JP3511716B2 - How to mount electronic components with lead pins - Google Patents
How to mount electronic components with lead pinsInfo
- Publication number
- JP3511716B2 JP3511716B2 JP03671395A JP3671395A JP3511716B2 JP 3511716 B2 JP3511716 B2 JP 3511716B2 JP 03671395 A JP03671395 A JP 03671395A JP 3671395 A JP3671395 A JP 3671395A JP 3511716 B2 JP3511716 B2 JP 3511716B2
- Authority
- JP
- Japan
- Prior art keywords
- lead pin
- electronic component
- circuit board
- electric circuit
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Description
【０００１】[0001]
【産業上の利用分野】この発明は、リードピン１を電気
回路基板６のスルホール２に挿通し半田４付けして実装
するリードピン付電子部品の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting an electronic component with a lead pin, in which a lead pin 1 is inserted into a through hole 2 of an electric circuit board 6 and solder 4 is mounted.
【０００２】[0002]
【従来の技術】図３に示すのは、この種の従来技術であ
り、リードピン付電子部品７のリードピン１を電気回路
基板６のスルホール２に挿通し半田４付けして実装して
いる。2. Description of the Related Art FIG. 3 shows a conventional technique of this type, in which a lead pin 1 of an electronic component 7 with a lead pin is inserted into a through hole 2 of an electric circuit board 6 and solder 4 is mounted.
【０００３】半田４の塗布は、通常、リードピン１を挿
通した電気回路基板６をリフロー炉に浸して行う。この
とき、半田浴に浸されるのは、電気回路基板６のリード
ピン１の遊端部が突出した側であるので、この側には、
半田４が高く盛り上がるが、スルホール２を介して吸い
上げる（表面張力によって付着する）反対側の半田４の
盛り上げ量は殆ど期待できない。The application of the solder 4 is usually performed by immersing the electric circuit board 6 having the lead pins 1 inserted therein in a reflow furnace. At this time, it is the side into which the free end of the lead pin 1 of the electric circuit board 6 projects that is immersed in the solder bath.
Although the solder 4 swells high, the amount of swelling of the solder 4 on the opposite side sucked up through the through hole 2 (attached by surface tension) can hardly be expected.
【０００４】上記のような状態では、リードピン１は、
主に遊端部側の半田４付けのみでスルホール２に支持さ
れているので、振動が加わったり、熱応力が加わると、
この半田４付け部に応力が集中し破壊する。このような
事態は、リフロー炉に浸して行う場合以外にも、半田４
付けを電気回路基板６の片面のみにておこなう場合に生
じる。In the above state, the lead pin 1 is
Since it is mainly supported by the through hole 2 only by attaching the solder 4 on the free end side, when vibration is applied or thermal stress is applied,
Stress concentrates on the solder 4 attachment portion and breaks. Such a situation is not limited to the case of immersing in the reflow furnace and the solder 4
This occurs when the attachment is performed on only one side of the electric circuit board 6.
【０００５】そこで、図３に示すように、リードピン付
電子部品７が大型であって、半田４付けのみでは、リー
ドピン付電子部品７の実装が確実に行われない虞の有る
場合には、さらに、リードピン付電子部品７の下部を電
気回路基板６に接着剤５で固定することがおこなれる。Therefore, as shown in FIG. 3, when the electronic component 7 with lead pins is large and there is a possibility that the electronic component 7 with lead pins may not be reliably mounted only by soldering 4, it is further necessary. The lower part of the electronic component 7 with lead pins is fixed to the electric circuit board 6 with the adhesive 5.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、電気回
路基板６とリードピン付電子部品７の下部間に接着剤５
を塗布するのは困難であり、接着剤５による固定を充分
に期待しえない場合があった。However, the adhesive 5 is provided between the electric circuit board 6 and the lower portion of the electronic component 7 with the lead pin.
Was difficult to apply, and there were cases in which fixing with the adhesive 5 could not be fully expected.
【０００７】本発明は、上記事由に鑑みてなしたもの
で、確実な固定が容易な、リードピン１を電気回路基板
６のスルホール２に挿通し半田４付けして実装する、リ
ードピン付電子部品７の実装方法を提供することを目的
とする。The present invention has been made in view of the above circumstances, and is an electronic component 7 with a lead pin, in which the lead pin 1 is easily fixed and fixed, and the lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and solder 4 is mounted. an object of the present invention is to provide a method of mounting.
【０００８】[0008]
【課題を解決するための手段】上記課題を解決するこの
発明に係るリードピン付電子部品は、リードピン付電子
部品７に突設されたリードピン１を中空管とし、このリ
ードピン１の遊端部に送り込み孔９を設け、このリード
ピン１の基部側に送り出し孔８を設けてなるものであ
る。Means for Solving the Problems] lead pin electronic part mounted according to the present invention for solving the problems is the lead pin 1 projecting from the lead pin with the electronic component 7 is a hollow tube, the free end portion of the lead pin 1 the feed hole 9 provided, those formed by the bore 8 feeding the base side of the lead pin 1 provided.
【０００９】ここで、送り出し孔８は、リードピン１の
基部側に周囲方向に等間隔で設けらていることが、接着
剤５を四周に供給するのを容易にするので、リードピン
１と電気回路基板６との間の接着を強固にするのに有効
である。Here, since the feed-out holes 8 are provided on the base side of the lead pin 1 at equal intervals in the circumferential direction, it becomes easy to supply the adhesive 5 to the four circumferences, and therefore the lead pin 1 and the electric circuit. It is effective in strengthening the adhesion with the substrate 6.
【００１０】また、送り込み孔９は、リードピン１の遊
端面を開口して設けるようにすると中空管の端部をその
まま使える。If the feed hole 9 is provided by opening the free end surface of the lead pin 1, the end portion of the hollow tube can be used as it is.
【００１１】上記課題を解決するこの発明のリードピン
付電子部品の実装方法は、上記に記載のリードピン付電
子部品のリードピン１を、電気回路基板６のスルホール
２に挿通して、この電気回路基板６に半田４付けし、送
り込み孔９から接着剤５を注入して送り出し孔８からリ
ードピン付電子部品７と電気回路基板６の間に充填する
ことを特徴とするものである。According to the method of mounting an electronic component with a lead pin of the present invention for solving the above-mentioned problems, the lead pin 1 of the electronic component with a lead pin described above is inserted into the through hole 2 of the electric circuit board 6, and the electric circuit board 6 is inserted. It is characterized in that the solder 4 is attached to the above, the adhesive 5 is injected from the feeding hole 9, and the space between the electronic component 7 with the lead pin and the electric circuit board 6 is filled from the feeding hole 8.
【００１２】このリードピン１の遊端部側を電気回路基
板６に半田４付けするのは、リードピン１の遊端部側を
リフロー炉に浸したり、リードピン１の遊端部側に溶融
半田４を滴下しておこなう等任意の方法が採用できる。The soldering of the free end side of the lead pin 1 to the electric circuit board 6 is performed by immersing the free end side of the lead pin 1 in a reflow furnace or by applying the molten solder 4 to the free end side of the lead pin 1. Any method such as dropping may be employed.
【００１３】接着剤５としては、通常、合成樹脂系のも
のが使用される。ここで、電子部品７には、ＩＣを樹脂
封止し、その端子としてリードピン１を設けたもの、あ
るいは、小さな回路基板に複数のＩＣを搭載したものを
樹脂封止し、その端子として複数のリードピン１を設け
たもの等が用いられる。As the adhesive 5, a synthetic resin type is usually used. Here, in the electronic component 7, an IC is resin-sealed and the lead pin 1 is provided as a terminal thereof, or a plurality of ICs mounted on a small circuit board is resin-sealed and a plurality of ICs are used as terminals thereof. The one provided with the lead pin 1 or the like is used.
【００１４】[0014]
【作用】この発明のリードピン付電子部品では、送り込
み孔９から接着剤５を注入して送り出し孔８から電子部
品７と電気回路基板６の間に充填することができるの
で、電子部品７をスルホール２に挿通したリードピン１
の電気回路基板６への半田４付けのみならず、電子部品
７と電気回路基板６とを、接着剤５にて接着固定でき
る。このようにして、リードピン付電子部品は、半田４
と接着剤５にて強固に実装できる。In the electronic component with lead pins according to the present invention, the adhesive 5 can be injected from the feed hole 9 and filled between the electronic component 7 and the electric circuit board 6 from the feed hole 8. Lead pin 1 inserted in 2
Not only can the solder 4 be attached to the electric circuit board 6, but the electronic component 7 and the electric circuit board 6 can be bonded and fixed with the adhesive 5. In this way, the electronic components with lead pins are
It can be firmly mounted with the adhesive 5.
【００１５】ここで、送り出し孔８は、リードピン１の
基部に周囲方向に等間隔で設けらていると接着剤５を四
周に供給するのを容易にする。Here, the feed-out holes 8 make it easy to supply the adhesive 5 to the four circumferences when provided at the base of the lead pin 1 at equal intervals in the circumferential direction.
【００１６】また、送り込み孔９は、リードピン１の遊
端面を開口して設けるようにすると中空管の端部をその
まま使える。If the feed hole 9 is provided by opening the free end surface of the lead pin 1, the end portion of the hollow tube can be used as it is.
【００１７】この発明のリードピン付電子部品では、リ
ードピン１を電気回路基板６のスルホール２に挿通して
この電気回路基板６に半田４付けし、この状態で、送り
込み孔９から接着剤５を注入して送り出し孔８から電子
部品７と電気回路基板６の間に充填することが容易にお
こなえ、電子部品７と電気回路基板６とを、接着剤５に
て接着固定できる。In the electronic component with lead pins according to the present invention, the lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and the solder 4 is attached to the electric circuit board 6. In this state, the adhesive 5 is injected from the feed hole 9. Then, the space between the electronic component 7 and the electric circuit board 6 can be easily filled through the delivery hole 8, and the electronic component 7 and the electric circuit board 6 can be bonded and fixed with the adhesive 5.
【００１８】このようにして、リードピン付電子部品
は、半田４と接着剤５にて電気回路基板６に強固に実装
することが、容易にできる。In this way, the electronic component with lead pins can be easily mounted firmly on the electric circuit board 6 with the solder 4 and the adhesive 5.
【００１９】[0019]
【実施例】本発明の実施例について以下に説明する。EXAMPLES Examples of the present invention will be described below.
【００２０】図１、図２は本発明に係わる一実施例を示
す。リードピン付電子部品は、電子部品７に突設された
リードピン１を中空管とし、このリードピン１の遊端部
に送り込み孔９を設け、このリードピン１の基部に送り
出し孔８を設けてなる。1 and 2 show an embodiment according to the present invention. In the electronic component with lead pins, the lead pin 1 projecting from the electronic component 7 is a hollow tube, a feed hole 9 is provided at the free end of the lead pin 1, and a feed hole 8 is provided at the base of the lead pin 1.
【００２１】リードピン１は、電子部品７に設けられた
もので、このリードピン１が電気回路基板６のスルホー
ル２に挿通され、半田４にて固定されるものである。The lead pin 1 is provided on the electronic component 7, and the lead pin 1 is inserted into the through hole 2 of the electric circuit board 6 and fixed by the solder 4.
【００２２】図２に示すように、送り出し孔８は、リー
ドピン１の基部に周囲方向に等間隔で４個設けらてい
る。As shown in FIG. 2, four feed holes 8 are provided at the base of the lead pin 1 at equal intervals in the circumferential direction.
【００２３】また、送り込み孔９は、リードピン１の遊
端面を開口して設けている。このリードピン付電子部品
の実装方法は、以下のようにおこなわれる。The feed hole 9 is provided by opening the free end surface of the lead pin 1. The mounting method of this electronic component with lead pins is performed as follows.
【００２４】上記に記載のリードピン付電子部品のリー
ドピン１を、電気回路基板６のスルホール２に挿通し、
このリードピン１の遊端部側をリフロー炉等により、電
気回路基板６に半田４付けする。リードピン１の遊端部
側をリフロー炉に浸けても、浸ける時間をコントロール
すると表面張力により送り込み孔９が半田４で塞がるの
は防止される。The lead pin 1 of the electronic component with lead pins described above is inserted into the through hole 2 of the electric circuit board 6,
The free end side of the lead pin 1 is soldered to the electric circuit board 6 by a reflow furnace or the like. Even if the free end side of the lead pin 1 is dipped in the reflow furnace, the feeding hole 9 is prevented from being blocked by the solder 4 due to surface tension by controlling the dipping time.
【００２５】つづいて、送り込み孔９にノズルを押し当
ててこのノズルより接着剤５を注入して送り出し孔８か
らリードピン付電子部品７と電気回路基板６の間に充填
し、このようにして両者を接着する。Subsequently, a nozzle is pressed against the feed-in hole 9 to inject the adhesive 5 from this nozzle to fill the space between the lead pin-equipped electronic component 7 and the electric circuit board 6 from the feed-out hole 8. Glue.
【００２６】このようにして、リードピン付電子部品７
は、半田４と接着剤５とにより電気回路基板６の上に実
装されるのである。In this way, the electronic component with lead pin 7
Are mounted on the electric circuit board 6 by the solder 4 and the adhesive 5.
【００２７】[0027]
【発明の効果】この発明のリードピン付電子部品及びリ
ードピン付電子部品の実装方法では、送り込み孔９から
接着用樹脂を注入して送り出し孔８から電子部品７と電
気回路基板６の間に充填することが容易にできるので、
電子部品７を、スルホール２に挿通したリードピン１の
電気回路基板６への半田４付けのみならず、電子部品７
と電気回路基板６との接着剤５による接着で強固に固定
できる。このようにして、リードピン付電子部品は、半
田４と接着剤５にて電気回路基板６の上に強固に実装す
ることが容易にできる。According to the electronic component with lead pin and the method of mounting the electronic component with lead pin of the present invention, the adhesive resin is injected through the feed-in hole 9 and filled between the electronic component 7 and the electric circuit board 6 through the feed-out hole 8. Because you can easily
The electronic component 7 is not only attached to the solder 4 on the electric circuit board 6 of the lead pin 1 inserted through the through hole 2, but also the electronic component 7
And the electric circuit board 6 can be firmly fixed by adhesion with the adhesive 5. In this way, the electronic component with lead pins can be easily mounted firmly on the electric circuit board 6 with the solder 4 and the adhesive 5.
【図１】本発明の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】同上の要部を示す斜視図。FIG. 2 is a perspective view showing a main part of the same.
【図３】従来例を示す断面図。FIG. 3 is a cross-sectional view showing a conventional example.
１ リードピン ２ スルホール ４ 半田 ５ 接着剤 ６ 電気回路基板 ７ 電子部品 ８ 送り出し孔 ９ 送り込み孔 1 lead pin 2 through hole 4 solder 5 adhesive 6 electric circuit board 7 electronic components 8 Sending hole 9 Feed hole
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平７−58342（ＪＰ，Ａ) 特開 平４−2070（ＪＰ，Ａ) 特開 昭59−47747（ＪＰ，Ａ) 実開 昭58−109235（ＪＰ，Ｕ) 実開 昭56−167535（ＪＰ，Ｕ) 特表 昭63−501254（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01G 4/228 H01R 12/32 H05K 3/34 507 H05K 1/18 ─────────────────────────────────────────────────── --Continued from the front page (56) References JP-A-7-58342 (JP, A) JP-A-4-2070 (JP, A) JP-A-59-47747 (JP, A) Actual development Sho-58- 109235 (JP, U) Actual development Sho 56-167535 (JP, U) Special table 63-501254 (JP, A) (58) Fields investigated (Int.Cl. 7 , DB name) H01G 4/228 H01R 12 / 32 H05K 3/34 507 H05K 1/18
Claims (3)
ードピン１を中空管とし、このリードピン１の遊端部に
送り込み孔９を設け、このリードピン１の基部側に送り
出し孔８を設けてなるリードピン付電子部品の実装方法
であって、前記リードピン１を電気回路基板６のスルホ
ール２に挿通してこの電気回路基板６に半田４付けし、
送り込み孔９から接着剤５を注入して送り出し孔８から
リードピン付電子部品７と電気回路基板６の間に充填す
ることを特徴とするリードピン付電子部品の実装方法。1. A lead tube 1 projecting from an electronic component with a lead pin 7 is formed into a hollow tube, a feed hole 9 is provided at a free end portion of the lead pin 1, and a feed hole 8 is provided at a base side of the lead pin 1. Of mounting electronic components with lead pins
And the lead pin 1 is connected to the sulphate of the electric circuit board 6.
And then solder 4 to this electric circuit board 6,
Inject the adhesive 5 from the feeding hole 9 and from the feeding hole 8
Fill between the electronic component with lead pin 7 and the electric circuit board 6
Lead pins with the mounting method of electronic components, characterized in that that.
周囲方向に等間隔で設けられていることを特徴とする請
求項１記載のリードピン付電子部品の実装方法。2. The method for mounting an electronic component with lead pins according to claim 1, wherein the feed-out holes 8 are provided on the base side of the lead pin 1 at equal intervals in the circumferential direction.
開口していることを特徴とする請求項１記載のリードピ
ン付電子部品の実装方法。3. The method for mounting an electronic component with a lead pin according to claim 1, wherein the feed hole 9 is opened in the free end surface of the lead pin 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03671395A JP3511716B2 (en) | 1995-02-24 | 1995-02-24 | How to mount electronic components with lead pins |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP03671395A JP3511716B2 (en) | 1995-02-24 | 1995-02-24 | How to mount electronic components with lead pins |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08236396A JPH08236396A (en) | 1996-09-13 |
| JP3511716B2 true JP3511716B2 (en) | 2004-03-29 |
Family
ID=12477407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP03671395A Expired - Fee Related JP3511716B2 (en) | 1995-02-24 | 1995-02-24 | How to mount electronic components with lead pins |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3511716B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105246269A (en) * | 2015-10-30 | 2016-01-13 | 程啸 | Quick connection device and method for spring needle and circuit board |
-
1995
- 1995-02-24 JP JP03671395A patent/JP3511716B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH08236396A (en) | 1996-09-13 |
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