JPH08227772A - Socket for semiconductor device - Google Patents

Abstract

PURPOSE: To provide a socket in which attention is paid so that a contact terminal on the socket side is precisely pressed to each of a number of external leads of an IC regularly in the same condition, and a foreign matter left and accumulated in the socket is never adhered, particularly, to the external leads of the IC at inspection. CONSTITUTION: An IC 1 is supported by the contact of the positioning base 21a of the body part 20a of a socket 50a with the lower side of the root part 4 of each external lead 2. When the external pressing force to a movable cover 40 is eliminated, a movable contact terminal 30a provided around the positioning base 21a raises the movable cover 40 by its elastic force, and a contact part 32a is brought into contact with the upper flat surface of the root part 4 of the corresponding external lead 2, and also pressed thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket for performing a test or the like by connecting an external circuit to an external lead of a semiconductor device such as a surface mount type device.

[0002]

2. Description of the Related Art A semiconductor device socket is used for performing an electrical function test on a manufactured semiconductor device, and is connected to an external lead of the semiconductor device (hereinafter referred to as an IC) for external testing. This is for connecting circuits. The inspection includes an electrical characteristic test for performing a function test of the IC, a burn-in test for finding a potential defect of the IC in advance, and the like. Such a socket is disclosed, for example, in Japanese Examined Patent Publication No. 4-14877.

[0003]

Since the IC operates with a very small voltage, its input / output signal also has a small voltage. The IC also has a large number of external leads.
Therefore, in such a semiconductor device socket, I
It is necessary to press the contact terminals on the socket side to each of a large number of external leads of C accurately and always under the same conditions.
Further, it is necessary to pay attention so that foreign matter remaining or accumulated in the socket does not adhere to the external leads of the IC during the inspection. However, there has been no semiconductor device socket that sufficiently satisfies such conditions.

The present invention has been made in order to solve the above problems, and it is possible to always apply a contact pressure between the external lead of the IC and the contact terminal on the socket side reliably and under a constant condition. An object of the present invention is to obtain a semiconductor device socket having features such as being able to.

[0005]

SUMMARY OF THE INVENTION In view of the above objects, the present invention relates to a socket for a semiconductor device used for connecting an external circuit to an external lead of the semiconductor device and performing a test. And a movable cover that is movable toward the main body. The main body includes a positioning table that contacts a lower side of a base of the external lead and supports the semiconductor device; A plurality of movable contact terminals made of a conductive material having elasticity arranged around the positioning table so as to face each other,
The movable cover is formed in a frame shape having an entrance / exit window of a semiconductor device, and each movable contact terminal is configured to operate to make contact or non-contact with the external lead.
In a state in which the movable cover is in a position separated from the main body portion, each movable contact terminal is configured to be pressed by the elastic force to the upper plane of the root portion of the external lead,
Further, when the movable cover is in the push-in position with respect to the main body, the movable contact terminals are released from the external leads against the elastic force thereof, and the semiconductor device can be inserted and removed through the access window. It is in the socket for semiconductor devices.

Further, according to the present invention, the external lead of the semiconductor device has the root portion, the inclined portion following the root portion, and the mounting surface, and the positioning table floats the inclined portion and the mounting surface to form the semiconductor device. The semiconductor device socket according to claim 1, wherein the socket is for supporting.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of a semiconductor device socket according to the present invention. In the figure, reference numeral 1 denotes a surface-mount type semiconductor device (hereinafter referred to as IC),
Reference numeral 2 denotes a plurality of gull-wing external leads extending from both sides of the IC 1, and reference numeral 3 denotes a package. The IC 1 is a well-known mold type IC in which an IC chip is bonded onto a lead frame, wire bonding is performed, and then the IC chip and the bonding wire are sealed with resin, and the package unit 3 is formed by resin molding.

In each external lead 2, 4 is a shoulder portion, that is, a root of the external lead 2, 5 is a tip portion which is a flat portion, 6 is a mounting surface on the back side of the tip portion 5, 7 is an upper surface on the front side, 8
Indicates an inclined portion. The mounting surface 6 is a surface that comes into contact with electrodes (both not shown) on the substrate when the IC 1 is actually mounted on the circuit substrate.

Reference numeral 50a is a semiconductor device socket,
It comprises a main body 20a on which C1 is placed and a movable cover 40 which moves up and down on the main body 20a. In the main body portion 20a, 21a is a positioning table that contacts and supports the IC 1 below the base 4 of the external lead 2 and positions the IC 1;
22a is an IC when the IC1 is mounted on the positioning base 21a.
1 is a terminal guide for guiding the tip portion 5 of the outer lead 2 and for aligning movable contact terminals 30a described later.

Numeral 30a is a movable contact terminal provided corresponding to each external lead 2. The movable contact terminal 30a
The positioning guides 21a are provided on both sides outside the positioning table 21a in a row corresponding to the external leads 2, and the terminal guides 22a are provided between the movable contact terminals 30a. In the case of a socket for a QFP (Quad Flat Package) type semiconductor device, the movable contact terminal 30a has four surrounding
It is provided in each direction. In each movable contact terminal 30a, 31 is a lever portion, 32a is a contact portion, and 33 is an external circuit.
It is a terminal portion for making an electrical connection with (not shown).

In the movable cover 40, 41 is an IC.
The IC 1 is mounted on the positioning table 21a through the access window 41 while the external leads 2 of the IC 1 are guided by the terminal guides 22a. . An engagement portion 42 on the back surface of the movable cover 40 has an R surface 43 that abuts on the lever portion 31 of each movable contact terminal 30a and opens and closes each movable contact terminal 30a according to the vertical movement of the movable cover 40. .

In this embodiment, the positioning base 21a formed on the main body 20a positions and supports the IC1 so as to support the lower side of the base portion 4 of each external lead 2 of the IC1, and each external lead 2 Slope 8 following the base 4 of the
Also, the tip portion 5 having the mounting surface 6 is supported so as to be in a floating state without coming into contact with anything. Further, the package section 3 of the IC 1 is also in a floating state. On the other hand, each of the movable contact terminals 30a having elasticity has a contact portion 32a whose base portion 4 of the external lead 2 is supported by the positioning table 21a.
It is designed to come into contact with the upper flat surface of and contact pressure.

FIG. 1 shows a state in which the IC 1 is mounted in the socket 50a, and the contact portion 32a of the movable contact terminal 30a is in contact with the base portion 4 of the external lead 2 and is in contact therewith.

Next, the operation will be described. When the movable cover 40 of the socket 50a is pressed down by a transport mechanism or the like to be movably coupled to the main body 20a (push-in position), the movable cover 4
The lever portion 31 of each movable contact terminal 30a is pushed and spread by the R surface 43 on the back side of 0, and the contact portion 32a retracts upward while drawing an arc. In this state, the main body 20a
The IC 1 can be placed on the positioning table 21a.

Next, when the pressing force that pushes down the movable cover 40 is released, each movable contact terminal 30a formed of an elastic metal material such as BeCu returns to the closed state due to its own elastic force, and as a result, The contact portions 32a come into contact with the upper surfaces of the root portions 4 of the external leads 2 corresponding to the IC 1 respectively. At this time, the movable cover 40 is simultaneously pushed up by the elastic force of each movable contact terminal 30a, and moves and separates from the main body 20a (separated position).

In this state, as described above, the contact portion 32a of each movable contact terminal 30a comes into contact with the upper plane of the root portion 4 of the corresponding outer lead 2 supported on the positioning base 21a of the main body portion 20a. Good electrical connection with wiping between the corresponding external lead 2 and the movable contact terminal 30a can be achieved. By the above operation, the IC 1 is attached to the socket 50a or the socket 5a
0a is taken out, and the electric characteristic test of IC1 is performed.

Further, the socket 50a has a movable contact terminal 3 in which the IC 1 is mounted without pressing force from the outside.
Since the elastic force of 0a provides good and stable electrical contact with the external leads 2 of the IC 1, it can be used for burn-in inspection in which a predetermined bad condition is created in the chamber for inspection.

[0018]

As described above, in the semiconductor device socket according to the present invention, the IC inserted in the socket has the highest strength among the external leads and is particularly deformed during the lead bending process and other processes. The lower side of the base, which is rarely used, is precisely positioned and supported on the positioning base provided on the body of the socket, and the movable contact terminal is located on the upper surface of the base of the external lead, which is the opposite side supported by the base. Since the external leads are not deformed in the process of mutual pressure contact, the external leads and the movable contact terminal can be reliably brought into contact with each other at a predetermined position.

Further, since the root portions of the external leads are reliably positioned and supported on the positioning base, the mutual positional relationship between the external leads and the movable contact terminals which are not deformed and are accurately positioned can always be kept constant. Therefore, the contact pressure of the movable contact terminal to the external lead is always constant and the contact electric resistance is also constant, so that a stable electrical test result can be obtained.

As for the arrangement dimension of the root portion of the external lead, if the size of the package portion and the pitch of the external lead are the same, the dimensions and shape of the inclined portion and the mounting surface following the root portion as shown in FIG. However, since it is almost the same and there is almost no displacement when inserted and supported in the socket, one type of socket can be shared by many types of ICs.

Further, since the movable contact terminal is pressed against the upper flat surface of the root portion of the external lead which is the most visible from the entrance / exit window of the socket, the contact state between the two can be easily monitored and inspected.

Further, since the IC is supported in a state where the inclined portion following the root of the external lead and the mounting surface are floated, mold burrs that are generated from the IC and remain and accumulate in the socket, and the external lead. Various foreign substances such as plating scraps on the surface and fiber scraps generated from clothes of workers in the room do not adhere to the mounting surface.

[Brief description of drawings]

FIG. 1 is a sectional view showing a structure of a semiconductor device socket according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view for explaining the relationship between the socket of FIG. 1 and the shape of the external lead of the semiconductor device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC (semiconductor device), 2 external lead, 3 package part, 4 root part, 5 tip part, 6 mounting surface, 7 top surface, 8 inclined part, 20a main body part, 21a positioning table, 22a terminal guide, 30a movable contact terminal , 31
Lever part, 32a contact part, 33 terminal part, 40 movable cover, 41 entrance / exit window, 42 engaging part, 43 R surface,
50a Socket for semiconductor device.

─────────────────────────────────────────────────── ───

[Procedure amendment]

[Submission date] December 22, 1995

[Procedure Amendment 1]

[Document name to be amended] Statement

[Correction target item name] Full text

[Correction method] Change

[Correction content]

[Document name] Statement

Patent application title: Semiconductor device socket

[Claims]

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device socket for performing a test or the like by connecting an external circuit to an external lead of a semiconductor device such as a surface mount type device.

[0002]

2. Description of the Related Art A semiconductor device socket is used for performing an electrical function test on a manufactured semiconductor device, and is connected to an external lead of the semiconductor device (hereinafter referred to as an IC) for external testing. This is for connecting circuits. The inspection includes an electrical characteristic test for performing a function test of the IC, a burn-in test for finding a potential defect of the IC in advance, and the like.

[0003] The characteristics of recent ICs are that
Along with this, the external leads have multiple pins and narrower pins,
That is, the external lead interval is extremely narrow,
This trend is expected to continue.

[0004] Such IC electrical characteristic tests and burn
In particular, sockets used in
The contact terminals of the socket make electrical contact with the external leads of the IC
Be sure that the external leads do not bend and deform.
Foreign matter such as plating debris and mold burr debris on the mounting surface of the lead
Is required not to adhere. like this
Disclose a socket that meets the demands
For example, there is Japanese Utility Model Publication No. 4-8777.

[0005]

THE INVENTION Problems to be Solved] However, the above-mentioned conventional
In the socket of the above, make sure that the cover completely covers the IC.
The cover when inserting and removing the IC.
Need to be completely removed, which is troublesome to operate.
It In addition, the free end of each contact terminal on the socket side is
Gull wing type external lead core piece and vertical part of middle part
Fit into the inner surface of the L-shaped bent part formed by
IC while supporting the core piece of the external lead at the free end of the terminal
The package engages with the side of the package
Position the lead with respect to the contact terminal.
I am sorry.

However, the freedom of contact terminals on the socket side
The edge is engaged with the side of the IC package
Position the parts, and the side surface of the package is in contact,
Or ICs are placed in close proximity within the permissible range, or
The socket side can be taken out.
Between the free end of each contact terminal and the IC package part
The gap is formed extremely small.

For this reason, when inserting an IC into a socket,
Requires extremely high accuracy and the insertion position is shifted
In addition to the positioning and positioning of the IC,
The child or the external lead may be deformed.

[0008] The IC inserted into the socket includes a module.
Burr debris, external lead surface plating debris, worker clothing
Foreign matter such as fiber waste from clothes may be attached.
They shake when inserting and placing the IC in the socket.
Often fall off due to movement. However, the above-mentioned conventional
In the socket, of the core part of the external lead of the IC
Contact terminals on the socket side that make electrical contact with the
Designed so that the free end contact area is always facing upwards
Drop out when inserting and placing the IC in the socket.
Foreign matter adheres to the contact part of the free end of the contact terminal or
It may adhere to the contact terminals
It

For this reason, the external leads of the IC and the socket
If normal electrical contact cannot be obtained between the contact terminals, or
The test of IC is performed because the contact terminals are short-circuited by plating debris.
A situation that cannot be performed occurs. Furthermore, contact of the free end of the contact terminal
If the external lead is pressed while foreign matter is
In this case, the external lead may be bent and deformed.

As described above, in the semiconductor device socket, it is necessary to contact the contact terminals on the socket side to each of a large number of external leads of the IC accurately and always under the same condition. In particular, it is necessary to pay attention so that foreign matter that remains or accumulates in the socket does not adhere to the external leads. However, there has been no semiconductor device socket that sufficiently satisfies such conditions.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has been made in consideration of the operation of attaching and detaching an IC from a socket.
Work is easy, moreover for its object to obtain a semiconductor device socket having the characteristics such that it is possible to provide a consistently reliable and contact pressure under certain conditions between the contact terminals of the external lead and the socket of the IC .

[0012]

SUMMARY OF THE INVENTION In view of the above objects, the present invention relates to a socket for a semiconductor device used for connecting an external circuit to an external lead of the semiconductor device and performing a test. And a movable cover that is movable toward the main body. The main body includes a positioning table that contacts a lower side of a base of the external lead and supports the semiconductor device; A plurality of movable contact terminals made of a conductive material having elasticity arranged around the positioning table so as to face each other,
The movable cover is formed in a frame shape having an entrance / exit window of a semiconductor device, and each movable contact terminal is configured to operate to make contact or non-contact with the external lead.
In a state in which the movable cover is in a position separated from the main body portion, each movable contact terminal is configured to be pressed by the elastic force to the upper plane of the root portion of the external lead,
Further, when the movable cover is in the push-in position with respect to the main body, the movable contact terminals are released from the external leads against the elastic force thereof, and the semiconductor device can be inserted and removed through the access window. It is in the socket for semiconductor devices.

Further, according to the present invention, an external lead of the semiconductor device has the root portion, an inclined portion following the root portion, and a mounting surface, and the positioning device mounts the semiconductor device with the inclined portion and the mounting surface floating. The socket for a semiconductor device according to claim 1, wherein the socket is configured to be supported.

Further, according to the present invention, each of the above movable contact terminals is provided.
However, due to its elastic force,
It is specially constructed so that the pressure is applied from diagonally above.
The semiconductor device source according to claim 1 or 2, wherein
In the ket.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of a semiconductor device socket according to the present invention. In the figure, reference numeral 1 denotes a surface-mount type semiconductor device (hereinafter referred to as IC),
Reference numeral 2 denotes a plurality of gull-wing external leads extending from both sides of the IC 1, and reference numeral 3 denotes a package. The IC 1 is a well-known molded IC in which an IC chip is bonded to a lead frame, wire bonding is performed, and then the IC chip and bonding wires are sealed with a resin, and the package unit 3 is formed of a resin mold. .

In each of the external leads 2, reference numeral 4 denotes a shoulder, that is, the root of the external lead 2, reference numeral 5 denotes a flat end portion, reference numeral 6 denotes a mounting surface on the back side of the front end portion 5, reference numeral 7 denotes an upper surface on the front side, and reference numeral 8
Indicates an inclined portion. The mounting surface 6 is a surface that comes into contact with electrodes (both not shown) on the substrate when the IC 1 is actually mounted on the circuit substrate.

Reference numeral 50a denotes a semiconductor device socket.
It comprises a main body 20a on which C1 is placed and a movable cover 40 which moves up and down on the main body 20a. In the main body portion 20a, 21a is a positioning table that contacts and supports the IC 1 below the base 4 of the external lead 2 and positions the IC 1;
22a is an IC when the IC1 is mounted on the positioning base 21a.
1 is a terminal guide for guiding the tip portion 5 of the outer lead 2 and for aligning movable contact terminals 30a described later.

Reference numeral 30a denotes a movable contact terminal provided corresponding to each external lead 2. The movable contact terminal 30a
The positioning guides 21a are provided on both sides outside the positioning table 21a in a row corresponding to the external leads 2, and the terminal guides 22a are provided between the movable contact terminals 30a. In the case of a socket for a QFP (Quad Flat Package) type semiconductor device, the movable contact terminal 30a has four surrounding
It is provided in each direction. In each movable contact terminal 30a, 31 is a lever portion, 32a is a contact portion, and 33 is an external circuit.
It is a terminal portion for making an electrical connection with (not shown).

In the movable cover 40, reference numeral 41 denotes an IC.
The IC 1 is mounted on the positioning table 21a through the access window 41 while the external leads 2 of the IC 1 are guided by the terminal guides 22a. . An engagement portion 42 on the back surface of the movable cover 40 has an R surface 43 that abuts on the lever portion 31 of each movable contact terminal 30a and opens and closes each movable contact terminal 30a according to the vertical movement of the movable cover 40. .

In this embodiment, the positioning table 21a formed on the main body 20a supports the IC 1 so as to support the lower side of the base 4 of each external lead 2 of the IC 1. Inclined part 8 following the base part 4
Also, the tip portion 5 having the mounting surface 6 is supported so as to be in a floating state without coming into contact with anything. Further, the package section 3 of the IC 1 is also in a floating state. On the other hand, each of the movable contact terminals 30a having elasticity has a contact portion 32a whose base portion 4 of the external lead 2 is supported by the positioning table 21a.
The upper flat surface (see FIG. 2) is pressed obliquely from above .

FIG. 1 shows a state in which the IC 1 is mounted in the socket 50a, and the contact portion 32a of the movable contact terminal 30a is in contact with the base portion 4 of the external lead 2 and is in contact therewith.

Next, the operation will be described. When the movable cover 40 of the socket 50a is pressed down by a transport mechanism or the like to be movably coupled to the main body 20a (push-in position), the movable cover 4
The lever portion 31 of each movable contact terminal 30a is pushed and spread by the R surface 43 on the back side of 0, and the contact portion 32a retracts upward while drawing an arc. In this state, the main body 20a
The IC 1 can be placed on the positioning table 21a.

Next, when the pressing force that has pressed down the movable cover 40 is removed, each movable contact terminal 30a formed of an elastic metal material such as BeCu returns to a closed state by its own elastic force. The contact portions 32a come into contact with the upper portions of the bases 4 of the external leads 2 corresponding to the ICs 1, respectively. At this time, the movable cover 40 is simultaneously pushed up by the elastic force of each movable contact terminal 30a, and moves and separates from the main body 20a (separated position).

In this state, as described above, the contact portion 32a of each movable contact terminal 30a is positioned obliquely from above on the upper surface of the base 4 of the corresponding external lead 2 supported on the positioning table 21a of the main body 20a. Because of the contact pressure, good electrical connection with wiping between the corresponding external lead 2 and the movable contact terminal 30a can be achieved. Through the above operation, the IC 1 is mounted on the socket 50a or taken out of the socket 50a, and the electrical characteristic test of the IC 1 is performed.

The socket 50a is mounted on the movable contact terminal 3 without any external pressing force when the IC 1 is mounted.
Since the elastic force of 0a provides good and stable electrical contact with the external leads 2 of the IC 1, it can be used for burn-in inspection in which a predetermined bad condition is created in the chamber for inspection.

[0026]

As described above, in the semiconductor device socket according to the present invention , simple operation can be performed through the access window of the movable cover.
ICs can be inserted and removed by hand, and ICs inserted into the socket have the highest strength of the external leads, and are particularly deformed during the lead bending process and other processes. The lower side of the root portion which is less likely to be fixed is accurately positioned and supported on a positioning table provided on the main body of the socket, and is movable contact with the upper flat surface of the root portion of the external lead which is the supported opposite side. Since the terminals are pressed, the external leads are not deformed during the mutual pressure process, and the external leads and the movable contact terminals can be reliably brought into contact at predetermined positions.

Further, since the root portions of the external leads are reliably positioned and supported on the positioning base, the mutual positional relationship between the external leads and the movable contact terminals which are not deformed and are accurately positioned can always be kept constant. Therefore, the contact pressure of the movable contact terminal to the external lead is always constant and the contact electric resistance is also constant, so that a stable electrical test result can be obtained.

If the size of the package and the pitch of the external leads are the same, the dimensions and the shape of the inclined portion and the mounting surface following the root as shown in FIG. Irrespective of the above, and since there is almost no displacement when inserted and supported in the socket, one kind of socket can be shared by many kinds of ICs.

Further, since the movable contact terminal is pressed on the upper flat surface of the base of the external lead which is most easily seen from the access window of the socket, the contact state between the two can be easily monitored and inspected.

Further, since the IC is supported while the inclined surface following the base of the external lead and the mounting surface are floated, mold flash debris generated from the IC and remaining and deposited in the socket, the external lead Various foreign substances such as plating dust on the surface and fiber dust generated from clothes of workers in the room do not adhere to the mounting surface or the like.

Further , the movable contact terminal is externally resilient by its elastic force.
So that it comes into contact with the upper plane of the base of the
So that wiping can be performed reliably and
When the top is contaminated or an insulating film is formed
Even to get a reliable and stable electrical contact
it can.

[Brief description of drawings]

FIG. 1 is a sectional view showing a structure of a semiconductor device socket according to an embodiment of the present invention.

FIG. 2 is a partial cross-sectional view for explaining the relationship between the socket of FIG. 1 and the shape of the external lead of the semiconductor device.

[Explanation of reference numerals] 1 IC (semiconductor device), 2 external leads, 3 package part, 4 root part, 5 tip part, 6 mounting surface, 7 upper surface, 8 inclined part, 20a main body part, 21a positioning base, 22a terminal guide , 30a Movable contact terminal, 31
Lever part, 32a contact part, 33 terminal part, 40 movable cover, 41 entrance / exit window, 42 engaging part, 43 R surface,
50a Socket for semiconductor device.

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Tsunetori Umezu No. 272-10 Heisei, Ohno, Otsu-cho, Kikuchi-gun, Kumamoto Prefecture Mitsubishi Electric Corporation Kumamoto Semiconductor Co., Ltd. 997 Mitsubishi Electric Corporation Kumamoto Works (72) Inventor Kunio Kobayashi 4-1-1 Mizuhara, Itami City Mitsubishi Electric Co., Ltd. Kita Itami Works

Claims (2)

[Claims] 1. A semiconductor device socket used for testing by connecting an external circuit to an external lead of a semiconductor device, the socket including a main body and a movable cover movable toward the main body. The main body portion is disposed around the positioning base so as to face the external lead and a positioning base that contacts the lower side of the base portion of the external lead to support the semiconductor device. And a plurality of movable contact terminals made of a conductive material having, wherein the movable cover is formed in a frame shape having an entrance / exit window of a semiconductor device, and the movable contact terminals are connected to the external leads. It is configured to operate contact and non-contact movements,
In a state in which the movable cover is in a position separated from the main body portion, each movable contact terminal is configured to be pressed by the elastic force to the upper plane of the root portion of the external lead,
Further, when the movable cover is in the push-in position with respect to the main body, the movable contact terminals are released from the external leads against the elastic force thereof, and the semiconductor device can be inserted and removed through the access window. Used for semiconductor device sockets. 2. The semiconductor device according to claim 1, wherein an external lead of the semiconductor device has the base portion, a slope portion following the root portion, and a mounting surface, and the positioning table supports the semiconductor device with the slope portion and the mounting surface floating. 2. The semiconductor device socket according to claim 1, wherein the socket is configured as follows.