JPH06140751A - Method for lead wire soldering onto printed-wiring board - Google Patents
Method for lead wire soldering onto printed-wiring boardInfo
- Publication number
- JPH06140751A JPH06140751A JP29050692A JP29050692A JPH06140751A JP H06140751 A JPH06140751 A JP H06140751A JP 29050692 A JP29050692 A JP 29050692A JP 29050692 A JP29050692 A JP 29050692A JP H06140751 A JPH06140751 A JP H06140751A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- wiring board
- hole
- printed wiring
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、自動アセンブリー工程
におけるプリント配線基板へのリード線半田付け方法に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for soldering a lead wire to a printed wiring board in an automatic assembly process.
【０００２】[0002]
【従来の技術】図５は従来のプリント配線基板へのリー
ド線半田付け方法を説明する斜視図である。図６は従来
の方法でリード線をプリント配線基板へ半田付けした状
態を示す要部断面図である。2. Description of the Related Art FIG. 5 is a perspective view illustrating a conventional method for soldering a lead wire to a printed wiring board. FIG. 6 is a cross-sectional view of essential parts showing a state in which a lead wire is soldered to a printed wiring board by a conventional method.
【０００３】プリント配線基板に半田付けされる電子部
品には各種の半田付け仕様のものがある。例えば、リー
ド線のないチップ部品と言われるもの、あるいは、半田
鍍金を施した単線の裸リード線を備えるもの、あるい
は、絶縁被覆付き撚り線のリード線を備えるもの等であ
る。There are various soldering specifications for electronic components to be soldered to a printed wiring board. For example, a so-called chip component having no lead wire, a solder-plated single-wire bare lead wire, or a lead wire of a stranded wire with an insulation coating is used.
【０００４】図５に示すように、スピーカーＳのような
電子部品のリード線には絶縁被覆付き撚り線のリード線
Ｌ1 を備えるものが多い。このような絶縁被覆付き撚り
線のリード線Ｌ1 を、他の電子部品である抵抗Ｒのよう
な半田鍍金を施した単線の裸リード線Ｌ2 と共に、自動
半田付け工程にてプリント配線基板Ｐへ半田付けする場
合は次のように行われている。As shown in FIG. 5, many lead wires of electronic parts such as a speaker S are provided with a lead wire L 1 which is a stranded wire with an insulating coating. Such a stranded wire L 1 with an insulation coating, together with a bare lead wire L 2 which is a solder-plated single wire such as a resistor R which is another electronic component, is used in a printed wiring board P in an automatic soldering process. When soldering to, it is performed as follows.
【０００５】すなわち、プリント配線基板Ｐには、絶縁
被覆付き撚り線のリード線Ｌ1 の撚り線を挿入するため
の撚り線用リード孔Ｐ1 および単線の裸リード線Ｌ2 を
挿入するための単線用リード孔Ｐ2 などが設けられてい
る。このそれぞれのリード孔Ｐ1,Ｐ2 の周縁には半田付
けのためのランド（銅張部がレジストされずに露出して
いる部分）Ｐ0 （図６に示す）がそれぞれ形成されてい
る。Namely, in the printed wiring board P, for inserting the stranded wire lead hole P 1 and solid wire bare lead wire L 2 for inserting the stranded wire of the lead wire L 1 of the insulating coated strand A single wire lead hole P 2 and the like are provided. Lands (portions where the copper clad portions are exposed without being resisted) P 0 (shown in FIG. 6) for soldering are formed on the peripheral edges of the respective lead holes P 1 and P 2 .
【０００６】そこで、自動半田付け工程の前工程である
自動挿入工程では、プリント配線基板Ｐの撚り線用リー
ド孔Ｐ1 には絶縁被覆付き撚り線のリード線Ｌ1 の先端
を、プリント配線基板Ｐの単線用リード孔Ｐ2 には単線
の裸リード線Ｌ2 の先端をそれぞれ自動挿入する。その
後、リード線Ｌ1,Ｌ2 を挿入したプリント配線基板Ｐ
は、次工程である自動半田付け工程へ搬送される。自動
半田付け工程では、リード線とランドとを半田付けす
る。Therefore, in the automatic insertion step which is a step prior to the automatic soldering step, the tip of the lead wire L 1 of the twisted wire with the insulation coating is inserted into the lead wire hole P 1 for the twisted wire of the printed wiring board P. The tip ends of the single bare lead wires L 2 are automatically inserted into the P single wire lead holes P 2 . After that, the printed wiring board P in which the lead wires L 1 and L 2 are inserted
Is transferred to the next step, the automatic soldering step. In the automatic soldering process, the lead wire and the land are soldered.
【０００７】[0007]
【発明が解決しようとする課題】ところで、適切な半田
付けを施すためには、挿入されるリード径に対するプリ
ント配線基板のリード孔のクリアランスは、最大でも0.
4mm 程度にする必要があり、自動挿入が困難である。ま
た、自動挿入工程から次工程の自動半田付け工程までの
搬送の途中で、特に前述した絶縁被覆付き撚り線のリー
ド線がリード孔から抜け易い。従って、自動アセンブリ
ー工程におけるプリント配線基板へのリード線半田付け
の自動化が難しいと言う問題点があった。By the way, in order to perform appropriate soldering, the clearance of the lead hole of the printed wiring board with respect to the diameter of the lead to be inserted is at most 0.
It needs to be about 4 mm and automatic insertion is difficult. In addition, during the transportation from the automatic insertion step to the next automatic soldering step, in particular, the lead wire of the above-described stranded wire with an insulation coating is likely to come off from the lead hole. Therefore, there is a problem that it is difficult to automate the lead wire soldering to the printed wiring board in the automatic assembly process.
【０００８】本発明は、上記の問題を改善するために成
されたもので、その目的とするところは、自動化の図れ
るプリント配線基板へのリード線半田付け方法を提供す
ることにある。The present invention has been made to solve the above problems, and an object thereof is to provide a method for soldering a lead wire to a printed wiring board which can be automated.
【０００９】[0009]
【課題を解決するための手段】本発明は上記の問題点を
解決するため、リード線挿入部を備えると共に一端が窄
んだ可撓性を有する接続金具を用いて、リード線の先端
近傍を、プリント配線基板に設けた貫通孔の周縁に形成
したランドへ固定してから、リード線とランドとを半田
付けするプリント配線基板へのリード線半田付け方法で
あって、リード線の先端を前記接続金具のリード線挿入
部へ挿入した後、該接続金具を前記貫通孔に圧入してリ
ード線挿入部の幅を貫通孔によって狭めると共にリード
線挿入部に挿入されたリード線の先端近傍を前記ランド
へ固定し、その後リード線の先端近傍とランドとを半田
付けするように成したことを特徴とする。SUMMARY OF THE INVENTION In order to solve the above problems, the present invention uses a flexible connecting fitting having a lead wire insertion portion and having one end narrowed, and A method of soldering a lead wire to a printed wiring board, the method comprising: fixing a lead wire to a land formed on a peripheral edge of a through hole provided in the printed wiring board; After being inserted into the lead wire insertion portion of the connection fitting, the connection fitting is press-fitted into the through hole to narrow the width of the lead wire insertion portion by the through hole, and the vicinity of the tip of the lead wire inserted into the lead wire insertion portion is It is characterized in that it is fixed to a land and then the vicinity of the tip of the lead wire and the land are soldered.
【００１０】[0010]
【作用】上記のように構成したことにより、接続金具
は、プリント配線基板に設けた貫通孔へ、接続金具の窄
んだ方から挿入することができる。しかも、前記貫通孔
へ接続金具を圧入すると、接続金具は前記貫通孔との接
触により両側から押圧される。すると、接続金具のリー
ド線挿入部の幅は撓んで狭まることになる。すなわち、
リード線に対するリード線挿入部のクリアランスは大き
く採ってあっても、適切な半田付けが成される程度に狭
め得ると共に、接続金具のリード線挿入部にリード線の
先端近傍が挿入されていれば、そのリード線の先端近傍
は前記貫通孔の周縁に形成したランドに押しつけられ固
定する。従って、自動アセンブリー工程における自動挿
入工程では、リード線の先端近傍は前記貫通孔の周縁に
形成したランドへ簡単に固定できる。また、自動挿入工
程から次工程の自動半田付け工程までの搬送の途中でリ
ード線の先端が前記ランドから外れることも無くなるの
である。With the above construction, the connecting fitting can be inserted into the through hole provided in the printed wiring board from the side where the connecting fitting is narrowed. Moreover, when the connecting fitting is press-fitted into the through hole, the connecting fitting is pressed from both sides by contact with the through hole. Then, the width of the lead wire insertion portion of the connection fitting is bent and narrowed. That is,
Even if the clearance of the lead wire insertion part with respect to the lead wire is large, it can be narrowed to the extent that proper soldering can be performed, and if the vicinity of the tip of the lead wire is inserted in the lead wire insertion part of the connection fitting. The vicinity of the tip of the lead wire is pressed and fixed to a land formed on the peripheral edge of the through hole. Therefore, in the automatic insertion process in the automatic assembly process, the vicinity of the tip of the lead wire can be easily fixed to the land formed on the peripheral edge of the through hole. Further, the leading end of the lead wire does not come off from the land during the conveyance from the automatic insertion step to the next automatic soldering step.
【００１１】[0011]
【実施例】本発明に係るプリント配線基板へのリード線
半田付け方法の一実施例を図１〜図４に基づいて詳細に
説明する。図１は手順を説明する斜視図であり、図１
（ａ）は接続金具をプリント配線基板の貫通孔へ挿入す
る様子を、図１（ｂ）はリード線の先端を接続金具のリ
ード線挿入部に挿入する様子を、図１（ｃ）はリード線
を挿入した接続金具をプリント配線基板の貫通孔へ圧入
した様子を、図１（ｄ）はリード線の先端近傍とプリン
ト配線基板の貫通孔周縁のランドとを半田付けした様子
をそれぞれ示している。図２はリード線をプリント配線
基板へ半田付けした状態を示す要部断面図、図３は各種
電子部品の中の一部に本発明の方法を用いた半田付けの
完了したプリント配線基板を示す斜視図である。図４は
異なる形状の接続金具を説明する正面図であり、図４
（ａ）と図４（ｂ）とはそれぞれ異なる形状の接続金具
を示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a method for soldering a lead wire to a printed wiring board according to the present invention will be described in detail with reference to FIGS. FIG. 1 is a perspective view for explaining the procedure.
1 (a) shows how the connection fitting is inserted into the through hole of the printed wiring board, FIG. 1 (b) shows how the tip of the lead wire is inserted into the lead wire insertion portion of the connection fitting, and FIG. 1 (c) shows the lead. FIG. 1 (d) shows a state in which the connection metal fitting with the wire inserted therein is press-fitted into the through hole of the printed wiring board, and a state in which the vicinity of the tip of the lead wire and the land around the through hole of the printed wiring board are soldered. There is. FIG. 2 is a cross-sectional view of an essential part showing a state in which a lead wire is soldered to a printed wiring board, and FIG. 3 shows a printed wiring board which has been soldered by the method of the present invention to a part of various electronic components. It is a perspective view. FIG. 4 is a front view for explaining the connection fittings having different shapes.
(A) and FIG.4 (b) have shown the connection metal fitting of a respectively different shape.
【００１２】図１〜図３において、１は接続金具、Ｐは
プリント配線基板、Ｌはリード線である。接続金具１は
可撓性と導電性とを兼ね備え且つ半田付け性の良い銅あ
るいはベリリューム板材を加工したものである。接続金
具１は、正面視すると窄み部１ａを備えた略砲弾形の板
状のもで、リード線挿入部に相当するリード線挿入孔１
ｂが設けられている。このリード線挿入孔１ｂは正面視
すると雨垂れ形に成されている。プリント配線基板Ｐは
貫通孔Ｐa を備え、貫通孔Ｐa の周縁にはランドＰb が
形成されている。なお、貫通孔Ｐa の幅は接続金具１の
幅Ｗより狭くされている。リード線Ｌは絶縁被覆付きの
撚り線であり、先端近傍Ｌa の絶縁被覆は剥がされてい
る。1 to 3, reference numeral 1 is a connecting fitting, P is a printed wiring board, and L is a lead wire. The connection fitting 1 is made of copper or beryllium plate material having both flexibility and conductivity and good solderability. The connection fitting 1 is a substantially bullet-shaped plate-like member having a constricted portion 1a when viewed from the front, and a lead wire insertion hole 1 corresponding to a lead wire insertion portion.
b is provided. The lead wire insertion hole 1b has a raindrop shape when viewed from the front. Printed circuit board P is provided with a through hole P a, land P b is formed in the periphery of the through hole P a. The width of the through hole P a is smaller than the width W of the fitting 1. Lead L is a stranded wire with an insulating coating, the insulating coating of the tip near L a is peeled.
【００１３】自動アセンブリー工程における自動挿入工
程では、リード線Ｌの先端近傍Ｌaは、接続金具１を用
いてプリント配線基板Ｐの貫通孔Ｐa 周縁のランドＰb
へ、次のように固定する。すなわち、図１（ａ）に示す
ように、接続金具１の窄み部１ａの先端をプリント配線
基板Ｐの貫通孔Ｐa に軽く宛がう。その後、図１（ｂ）
に示すように、接続金具１のリード線挿入孔１ｂへリー
ド線Ｌの先端近傍Ｌaを挿入する。その後、図１（ｃ）
に示すように、接続金具１を上方から押圧し貫通孔Ｐa
へ圧入する。すると、接続金具１には貫通孔Ｐa により
両側から押圧する力が作用する。従って、接続金具１
は、リード線挿入孔１ｂが両側から狭められるように撓
んで変形しながら貫通孔Ｐa に入り込む。そして、リー
ド線Ｌの先端近傍Ｌa がリード線挿入孔１ｂに銜えられ
ながらランドＰb に接触したところで、接続金具１の貫
通孔Ｐa への圧入を停止する。すると、リード線Ｌの先
端近傍Ｌa はランドＰb に固定した状態となり、簡単に
は外れない状態になる。In the automatic insertion process in the automatic assembly process, the connection metal 1 is used for the vicinity L a of the tip of the lead wire L and the land P b around the through hole P a of the printed wiring board P is used.
To, fix as follows. That is, as shown in FIG. 1 (a), lightly the tip of Subomi portion 1a of the fitting 1 into the through hole P a of the printed wiring board P allot. After that, FIG. 1 (b)
As shown in FIG. 3, the lead wire vicinity L a of the lead wire L is inserted into the lead wire insertion hole 1 b of the connection fitting 1. After that, FIG. 1 (c)
As shown in, pressing the fitting 1 from the upper through hole P a
Press into. Then, the fitting 1 force of pressing from both sides by the through-holes P a is applied. Therefore, the connection fitting 1
Is it enters the through hole P a while being deformed flex as the lead wire insertion hole 1b is narrowed from both sides. Then, near the tip L a of the leads L to stop injection of where in contact with the Kuwae is while land P b to the lead wire insertion hole 1b, the through hole P a connection fitting 1. Then, near the tip L a of the lead wire L is brought into such a state fixed to the land P b, in a state that does not come off easily.
【００１４】なお、リード線Ｌの先端近傍Ｌa のランド
Ｐb への固定手順は、接続金具１のリード線挿入孔１ｂ
へリード線Ｌの先端近傍Ｌa を挿入してから、該接続金
具１の窄み部１ａの先端をプリント配線基板Ｐの貫通孔
Ｐa に宛がい圧入しても良い。The procedure for fixing the end portion L a of the lead wire L to the land P b is as follows.
To insert the tip near L a of the leads L, and the tip of Subomi portion 1a of the fitting 1 into the through hole P a of the printed circuit board P may be Ategai pressed.
【００１５】接続金具１を用いてリード線Ｌの先端近傍
Ｌa がランドＰb に固定されたプリント配線基板Ｐは、
次工程の自動半田付け工程へ搬送される。自動半田付け
工程では、リード線Ｌの先端近傍Ｌa とランドＰb との
半田付けは、糸半田供給タイプの自動半田付けロボット
などにより行い、図１（ｄ）に示すような状態に成る。
なお、プリント配線基板Ｐには、絶縁被覆付きの撚り線
のリード線Ｌを備える電子部品のみでなく、例えば、半
田鍍金を施した単線の裸リード線を備えるもの等も実装
されるので、プリント配線基板Ｐの裏面側の半田付け
は、半田デップ槽などにより行う。The printed wiring board P in which the vicinity L a of the lead wire L is fixed to the land P b using the connection fitting 1 is
It is transferred to the next process, the automatic soldering process. The automatic soldering process, soldering of the tip proximity L a and the land P b of the leads L are carried out by an automatic soldering robot wire solder feed type, comprising the state shown in FIG. 1 (d).
The printed wiring board P is mounted with not only an electronic component including a stranded lead wire L with an insulating coating but also, for example, a solder-plated single bare lead wire, etc. Soldering on the back surface side of the wiring board P is performed by a solder dip tank or the like.
【００１６】上述のようにして半田付けした接続金具１
の近傍の断面図は図２に示すようになる。また、各種半
田付け仕様の電子部品を半田付けしたプリント配線基板
Ｐの外観は図３に示すようになる。Connection fitting 1 soldered as described above
A sectional view in the vicinity of is as shown in FIG. Further, the appearance of the printed wiring board P to which the electronic components of various soldering specifications are soldered is as shown in FIG.
【００１７】接続金具としては、図１に示すような形状
の接続金具１とは限らず、図４（ａ）あるいは図４
（ｂ）に示す接続金具１０のようにリード線挿入部に相
当する部分をリード線挿入切り欠き１０ｂにしても良
い。リード線挿入切り欠き１０ｂの方向は、図４（ａ）
に示すように貫通孔Ｐa への接続金具１０の圧入方向に
対して下方に設けても良いし、図４（ｂ）に示すように
上方に設けても良い。図４において、Ｌは絶縁被覆付き
の撚り線のリード線であり、Ｐはプリント配線基板、Ｐ
b はランドである。The connecting fitting is not limited to the connecting fitting 1 having the shape as shown in FIG.
A portion corresponding to the lead wire insertion portion such as the connection fitting 10 shown in (b) may be a lead wire insertion notch 10b. The direction of the lead wire insertion notch 10b is as shown in FIG.
May be provided downwardly with respect to the press-fitting direction of the fitting 10 into the through-hole P a as shown in, it may be provided upwardly as shown in Figure 4 (b). In FIG. 4, L is a stranded lead wire with an insulating coating, P is a printed wiring board, P
b is a land.
【００１８】なお、本発明は上記実施例に限定されるも
のではなく、リード線としては絶縁被覆付きの単線であ
っても良く、絶縁被覆の無い単線であっても良く、貫通
孔Ｐ a の形状も丸ではなく矩形でも良い。The present invention is not limited to the above embodiment.
Instead, the lead wire is a solid wire with an insulation coating.
It may be a single wire without insulation coating,
Hole P aThe shape of may be rectangular instead of round.
【００１９】[0019]
【発明の効果】本発明のプリント配線基板へのリード線
半田付け方法は上記のような方法であるから、リード線
に対するリード線挿入部のクリアランスは大きく採って
あっても適切な半田付けが成される程度に狭め得ると共
に、接続金具のリード線挿入部に挿入したリード線の先
端近傍は貫通孔の周縁に形成したランドに押しつけられ
固定する。従って、自動挿入工程では、リード線の先端
近傍はランドへ簡単に固定でき、自動挿入工程から次工
程の自動半田付け工程までの搬送の途中でリード線の先
端がランドから外れることの無い、自動化の図り得るプ
リント配線基板へのリード線半田付け方法が提供できる
と言う効果を奏する。Since the method for soldering a lead wire to a printed wiring board according to the present invention is as described above, proper soldering can be performed even if the clearance of the lead wire insertion portion with respect to the lead wire is large. The lead wire inserted into the lead wire insertion portion of the connection fitting is pressed against and fixed to a land formed on the peripheral edge of the through hole. Therefore, in the automatic insertion process, the vicinity of the tip of the lead wire can be easily fixed to the land, and the tip of the lead wire does not come off from the land during the transportation from the automatic insertion process to the next automatic soldering process. It is possible to provide a method of soldering a lead wire to a printed wiring board which can be achieved.
【図１】本発明に係るプリント配線基板へのリード線半
田付け方法の一実施例の手順を説明する斜視図である。FIG. 1 is a perspective view illustrating a procedure of an embodiment of a method for soldering a lead wire to a printed wiring board according to the present invention.
【図２】本発明に係るプリント配線基板へのリード線半
田付け方法の一実施例により、リード線をプリント配線
基板へ半田付けした状態を示す要部断面図である。FIG. 2 is a cross-sectional view of essential parts showing a state in which a lead wire is soldered to a printed wiring board according to an embodiment of a method for soldering a lead wire to a printed wiring board according to the present invention.
【図３】各種電子部品の中の一部のリード線を、本発明
に係るプリント配線基板へのリード線半田付け方法の一
実施例により半田付けした、プリント配線基板を示す斜
視図である。FIG. 3 is a perspective view showing a printed wiring board to which some lead wires of various electronic components are soldered by an embodiment of the lead wire soldering method to the printed wiring board according to the present invention.
【図４】本発明に係るプリント配線基板へのリード線半
田付け方法に用いる、他の接続金具を説明する正面図で
ある。FIG. 4 is a front view illustrating another connecting fitting used in the method for soldering a lead wire to a printed wiring board according to the present invention.
【図５】従来のプリント配線基板へのリード線半田付け
方法を説明する斜視図である。FIG. 5 is a perspective view illustrating a conventional method of soldering a lead wire to a printed wiring board.
【図６】従来のプリント配線基板へのリード線半田付け
方法でリード線をプリント配線基板へ半田付けした状態
を示す要部断面図である。FIG. 6 is a cross-sectional view of essential parts showing a state in which a lead wire is soldered to a printed wiring board by a conventional method of soldering a lead wire to a printed wiring board.
１ 接続金具 １ｂ リード線挿入部 １０ 接続金具 １０ｂ リード線挿入部 Ｌ リード線 Ｌa リード線の先端近傍 Ｐ プリント配線基板 Ｐa 貫通孔 Ｐb ランド1 fitting 1b lead wire insertion portion 10 fitting 10b lead wire insertion portion L leads L a vicinity of the tip P printed wiring leads substrate P a through hole P b land
Claims (1)
んだ可撓性を有する接続金具を用いて、リード線の先端
近傍を、プリント配線基板に設けた貫通孔の周縁に形成
したランドへ固定してから、リード線とランドとを半田
付けするプリント配線基板へのリード線半田付け方法で
あって、リード線の先端を前記接続金具のリード線挿入
部へ挿入した後、該接続金具を前記貫通孔に圧入してリ
ード線挿入部の幅を貫通孔によって狭めると共にリード
線挿入部に挿入されたリード線の先端近傍を前記ランド
へ固定し、その後リード線の先端近傍とランドとを半田
付けするように成したことを特徴とするプリント配線基
板へのリード線半田付け方法。1. A flexible connecting fitting having a lead wire insertion portion and having one end narrowed to a land formed near the tip of the lead wire on the periphery of a through hole formed in a printed wiring board. A method of soldering a lead wire to a printed wiring board, comprising fixing a lead wire and a land to each other, wherein the tip of the lead wire is inserted into a lead wire insertion portion of the connection fitting, and then the connection fitting is attached. The width of the lead wire insertion part is narrowed by press-fitting into the through hole and the vicinity of the tip of the lead wire inserted in the lead wire insertion part is fixed to the land, and then the vicinity of the tip of the lead wire and the land are soldered. A method for soldering a lead wire to a printed wiring board, which is characterized in that it is attached.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29050692A JPH06140751A (en) | 1992-10-28 | 1992-10-28 | Method for lead wire soldering onto printed-wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29050692A JPH06140751A (en) | 1992-10-28 | 1992-10-28 | Method for lead wire soldering onto printed-wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06140751A true JPH06140751A (en) | 1994-05-20 |
Family
ID=17756903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29050692A Pending JPH06140751A (en) | 1992-10-28 | 1992-10-28 | Method for lead wire soldering onto printed-wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06140751A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110874518A (en) * | 2018-08-13 | 2020-03-10 | 日本麦可罗尼克斯股份有限公司 | Design support device for wiring board, via hole arrangement method, and recording medium |
-
1992
- 1992-10-28 JP JP29050692A patent/JPH06140751A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110874518A (en) * | 2018-08-13 | 2020-03-10 | 日本麦可罗尼克斯股份有限公司 | Design support device for wiring board, via hole arrangement method, and recording medium |
| CN110874518B (en) * | 2018-08-13 | 2023-09-08 | 日本麦可罗尼克斯股份有限公司 | Design support device for wiring substrate, via arrangement method, and recording medium |
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