JPH0822643A - Master disk polishing device for optical disk - Google Patents

Abstract

PURPOSE:To reduce the size of the above device, to lessen the burden of utilities and to facilitate inline connection of a transporting system. CONSTITUTION:This master disk polishing device has a turn table 21 which is fixed with a glass master disk 30 and rotates this glass master disk 30, a polishing pad 11 which is pressed with prescribed pressing force onto the polishing surface of the glass master disk 30 fixed onto this turn table 21 and a slurry nozzle 14 which supplies a polishing liquid onto the polishing surface of the glass master disk 30. This polishing pad 11 is pressed to the glass master disk 30 rotated by rotation of the turn table 21 and the glass master disk is polished while the polishing liquid is supplied thereto.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for an optical disk master used, for example, in an optical disk manufacturing process.

[0002]

2. Description of the Related Art Optical disks include so-called CDs and LDs.
Play-only type such as (both are registered trademarks) and MO, W
There are three types: O, write-once type such as phase change type, and rewrite type. The playback-only type has very small audio and video signals (depth 0.11μ
m, width 0.4 μm, length 0.55 to 3.56 μm).

Further, in the write-once type and the rewritable type, although the signal recording is performed by the user, it is necessary to record the groove (guide groove) for recording the signal or for tracking during reproduction, the address information, the characteristics of the disc and the like. Pits are formed. These pits and grooves are usually transferred to a transparent substrate by injection molding using a nickel mold called a stamper or a signal transfer method using an ultraviolet curable resin called a 2P method. The process of manufacturing this stamper is usually called a mastering process.

To manufacture such a stamper, a pre-process for cleaning the glass master, a resist process for forming a resist layer on the glass master, a cutting process for laser exposure, a developing process for developing, and an electroforming process for nickel electroforming. It is manufactured by sequentially performing post-processes such as a casting process and cleaning of the finished stamper. When the stamper is completed, the glass master is recycled and reused, and the above steps are repeated.

Among these steps, the polishing step performed in the previous step is desired to be smooth because a resist layer is formed on the glass master afterwards. As a polishing device, for example, a polishing device as shown in FIGS. 7 and 8 is known.

This polishing apparatus holds a disk-shaped polishing surface plate 102 and a glass master disk in an apparatus body 101, and a work fixing member 1 for pressing the glass master disk onto the polishing surface plate 102.
03, a polishing material supply unit 104 that supplies a polishing liquid onto the polishing platen 102, and a pure supply unit 105 that supplies pure water, and is an apparatus configured to simultaneously polish a plurality of glass masters.

As shown in FIG. 9, the main part of the polishing platen 102 is a spindle 107 attached to a motor 106.
It is fixed on the top and rotates together with the spindle 107. This polishing platen 102 has a diameter of 650.
The disk is formed as a large disk made of stainless steel having a size of about mm to 1000 mm, and is rotated at a speed of, for example, 50 rpm to 250 rpm. A polishing pad 108 for polishing the glass master is attached to the surface of the polishing platen 102.

The glass master 109 is a workpiece fixing member 10.
Pressure plate 110 attached to the tip of 3
The work fixing member 103 is pressed against the polishing pad 108 with a predetermined pressing force. Polishing pad 1 for the glass master 109
Pressing against 08 is performed by air. Further, the glass master 109 is adapted to rotate together with the work fixing member 103 rotatably attached to the support arm 111 by a frictional force between the glass master 109 and the polishing pad 108 when the polishing platen 102 rotates. ing.

The polishing material supply unit 104 uses, for example, a polishing liquid prepared by mixing cerium oxide (CeO ₂ ) in water.
08 is supplied by a pump or the like. The tip of the nozzle of the abrasive supply unit 104 is directed onto the polishing pad 108.

On the other hand, the pure water supply unit 105 is the glass master 1
This is for cleaning the polishing material remaining on the polishing pad 108 after polishing 09. The tip of the nozzle of the pure water supply unit 105 is directed onto the polishing pad 108.

Polishing of the glass master 109 using the polishing apparatus configured as described above is performed according to the flowchart shown in FIG.

First, the operation of step ST51 is performed. That is, the glass master 109 is carried on the polishing platen 102 and held by the pressure plate 110. Then, air is supplied from the work fixing member 103, and the glass master 109 is pressed against the polishing pad 108 with a pressure of several tens g / cm ² . The glass master 109 is fixed by a machine or manually.

Next, in step ST52, a polishing liquid is supplied onto the polishing pad 108.

Then, in step ST53, the polishing platen 10
2 is rotated to polish the glass master 109. At this time, the glass master 109 rotates together with the polishing platen 102. Further, the work fixing member 103 is the polishing surface plate 1
Rock on 02.

Next, in step ST54, the glass master 10 is used.
When the polishing of 9 is completed, the supply of the polishing liquid is stopped, pure water is supplied, and the polishing liquid remaining on the polishing pad 108 is washed away.

Then, in step ST55, the polishing platen 10 is used.
The rotation of 2 is stopped, and then the glass master 109 is removed.
Then, the polishing is completed in step ST56.

[0017]

By the way, when the above-mentioned polishing apparatus is evaluated from the viewpoint of optical disk equipment, the size of the machine is increased due to the apparatus configuration, and the burden of utilities such as cooling water, pure water, and the amount of electric power consumption is increased. It has the disadvantage of being large. That is, since a considerably large surface plate having a diameter of 650 mm to 1000 mm is used, the device configuration inevitably becomes large, and the surface plate is 50 rpm to 250 mm.
Since it is rotated at a speed of rpm, a large motor is inevitably required, and a considerable amount of electric power is required.

Further, when the mastering device is constructed in-line, the resist coating, cutting, and developing steps are performed with the signal surface facing upward, whereas only the polishing step has the signal surface (polishing surface) facing downward. Therefore, the transport section becomes complicated only in this polishing step.

Further, although the glass master is placed on the polishing pad, there is a disadvantage that the glass master cannot be washed in the main body of the apparatus.

Therefore, the present invention has been proposed in order to solve the above-mentioned conventional problems, and makes it possible to reduce the size of the device, reduce the load on the utility, and facilitate the connection of the transport system by in-line. An object is to provide a polishing device.

[0021]

SUMMARY OF THE INVENTION An optical disk polishing apparatus according to the present invention comprises a turntable for fixing an optical disk master and rotating the optical disk master, and a polishing for the optical disk master fixed on the turntable. A polishing pad that is pressed against the surface with a predetermined pressing force, and a polishing liquid supply unit that supplies a polishing liquid onto the polishing surface of the optical disc master, and the optical disc master that is rotated by the rotation of the turntable. Press the polishing pad,
The above problems are solved by polishing while supplying a polishing liquid.

The polishing pad used in this apparatus is rotatably attached to the supporting member, and is rotated with the rotation of the optical disk master by the frictional force with the optical disk master. Alternatively, it is forcibly rotated by the rotation drive source as the master disk for optical disk rotates.

The turntable used is smaller than the master for the optical disc. Further, the optical disc master is fixed to the turntable by vacuum suction.

[0024]

In the optical disk polishing apparatus according to the present invention, the optical disk master is fixed to the turntable instead of sticking the polishing pad on the rotary surface plate and placing the optical disk master on the polishing pad for polishing. The turntable size is larger than that of the optical disc master because the polishing pad is pressed with a predetermined pressing force while polishing liquid is supplied to the rotating polishing surface of the optical disc master. The size of the apparatus can be reduced, and the size of the apparatus can be reduced. Further, since a master having a thickness of several millimeters and a diameter of about 22 cm can be rotated, a small motor is sufficient and required power can be reduced. Also, signal surface (polished surface)
Since the polishing is performed with the surface facing upward, it becomes possible to carry the workpiece while keeping the signal surface upward, and the delivery of the work and the installation on the stage are simplified.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the present invention is applied will be described in detail below with reference to the drawings.

Before describing the optical disk master polishing apparatus of this embodiment, the mastering process will be briefly described. The mastering is performed according to the flow shown in FIG.

The mastering process is roughly divided into a pre-process, a resist process, a cutting process, a developing process, an electroforming process and a post-process, and the processes are carried out in this order. The pre-process includes each process of reprocessing, polishing, scrubber, and precision cleaning. First, step ST1
In step ST2, a polishing process is performed, then in step ST3, a scrubber process is performed, and finally in step ST4, precision cleaning is performed.

The reproduction process of step ST1 is a process performed for reusing the glass master used as the master for the optical disc. Such regeneration treatment is performed by using ferric chloride and Na.
OH (or acetone) is used to remove the nickel residue and the resist residue. Both ferric chloride and NaOH are washed away with pure water.

In the polishing process of step ST2, a dedicated pad is attached on the turntable, a glass master is placed on the pad, and the turntable is rotated while pressing the master on the turntable using an air cylinder or the like. At this time, the slurry of cerium oxide is flown as an abrasive and polished. Next, the discharge of cerium is stopped and the cerium is switched to water to roughly remove the cerium on the surface.

The scrubber process in step ST3 is a process for removing the cerium residue on the glass master by scrubbing.

In the precision cleaning process of step ST4, most of the cerium is removed by the scrubber, but fine particles remain on the end face and the surface. Therefore, further cleaning is performed with pure water dipping and ultrasonic waves. Processing. At this time, a detergent may be used. Then, after drying with IPA or warm pure water, it is carried to a resist process.

The resist process includes resist coating, prebaking, dropout measurement, and film thickness measurement. In the resist process, first, in step ST5, a resist coating process for applying a photoresist to a glass master is performed, then in step ST6 prebaking is performed to cure the resist, then in step ST7, dropout measurement is performed, and finally, In step ST8, the resist film thickness is measured.

The cutting process is a process of exposing the resist with a laser, and the step S after the film thickness measurement.
Perform at T9.

The developing step is a step of developing the resist exposed in step ST9.

The electroforming step includes the electroconducting process of step ST11 and the electroforming process of electroforming nickel in step ST12.

The subsequent steps include back surface polishing, peeling, resist cleaning, protective film coating, and punching steps. In the post process, first, the back surface of the glass master is polished in step ST13, a peeling process is performed in the next step ST14, and then the resist is washed in step ST15. Then, in the next step ST16, a protective film is applied, and then in step ST
In step 17, punching is performed so that the stamper can be attached to the molding machine, and in the final step ST18, the stamper is attached to the molding machine to perform molding.

The above is the flow of the mastering process, and the polishing apparatus of this embodiment uses the step S in the process.
It is used in the polishing step performed at T2.

As shown in FIGS. 1 and 2, such a polishing apparatus includes an exterior portion, a transport unit portion, a polishing arm unit portion, a brush unit portion, a washing arm unit portion, a turntable unit portion, It consists of a utility section.

The exterior part includes a frame 1 and an operation panel 2.
, A liquid crystal display 3, a tower light 4, a main switch 5, and a control panel 6.

The frame 1 is a pedestal for mounting each unit, and is formed to have a size sufficient to accommodate these units. The operation panel 2 is for starting the device,
It is an operation unit that performs stop, condition setting, and the like. The liquid crystal display 3 functions as a display unit that displays condition settings, device abnormalities, and the like. The tower light 4 is designed to display the state of the device such as during operation and stop by using three-color lamps. And the control panel 6 contains electric parts such as sequencer, breaker, and motor driver.

The transfer unit section comprises a conveyor 7, a backup 8, a transfer arm 9 and a transfer arm actuator 10.

The conveyor 7 is a conveying means for receiving the glass master from the conveyor of the reprocessing machine, and is conveyed by a drive belt. Backup 8 is
This is a unit for transferring the glass master to the transfer arm 9. The transfer arm 9 is an arm that transfers the glass master to the handling lifter or the next device. The transfer arm actuator 10 is
It is composed of two axes, an axis and an R axis, and drives the transfer arm 9.

The polishing arm unit portion includes a polishing pad 11 which is a polishing pad, a polishing arm 12, and a polishing arm actuator 13.
And a slurry nozzle 14 and a pure water nozzle 15.

The polishing pad 11 is a pad for polishing a glass master. Polishing arm 12
Is an arm for attaching the polishing pad 11. The polishing arm actuator 13 is a drive source for vertically moving and swinging the polishing pad 11. The slurry nozzle 14 is for supplying the polishing liquid to the glass master disc, and is configured to supply the polishing liquid to the glass master disc from its tip.

Similarly, the deionized water nozzle 15 is a surface nozzle 15 for wetting the polished surface of the glass master 30 before the start of polishing.
a and a back surface nozzle 15b that prevents the abrasive material from adhering to the back surface of the glass master disk 30. Pure water is supplied from the tip of each nozzle toward the glass master disk.

The brush unit is a pad cleaning brush 1
6 and a brush drive unit 17. The pad cleaning brush 16 is for cleaning the polishing pad 11. The brush drive unit 17 is a drive source that rotates the pad cleaning brush 16. This pad cleaning brush 16 is used as a dirty polishing pad 1 after polishing.
By contacting with 1 and rotating, dirt of the pad is removed and the pad is made fresh. The pad cleaning brush 16 is used for pad cleaning and freshening.
This is done while supplying pure water from a pure water discharge nozzle provided beside the.

The washing arm unit portion comprises a washing arm 18 and a washing arm actuator 19. An ultrasonic oscillating nozzle is attached to the tip of the washing arm 18, and the glass master is cleaned. On the other hand, the washing arm actuator 19 functions as a drive source for swinging the washing arm 18.

The turntable unit includes a chamber 20, a turntable 21, and a handling lifter 2.
Consists of two. The chamber 20 is for cleaning the glass master disk,
This is the place where polishing is performed. In this chamber 20,
Each unit is installed. Turntable 21
Is for rotating the glass master. The handling lifter 22 is a unit that transfers the glass master disk from the transfer arm 9 to the turntable 21.

The utility section includes an exhaust duct 23,
It comprises a slurry tank 24 and a wastewater outlet 25. The exhaust duct 23 functions as an exhaust port inside the chamber 20 and inside the apparatus. The slurry tank 24 is a tank for supplying a polishing liquid, and is constantly stirred by a stirring motor. The waste water port 25 is for discharging the waste slurry after polishing.

FIG. 3 and FIG. 4 show enlarged main parts of the polishing mechanism section. The turntable 21 is attached to a spindle 28 attached to the tip end of a drive shaft 27 of a table drive motor 26, and is adapted to rotate together with the spindle 28. A coupling 29 is attached to the drive shaft 27 between the spindle 28 and the table drive motor 26.

The turntable 21 is formed as a disk having a size large enough to stably mount one glass master disk 30, and is formed as a disk about one size smaller than the glass master disk 30. Further, the turntable 21 is provided with a vacuum suction mechanism (not shown) for fixing the glass master 30 on the turntable 21 by vacuum suction.

In this apparatus, a plurality of glass master disks 30 are not simultaneously processed, but one glass master disk 30 is processed. Therefore, in the case of a CD, the glass master disks 30 having a diameter of about 220 mm are rotated. A small motor can be used because a sufficient motor is sufficient. Further, the chamber 20 may be small, as long as there is enough space for one glass master 30 to rotate. That is, the size of the entire device can be reduced.

Further, since the table drive motor 26 is downsized, the required electric power is reduced, and since it is not necessary to cool the surface plate as in the conventional case, the load on the utility can be reduced. That is, the diameter of 180 mm to 240
Since a glass plate having a thickness of 5 mm and a thickness of 5 mm to 12 mm can be rotated, a small amount of electric power is required. Further, the downsizing of the polishing pad 11 enables cooling with cerium + pure water for cleaning, which significantly reduces the need for using dedicated cooling water as a utility.

In this apparatus, since one cycle is processed for one sheet, the takt time is reduced as compared with the conventional plural sheet processing, but in the mastering plant, the polishing takt time is by far short and there is no disadvantage. . The benefits of automation and inlining are far greater than that. At present, the tact time of each process is about 10 minutes at the shortest. On the other hand, it is not so difficult to set the polishing time to 5 minutes or less, and the addition of the cleaning step balances with other steps, and there is no influence of the increased tact time.

In the polishing pad 11, a spindle 31 is rotatably provided at the tip of a polishing arm 12 which is a supporting member, and one main surface of a disk-shaped pad holding member 32 provided at the tip of the spindle 31. It is attached. The pad holding member 32 to which the polishing pad 11 is attached is rotated by the polishing actuator 33 together with the spindle 31. The pad holding member 32 is pressed against the glass master 30 with a predetermined pressing force by an air cylinder (not shown).

The pad holding member 32 to which the polishing pad 11 is attached is, as shown in FIG.
The polishing pad actuator 33 described above moves between the glass master 30 and the pad cleaning brush 16. Therefore, when the glass master 30 is polished, the pad holding member 32 is moved onto the glass master 30, and after polishing, it is moved onto the pad cleaning brush 16 to clean the dirty polishing pad 11. The pad holding member 32 is used for the glass master 3
During the polishing of 0, the glass master 30 is swung.

The slurry nozzle 14 is attached to the polishing arm 12, and the tip end of the nozzle is provided in a position close to the polishing pad 11. The polishing liquid is supplied to the glass master 30 from the slurry tank 24 to the slurry nozzle 14. Since the polishing pad 11 is downsized, the amount of the polishing liquid used can be significantly reduced. Therefore, the amount of waste liquid that is difficult to process can be reduced. In particular, a slurry of cerium oxide, which is a typical abrasive in glass polishing, is difficult to process because the cerium powder diameter is very small. Therefore, reducing waste liquid is effective in reducing the burden on wastewater treatment facilities. In this device, since the entire surface of the polishing pad acts as an effective diameter, it is possible to considerably reduce the cerium flow rate.

The pure water nozzles 15 are provided above and below the glass master disk 30. The pure water nozzle 15 is provided with a front surface nozzle 15a on the polishing surface of the glass master disk 30 and a back surface nozzle 15b on the back surface side. The surface nozzle 15a has a function of wetting the polished surface of the glass master 30 before the start of polishing and a function of cleaning the polished surface after polishing. The back surface nozzle 15b is sprayed on the back surface of the glass master 30 during polishing,
It serves to prevent adhesion of the abrasive to the back surface. Since pure water is constantly sprayed onto the back surface of the glass master 30 during polishing to prevent the adherence of the abrasive, the back surface is prevented from being polished by the abrasive.

The ultrasonic oscillating nozzle 34 provided at the tip of the washing arm 18 is rotated by the polishing actuator 13 and scans the glass master 30. A pure water supply pipe 35 connected to a pure water supply controller for supplying pure water is connected to the ultrasonic oscillation nozzle 34. Therefore, pure water is ejected from the ultrasonic oscillation nozzle 34 toward the glass master disk 30.

In the polishing apparatus described above, the polishing pad 11 is configured to rotate by frictional force with the turntable 21, but it may be forcibly rotated by a rotary drive source such as a motor. .

Next, the step of polishing a glass master using this polishing apparatus will be described with reference to the flow chart of FIG.

First, in step ST19, the glass master 30 is carried to the conveyor 7 by the carrier robot. At this time, the glass master 30 is carried so that the polishing surface thereof faces upward. And, by this conveyor 7, the glass master 3
0 is conveyed to the center of the apparatus main body, and the glass master 30 is transferred onto the turntable 21 by the transfer arm 9. The glass master 30 placed on the turntable 21 is vacuum-sucked and fixed to the turntable 21.

As described above, since the signal surface can be conveyed while being kept upward, the work transfer and the installation on the stage are simplified. When considering the transfer of the work, if the direction of the work is different from that of the front and rear machines, a mechanism for repositioning must be provided. In the conventional apparatus, the direction of the work in the regeneration process → polishing → scrubber → cleaning is horizontal → down → horizontal (upper) → horizontal considering the signal surface.
However, in this apparatus, the orientation of the work is changed from the side to the top and then to the top during the recycling process, the polishing, and the cleaning, so that the work is easily transported.

Next, in step ST20, the turntable 21 is rotated and the glass master 30 is rotated.

Next, in step ST21, pure water is sprayed by the back surface nozzle 15b onto the back surface of the glass master disk 30 fixed on the turntable 21 on the side opposite to the polishing surface. This work is continued until the end of polishing.

Subsequently, in step ST22, the glass master 3 is used.
Pure water is discharged from the surface nozzle 15a onto the polishing surface No. 0 to wet the polishing surface.

Next, in step ST23, the polishing arm 12 carries the polishing pad 11 onto the pad cleaning brush 16.

Then, in step ST24, the polishing pad 11 is pressed against the pad cleaning brush 16, and while the pure water is being discharged from the cleaning nozzle attached to the side of the brush, the pad cleaning brush 16 is rotated to clean and set the pad. To do.

Next, in step ST25, the polishing pad 11 is carried onto the glass master disk 30, and the polishing pad 11 is pressed against the glass master disk 30 with a predetermined pressing force by an air cylinder. Then, the turntable 21 is rotated while the polishing liquid is supplied from the slurry nozzle 14 provided beside the polishing pad 11, and the glass master 30 is polished. At this time, the polishing pad 11 rotates together with the glass master disk 30 due to the frictional force between the polishing pad 11 and the glass master disk 30, and swings on the glass master disk 30.

After the polishing is completed in step ST26, the supply of the polishing liquid is stopped and the polishing is continued while supplying pure water. As a result, the abrasive on the glass master 30 is roughly washed. When the rough cleaning is completed, the polishing in step ST27 is completed.

Next, in step ST28, the glass master 30 is used.
While rotating, the ultrasonic oscillation nozzle 34 is scanned and pure water is discharged to clean the glass master 30.

Next, at step ST29, the polishing pad 11 is pressed against the pad cleaning brush 16, and while the pure water is discharged from the cleaning nozzle mounted on the side of the brush, the pad cleaning brush 16 is rotated to clean and set the pad. To do.

Then, in step ST30, the glass master 3 is used.
By rotating 0 at a high speed, the glass master 30
Is dried, and the polishing process of the glass master 30 is completed in step ST31.

Here, the glass master was actually polished using the above-mentioned polishing apparatus, and the surface defects of the glass master were measured by a laser reflection type surface defect measuring machine. As a result, the number of defects showed a good value. In addition, as a result of measuring the surface shape and the signal of the stamper produced using this glass master, good numbers were shown.

[0075]

As is apparent from the above description, in the optical disk master polishing apparatus of the present invention, the optical disk master is fixed on a turntable smaller than the master so that the polishing surface faces upward. Since the turntable is rotated and the polishing liquid is supplied while polishing is performed by the polishing pad, the chamber that is the polishing space and the motor that drives the turntable can be significantly downsized, and the entire apparatus can be made compact. Can be one.

Further, according to the optical disk master polishing apparatus of the present invention, the size of the motor for rotationally driving the turntable can be reduced, so that the required power can be reduced and
Since it is not necessary to cool the surface plate of the conventional device, the load on the utility can be reduced. Further, since the diameter of the polishing pad is reduced, the amount of abrasive used can be greatly reduced, and the amount of waste liquid that is difficult to process can be reduced.

Further, according to the optical disk master polishing apparatus of the present invention, since it is possible to carry the optical disk while keeping the signal surface facing upward, it is possible to simplify the delivery of the work and the installation on the stage.

[Brief description of drawings]

FIG. 1 is a partially transparent front view showing an optical disk master polishing apparatus to which the present invention is applied.

FIG. 2 is a plan view showing a part of a master disk polishing apparatus for an optical disk to which the present invention is applied, as seen through.

FIG. 3 is a schematic front view showing a main part of a polishing mechanism portion of an optical disk master polishing apparatus to which the present invention is applied.

FIG. 4 is a schematic plan view showing a main part of a polishing mechanism portion of an optical disk master polishing apparatus to which the present invention is applied.

FIG. 5 is a flowchart of a glass master disk polishing process using the optical disk master disk polishing apparatus to which the present invention is applied.

FIG. 6 is a flowchart showing a mastering process using an optical disk master polishing apparatus to which the present invention is applied.

FIG. 7 is a front view showing a conventional optical disk master polishing device with a part thereof cut away.

FIG. 8 is a side view showing a conventional optical disc master polishing device with a part thereof cut away.

FIG. 9 is a schematic view showing a main part of a polishing mechanism section of a conventional optical disk master polishing apparatus.

FIG. 10 is a flowchart of a polishing process using a conventional optical disk master polishing apparatus.

[Explanation of symbols]

 1 Frame 7 Conveyor 9 Transfer Arm 11 Polishing Pad 12 Polishing Arm 13 Polishing Arm Actuator 14 Slurry Nozzle 15a Surface Nozzle 15b Backside Nozzle 16 Pad Cleaning Brush 17 Brush Drive Unit 18 Washing Arm 20 Chamber 21 Turntable 24 Slurry Tank 26 Table Drive Motor 30 Glass Master 32 Pad Holding Member 33 Polishing Actuator 34 Ultrasonic Oscillating Nozzle

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Junzo Takano 6-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (5)

[Claims] 1. A turntable that fixes an optical disk master and rotates the optical disk master, and a polishing pad that is pressed on the polishing surface of the optical disk master fixed on the turntable with a predetermined pressing force. And a polishing liquid supply unit for supplying a polishing liquid onto the polishing surface of the optical disc master, the polishing pad is pressed against the optical disc master rotated by the rotation of the turntable, and polishing is performed while supplying the polishing liquid. An optical disk master polishing device characterized by the above. 2. The polishing pad is rotatably attached to a support member, and is rotated with the rotation of the optical disc master by a frictional force with the optical disc master. Item 1. An optical disk master polishing device according to item 1. 3. The optical disk master polishing apparatus according to claim 1, wherein the polishing pad is forcibly rotated by a rotary drive source as the optical disk master rotates. 4. The optical disk master polishing apparatus according to claim 1, wherein the turntable is smaller than the optical disk master. 5. The optical disk master polishing apparatus according to claim 1, wherein the optical disk master is fixed to the turntable by vacuum suction.