JPH0729223A - Production of stamper and device for polishing rear surface of stamper - Google Patents

Production of stamper and device for polishing rear surface of stamper

Info

Publication number
JPH0729223A
JPH0729223A JP17052393A JP17052393A JPH0729223A JP H0729223 A JPH0729223 A JP H0729223A JP 17052393 A JP17052393 A JP 17052393A JP 17052393 A JP17052393 A JP 17052393A JP H0729223 A JPH0729223 A JP H0729223A
Authority
JP
Japan
Prior art keywords
stamper
polishing
back surface
polishing head
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17052393A
Other languages
Japanese (ja)
Inventor
Nobuyuki Hosoi
信幸 細井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP17052393A priority Critical patent/JPH0729223A/en
Publication of JPH0729223A publication Critical patent/JPH0729223A/en
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

PURPOSE:To smoothly polish the rear surface of a stamper with high accuracy. CONSTITUTION:The stamper 4 is placed in tight contact with a glass master disk 5 on a turn table 6. A polishing head 2 smaller than the size of the stamper 4 is disposed to face the rear surface of the stamper 4. The polishing head 2 is stuck with a polishing cloth 1. This polishing head 2 is rotated and is moved back and forth toward a direction (x) while a polishing liquid is supplied between the stamper 4 and polishing cloth 1 at the time of polishing. The pressure acting on the polishing head 2 is detected by a pressure detecting means 13 and a feed mechanism 10 in a direction (z) is so driven with a control means 14 in such a manner that the specified pressure is obtd.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光記録媒体形成用のス
タンパの裏面を鏡面研磨するために用いられるスタンパ
裏面研磨装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stamper back surface polishing apparatus used for mirror polishing the back surface of a stamper for forming an optical recording medium.

【0002】[0002]

【従来の技術】従来、多種多様の情報を効率よく取り扱
う手段として、光記録媒体による光学的情報記録方法が
提案され、そのための光学的情報記録坦体、記録再生方
法、記録再生装置が提案されている。かかる情報記録坦
体としての光記録媒体では、一般に、予め、トラックや
情報に対応する凹凸パターンが形成されたスタンパを作
製しておき、熱可塑性樹脂であるポリカーボネート樹脂
やポリメチルメタクリル樹脂にスタンパの凹凸パターン
を転写して溝部を形成している。情報の記録、再生は、
溝部の微細な凹凸を利用してレーザー光の位相差により
位置決めしながら行なっている。
2. Description of the Related Art Conventionally, as a means for efficiently handling a wide variety of information, an optical information recording method using an optical recording medium has been proposed, and an optical information recording carrier, a recording / reproducing method, and a recording / reproducing apparatus therefor have been proposed. ing. In such an optical recording medium as an information recording carrier, in general, a stamper on which a concavo-convex pattern corresponding to tracks and information is formed is prepared in advance, and a stamper is formed on a polycarbonate resin or polymethylmethacrylic resin which is a thermoplastic resin. A groove portion is formed by transferring the uneven pattern. Information recording and playback is
It is performed while positioning by the phase difference of the laser light by using the fine unevenness of the groove.

【0003】ここで、従来のスタンパの製造工程につい
て説明する。まず、平面性良く研磨されたガラス基板の
上に、レジストや感光性樹脂で所定の深さに凹凸パター
ンを形成した樹脂層を積層してガラス原盤とする。次
に、ガラス原盤の表面にスパッタなどにより導電膜を形
成する。その後、電鋳法により導電膜上に電鋳膜を電着
する。そして、この電鋳膜の裏面を平滑に研磨した後、
導電膜と樹脂層との界面で引き剥して、表面に凹凸パタ
ーンが形成されたスタンパを得ている。ここで、スタン
パの裏面に凹凸があると、転写されたパターンに歪みを
生じたり、転写された凹凸によりサーボ性能、データ検
出性能に悪影響を与えるので、スタンパの裏面はできる
だけ平滑に研磨する必要がある。
Now, a conventional stamper manufacturing process will be described. First, a glass master is prepared by laminating a resin layer having a concavo-convex pattern formed at a predetermined depth with a resist or a photosensitive resin on a glass substrate that has been polished with good flatness. Next, a conductive film is formed on the surface of the glass master by sputtering or the like. Then, an electroformed film is electrodeposited on the conductive film by electroforming. And after polishing the back surface of this electroformed film smoothly,
The stamper having the concavo-convex pattern formed on the surface is obtained by peeling the conductive film and the resin layer at the interface. If the back surface of the stamper has irregularities, the transferred pattern will be distorted or the transferred irregularities will adversely affect the servo performance and data detection performance.Therefore, the back surface of the stamper must be polished as smooth as possible. is there.

【0004】このようなスタンパの裏面を研磨する装置
として、例えば、単にスタンパを移動させながらスタン
パの裏面にベルト状の回転研磨体を当接させる乾式の研
磨装置や、スタンパの裏面に、スタンパの大きさよりも
大きく、かつ表面に研磨布を張り付けた回転円盤を対向
配置し、両者の間に研磨液を供給しつつ両者を互いに逆
回転させて研磨するいわゆるラッピング装置がある。ラ
ッピング装置による研磨方法としては次の二つの方法が
ある。スタンパの研磨前にスタンパをガラス原盤から
剥離し、パターン面を保護膜で覆った後に研磨する。
スタンパをガラス原盤に密着させたまま研磨する。
As a device for polishing the back surface of such a stamper, for example, a dry polishing device in which a belt-shaped rotary polishing body is brought into contact with the back surface of the stamper while simply moving the stamper, or a stamper is provided on the back surface of the stamper. There is a so-called lapping device, which is larger than the size and has a rotating disk having a polishing cloth attached to the surface thereof, which faces each other, and supplies the polishing liquid between them to rotate them in opposite directions to each other. There are the following two methods of polishing with a lapping device. Before the stamper is polished, the stamper is peeled off from the glass master, and the pattern surface is covered with a protective film and then polished.
Polish with the stamper in close contact with the glass master.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、上述し
た従来の研磨装置のうち、ベルト状の回転研磨体をスタ
ンパの裏面に当接させる乾式のものでは、研磨中に生じ
る研磨粉や周囲からのゴミを巻き込み、研磨面に擦り傷
が発生しやすいという問題点があった。
However, among the above-mentioned conventional polishing apparatuses, in the dry type in which the belt-like rotary polishing body is brought into contact with the back surface of the stamper, the polishing powder generated during polishing and dust from the surroundings are generated. However, there is a problem in that the scratches are likely to be generated on the polished surface due to the inclusion of

【0006】一方、ラッピング装置による研磨では、ス
タンパの裏面の形状は保護膜の厚みのばらつき、または
原盤の反り等の形状に依存しており、しかもスタンパよ
りも大きな回転円盤をスタンパの裏面に当接させて研磨
を行なうので、保護膜に厚みのばらつきが生じていたり
原盤に反り等が生じている状態で研磨を行なうと、スタ
ンパは一定の厚みには研磨されない。すなわち、保護膜
または原盤から剥離されたスタンパは厚みが一定でな
く、平滑なスタンパが得られないという問題点があっ
た。また、ラッピング研磨装置は比較的大型の回転定盤
とその回転機構とを有するために、装置の小型化が困難
であった。
On the other hand, in polishing with a lapping device, the shape of the back surface of the stamper depends on the thickness of the protective film, the shape of the warp of the master, and the like, and a rotating disk larger than the stamper is applied to the back surface of the stamper. Since the polishing is performed in contact with each other, the stamper is not polished to a certain thickness when the polishing is performed in a state where the thickness of the protective film is varied or the master is warped. That is, there is a problem that the stamper peeled from the protective film or the master does not have a constant thickness and a smooth stamper cannot be obtained. Further, since the lapping and polishing apparatus has a relatively large rotating platen and its rotating mechanism, it is difficult to downsize the apparatus.

【0007】本発明は、スタンパの裏面をより精度よく
平滑に研磨できる、スタンパの製造方法およびスタンパ
裏面研磨装置を提供することを目的とする。
It is an object of the present invention to provide a stamper manufacturing method and a stamper back surface polishing apparatus that can polish the back surface of the stamper more accurately and smoothly.

【0008】[0008]

【課題を解決するための手段】上記目的を達成するため
本発明のスタンパの製造方法は、記録すべき情報に対応
した凹凸パターンが形成された原盤の表面に、導電膜お
よび電鋳膜を順次積層することで、前記導電膜および電
鋳膜で構成され前記電鋳膜を裏面とするスタンパを形成
し、前記スタンパの裏面を研磨した後に、前記原盤と前
記導電膜との界面で引き剥がすことで、光記録媒体形成
用のスタンパを得る、スタンパの製造方法において、前
記スタンパの裏面の研磨時に、前記スタンパの裏面の大
きさに比較して小さく、かつ、前記スタンパの裏面と対
向する面に研磨布が固定された研磨ヘッドを用い、前記
研磨ヘッドを、回転させつつ前記スタンパの裏面の形状
に沿って前記スタンパの径方向に往復移動させながら、
前記研磨布と前記スタンパの裏面との間に研磨液を供給
して、前記スタンパの裏面を研磨することを特徴とす
る。
In order to achieve the above-mentioned object, the stamper manufacturing method of the present invention is such that a conductive film and an electroformed film are sequentially formed on the surface of a master having an uneven pattern corresponding to information to be recorded. Forming a stamper that is composed of the conductive film and the electroformed film and has the electroformed film as a back surface by stacking, and after peeling the back surface of the stamper, peeling the stamper at the interface between the master and the conductive film. In the method of manufacturing a stamper for obtaining a stamper for forming an optical recording medium, in polishing the back surface of the stamper, the surface of the stamper is smaller than the size of the back surface of the stamper and faces the back surface of the stamper. Using a polishing head with a fixed polishing cloth, while reciprocating the polishing head in the radial direction of the stamper along the shape of the back surface of the stamper while rotating,
A polishing liquid is supplied between the polishing cloth and the back surface of the stamper to polish the back surface of the stamper.

【0009】また、前記研磨布が前記スタンパの裏面に
当接することにより前記研磨ヘッドに加わる圧力が一定
になるように前記研磨ヘッドの位置を制御することで、
前記研磨ヘッドを前記スタンパの裏面の形状に沿って移
動させるものでもよい。
Further, by controlling the position of the polishing head so that the pressure applied to the polishing head becomes constant by bringing the polishing cloth into contact with the back surface of the stamper,
The polishing head may be moved along the shape of the back surface of the stamper.

【0010】本発明のスタンパ裏面研磨装置は、記録す
べき情報に対応した凹凸パターンが形成された原盤の表
面に、導電膜および電鋳膜を順次積層することで形成さ
れた、前記導電膜および電鋳膜で構成され前記電鋳膜を
裏面とする光記録媒体形成用のスタンパが、前記原盤に
密着した状態で前記原盤を介して載置され、かつ、回転
自在に設けられた回転テーブルと、回転自在および前記
スタンパの径方向に往復移動自在に設けられ、前記スタ
ンパの裏面の大きさに比較して小さく、前記回転テーブ
ルに載置されたスタンパの裏面と対向する面に研磨布が
固定された研磨ヘッドと、前記研磨ヘッドと前記スタン
パの裏面との間に研磨液を供給する研磨液供給手段と、
前記スタンパの裏面の研磨時に、前記研磨ヘッドの前記
スタンパの径方向への往復移動とともに、前記研磨ヘッ
ドを前記スタンパの裏面の形状に沿って移動させる駆動
手段とを有することを特徴とする。
In the stamper back surface polishing apparatus of the present invention, the conductive film and the electroformed film formed by sequentially laminating the conductive film and the electroformed film on the surface of the master on which the concavo-convex pattern corresponding to the information to be recorded are formed. A stamper for forming an optical recording medium, which is composed of an electroformed film and has the electroformed film as a back surface, is placed through the master in a state of being in close contact with the master, and a rotary table rotatably provided. , Rotatable and reciprocally movable in the radial direction of the stamper, smaller than the size of the back surface of the stamper, and a polishing cloth is fixed to the surface facing the back surface of the stamper mounted on the rotary table. And a polishing liquid supply means for supplying a polishing liquid between the polishing head and the back surface of the stamper.
When the back surface of the stamper is polished, the polishing head further includes a drive unit that moves the polishing head along the shape of the back surface of the stamper together with the reciprocating movement of the polishing head in the radial direction of the stamper.

【0011】また、前記駆動手段は、前記研磨布が前記
スタンパの裏面に当接することにより前記研磨ヘッドに
加わる圧力を検出する圧力検出手段と、前記圧力検出手
段で検出された圧力が一定になるように、前記研磨ヘッ
ドの位置を制御する制御手段とを有するものであっても
よい。
Further, the driving means has a pressure detecting means for detecting a pressure applied to the polishing head when the polishing cloth is in contact with the back surface of the stamper, and the pressure detected by the pressure detecting means is constant. As described above, a control means for controlling the position of the polishing head may be provided.

【0012】[0012]

【作用】上記のとおり構成された本発明のスタンパの製
造方法では、スタンパの裏面の研磨時に、研磨ヘッドに
固定された研磨布とスタンパとの間に研磨液が供給され
るので、化学的なエッチング効果と研磨粒子によるメカ
ニカルな研磨とが組み合わされ、スタンパの裏面は擦り
傷の少ない鏡面に仕上げられる。また、スタンパは、原
盤の表面に導電膜および電鋳膜を順次積層したものなの
で、その厚みは一定となり、裏面の形状は原盤の形状に
依存する。すなわち、原盤に反り等が生じている場合に
は、スタンパの裏面も反った形状となっている。そこ
で、研磨ヘッドの大きさが、スタンパの裏面の大きさに
比較して小さいものを用い、その研磨ヘッドをスタンパ
の裏面の形状に沿って移動させることで、研磨されたス
タンパの厚みは一定になり、原盤から引き剥がされた後
には裏面が平滑なものとなる。
In the method of manufacturing a stamper of the present invention configured as described above, when the back surface of the stamper is polished, the polishing liquid is supplied between the polishing cloth fixed to the polishing head and the stamper. By combining the etching effect and mechanical polishing with abrasive particles, the back surface of the stamper is finished into a mirror surface with few scratches. Further, since the stamper is formed by sequentially laminating a conductive film and an electroformed film on the surface of the master, the thickness thereof is constant, and the shape of the back surface depends on the shape of the master. That is, when the master disc is warped or the like, the back surface of the stamper is also warped. Therefore, by using a polishing head whose size is smaller than the size of the back surface of the stamper and moving the polishing head along the shape of the back surface of the stamper, the thickness of the polished stamper is kept constant. After being peeled off from the master, the back surface becomes smooth.

【0013】[0013]

【実施例】次に、本発明の実施例について図面を参照し
て説明する。
Embodiments of the present invention will now be described with reference to the drawings.

【0014】図1は、本発明のスタンパ裏面研磨装置の
一実施例の概略構成図である。図1において、回転テー
ブル6は、テーブル回転モータ7によりθz方向に回転
自在に設けられており、その上面にはスタンパ4が載置
される。スタンパ4は、図2に示すように、平面性良く
研磨されたガラス基板5aに所定の深さで凹凸パターン
を形成した樹脂層5bを積層したガラス原盤5の表面に
形成された導電膜4aと電鋳膜4bとの積層体であり、
図1に示したようにガラス原盤5に密着したままの状態
で、ガラス原盤5側が回転テーブル6に載置されてい
る。すなわち、スタンパ4の裏面が図示上方に向けられ
ている。また、スタンパ4の研磨時に供給される研磨液
を受容する桶状の研磨液受け8が、回転テーブル6を囲
んで配置されている。研磨液受け8の下壁には、研磨液
を排出するための廃液孔8aが形成されている。
FIG. 1 is a schematic configuration diagram of an embodiment of a stamper back surface polishing apparatus of the present invention. In FIG. 1, a rotary table 6 is rotatably provided in a θz direction by a table rotary motor 7, and a stamper 4 is mounted on the upper surface thereof. As shown in FIG. 2, the stamper 4 includes a conductive film 4a formed on the surface of a glass master 5 in which a resin layer 5b having a concavo-convex pattern formed at a predetermined depth is laminated on a glass substrate 5a polished to have a good flatness. It is a laminate with the electroformed film 4b,
As shown in FIG. 1, the glass master 5 side is placed on the rotary table 6 while being in close contact with the glass master 5. That is, the back surface of the stamper 4 is directed upward in the figure. Further, a trough-shaped polishing liquid receiver 8 for receiving the polishing liquid supplied at the time of polishing the stamper 4 is arranged so as to surround the rotary table 6. A waste liquid hole 8a for discharging the polishing liquid is formed on the lower wall of the polishing liquid receiver 8.

【0015】一方、回転テーブル6に対向して研磨ヘッ
ド2が配置されている。研磨ヘッド2は、x方向送り機
構9およびz方向送り機構10によってx方向およびz
方向に移動自在に設けられたヘッド支持部材11に固定
されたヘッド回転モータ12の出力軸に結合されてお
り、ヘッド回転モータ12によりθz方向に回転される
構成となっている。研磨ヘッド2の大きさは、スタンパ
4の研磨面大きさに比較して十分に小さな大きさであ
り、その、回転テーブルと6の対向面には研磨布1(例
えば、フジミ社製「Surfin018」)が貼り付け
られている。また、ヘッド支持部材11には、研磨時に
研磨布1の近傍でスタンパ4の裏面に研磨液を供給する
ための、研磨液供給源15に接続された研磨液供給ノズ
ル3が設けられている。研磨液としては、例えば、フジ
ミ社製の「POLIPLA−700」が用いられる。さ
らに、ヘッド支持部材11には、研磨時に研磨ヘッド2
がスタンパ4に当接することにより研磨ヘッド4に加わ
る圧力を検出するための圧力検出手段13が設けられて
いる。
On the other hand, the polishing head 2 is arranged so as to face the rotary table 6. The polishing head 2 is moved by the x-direction feed mechanism 9 and the z-direction feed mechanism 10 in the x-direction and the z-direction.
It is connected to the output shaft of a head rotation motor 12 fixed to a head support member 11 movably provided in the direction, and is rotated in the θz direction by the head rotation motor 12. The size of the polishing head 2 is sufficiently smaller than the size of the polishing surface of the stamper 4, and the polishing cloth 1 (for example, "Surfin018" manufactured by Fujimi Co., Ltd.) is provided on the surface facing the rotary table 6 and the polishing table 2. ) Is attached. Further, the head support member 11 is provided with a polishing liquid supply nozzle 3 connected to a polishing liquid supply source 15 for supplying the polishing liquid to the back surface of the stamper 4 near the polishing cloth 1 during polishing. As the polishing liquid, for example, "POLIPLA-700" manufactured by Fujimi Co., Ltd. is used. Further, the head support member 11 has a polishing head 2 for polishing.
There is provided a pressure detecting means 13 for detecting the pressure applied to the polishing head 4 by contacting the stamper 4.

【0016】制御手段は14、テーブル回転モータ7、
ヘッド回転モータ12、x方向送り機構9、およびz方
向送り機構10の駆動を制御するとともに、研磨液供給
源15から研磨液供給ノズル3への研磨液供給量を制御
するもので、シーケンサーやパーソナルコンピュータ等
が用いられる。さらに、制御手段14には圧力検出手段
13からの検出結果が送られ、制御手段14は、研磨時
に研磨ヘッド2に加わる圧力が一定になるようにz方向
送り機構10を制御する。
The control means is 14, a table rotation motor 7,
It controls the drive of the head rotation motor 12, the x-direction feed mechanism 9, and the z-direction feed mechanism 10, and also controls the amount of polishing liquid supplied from the polishing liquid supply source 15 to the polishing liquid supply nozzle 3, and is a sequencer or a personal computer. A computer or the like is used. Further, the detection result from the pressure detection means 13 is sent to the control means 14, and the control means 14 controls the z-direction feed mechanism 10 so that the pressure applied to the polishing head 2 during polishing becomes constant.

【0017】次に、本実施例のスタンパ裏面研磨装置の
動作について説明する。
Next, the operation of the stamper back surface polishing apparatus of this embodiment will be described.

【0018】まず、回転テーブル6上に、ガラス原盤5
に密着したままのスタンパ4を、ガラス原盤5を下側に
して載置し、回転テーブルモータ7により回転テーブル
6を所定の回転数で回転テーブル6とは逆向きに回転さ
せる。次いで、ヘッド回転モータ12により研磨ヘッド
2を所定の回転数で回転させるとともに研磨液供給ノズ
ル3より研磨液を供給し、z方向送り機構10により研
磨ヘッド2を下降させて研磨布1とスタンパ4の裏面と
を所定の圧力で当接させる。そして、x方向送り機構9
により研磨ヘッド2をx方向に所定の速度で往復運動さ
せることで、スタンパ4の裏面が研磨される。
First, the glass master 5 is placed on the rotary table 6.
The stamper 4 still in close contact with the glass master 5 is placed with the glass master 5 facing downward, and the rotary table motor 7 rotates the rotary table 6 in a direction opposite to the rotary table 6 at a predetermined rotation speed. Next, the head rotating motor 12 rotates the polishing head 2 at a predetermined number of rotations, the polishing liquid supply nozzle 3 supplies the polishing liquid, and the z-direction feeding mechanism 10 lowers the polishing head 2 to lower the polishing cloth 1 and the stamper 4. And contact the back surface of the sheet with a predetermined pressure. Then, the x-direction feed mechanism 9
Thus, the back surface of the stamper 4 is polished by reciprocating the polishing head 2 in the x direction at a predetermined speed.

【0019】このとき制御手段14は、圧力検出手段1
3からの検出結果に応じて、研磨ヘッド2に加わる圧力
が一定になるようにz方向送り機構10を制御している
ので、研磨ヘッド2はスタンパ4の裏面形状に沿ってz
方向に移動しながらx方向に往復運動する。一方スタン
パ4は、上述したように導電膜4aおよび電鋳膜4bが
積層されたものなのでその厚みは一定であり、スタンパ
4の裏面形状はガラス原盤5の面形状に依存している。
すなわち、ガラス原盤5に反り等が生じている場合に
は、スタンパ4の裏面も反った形状となる。従って、研
磨ヘッド2がスタンパ4の裏面形状に沿ってz方向に移
動しながらスタンパ4の裏面を研磨することで、研磨さ
れたスタンパ4の厚みは一定になる。
At this time, the control means 14 controls the pressure detecting means 1
According to the detection result from 3, the z-direction feed mechanism 10 is controlled so that the pressure applied to the polishing head 2 becomes constant, so that the polishing head 2 moves in the z direction along the back surface shape of the stamper 4.
It reciprocates in the x direction while moving in the direction. On the other hand, since the stamper 4 is formed by laminating the conductive film 4a and the electroformed film 4b as described above, the thickness thereof is constant, and the back surface shape of the stamper 4 depends on the surface shape of the glass master 5.
That is, when the glass master 5 is warped or the like, the back surface of the stamper 4 is also warped. Therefore, by polishing the back surface of the stamper 4 while the polishing head 2 moves in the z direction along the back surface shape of the stamper 4, the thickness of the polished stamper 4 becomes constant.

【0020】しかも、研磨の種類としては、研磨液をス
タンパ4と研磨布1との間に供給し、化学的なエッチン
グ効果と研磨粒子によるメカニカルな研磨とを組み合せ
た、いわゆるメカノケミカル研磨であるので、研磨粒子
によるスタンパ4の裏面の擦り傷も少なく、従来のラッ
ピング研磨装置と同様の面精度でスタンパ4の裏面を鏡
面に仕上げることができる。また、スタンパ4の裏面を
研磨するための研磨ヘッド2は、スタンパの大きさに比
較して十分に小さいものが用いられるので、スタンパ裏
面研磨装置の小型化が達成される。
Moreover, the type of polishing is so-called mechanochemical polishing, in which a polishing liquid is supplied between the stamper 4 and the polishing cloth 1 to combine a chemical etching effect and mechanical polishing with polishing particles. Therefore, there are few scratches on the back surface of the stamper 4 due to the abrasive particles, and the back surface of the stamper 4 can be mirror-finished with the same surface accuracy as that of the conventional lapping and polishing apparatus. Further, since the polishing head 2 for polishing the back surface of the stamper 4 is sufficiently smaller than the size of the stamper, the stamper back surface polishing apparatus can be downsized.

【0021】研磨されたスタンパ4は、回転テーブル6
から取り外された後にガラス原盤5の樹脂層5bとの界
面で引き剥がされ、光記録媒体の製造に用いられる。ガ
ラス原盤5から引き剥がされたスタンパ4は、その裏面
が平滑なものとなる。
The polished stamper 4 has a rotary table 6
Then, it is peeled off at the interface with the resin layer 5b of the glass master 5 and used for manufacturing an optical recording medium. The stamper 4 peeled off from the glass master 5 has a smooth back surface.

【0022】本実施例では、圧力検出手段13を用い
て、研磨ヘッド2をスタンパ4の裏面の形状に沿って移
動させる構造とした場合の例を示したが、それに限ら
ず、スタンパ4の裏面の形状を光学的な検出手段によっ
て検出し、その検出結果に基づいて研磨ヘッド2を制御
してもよい。
In this embodiment, the pressure detecting means 13 is used to move the polishing head 2 along the shape of the back surface of the stamper 4, but the present invention is not limited to this. The shape may be detected by an optical detecting means, and the polishing head 2 may be controlled based on the detection result.

【0023】[0023]

【発明の効果】本発明は以上説明したとおり構成されて
いるので、以下に記載する効果を奏する。
Since the present invention is configured as described above, it has the following effects.

【0024】本発明のスタンパの製造方法は、スタンパ
の裏面の研磨時に、研磨布とスタンパの裏面との間に研
磨液を供給することにより、スタンパの裏面を擦り傷の
少ない鏡面に仕上げることができる。また、スタンパの
裏面の大きさに比較して小さな研磨ヘッドを用い、この
研磨ヘッドをスタンパの裏面の形状に沿って移動させる
ので、ガラス原盤に反り等が生じている場合でもスタン
パは一定の厚みに研磨され、平滑なスタンパを製造する
ことができる。
In the stamper manufacturing method of the present invention, when the back surface of the stamper is polished, a polishing liquid is supplied between the polishing cloth and the back surface of the stamper, whereby the back surface of the stamper can be finished to a mirror surface with less scratches. . Further, since a polishing head that is smaller than the size of the back surface of the stamper is used and this polishing head is moved along the shape of the back surface of the stamper, the stamper has a constant thickness even if the glass master disc is warped or the like. It can be ground to produce a smooth stamper.

【0025】本発明のスタンパ裏面研磨装置は、上述し
た効果に加え、スタンパの大きさに比較して小さい研磨
ヘッドが用いられることにより、装置の小型化を図るこ
とができる。
In addition to the effects described above, the stamper back surface polishing apparatus of the present invention uses a polishing head that is smaller than the stamper size, so that the apparatus can be downsized.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のスタンパ裏面研磨装置の一実施例の概
略構成図である。
FIG. 1 is a schematic configuration diagram of an embodiment of a stamper back surface polishing apparatus of the present invention.

【図2】図1に示したスタンパおよびガラス原盤の断面
図である。
FIG. 2 is a cross-sectional view of the stamper and the glass master shown in FIG.

【符号の説明】[Explanation of symbols]

1 研磨布 2 研磨ヘッド 3 研磨液供給ノズル 4 スタンパ 4a 導電膜 4b 電鋳膜 5 ガラス原盤 5a ガラス基板 5b 樹脂層 6 回転テーブル 7 テーブル回転モータ 8 研磨液受け 8a 廃液孔 9 x方向送り機構 10 z方向送り機構 11 ヘッド支持部材 12 ヘッド回転モータ 13 圧力検出手段 14 制御手段 15 研磨液供給源 1 polishing cloth 2 polishing head 3 polishing liquid supply nozzle 4 stamper 4a conductive film 4b electroformed film 5 glass master 5a glass substrate 5b resin layer 6 rotary table 7 table rotation motor 8 polishing liquid receiver 8a waste liquid hole 9 x direction feed mechanism 10 z Direction feed mechanism 11 Head support member 12 Head rotation motor 13 Pressure detection means 14 Control means 15 Polishing liquid supply source

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 記録すべき情報に対応した凹凸パターン
が形成された原盤の表面に、導電膜および電鋳膜を順次
積層することで、前記導電膜および電鋳膜で構成され前
記電鋳膜を裏面とするスタンパを形成し、前記スタンパ
の裏面を研磨した後に、前記原盤と前記導電膜との界面
で引き剥がすことで、光記録媒体形成用のスタンパを得
る、スタンパの製造方法において、 前記スタンパの裏面の研磨時に、前記スタンパの裏面の
大きさに比較して小さく、かつ、前記スタンパの裏面と
対向する面に研磨布が固定された研磨ヘッドを用い、 前記研磨ヘッドを、回転させつつ前記スタンパの裏面の
形状に沿って前記スタンパの径方向に往復移動させなが
ら、前記研磨布と前記スタンパの裏面との間に研磨液を
供給して、前記スタンパの裏面を研磨することを特徴と
するスタンパの製造方法。
1. A conductive film and an electroformed film are sequentially laminated on a surface of a master on which a concavo-convex pattern corresponding to information to be recorded is formed, whereby the electroformed film and the electroformed film are formed. A stamper for forming an optical recording medium by forming a stamper having a back surface as the back surface, and polishing the back surface of the stamper, and then peeling the stamper at the interface between the master and the conductive film. When polishing the back surface of the stamper, a polishing head having a size smaller than the size of the back surface of the stamper and having a polishing cloth fixed to the surface facing the back surface of the stamper is used, while rotating the polishing head. While reciprocating in the radial direction of the stamper along the shape of the back surface of the stamper, a polishing liquid is supplied between the polishing cloth and the back surface of the stamper to polish the back surface of the stamper. Method of manufacturing a stamper, characterized in that.
【請求項2】 前記研磨布が前記スタンパの裏面に当接
することにより前記研磨ヘッドに加わる圧力が一定にな
るように前記研磨ヘッドの位置を制御することで、前記
研磨ヘッドを前記スタンパの裏面の形状に沿って移動さ
せる、請求項1に記載のスタンパの製造方法。
2. The position of the polishing head is controlled so that the pressure applied to the polishing head becomes constant by bringing the polishing cloth into contact with the back surface of the stamper, so that the polishing head moves on the back surface of the stamper. The stamper manufacturing method according to claim 1, wherein the stamper is moved along a shape.
【請求項3】 記録すべき情報に対応した凹凸パターン
が形成された原盤の表面に、導電膜および電鋳膜を順次
積層することで形成された、前記導電膜および電鋳膜で
構成され前記電鋳膜を裏面とする光記録媒体形成用のス
タンパが、前記原盤に密着した状態で前記原盤を介して
載置され、かつ、回転自在に設けられた回転テーブル
と、 回転自在および前記スタンパの径方向に往復移動自在に
設けられ、前記スタンパの裏面の大きさに比較して小さ
く、前記回転テーブルに載置されたスタンパの裏面と対
向する面に研磨布が固定された研磨ヘッドと、 前記研磨ヘッドと前記スタンパの裏面との間に研磨液を
供給する研磨液供給手段と、 前記スタンパの裏面の研磨時に、前記研磨ヘッドの前記
スタンパの径方向への往復移動とともに、前記研磨ヘッ
ドを前記スタンパの裏面の形状に沿って移動させる駆動
手段とを有することを特徴とするスタンパ裏面研磨装
置。
3. A conductive film and an electroformed film, which are formed by sequentially laminating a conductive film and an electroformed film on a surface of a master on which an uneven pattern corresponding to information to be recorded is formed. A stamper for forming an optical recording medium having an electroformed film as a back surface is mounted on the master in a state of being in close contact with the master, and is rotatably provided on the rotary table. A polishing head that is provided so as to be reciprocally movable in the radial direction, is smaller than the size of the back surface of the stamper, and has a polishing cloth fixed to the surface facing the back surface of the stamper mounted on the rotary table; Polishing liquid supply means for supplying a polishing liquid between a polishing head and the back surface of the stamper; and during polishing of the back surface of the stamper, the polishing head reciprocates in the radial direction of the stamper, and the polishing A stamper back surface polishing apparatus comprising: a driving unit that moves the head along the shape of the back surface of the stamper.
【請求項4】 前記駆動手段は、前記研磨布が前記スタ
ンパの裏面に当接することにより前記研磨ヘッドに加わ
る圧力を検出する圧力検出手段と、前記圧力検出手段で
検出された圧力が一定になるように、前記研磨ヘッドの
位置を制御する制御手段とを有する、請求項3に記載の
スタンパ裏面研磨装置。
4. The pressure detecting means for detecting the pressure applied to the polishing head when the polishing cloth contacts the back surface of the stamper, and the pressure detected by the pressure detecting means is constant. 4. The stamper back surface polishing apparatus according to claim 3, further comprising a control unit that controls the position of the polishing head.
JP17052393A 1993-07-09 1993-07-09 Production of stamper and device for polishing rear surface of stamper Pending JPH0729223A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17052393A JPH0729223A (en) 1993-07-09 1993-07-09 Production of stamper and device for polishing rear surface of stamper

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17052393A JPH0729223A (en) 1993-07-09 1993-07-09 Production of stamper and device for polishing rear surface of stamper

Publications (1)

Publication Number Publication Date
JPH0729223A true JPH0729223A (en) 1995-01-31

Family

ID=15906522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17052393A Pending JPH0729223A (en) 1993-07-09 1993-07-09 Production of stamper and device for polishing rear surface of stamper

Country Status (1)

Country Link
JP (1) JPH0729223A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100601095B1 (en) * 2004-10-22 2006-07-19 재단법인 포항산업과학연구원 An apparatus and a method for friction surfacing
US8257143B2 (en) 2008-02-14 2012-09-04 Ebara Corporation Method and apparatus for polishing object
CN105290955A (en) * 2015-10-21 2016-02-03 无锡清杨机械制造有限公司 Machining surface finishing equipment
US10074472B2 (en) 2015-12-15 2018-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. InFO coil on metal plate with slot

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100601095B1 (en) * 2004-10-22 2006-07-19 재단법인 포항산업과학연구원 An apparatus and a method for friction surfacing
US8257143B2 (en) 2008-02-14 2012-09-04 Ebara Corporation Method and apparatus for polishing object
CN105290955A (en) * 2015-10-21 2016-02-03 无锡清杨机械制造有限公司 Machining surface finishing equipment
US10074472B2 (en) 2015-12-15 2018-09-11 Taiwan Semiconductor Manufacturing Company, Ltd. InFO coil on metal plate with slot
US10847304B2 (en) 2015-12-15 2020-11-24 Taiwan Semiconductor Manufacturing Company, Ltd. InFO coil on metal plate with slot
US11600431B2 (en) 2015-12-15 2023-03-07 Taiwan Semiconductor Manufacturing Company, Ltd. InFO coil on metal plate with slot

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