mounted and the positional deviation is examined to check the initial positioning error, and then the mounting position of the correction arm is adjusted. In addition, by periodically adjusting or replacing the correction arm, misalignment of electronic components due to the correction arm is prevented.

However, since the work of adjusting the correction arm and the like is extremely precise and requires skill, the workability is poor, and the misalignment of electronic parts caused by the correction arm during operation in a factory or the like. If the occurrence occurs, it cannot be easily dealt with by the user or the like, and therefore, the mounting line must be stopped for a long time.

The present invention has been made in order to solve the above-mentioned problem, and by performing the mounting operation in consideration of the positional deviation of the electronic component caused by the initial error of the correction arm and the wear, the predetermined operation is performed. An object of the present invention is to provide a position correction method and device for a mounting machine that can more reliably maintain mounting accuracy.

[0008]

According to a first aspect of the present invention, there is provided a mounter position correcting method, comprising: a movable head unit, a suction nozzle, and a correction arm for positioning by picking up an electronic component. In a mounting machine that picks up an electronic component on the component supply side with a suction nozzle and positions the electronic component with the correction arm, and then mounts the electronic component on a printed circuit board on the component mounting side, the electronic component has a predetermined mounting position on the component mounting side. On a trial basis, measure the amount of displacement of the electronic component with respect to the predetermined mounting position, calculate the correction amount corresponding to the positioning error by the correction arm based on this amount of displacement, and store this correction amount data. During the mounting operation, the target mounting position of the electronic component is corrected based on the stored correction amount data.

A position correcting device for a mounting machine according to claim 2 is
A rotatable suction nozzle for sucking an electronic component, which is provided in a movable head unit, and a correction arm that performs positioning by sandwiching the electronic component sucked by the suction nozzle,
In a mounting machine provided with the head unit and a driving means for the suction nozzle, an image pickup means equipped in the head unit and an electronic component are mounted at a predetermined mounting position, and a predetermined electronic component mounted by the mounting means is mounted. A drive control means for operating the drive means so as to arrange the image pickup means at the image pickup position, and a correction amount calculation for calculating a correction amount for a target mounting position of the electronic component based on an image position of the electronic component captured by the image pickup means. Means, storage means for storing the obtained correction amount data, and correction means for correcting the target mounting position of the electronic component based on the correction amount data read from the storage means.

A position correcting device for a mounting machine according to a third aspect is
3. The position correcting device for a mounting machine according to claim 2, wherein the drive control means mounts a plurality of electronic components at predetermined intervals in the moving direction of the head unit and alternately while rotating by a constant angle. Therefore, the driving means is operated, and the correction amount calculation means calculates the correction amount based on the image position of each electronic component.

[0011]

According to the position correcting method of the mounting machine described in claim 1, the electronic component can be positioned at the position where it should be originally positioned due to abrasion of the supporting portion of the correction arm or the contact portion with the electronic component. Even if it is not possible, it becomes possible to mount by taking into account the amount of deviation of the electronic component from the predetermined position where it should be originally positioned, so that it is possible to prevent deterioration of mounting accuracy.

According to the position correcting device of the mounting machine of the second aspect, when the sucked electronic component is positioned by the correction arm and mounted at a predetermined mounting position, the head unit is moved to move the image pickup means. Is placed at a predetermined imaging position, and the mounted electronic component is imaged. Then, a correction amount for the target mounting position of the electronic component is calculated based on the image position of the captured electronic component, and the target mounting position of the electronic component, that is, the target moving position of the head unit at the time of mounting is calculated based on this correction amount. Will be corrected.

According to the position correcting device of the mounting machine described in claim 3, at a predetermined interval in the moving direction of the head unit,
A plurality of electronic components mounted while being alternately rotated by a fixed angle are sequentially imaged, and the correction amount is calculated based on the image position of each of these electronic components.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A position correcting apparatus of the present invention is shown in FIGS.
Will be explained.

FIG. 1 shows the overall structure of an electronic component mounting machine to which the position correcting apparatus according to the present invention is applied.
Shows schematically a head unit described later.

As shown in these figures, a conveyor 2 for conveying a printed circuit board is arranged on a base 1 of an electronic component mounting machine (hereinafter, abbreviated as a mounting machine), and a printed circuit board 3 is placed on the conveyor 2. It is conveyed and stopped at a predetermined mounting work position.

On the side of the conveyor 2, a parts supply section 4 is provided.
Is arranged. The component supply unit 4 includes a large number of rows of tape feeders 4a, and each tape feeder 4a is a reel in which small pieces of electronic components such as ICs, transistors, and capacitors are stored and held at predetermined intervals. The tape feeding end is provided with a ratchet type feeding mechanism so that the tape is intermittently fed as electronic components are picked up by a head unit 5 described later.

A head unit 5 for mounting components is installed above the base 1. The head unit 5 is movable in the X-axis direction (direction of the conveyor 2) and Y-axis direction (direction on the horizontal plane orthogonal to the X-axis).

That is, a pair of fixed rails 7 extending in the Y-axis direction and a ball screw shaft 8 rotatably driven by a Y-axis servomotor 9 are arranged on the base 1, and the fixed rails 7 are mounted on the fixed rail 7. A head unit support member 11 is arranged in the head unit, and a nut portion 12 provided on the support member 11 is screwed onto the ball screw shaft 8. A guide member 13 extending in the X-axis direction and a ball screw shaft 14 driven by an X-axis servomotor 15 are arranged on the support member 11, and the head unit 5 can be moved on the guide member 13. A nut portion (not shown) that is held and provided on the head unit 5 is screwed onto the ball screw shaft 14. Then, the ball screw shaft 8 is rotated by the operation of the Y-axis servomotor 9 to move the support member 11 in the Y-axis direction, and the ball screw shaft 14 is rotated by the operation of the X-axis servomotor 15, so that the head unit is rotated. 5 moves in the X-axis direction with respect to the support member 11.

Further, the Y-axis servo motor 9 and the X-axis servo motor 15 are provided with position detecting means 10 and 16 each comprising an encoder so that the operating position of the head unit 5 can be detected. Has become.

As shown in FIG. 2, the head unit 5 includes a head holding portion 19 and a suction head 20 held by the head holding portion 19. In the illustrated example, the head holding portion 19 is provided.
The three suction heads 20 are mounted on.

Each of the suction heads 20 is capable of moving up and down and rotating, and two sets of correction arms 22 for positioning the electronic components sucked by the suction nozzles 21.
A, 22B and 23A, 23B (shown in FIG. 4).

As shown in FIG. 3, each suction head 20 has a head body 24, and the head body 24 is fixed to the head holding portion 19. The head body 2
A cylindrical guide 25 is rotatably attached to a central portion of 4 via a bearing in a state in which the vertical movement is blocked. A hollow outer shaft 26 is inserted inside the guide 25, and a hollow inner shaft 27 is inserted inside the outer shaft 26. The suction nozzle is attached to the tip (lower end) of the inner shaft 27. 21 is attached. A negative pressure supply passage connected to a negative pressure supply means (not shown) via a valve or the like is formed in the inner shaft 27, and a negative pressure for adsorbing components passes through the negative pressure supply passage when necessary. The suction nozzle 2
1 is supplied.

The outer shaft 26 and the inner shaft 27 are slidable in the vertical direction and are prevented from rotating with respect to the guide 25 by a rotation preventing means (not shown). Further, the guide 25 is connected to a rotation drive means (not shown), and at the time of mounting, the guide 25 and both shafts 26 and 27 are integrally rotated by operating this rotation drive means as needed. It has become.

The upper end of the outer shaft 26 is connected to an operating shaft of an air cylinder (not shown), and the outer shaft 26 can be moved up and down according to the operation of the air cylinder. Then, when the outer shaft 26 descends, the tip portion (lower end portion) of the outer shaft 26 abuts on the collar-shaped portion 28 attached to the lower end portion of the inner shaft 27, whereby the inner shaft 2
7 can be pushed down. When the outer shaft 26 rises from the lowered position, the inner shaft 27 is pushed up to a predetermined raised position by the urging force of a return spring (not shown).

The correction arms 22A, 22B and 23
A and 23B can be opened and closed about the shaft 30 by being axially supported by an outer frame member 29 provided around the lower end portion of the guide 25 via a shaft 30. A mountain-shaped cam 31 protruding inward is provided on the inner side of each of the correction arms 22A, 22B and 23A, 23B. Then, when the outer shaft 26 descends, the cam 31 comes into contact with the lower end portion of the outer shaft 26 and the outer shaft 26 causes the correction arms 22A, 22B and 2 to move.
3A and 23B can be spread out.

Around the outer frame member 29, double sleeves 34, 35 that are vertically movable and are urged downward by springs 32, 33 are provided, and the lower end portion of the inner sleeve 34 is Is in contact with the upper surfaces of the correction arms 22A and 22B. Then, the outer shaft 26
The correction arms 22A and 22B are pushed by the sleeve 34 to be closed when is raised. The outer sleeve 35 is adapted to come into contact with the upper surfaces of the other correction arms 23A and 23B.
23B is also opened and closed in the same manner as the correction arms 22A and 22B.

Further, a board recognition camera (imaging means) 37 is attached to the head unit 5 at the side front part thereof. The board recognition camera 37 captures an image of a fiducial mark (hereinafter, simply abbreviated as a mark) provided on the surface of the printed board 3 at the time of mounting, and is mounted on a dummy board at the time of position correction processing described later. It is designed to capture images of electronic components. A light-emitting body 38 including a large number of LEDs is fixed to the front end portion (lower end portion) of the board recognition camera 37, and at the time of image capturing, the light-emitting body 38 emits light and a detection hole (not shown) of the light-emitting body 38 is formed. The image is taken in by the board recognition camera 37 via this.

During the mounting operation by the mounting machine, the head unit 5 is moved onto the component supply unit 4 and the outer shaft 26 of each of the suction heads 20 is lowered, and along with this, the correction arms 22A, 22B and the arms. Two
Inner shaft 2 while 3A and 23B are being spread
7 falls. Then, a negative pressure for sucking the component is supplied to the suction nozzle 21, so that the electronic component of the component supply unit 4 is sucked. When the electronic components are adsorbed in this way, next,
The outer shaft 26 and the inner shaft 27 are integrally raised to pick up electronic components, and
With the rise of the outer shaft 26, the correction arm 2
2A, 22B and the correction arms 23A, 23B are closed, and thereby the electronic components that are adsorbed are positioned. Specifically, the center of the electronic component and the suction nozzle 21
The center of rotation (center of rotation) is aligned.

After that, the head unit 5 is moved onto the printed circuit board 3, the outer shaft 26 and the inner shaft 27 are lowered, and then the negative pressure supply to the suction nozzle 21 is cut off, so that the electronic parts are predetermined. It is installed in the installation position.

Next, the control system of the mounting machine will be described with reference to the block diagram of FIG.

A control device 40 as shown in FIG. 5 is mounted on the mounter, and the Y-axis and X-axis servomotors 9 and 15 and the rotation driving means for the suction heads 20 of the head unit 5 and the air are provided. Cylinders, etc. are all controlled by this control device 40
Is electrically connected to the control unit 40 and is centrally controlled by the control device 40. More specifically, the main arithmetic unit 4 having predetermined information for controlling the operation of the mounting machine in a centralized manner.
2 and an axis control unit 41 controlled by the main calculation unit 42
Are provided in the control device 40, and the servomotors and the like are connected to the axis control unit 41.

The axis control unit 41 and the main calculation unit 42 perform control for performing a predetermined mounting operation for mounting an electronic component, and at the time of a position correction process described later, a predetermined component mounting position on the dummy substrate. It also functions as a drive control means for mounting an electronic component on the electronic component and moving the head unit 5 to dispose the board recognition camera 25 at a predetermined imaging position for the electronic component.

An image processing section 43 is provided in the control device 40, and the board recognition camera 37 is connected to the image processing section 43. That is, the image data captured by the board recognizing camera 37 is subjected to predetermined image processing and output to the main processing unit 42, so that the main processing unit 42 performs processing of mark and position correction of the printed circuit board 3. The recognition of electronic components has been performed.

The control device 40 is further provided with a correction amount calculation unit (correction amount calculation means) 44, and the correction amount calculation unit 44 is connected to the main calculation unit 42 and the storage unit 45 and further stored therein. The unit 45 is connected to the main calculation unit 42.

When an electronic component is recognized by the main calculation unit 42 during the position correction process, the image data is output to the correction amount calculation unit 44. Then, the correction amount calculation unit 44 calculates the correction amount for the target mounting position of the electronic component during the mounting operation from the input image data based on the image position of the electronic component, and the calculation result is stored in the storage unit 45. Remembered. And at the time of implementation,
The correction amount data stored in the storage unit 45 is read by the main calculation unit 42, and the target mounting position of the electronic component, that is, the target moving position of the head unit 5 at the time of mounting is corrected based on the correction amount data. It In other words, the main calculation unit 42 also functions as a correction unit in addition to the function as the drive control unit described above.

Next, a first embodiment of the position correcting method in the above mounting machine will be described.

In the mounting machine, for example, at the initial setting stage of the mounting machine, or if necessary, the correction arm 22.
A, 22B, the correction arms 23A, 23B may be changed over time for a suitable period or when such correction arms 22A, 22B and correction arms 23A, 23B are changed over time. The position correction process for the target mounting position of the electronic component in the mounting machine is performed based on the flowchart shown in FIG.

In this process, first, the dummy substrate is fixed to a predetermined mounting work position during mounting (step S).
1).

Next, the head unit 5 is moved, and a predetermined electronic component is picked up from the component supply section 4 by the suction nozzle 21 of the suction head 20 (one predetermined suction head 20). The electronic component is mounted at a predetermined mounting position on the dummy substrate (step S2).

When the electronic component is mounted, the board recognition camera 37 is placed at a predetermined image pickup position above the electronic component by the movement of the head unit 5. That is,
Based on the data stored in advance regarding the positional relationship between the image center position and the nozzle center position, the board recognition camera 37 is arranged at a position where the image center comes to the regular mounted component center position, and the electronic component is imaged. (Step S
3).

Then, the correction amount calculation unit 44 calculates the amount of deviation between the image position of the electronic component and the proper image position with respect to this image position, based on the image data taken in by the board recognition camera 37 (step). S
4).

More specifically, as shown by the solid line in FIG. 7, when the electronic component 47 is properly positioned by the correction arms 22A, 22B and 23A, 23B, as described above, the center O of the electronic component 47 and The electronic component 47 is positioned so that the center R of the suction nozzle 21 matches.
However, the correction arms 22A, 22B and the correction arm 23
When the electronic component 47 is not properly positioned due to wear of A and 23B, the center O of the electronic component 47 and the center R of the suction nozzle 21 are displaced from each other as shown by the chain double-dashed line in FIG. There is. Therefore, when the electronic component 47 is mounted in this state, as shown in FIG.
Center R of the mounting position (shown by the chain double-dashed line) where the
₁ , that is, the center O _{1 of} the electronic component 47 (shown by the solid line) actually mounted is displaced from the center of the image captured by the board recognition camera 37.

That is, in step S4, as shown in FIG. 8, the center R ₁ of the electronic component image when the electronic component 47 is originally mounted at the position where it should be mounted, and the electronic component image actually captured. The amount of deviation (A, B) from the center O _{1 of} is calculated.

When the shift amount (A, B) is calculated in the correction amount calculation unit 44 in this way, data indicating the shift amount (A, B) is stored in the storage unit 45 as correction amount data (step S5). The position correction process according to this flowchart ends. The dummy substrate is removed from the mounting machine after the completion of this processing.

The above is the position correction processing for one suction head 20, and in the mounting machine of the above-mentioned embodiment equipped with three suction heads 20, the above-mentioned position correction processing is performed for each suction head. This is performed on the head 20. That is, by repeating the processing of steps S2 to S5 for each suction head 20, the correction amount data for each suction head 20 is calculated and stored in the storage unit 45.

When the position correction process is completed in this way, the mounting operation for mounting the electronic component by the mounting machine is started.

Specifically, the head unit 5 is moved to the component supply unit 4 side, and a predetermined electronic component to be mounted is sucked by the suction nozzles 21 of the respective suction heads 20 to be sucked from the component supply unit 4. Will be picked up. When the electronic component is picked up, the electronic component is corrected by the correction arm 22.
After being positioned by A, 22B and 23A, 23B, the head unit 5 is moved above the printed circuit board 3, and the electronic component is mounted at a predetermined mounting position on the printed circuit board 3. At this time, the correction amount data corresponding to the suction head 20 is read from the storage unit 45 to the main calculation unit 42, and the target mounting position of the electronic component, that is, the target movement position of the head unit 5 is determined based on the correction amount data. Will be corrected. Then, a drive signal corresponding to the corrected target mounting position is output to the motor, so that the head unit 5 is moved and the electronic component is mounted.

As described above, in the position correcting method of the first embodiment, the electronic component is mounted on the dummy substrate, the electronic component is imaged by using the substrate recognition camera 37, and the electronic component to be imaged by the electronic component is imaged. A position correction process is performed in which a shift amount (A, B) between the image center position and the image center position of the electronic component actually captured is calculated, and the shift amount is stored as a correction amount for the target mounting position of the electronic component. At the time of mounting, since the mounting is performed while correcting the target mounting position of the electronic component, that is, the target moving position of the head unit 5, which is preset based on the correction amount, the correction arm 22
Even if the electronic components cannot be positioned at the predetermined positions due to wear of the A, 22B and the correction arms 23A, 23B, the mounting operation can be performed in consideration of the positional displacement of the electronic components. Is. Therefore, it is possible to preferably maintain the predetermined mounting accuracy of the mounting machine.

In particular, even when the above situation occurs during operation in a factory or the like, by performing the above-mentioned position correction processing, the mounting operation can be continued without adjusting or replacing the correction arm. Therefore, unlike the conventional device, it is not necessary to stop the mounting machine for a long time in order to adjust the correction arm and the like, and therefore it is possible to avoid the disadvantage that work efficiency is significantly impaired.

Further, the above-described position correction processing is performed, for example,
If the data stored in the storage unit 45 is updated on a regular basis, the predetermined mounting accuracy can be maintained for a long period of time without frequent adjustments and replacements of the correction arm. Since it can be maintained, there is also an advantage that the maintenance cycle such as adjustment and replacement of the correction arm can be extended.

Next, a second embodiment of the position correcting method in the mounting machine will be described.

In the position correcting method of the second embodiment, the position correcting process is performed based on the flowchart shown in FIG. 9 before the mounting operation.

First, the dummy substrate is fixed at a predetermined mounting work position, and as shown in FIG.
Suction head 20 (one predetermined suction head 2
The electronic component 50 is mounted on the dummy substrate at a predetermined mounting position (step S11, S12).

Next, after the counter values Nx and Ny are each reset to "0" (step S13), a plurality of electronic components having the same shape as the electronic component 50 are X-axis based on the electronic component 50. Are mounted side by side in the Y direction. Specifically, as shown in FIG. 10, the electronic component 50 is mounted on the same axis line in the X-axis direction at the mounting position of the electronic component 50 at a predetermined distance from the electronic component 50 and around the R-axis ( The electronic component 51a is mounted in a state of being rotated by 180 ° around the suction nozzle 21 (step S1).
4). When the electronic component 51a is mounted, the counter value Nx
Is incremented, and it is further determined whether or not this value has reached the predetermined value H, that is, whether or not a predetermined number H of electronic components are mounted on the same X-axis axis (step S15,
S16). If the determination here is NO, the process proceeds to step S14, and at a predetermined distance from the electronic component 51a on the same axis in the X-axis direction, and around the R-axis with respect to the electronic component 51a. The electronic component 51b is mounted in a state of being rotated by 180 °.

In this way, a predetermined number H (in the illustrated example, the electronic component 51 is provided on the same axis of the electronic component 50 in the X axis direction).
Electronic components a) to 51c) are mounted.

When the mounting of the electronic component in the X-axis direction is completed (YES in step S16), the electronic component 5 is then loaded.
The electronic component 52a is mounted on the same axis line in the Y-axis direction at the mounting position of 0 at a predetermined interval from the electronic component 50 and in a state of being rotated by 180 ° around the R-axis with respect to the electronic component 50. Then, similarly to the case where the electronic components are mounted side by side in the X-axis direction, at a predetermined interval on the same axis line in the Y-axis direction,
In addition, a predetermined number K (three electronic components 52a to 52c in the illustrated example) of electronic components are mounted while being alternately rotated about the R axis by 180 ° (steps S17 to S1).
9).

In this way, the electronic component 5 is mounted on the dummy substrate.
When 0, 51a to 51c and 52a to 52c are mounted,
Next, the board recognition camera 37 is placed at a predetermined imaging position for the electronic component 50 by the movement of the head unit 5, and the electronic component 50 is imaged by the board recognition camera 37 (step S20).

Next, after the counter values Nx and Ny are each reset to "0" (step S21), the board recognition camera 37 is moved in the X-axis direction from the predetermined image pickup position with respect to the electronic component 50, The electronic components 51a to 51c mounted in the X-axis direction are sequentially imaged by the board recognition camera 37. That is, the board recognition camera 37
From the position where the electronic component 50 is imaged,
The electronic component 51a is imaged by being moved on the same axis in the X-axis direction according to the mounting intervals of 1a to 51c (step S22). Then, when the electronic component 51a is imaged, the counter value Nx is incremented, and whether or not this value reaches a predetermined value H, that is, whether all the electronic components mounted in the X-axis direction are imaged. It is determined whether or not (steps S23 and S24). NO here
In this case, the process proceeds to step S22, the board recognition camera 37 is further moved in the X-axis direction, and the next electronic component 51b is imaged.

In this way, all the electronic components 51a to 51c mounted in the X-axis direction are imaged.

When the image pickup of the electronic component mounted in the X-axis direction is completed (YES in step S24), the board recognition camera 37 is reset to the predetermined image pickup position for the electronic component 50 by the movement of the head unit 5. Then, the board recognition camera 37 is moved on the same axis in the Y-axis direction from the position where the electronic component 50 is imaged, in accordance with the mounting intervals of the electronic components 52a to 52c, whereby the electronic components mounted in the Y-axis direction. Imaging of the components 52a to 52c is sequentially performed (steps S25 to S27).

When the image pickup of all the mounted electronic components is completed (YES in step S27), the center position of each electronic component is determined from the image data captured by the board recognition camera 37 in the correction amount calculation section 44. The calculated amount of deviation between the center positions of adjacent electronic components is calculated. At this time, as shown in FIG. 10, the shift amount Yb in the Y-axis direction is calculated for the electronic component mounted in the X-axis direction, and the shift amount Xa in the X-axis direction is calculated for the electronic component mounted in the Y-axis direction. Is calculated. Then, the average value (Xa ', Yb') of the deviation amount in each of these directions is calculated,
Further, a value (A = Xa '/ 2, B = Yb' / 2) that is 1/2 of the average value (Xa ', Yb') is obtained (step S28).

That is, the electronic parts are the correction arms 22A, 2
When properly positioned by 2B, 22A, and 22B (shown by the solid line in FIG. 7), the electronic components are mounted side by side on the same axis line in the X-axis direction while being rotated by 180 ° as described above. However, the center positions of these electronic components do not shift in the Y-axis direction. However, when the electronic components are not properly positioned (shown by the chain double-dashed line in Fig. 7)
In addition, since the center of the suction nozzle 21 (center of rotation) is deviated from the center of the electronic component, the electronic components are 180 ° apart from each other.
When mounted side by side in a rotated state, the centers of these electronic components are displaced from each other in the Y-axis direction, as shown in FIG.
The amount of deviation at this time is twice the amount of deviation between the center of the electronic component and the center of the suction nozzle 21. When electronic components are mounted side by side on the same axis in the Y-axis direction while being rotated by 180 °, the centers of the electronic component images are displaced in the X-axis direction.

Therefore, the value (A, B) obtained in step S28 becomes the deviation amount of the electronic component with respect to the electronic component positioned at the position that should be originally positioned, that is, the correction amount.

When the correction amount (A, B) is obtained in this way, the data is stored in the storage unit 45 (step S29), and the position correction processing according to this flowchart is completed. The dummy substrate is removed from the mounting machine after the completion of this processing.

In addition, the above description also shows one suction head 20.
Position correction processing for three suction heads 2
In the mounting machine of the above-described embodiment having 0, the processing of steps S12 to S29 is repeated for each suction head 20, whereby the correction amount data for each suction head 20 is calculated and stored in the storage unit 45. To be done.

When the correction amount calculation process is completed in this way, the mounting operation for mounting the electronic component by the mounting machine is started. At this time, as in the case of the first embodiment, the correction amount data stored in the storage unit 45 is read out to the main calculation unit 42, and the target mounting position of the electronic component based on the correction amount data, That is, the target movement position of the head unit 5 is corrected. Then, a drive signal corresponding to the corrected target mounting position is output to the motor, so that the head unit 5 is moved and the electronic component is mounted.

In this way, the X of the reference electronic component 50 is
After mounting a plurality of electronic components on the same axial line in the axial direction and the same axial line in the Y axis direction at predetermined intervals and alternately rotated about the R axis by 180 °, these electronic components are mounted on the board recognition camera 37. And the average value (Xa ′, Y) of the shift amount of the center position of each electronic component image picked up by the
The correction amount (A, B) for the target mounting position of the electronic component is obtained from b ′) and the position correction process for storing the correction amount is performed. At the time of mounting, the preset target mounting position of the electronic component is set based on this correction amount. Also in the position correcting method of the second embodiment, which is configured to be mounted while performing correction, as in the position correcting method of the first embodiment, when the electronic component cannot be positioned at a predetermined position, the position shift of the electronic component is caused. It is possible to carry out the mounting operation in consideration of the above, and thus it is possible to preferably maintain a predetermined mounting accuracy.

In the position correction process of the position correction method of the second embodiment, X is set with the electronic component 50 as a reference.
Three electronic components are mounted in the axial direction and the Y-axis direction, displacement amounts Xa and Yb of the center positions of adjacent electronic components are respectively obtained, and an average value (Xa ', Yb) of these displacement amounts Xa and Yb is obtained.
A value (A, B) that is 1/2 of b ′) is stored as a correction amount. For example, a state of being rotated by 180 ° in the X-axis direction and the Y-axis direction with the electronic component 50 as a reference. It is also possible to mount only one of these electronic components and set the correction amount to a value that is ½ of the shift amount between the electronic component 50 and the center position of these electronic components. According to this, it is possible to mount and image the electronic component in a short time, and therefore, it is possible to reduce the time required for the position correction process. However, from the viewpoint of ensuring high correction accuracy, a plurality of electronic components are mounted side by side in the X-axis direction and the Y-axis direction based on the electronic component 50 as in the above-described embodiment, and correction is performed from the average value of these deviation amounts. It is preferable to determine the amount.

Further, in each of the above embodiments, the positional deviation of the electronic component mounted on a trial basis is detected based on the image recognition using the image pickup means. The positional deviation may be measured by visual inspection or the like, and the data may be input to the control device 40 to be stored in the storage unit 45.

Further, in the position correction process of the above embodiment, the electronic component is mounted on the dummy substrate to capture an image. In this case, for example, a white board dummy substrate is applied to perform the position correction process. By doing so, it is possible to further clarify the mounted electronic component and improve the recognition accuracy of the electronic component. Furthermore, by applying a dummy substrate with double-sided tape attached to the surface of the dummy substrate and attaching electronic components to the dummy substrate by the adhesive force of this tape, the attached electronic components can be easily removed from the dummy substrate. Can be reused.

[0072]

As described above, according to the present invention, after the electronic component is positioned by the correction arm and mounted at a predetermined mounting position, the electronic component is imaged by the image pickup means mounted on the head unit, A correction amount for the target mounting position of the electronic component is calculated from the image position of the electronic component imaged by, and the target mounting position of the electronic component, that is, the target moving position of the head unit during mounting is corrected based on this correction amount. Therefore, even if the correction arm is worn or the like, it is possible to perform mounting by taking into account the amount of deviation from the predetermined positioning position of the electronic component caused by this, and as a result, the predetermined mounting is performed. The accuracy can be preferably maintained.

Further, a plurality of electronic components are mounted at predetermined intervals in the moving direction of the head unit and alternately rotated by a constant angle, these electronic components are sequentially imaged, and the image position of each electronic component is imaged. Therefore, if the correction amount is calculated, a more accurate correction amount can be obtained, and the mounting accuracy can be better maintained.

[Brief description of drawings]

FIG. 1 is a plan view showing a mounting machine to which an example of a position correction device according to the present invention is applied.

FIG. 2 is a front view showing a head unit.

FIG. 3 is a cross-sectional view showing the structure of a suction head.

FIG. 4 is a view of the tip of the suction head as viewed in the direction of arrow A in FIG.

FIG. 5 is a block diagram showing a control system of the mounting machine.

FIG. 6 is a flowchart showing a position correction process in the position correction method of the first embodiment.

FIG. 7 is a schematic view showing a state in which an electronic component is positioned by a correction arm.

FIG. 8 is a schematic diagram showing the mounted electronic component.

FIG. 9 is a flowchart showing a position correction process in the position correction method of the second embodiment.

FIG. 10 is a schematic view showing the mounted electronic component.

[Explanation of symbols]

 1 Base 2 Conveyor 3 Printed Circuit Board 4 Component Supply Unit 5 Head Unit 20 Suction Head 21 Suction Nozzle 22A, 22B, 23A, 23B Correction Arm 37 Board Recognition Camera 38 Light Emitting Body 40 Controller 41 Axis Control Unit 42 Main Computing Unit 43 Image Processing unit 44 Correction amount calculation unit 45 Storage unit

Claims (3)

[Claims] 1. A movable head unit is equipped with a suction nozzle and a correction arm for positioning by picking up an electronic component. The suction nozzle sucks an electronic component on the component supply side and the correction arm In a mounting machine that mounts electronic components on a printed circuit board on the component mounting side, electronically mounts the electronic components on a predetermined mounting position on the component mounting side, and shifts the electronic components from the predetermined mounting position. The correction amount corresponding to the positioning error by the correction arm is calculated based on this displacement amount, and the correction amount data is stored. During the mounting operation, the correction amount data of the electronic component of the electronic component is stored based on the correction amount data stored. A method for correcting the position of a mounting machine, which comprises correcting a target mounting position. 2. A rotatable suction nozzle for sucking an electronic component, which is provided in a movable head unit, a correction arm for picking up and positioning an electronic component sucked by the suction nozzle, the head unit, and In a mounting machine provided with a driving unit for a suction nozzle, the image pickup unit mounted on the head unit and an electronic component are mounted at a predetermined mounting position, and the electronic component mounted by the mounting unit is mounted at a predetermined image capturing position. Drive control means for actuating the drive means to arrange the image pickup means, correction amount calculation means for calculating a correction amount for a target mounting position of the electronic component based on the image position of the electronic component captured by the image pickup means, and Storage means for storing the corrected amount data,
A position correcting apparatus for a mounting machine, comprising: a correcting unit that corrects a target mounting position of an electronic component based on the correction amount data read from the storage unit. 3. The drive control means actuates the drive means to mount a plurality of electronic components at predetermined intervals in the moving direction of the head unit and alternately while rotating by a constant angle, 3. The position correcting apparatus for a mounting machine according to claim 2, wherein the correction amount calculating means calculates the correction amount based on the image position of each electronic component.