JP2009271032A - Method for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve reliability of contact with a lead while preventing adhesion of foreign material on the lead of a semiconductor package in a burn-in socket. <P>SOLUTION: The semiconductor package introduced in the burn-in socket has a structure which is supported when a resin 6 is supported. The lead 1 is sandwiched by an upper contact pin 10 and a lower contact pin 11, and a burn-in test is conducted under a condition in which a mounting surface 1C as a lower surface around a tip end of the lead 1 is not in contact with other member such as a component of the burn-in socket. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a semiconductor device manufacturing technique, and more particularly to a technique effective when applied to a burn-in process socket.

Japanese Patent Application Laid-Open No. 6-231845 (Patent Document 1) discloses a situation in which a semiconductor device is supported by a shoulder portion of an external lead so that the tip portion of the external lead is lifted so that the bottom mounting surface does not come into contact with anywhere. A socket for a semiconductor device is disclosed that can prevent adhesion of foreign matter to the bottom mounting surface of the external lead of the semiconductor device by making electrical contact with the shoulder portion of the external lead.
JP-A-6-231845

  The burn-in (energization acceleration) test of a semiconductor device is performed by accommodating individual semiconductor devices in a burn-in socket. The present inventors are examining a burn-in test technique for a semiconductor package having a gull-wing lead for external connection, such as QFP (Quad Flat Package) and SOP (Small Outline Package). I found a new problem.

  The burn-in test technique investigated by the present inventors is as follows. In other words, a burn-in test for a semiconductor package having a gull-wing lead for external connection is performed under the condition that the contact pin provided in the burn-in socket is in contact with the back surface (mounting surface) or top surface of the lead tip. . When the contact pin contacts the upper surface of the lead, the opposite mounting surface is in contact with the seating surface in the burn-in socket, and the tip of the lead is sandwiched between the contact pin and the seating surface. The electrical connection is ensured. On the other hand, when the contact pin contacts the back of the tip of the lead, the upper surface on the opposite side is in contact with the cover of the burn-in socket that also serves as a lead retainer, and the tip of the lead is sandwiched between the contact pin and the cover of the burn-in socket. By doing so, the electrical connection between the contact pin and the lead is ensured.

  However, when performing the burn-in test with the tip of the lead in contact with the contact pin as described above, foreign matters such as foreign matter, solder waste and fiber waste that have fallen into the burn-in socket adhere to the back surface of the lead tip. There is a concern about malfunctions that will occur. If such foreign matter adheres, there is a concern about the occurrence of defects such as poor contact and poor appearance.

  An object of the present invention is to provide a technique capable of improving contact reliability with a lead in a burn-in socket while preventing foreign matter from adhering to the lead of a semiconductor package.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

The method for manufacturing a semiconductor device according to the present invention includes a first bent portion and a second bent portion in a direction opposite to the first bent portion, and the first bent portion and the second bent portion in order from the front end side. A method of manufacturing a semiconductor device including a step of performing an acceleration test by aligning and accommodating a semiconductor device including a plurality of external leads in which bending portions of the semiconductor device are positioned and accommodated in a socket,
The socket includes a plurality of first contact jigs that contact each of the plurality of external leads from above during the acceleration test, and a plurality of second contacts that contact each of the plurality of external leads from below during the acceleration test. A jig,
The acceleration test is performed in a state where the plurality of first contact jigs and the plurality of second contact jigs sandwich each of the plurality of external leads and apply a voltage to the external leads. is there.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  That is, in the burn-in socket, it is possible to improve the contact reliability with the lead while preventing the foreign matter from adhering to the lead of the semiconductor package.

  In the following embodiments, when it is necessary for the sake of convenience, the description will be divided into a plurality of sections or embodiments. However, unless otherwise specified, they are not irrelevant to each other. There are some or all of the modifications, details, supplementary explanations, and the like.

  Further, in the following embodiments, when referring to the number of elements (including the number, numerical value, quantity, range, etc.), especially when clearly indicated and when clearly limited to a specific number in principle, etc. Except, it is not limited to the specific number, and may be more or less than the specific number.

  Further, in the following embodiments, the constituent elements (including element steps and the like) are not necessarily indispensable unless otherwise specified and apparently essential in principle. Needless to say. In addition, when referring to the constituent elements in the embodiments, etc., “consisting of A” and “consisting of A” do not exclude other elements unless specifically stated that only the elements are included. Needless to say.

  Similarly, in the following embodiments, when referring to the shapes, positional relationships, etc. of the components, etc., the shapes are substantially the same unless otherwise specified, or otherwise apparent in principle. And the like are included. The same applies to the above numerical values and ranges.

  In addition, when referring to materials, etc., unless specified otherwise, or in principle or not in principle, the specified material is the main material, and includes secondary elements, additives It does not exclude additional elements. For example, unless otherwise specified, the silicon member includes not only pure silicon but also an additive impurity, a binary or ternary alloy (for example, SiGe) having silicon as a main element.

  In addition, components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiments, and the repetitive description thereof will be omitted.

  In the drawings used in the present embodiment, even a plan view may be partially hatched to make the drawings easy to see.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

  The semiconductor device according to the present embodiment is a semiconductor package having gull-wing-like external connection leads such as SOP and QFP. FIG. 1 is a plan view of the SOP, FIG. 2 is a plan view of the QFP, and FIG. 3 is a cross-sectional view of the SOP or QFP.

  As shown in FIGS. 1 to 3, the semiconductor device according to the present embodiment extends from a pair of sides or four sides opposed to external connection leads (external leads) 1 formed in a gull wing shape. Yes. The lead 1 is formed into a gull wing shape, so that the lead 1 has two bent portions 1A and 1B. The bent portion (first bent portion) 1A and the bent portion (second bent portion) are sequentially formed from the tip of the lead 1. 1B is arranged, and the bending direction of the bending portion 1A and the bending direction of the bending portion 1B are opposite to each other. Inside the semiconductor package, a semiconductor chip 4 is mounted on the tab 2 via an adhesive 3 such as DAF (Die Attach Film), and the semiconductor chip 4 and the lead 1 are electrically connected via a bonding wire 5. Yes. These tab 2, semiconductor chip 4 and bonding wire 5 are sealed with resin 6.

  Next, a burn-in test (acceleration test) of the semiconductor device of the present embodiment having the external connection leads 1 formed in the gull wing shape as described above will be described. Here, in this embodiment, the burn-in or burn-in test is a method for removing an initial failure, and usually accelerates stress by applying temperature and voltage stress as a screening process in semiconductor device manufacturing. In this case, the initial defective product is removed.

  4 and 5 are a plan view and a cross-sectional view of the main part of the burn-in socket used in the burn-in test in the present embodiment, respectively.

  The housing 7 includes a guide 8 for guiding the semiconductor package to be burned in to a predetermined position in the housing 7, a positioning guide 9 for positioning and holding the semiconductor package at a predetermined position in the housing 7, A contact jig 13 including an upper contact pin (first contact jig) 10, a lower contact pin (second contact jig) 11, and a push-in pin 12 is disposed. Further, a lid 15 is disposed on the upper portion of the housing 7 via a spring 14.

  The lid 15 is normally lifted by the elastic force of the spring 14, but pushes the push pin 12 downward by being pushed down. In conjunction with this, the upper contact pin 10 formed integrally with the push-in pin 12 is lifted, and the semiconductor package can be introduced into the burn-in socket. Under this situation, the semiconductor package is introduced into the burn-in socket. The positioning guide 9 holds the semiconductor package by supporting the resin 6 of the semiconductor package introduced into the burn-in socket, and each of the leads 1 of the semiconductor package has a lower contact at a predetermined position described in detail later. The pin 11 contacts from below. After the semiconductor package is introduced into the burn-in socket, the lid 15 is opened again, so that the pushing pin 12 pushed down is restored to the original position, and the upper contact pin 10 is lowered in conjunction with the restoration. As a result, the lead 1 is sandwiched between the upper contact pin 10 from above and the lower contact pin 11 from below at a predetermined position, and the burn-in test of the semiconductor package is performed in this state. Further, when the upper contact pin 10 is lowered and comes into contact with the lead 1, at least one of the upper contact pin 10 and the lower contact pin 11 performs an wiping operation to form an oxide film such as a natural oxide film on the surface of the lead 1. Break and ensure electrical connection with lead 1.

  A configuration may be adopted in which various signals are sent from the contact jig 13 to the lead 1. As a result, the semiconductor package is not only subjected to stress acceleration by application of temperature and voltage stress but also various signals through the electrically connected lead 1 sandwiched between the upper contact pin 10 and the lower contact pin 11. Can be tested to see if it works properly.

  Here, in the present embodiment, the lower surface near the tip of the lead 1 that contacts the mounting substrate when the semiconductor package is mounted is defined as a mounting surface 1C. As described above, under the situation where the lead 1 is sandwiched between the upper contact pin 10 and the lower contact pin 11, in this embodiment, the mounting surface 1C of the lead 1 is another member such as a component member of the burn-in socket. It is in a state of not touching. By performing the burn-in test in such a state, it is possible to prevent foreign matters such as solder scraps and fiber scraps remaining in the burn-in socket from adhering to the mounting surface 1C of the lead 1. If foreign matter adheres to the mounting surface 1C of the lead 1, there is a concern about the occurrence of defects such as poor appearance of the semiconductor package and poor connection when mounting the semiconductor package, but the burn-in socket according to the present embodiment is used. Thus, occurrence of such a problem can be prevented.

  Further, the burn-in socket used in the burn-in test in the present embodiment may have a structure as shown in FIG.

  The burn-in socket shown in FIG. 6 has a structure in which the upper contact pin 10 is lifted when the lid 15 pushes down the pushing jig 16 connected to the spring 14 and fitted to the upper contact pin 10. The lid 15 is normally lifted by the elastic force of the spring 14 as in the case of the structure shown in FIG. Since the upper contact pin 10 has a structure fitted with the pushing jig 16, it is difficult to perform the wiping operation to the lead 1, but since the lower contact pin 11 has a bend 11A, this bend 11A. The lower contact pin 11 can perform the wiping operation to the lead 1 by utilizing the elasticity of.

  Next, the position where the lead 1 is sandwiched between the upper contact pin 10 and the lower contact pin 11 will be described with reference to FIG.

  As shown in FIG. 7, the sandwiching position of the lead 1 between the upper contact pin 10 and the lower contact pin 11 in the present embodiment is a range from a position A that is the root of the lead 1 to a central position B of the bent portion 1A. It is preferable that However, the upper contact pin 10 and the lower contact pin 11 are positioned so as not to contact the sealing resin 6. The center position B of the bent portion 1A corresponds to a position where the horizontal portion from the tip of the lead 1 is rotated by 45 ° about the bent portion 1A.

  The position where the lead 1 is sandwiched between the upper contact pin 10 and the lower contact pin 11 is more preferably in the range from the position A to the center position C of the bent portion 1B. However, the upper contact pin 10 and the lower contact pin 11 are positioned so as not to contact the sealing resin 6. The central position C of the bent portion 1B corresponds to a position where the horizontal portion from the base of the lead 1 is rotated by 45 ° about the bent portion 1B.

  When the upper contact pin 10 and the lower contact pin 11 sandwich the lead 1 at the position as described above, at least one of the upper contact pin 10 and the lower contact pin 11 can be wiped, and the tip of the lead 1 It is possible to prevent the lower contact pin 11 from coming into contact with the nearby mounting surface 1C. Thereby, it is possible to realize good contact with the lead 1 by the upper contact pin 10 and the lower contact pin 11 while preventing foreign matter from adhering to the mounting surface 1C of the lead 1.

  Further, as shown in FIG. 8, the upper contact pin 10 and the lower contact pin 11 may be configured to be in contact with each other while being displaced from the position where the lead 1 is sandwiched. In this case, stress that deforms the lead 1 due to the contact between the upper contact pin 10 and the lower contact pin 11 being shifted from each other acts, so that such deformation is prevented. The lead 1 is fixed at a position other than the mounting surface 1C of the lead 1 by a fixing jig (not shown).

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The method for manufacturing a semiconductor device of the present invention can be applied to a burn-in test of a semiconductor package having a gull-wing lead for external connection, such as QFP and SOP.

It is a top view of the semiconductor device which is one embodiment of the present invention. It is a top view of the semiconductor device which is one embodiment of the present invention. It is sectional drawing of the semiconductor device which is one embodiment of this invention. It is a principal part top view of the burn-in socket used by the burn-in test in the manufacturing process of the semiconductor device which is one embodiment of this invention. It is principal part sectional drawing of the burn-in socket used in the burn-in test in the manufacturing process of the semiconductor device which is one embodiment of this invention. It is principal part sectional drawing of the burn-in socket used in the burn-in test in the manufacturing process of the semiconductor device which is one embodiment of this invention. It is explanatory drawing explaining the burn-in test in the manufacturing process of the semiconductor device which is one embodiment of this invention. It is explanatory drawing explaining the burn-in test in the manufacturing process of the semiconductor device which is one embodiment of this invention.

Explanation of symbols

1 Lead (External lead)
1A bent portion (first bent portion)
1B bent part (second bent part)
1C Mounting surface 2 Tab 3 Adhesive material 4 Semiconductor chip 5 Bonding wire 6 Resin 7 Housing 8 Guide guide 9 Positioning guide 10 Upper contact pin (first contact jig)
11 Lower contact pin (second contact jig)
11A Deflection 12 Pushing Pin 13 Contact Jig 14 Spring 15 Lid 16 Pushing Jig

Claims (4)

A plurality of first bent portions and second bent portions in a direction opposite to the first bent portions, and the first bent portions and the second bent portions are arranged in order from the tip side. A method of manufacturing a semiconductor device including a step of aligning and accommodating a semiconductor device having an external lead in a socket and performing an acceleration test,
The socket includes a plurality of first contact jigs that contact each of the plurality of external leads from above during the acceleration test, and a plurality of second contacts that contact each of the plurality of external leads from below during the acceleration test. A jig,
The acceleration test is performed under a condition where the plurality of first contact jigs and the plurality of second contact jigs sandwich each of the plurality of external leads and apply a voltage to the external leads. A method of manufacturing a semiconductor device. A plurality of first bent portions and second bent portions in a direction opposite to the first bent portions, and the first bent portions and the second bent portions are arranged in order from the tip side. A method of manufacturing a semiconductor device including a step of aligning and accommodating a semiconductor device having an external lead in a socket and performing an acceleration test,
The socket includes a plurality of first contact jigs that contact each of the plurality of external leads from above during the acceleration test, and a plurality of second contacts that contact each of the plurality of external leads from below during the acceleration test. A jig,
The acceleration test is performed under a condition in which the plurality of first contact jigs and the plurality of second contact jigs sandwich each of the plurality of external leads and voltage is applied to the external leads,
The contact positions of the plurality of first contact jigs and the plurality of second contact jigs to the plurality of external leads during the acceleration test are determined from the roots of the plurality of external leads to the semiconductor device. A method of manufacturing a semiconductor device, characterized by being between the center of the first bent portion. A plurality of first bent portions and second bent portions in a direction opposite to the first bent portions, and the first bent portions and the second bent portions are arranged in order from the tip side. A method of manufacturing a semiconductor device including a step of aligning and accommodating a semiconductor device having an external lead in a socket and performing an acceleration test,
The socket includes a plurality of first contact jigs that contact each of the plurality of external leads from above during the acceleration test, and a plurality of second contacts that contact each of the plurality of external leads from below during the acceleration test. A jig,
The acceleration test is performed under a situation in which the plurality of first contact jigs and the plurality of second contact jigs sandwich each of the plurality of external leads, and a voltage is applied to the external leads,
At least one of the plurality of first contact jigs or the plurality of second contact jigs rubs the surfaces of the plurality of external leads and breaks the oxide film on the surfaces of the plurality of external leads. A method for manufacturing a semiconductor device. A plurality of first bent portions and second bent portions in a direction opposite to the first bent portions, and the first bent portions and the second bent portions are arranged in order from the tip side. A method of manufacturing a semiconductor device including a step of aligning and accommodating a semiconductor device having an external lead in a socket and performing an acceleration test,
The socket includes a plurality of first contact jigs that contact each of the plurality of external leads from above during the acceleration test, and a plurality of second contacts that contact each of the plurality of external leads from below during the acceleration test. A jig,
The acceleration test is performed under a condition in which the plurality of first contact jigs and the plurality of second contact jigs sandwich each of the plurality of external leads and voltage is applied to the external leads,
In the accelerated test, a test signal is transmitted from at least one of the plurality of first contact jigs or the plurality of second contact jigs to the plurality of external leads. .

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