JPH08228062A - Connecting structure of lead pin - Google Patents
Connecting structure of lead pinInfo
- Publication number
- JPH08228062A JPH08228062A JP7032217A JP3221795A JPH08228062A JP H08228062 A JPH08228062 A JP H08228062A JP 7032217 A JP7032217 A JP 7032217A JP 3221795 A JP3221795 A JP 3221795A JP H08228062 A JPH08228062 A JP H08228062A
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- solder
- circuit board
- electric circuit
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、電子部品のリードピ
ンを、電気回路基板のスルホールに挿通した上で両面半
田付け接合する技術に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for inserting lead pins of electronic parts into through holes of an electric circuit board and then soldering them to both sides.
【０００２】[0002]
【従来の技術】図４に示すのは、この種の従来技術であ
り、電子部品のリードピン１を電気回路基板６のスルホ
ール２に挿通し、リードピン１の遊端部側から半田４を
塗布して電気回路基板６の表裏面に半田４付け接合して
いる。2. Description of the Related Art FIG. 4 shows a conventional technique of this type, in which a lead pin 1 of an electronic component is inserted into a through hole 2 of an electric circuit board 6 and a solder 4 is applied from the free end side of the lead pin 1. The solder 4 is bonded to the front and back surfaces of the electric circuit board 6.
【０００３】半田４の塗布は、通常、リードピン１を挿
通した電気回路基板６をリフロー炉に浸して行う。この
とき、半田浴に浸されるのは、電気回路基板６のリード
ピン１の遊端部が突出した側であるので、この側には、
半田４が高く盛り上がるが、スルホール２を介して吸い
上げる（表面張力によって付着する）反対側の半田４の
盛り上げ量は不足しがちとなる。The application of the solder 4 is usually performed by immersing the electric circuit board 6 having the lead pins 1 inserted therein in a reflow furnace. At this time, it is the side into which the free end of the lead pin 1 of the electric circuit board 6 projects that is immersed in the solder bath.
Although the solder 4 swells high, the amount of swelling of the solder 4 on the opposite side sucked up (attached by surface tension) through the through hole 2 tends to be insufficient.
【０００４】上記のような状態は、次のような場合にも
同様に起こる。半田４の塗布を、リードピン１を挿通し
た電気回路基板６の上面から行った場合においても、半
田４の歩留りは、電気回路基板６の下面側において充分
であるが上面側では不足勝ちとなる。The above-mentioned state also occurs in the following cases. Even when the application of the solder 4 is performed from the upper surface of the electric circuit board 6 in which the lead pins 1 are inserted, the yield of the solder 4 is sufficient on the lower surface side of the electric circuit board 6 but insufficient on the upper surface side.
【０００５】[0005]
【発明が解決しようとする課題】上記のような状態で
は、リードピン１は、主に遊端部側の半田４付けのみで
支持されているので、振動が加わったり、熱応力が加わ
ると、この半田４付け部に応力が集中し破壊する。In the above-mentioned state, the lead pin 1 is mainly supported only by the attachment of the solder 4 on the free end side. Therefore, when vibration is applied or thermal stress is applied, Stress concentrates on the solder 4 attachment portion and breaks.
【０００６】本発明は、上記事由に鑑みてなしたもの
で、リードピン１やリードピン１の半田４付け部が破損
しにくいリードピンの接続構造を提供することである。The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a lead pin connection structure in which the lead pin 1 and the solder 4 attachment portion of the lead pin 1 are less likely to be damaged.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決する請求
項１記載の発明は、電子部品７のリードピン１を電気回
路基板６のスルホール２に挿通し、この挿通部におい
て、電気回路基板６の両面に半田４を塗布してなるリー
ドピンの接続構造であって、電気回路基板６の電子部品
７側において、リードピン１に半田４の盛り上がりを助
けるリング３を巻装して成ることを特徴とするリードピ
ンの接続構造である。According to a first aspect of the invention for solving the above-mentioned problems, the lead pin 1 of the electronic component 7 is inserted into the through hole 2 of the electric circuit board 6, and the electric circuit board 6 is inserted at this insertion portion. A lead pin connection structure, in which solder 4 is applied on both sides, is characterized in that a lead pin 1 is wound around a ring 3 on the electronic component 7 side of an electric circuit board 6 to help the solder 4 rise up. This is a lead pin connection structure.
【０００８】請求項２記載の発明は、リング３がローレ
ット８を形成して成ることを特徴とするリードピンの接
続構造である。A second aspect of the present invention is a lead pin connection structure, wherein the ring 3 is formed by forming a knurl 8.
【０００９】請求項３記載の発明は、リング３がコイル
であることを特徴とするリードピンの接続構造である。The third aspect of the present invention is the lead pin connection structure, wherein the ring 3 is a coil.
【００１０】請求項４記載の発明は、電子部品７のリー
ドピン１を電気回路基板６のスルホール２に挿通し、電
気回路基板６の電子部品７側において、リードピン１に
半田４の盛り上がりを助けるリング３を巻装し、リード
ピン１の遊端部側から半田４を塗布することを特徴とす
るリードピンの接続方法である。According to a fourth aspect of the present invention, the lead pin 1 of the electronic component 7 is inserted into the through hole 2 of the electric circuit board 6 so that the lead pin 1 on the electronic component 7 side of the electric circuit board 6 helps the solder 4 to rise up. 3 is a winding method, and the solder 4 is applied from the free end side of the lead pin 1, which is a lead pin connecting method.
【００１１】半田４の盛り上がりを助けるリング３は、
表面処理を施したり、その形状に工夫を凝らすことによ
り形成されている。表面処理の例としては、半田メッ
キ、金メッキ等を施す例がある。その形状に工夫を凝ら
す例としては、請求項２、請求項３に示す例等がある。
そして、これらの工夫が単独で、または、複合して用い
られる。The ring 3 that helps the solder 4 to rise is
It is formed by applying a surface treatment or devising its shape. Examples of the surface treatment include solder plating, gold plating and the like. Examples in which the shape is devised include the examples shown in claims 2 and 3.
And these ideas are used individually or in combination.
【００１２】ここで、電子部品７には、ＩＣを樹脂封止
し、その端子としてリードピン１を設けたもの、あるい
は、小さな回路基板に複数のＩＣを搭載したものを樹脂
封止し、その端子として複数のリードピン１を設けたも
の等が用いられる。Here, as the electronic component 7, an IC is resin-sealed and the lead pin 1 is provided as a terminal thereof, or a plurality of ICs mounted on a small circuit board is resin-sealed and its terminal is provided. For example, a device provided with a plurality of lead pins 1 is used.
【００１３】[0013]
【作用】請求項１記載の発明では、リング３が半田４の
盛り上がりを助けるので、半田４の歩留りは、電気回路
基板６のリードピン１の遊端部側においても、電子部品
側においても充分となる。According to the present invention, the ring 3 assists the solder 4 to rise up, so that the yield of the solder 4 is sufficient both on the free end side of the lead pin 1 of the electric circuit board 6 and on the electronic component side. Become.
【００１４】請求項２記載の発明では、半田４がローレ
ット８に吸い上げれて、その歩留りが電気回路基板６の
電子部品側においても充分となる。According to the second aspect of the invention, the solder 4 is sucked up by the knurls 8 and the yield is sufficient even on the electronic component side of the electric circuit board 6.
【００１５】請求項３記載の発明では、半田４がコイル
状のリング３に吸い上げられるので、その歩留りが電気
回路基板６の電子部品側においても充分となる。According to the third aspect of the invention, since the solder 4 is sucked up by the coiled ring 3, the yield is sufficient even on the electronic component side of the electric circuit board 6.
【００１６】請求項４記載の発明では、リング３が半田
４の盛り上がりを助けるので、半田４の歩留りは、リー
ドピン１の遊端部側においても、電子部品側においても
充分となる。In the invention according to claim 4, since the ring 3 assists the swelling of the solder 4, the yield of the solder 4 is sufficient both on the free end side of the lead pin 1 and on the electronic component side.
【００１７】[0017]
【実施例】本発明の実施例について以下に説明する。EXAMPLES Examples of the present invention will be described below.
【００１８】図１、図２は本発明に係わる一実施例を示
す。リードピン１は、電子部品７に設けられたもので、
このリードピン１が電気回路基板６のスルホール２に挿
通され、半田４にて固定されている。このようにして、
電子部品７は、電気回路基板６の上にリードピン１によ
って実装されるのである。1 and 2 show an embodiment according to the present invention. The lead pin 1 is provided on the electronic component 7,
The lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and fixed by the solder 4. In this way,
The electronic component 7 is mounted on the electric circuit board 6 by the lead pins 1.
【００１９】このリードピン１の、電気回路基板６の電
子部品７側において、リードピン１に、半田４の盛り上
がりを助けるローレット８を形成し、且つ、金メッキを
施したリング３を巻装している。図２Ａは、上記のロー
レット８を形成したリング３を示している。On the electronic component 7 side of the electric circuit board 6 of the lead pin 1, a knurl 8 for assisting the swelling of the solder 4 is formed on the lead pin 1, and a ring 3 plated with gold is wound. FIG. 2A shows the ring 3 on which the knurl 8 has been formed.
【００２０】具体的な半田４付けによる実装作業は、次
のようになされる。電気回路基板６の電子部品７側（以
下、この実施例では「上面側」という）において、電子
部品７のリードピン１に半田４の盛り上がりを助けるロ
ーレット８を形成したリング３を巻装し、その状態でリ
ードピン１を電気回路基板６のスルホール２に挿通し、
電気回路基板６の上面側において、リードピン１にリン
グ３を巻装した状態となし、リフロー炉により、リード
ピン１の遊端部側（以下、この実施例では「下面側」と
いう）から半田４を塗布する．このようにして半田４付
けされると、リング３のローレット８が半田４の盛り上
がりを助けているので、半田４の歩留りは、電気回路基
板６の下面側においても、上面側においても充分となっ
ている。The specific mounting work by soldering 4 is performed as follows. On the electronic component 7 side of the electric circuit board 6 (hereinafter referred to as “upper surface side” in this embodiment), the lead pin 1 of the electronic component 7 is wound with the ring 3 formed with the knurls 8 that help the solder 4 to rise. Insert the lead pin 1 into the through hole 2 of the electric circuit board 6 in the state,
On the upper surface side of the electric circuit board 6, the ring 3 is wound around the lead pin 1, and the solder 4 is applied from the free end side of the lead pin 1 (hereinafter, referred to as “lower surface side” in this embodiment) by a reflow furnace. Apply. When the solder 4 is attached in this manner, the knurls 8 of the ring 3 help the solder 4 to rise, so that the yield of the solder 4 is sufficient on both the lower surface side and the upper surface side of the electric circuit board 6. ing.
【００２１】図２Ｂは本発明に係わる異なる実施例を示
す。即ち、本発明の異なる実施例に使用するリング３を
示している。このリング３は、コイルからなる。FIG. 2B shows a different embodiment according to the present invention. That is, the ring 3 used in different embodiments of the present invention is shown. This ring 3 consists of a coil.
【００２２】このリング３は、巻装される線間が連続し
た溝となり、半田４がコイル状のリング３に吸い上げら
れるので、その歩留りが電気回路基板６の上面側におい
ても、下面側においても充分となる。The ring 3 forms a continuous groove between the wound wires, and the solder 4 is sucked up by the coiled ring 3, so that the yield is obtained on both the upper surface side and the lower surface side of the electric circuit board 6. Will be enough.
【００２３】[0023]
【発明の効果】本発明によれば、リードピン１やリード
ピン１の半田４付け部が破損しにくいリードピンの接続
構造を提供できた。具体的には、以下の通りである。According to the present invention, it is possible to provide a lead pin connecting structure in which the lead pin 1 and the solder 4 attachment portion of the lead pin 1 are less likely to be damaged. Specifically, it is as follows.
【００２４】請求項１記載の発明では、リング３が半田
４の盛り上がりを助けるので、半田４の歩留りは、電気
回路基板６のリードピン１の遊端部側においても、電子
部品７側においても充分となる。この結果、リードピン
１やリードピン１の半田４付け部が破損しにくい。According to the first aspect of the present invention, since the ring 3 helps the solder 4 to rise up, the yield of the solder 4 is sufficient on both the free end side of the lead pin 1 of the electric circuit board 6 and the electronic component 7 side. Becomes As a result, the lead pin 1 and the solder 4 attachment portion of the lead pin 1 are less likely to be damaged.
【００２５】請求項２記載の発明では、半田４がローレ
ット８に吸い上げれて、その歩留りが電気回路基板６の
電子部品７側においても充分となる。According to the second aspect of the invention, the solder 4 is sucked up by the knurls 8 and the yield is sufficient even on the electronic component 7 side of the electric circuit board 6.
【００２６】請求項３記載の発明では、半田４がコイル
状のリング３に吸い上げられるので、その歩留りが電気
回路基板６の電子部品７側においても充分となる。According to the third aspect of the invention, since the solder 4 is sucked up by the coil-shaped ring 3, the yield is sufficient even on the electronic component 7 side of the electric circuit board 6.
【００２７】請求項４記載の発明では、歩留りが、リー
ドピン１の遊端部側においても、電子部品７側において
も充分となる半田４付けが可能である。According to the fourth aspect of the invention, the solder 4 can be attached so that the yield is sufficient both on the free end side of the lead pin 1 and on the electronic component 7 side.
【図１】本発明の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】同上の要部を示す斜視図。FIG. 2 is a perspective view showing a main part of the same.
【図３】従来例を示す断面図。FIG. 3 is a sectional view showing a conventional example.
１ リードピン ２ スルホール ３ リング ４ 半田 ６ 電気回路基板 ７ 電子部品 ８ ローレット 1 lead pin 2 through hole 3 ring 4 solder 6 electric circuit board 7 electronic component 8 knurl
Claims (4)
板６のスルホール２に挿通し、この挿通部において、電
気回路基板６の両面に半田４を塗布してなるリードピン
の接続構造であって、電気回路基板６の電子部品７側に
おいて、リードピン１に半田４の盛り上がりを助けるリ
ング３を巻装して成ることを特徴とするリードピンの接
続構造。1. A lead pin connection structure in which a lead pin 1 of an electronic component 7 is inserted into a through hole 2 of an electric circuit board 6 and solder 4 is applied to both surfaces of the electric circuit board 6 at the insertion portion. A lead pin connection structure, characterized in that a ring 3 for winding up the solder 4 is wound around the lead pin 1 on the electronic component 7 side of the electric circuit board 6.
ことを特徴とするリードピンの接続構造。2. A lead pin connecting structure, wherein the ring 3 is formed by forming a knurl 8.
るリードピンの接続構造。3. A lead pin connection structure, wherein the ring 3 is a coil.
板６のスルホール２に挿通し、電気回路基板６の電子部
品７側において、リードピン１に半田４の盛り上がりを
助けるリング３を巻装し、リードピン１の遊端部側から
半田４を塗布することを特徴とするリードピンの接続方
法。4. A lead pin 1 of an electronic component 7 is inserted into a through hole 2 of an electric circuit board 6, and a ring 3 for winding up the solder 4 is wound around the lead pin 1 on the electronic component 7 side of the electric circuit board 6, A method for connecting lead pins, characterized in that the solder 4 is applied from the free end side of the lead pin 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032217A JPH08228062A (en) | 1995-02-21 | 1995-02-21 | Connecting structure of lead pin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7032217A JPH08228062A (en) | 1995-02-21 | 1995-02-21 | Connecting structure of lead pin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08228062A true JPH08228062A (en) | 1996-09-03 |
Family
ID=12352769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7032217A Withdrawn JPH08228062A (en) | 1995-02-21 | 1995-02-21 | Connecting structure of lead pin |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08228062A (en) |
-
1995
- 1995-02-21 JP JP7032217A patent/JPH08228062A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20020507 |