JPH08225962A - Etching method by ferric chloride and etching device therefor - Google Patents
Etching method by ferric chloride and etching device thereforInfo
- Publication number
- JPH08225962A JPH08225962A JP3203595A JP3203595A JPH08225962A JP H08225962 A JPH08225962 A JP H08225962A JP 3203595 A JP3203595 A JP 3203595A JP 3203595 A JP3203595 A JP 3203595A JP H08225962 A JPH08225962 A JP H08225962A
- Authority
- JP
- Japan
- Prior art keywords
- ferric chloride
- tank
- etching
- water
- chloride solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005530 etching Methods 0.000 title claims abstract description 43
- 229910021578 Iron(III) chloride Inorganic materials 0.000 title claims abstract description 40
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 title claims abstract description 40
- 238000000034 method Methods 0.000 title claims description 5
- 238000005406 washing Methods 0.000 claims abstract description 35
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 238000005554 pickling Methods 0.000 claims abstract description 9
- 230000005484 gravity Effects 0.000 claims description 18
- 239000007921 spray Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 3
- 239000008237 rinsing water Substances 0.000 claims 1
- 239000002351 wastewater Substances 0.000 claims 1
- 239000000243 solution Substances 0.000 description 33
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 16
- 239000008235 industrial water Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 7
- 239000002699 waste material Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 238000005660 chlorination reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012487 rinsing solution Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- ing And Chemical Polishing (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板の回路
を形成するためのエッチング方法及びその装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an etching method and apparatus for forming a circuit on a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板は、銅張積層板をエッチ
ングすることによって製造される。塩化第２鉄溶液でエ
ッチングするときの基本工程は次の通りである。塩化第
２鉄溶液槽で塩化第２鉄を塩酸及び水で溶解し、これを
エッチング槽のスプレーノズルに供給し、その後、酸洗
槽で５％塩酸にて酸洗し、次に水洗する。水洗槽は３段
に構成され、第２水洗槽（最終段）に新しい水を供給
し、オーバーフローした水を第２水洗槽へ送り、第２水
洗槽にてオーバーフローした水を第１水洗槽へ送って回
路を形成した基板を洗浄する。第１及び第２水洗槽は循
環水洗を行う。そして、第１水洗槽にてオーバーフロー
した水は、廃液処理設備に送られる。塩化第２鉄エッチ
ング溶液のコントロールは、塩化第２鉄、塩酸の濃度の
個別制御および塩化第２鉄エッチング液の比重の制御に
よっている。塩化第２鉄の比重を制御するために、比重
１．０００の工業用水を利用している。Printed wiring boards are manufactured by etching copper clad laminates. The basic steps of etching with a ferric chloride solution are as follows. Ferric chloride is dissolved in hydrochloric acid and water in a ferric chloride solution tank, supplied to a spray nozzle of an etching tank, and then pickled in a pickling tank with 5% hydrochloric acid, and then washed with water. The washing tank is composed of three stages. New water is supplied to the second washing tank (final stage), the overflowed water is sent to the second washing tank, and the overflowed water in the second washing tank is sent to the first washing tank. The substrate on which the circuit is formed is washed. Circulating water washing is performed in the first and second water washing tanks. Then, the water that overflows in the first washing tank is sent to the waste liquid treatment facility. The ferric chloride etching solution is controlled by individually controlling the concentrations of ferric chloride and hydrochloric acid and controlling the specific gravity of the ferric chloride etching solution. Industrial water having a specific gravity of 1.000 is used to control the specific gravity of ferric chloride.
【０００３】[0003]
【発明が解決しようとする課題】精度よくエッチングす
るために塩化第２鉄溶液の比重を一定にしておく必要が
ある。従来は、比重制御のために工業用水を使用してお
り、エッチング液の比重が変動し、工業用水の消費量が
大である。本発明は、エッチング液の比重変動を小さく
し、かつ工業用水に使用量を節減することを目的とする
ものである。The specific gravity of the ferric chloride solution must be kept constant in order to perform etching with high accuracy. Conventionally, industrial water is used for controlling the specific gravity, and the specific gravity of the etching solution fluctuates, and the consumption of industrial water is large. An object of the present invention is to reduce the fluctuation of the specific gravity of the etching solution and to reduce the amount used for industrial water.
【０００４】[0004]
【課題を解決するための手段】本発明は、塩化第２鉄溶
液でエッチングした後のプリント配線板を洗浄した水洗
水廃液を塩化第２鉄溶液槽に供給して、塩化第２鉄の比
重を制御することを特徴とする。According to the present invention, a washing water waste liquid obtained by cleaning a printed wiring board after etching with a ferric chloride solution is supplied to a ferric chloride solution tank to obtain a specific gravity of ferric chloride. It is characterized by controlling.
【０００５】また本発明の方法を実施するための装置
は、エッチング槽１と、酸洗槽２及び水洗槽３をこの順
に配置し、水洗槽からのオーバーフロー水を貯留するタ
ンク７を設け、塩化第２鉄溶液槽１０からエッチング槽
１に、塩化第２鉄溶液を供給し、水洗槽からのオーバー
フロー水を貯留するタンク７に貯留されたオーバーフロ
ー水を塩化第２鉄溶液槽１０に供給するように構成され
ている。The apparatus for carrying out the method of the present invention comprises an etching bath 1, a pickling bath 2 and a washing bath 3 which are arranged in this order, and a tank 7 for storing overflow water from the washing bath is provided for chlorination. A ferric chloride solution is supplied from the ferric chloride solution tank 10 to the etching tank 1, and overflow water stored in a tank 7 that stores overflow water from the water washing tank is supplied to the ferric chloride solution tank 10. Is configured.
【０００６】[0006]
【作用】酸洗後の第１水洗液は、前工程の塩化第２鉄エ
ッチング液および酸洗液の持込みがあり、廃液は若干の
酸性になっており、また、比重値も従来の工業用水の比
重よりも高く、１．０１０〜１．０２０程度になってい
る。この廃液を前工程の塩化第２鉄エッチングの比重制
御用の水として利用するので、工業用水を加えるよりも
液の安定性のため有利である。The first rinsing solution after pickling has the ferric chloride etching solution and the pickling solution of the previous step brought in, and the waste solution is slightly acidic, and the specific gravity is the same as that of conventional industrial water. It is higher than the specific gravity of, and is about 1.010 to 1.020. Since this waste liquid is used as water for controlling the specific gravity of the ferric chloride etching in the previous step, it is more advantageous than the addition of industrial water for the stability of the liquid.
【０００７】[0007]
【実施例】まず、本発明の一実施例になるエッチング装
置について図１を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an etching apparatus according to an embodiment of the present invention will be described with reference to FIG.
【０００８】本発明エッチング装置は、エッチング槽１
と、酸洗槽２及び水洗槽３をこの順に配置してある。The etching apparatus of the present invention comprises an etching tank 1
The pickling tank 2 and the water washing tank 3 are arranged in this order.
【０００９】塩化第２鉄溶液１１は、塩化第２鉄溶液槽
１０から、エッチング槽１のスプレーノズル２１ａに供
給され、ローラーコンベヤ４０で送られてくる基板にス
プレーされる。塩化第２鉄溶液槽１０内の溶液は、薬液
分析コントローラーＣで常時分析され、必要により新
液、塩酸、水を追加する。The ferric chloride solution 11 is supplied from the ferric chloride solution tank 10 to the spray nozzle 21a of the etching tank 1 and sprayed onto the substrate sent by the roller conveyor 40. The solution in the ferric chloride solution tank 10 is constantly analyzed by the chemical solution analysis controller C, and a new solution, hydrochloric acid, and water are added if necessary.
【００１０】エッチング槽１に続く酸洗槽２にのスプレ
ーノズル２２ａには、５％塩酸２２が供給され、ローラ
ーコンベヤ４０で送られてくる基板にスプレーされる。5% hydrochloric acid 22 is supplied to the spray nozzle 22a of the pickling tank 2 following the etching tank 1 and is sprayed on the substrate sent by the roller conveyor 40.
【００１１】水洗槽３は、第１水洗槽３ａ、第２水洗槽
３ｂ及び第３水洗槽３ｃからなり、新しい水２３を第３
水洗槽３ｃのスプレーノズル３３ｃに供給し、第３水洗
槽３ｃの底から、第２水洗槽３ｂのスプレーノズル３３
ｂに送り、第２水洗槽ｂの底から、第１水洗槽３ａのス
プレーノズル３３ａに送る。The washing tank 3 comprises a first washing tank 3a, a second washing tank 3b and a third washing tank 3c.
It is supplied to the spray nozzle 33c of the washing tank 3c, and the spray nozzle 33 of the second washing tank 3b is supplied from the bottom of the third washing tank 3c.
b to the spray nozzle 33a of the first washing tank 3a from the bottom of the second washing tank b.
【００１２】第１水洗槽３ａからのオーバーフロー水
は、タンク７に貯留され、塩化第２鉄溶液槽１０の薬液
コントローラーＣからの指令に応じて動作する電磁弁８
を開き、ポンプＰにより塩化第２鉄溶液槽１０に送られ
る。The overflow water from the first washing tank 3a is stored in the tank 7 and is operated by a solenoid valve 8 which operates according to a command from the chemical solution controller C of the ferric chloride solution tank 10.
Is opened and is sent to the ferric chloride solution tank 10 by the pump P.
【００１３】塩化第２鉄エッチング液の制御は、３７〜
４２ボーメ度の塩化第２鉄新液及び塩酸液を用い、濃度
を個別に測定制御する。一般に、塩化第２鉄濃度：１．
９〜２．１ｍｏｌ／リットル、塩酸濃度：０．８〜１．
０ｍｏｌ／リットル、エッチング液温度：４５〜５０
℃、エッチング液比重：１．２８０〜１．３００であ
る。また、第１水洗槽廃液の比重は、１．０１０〜１．
０２０となる。The control of the ferric chloride etching solution is 37-
A new ferric chloride solution and a hydrochloric acid solution with 42 Baume degree are used, and the concentration is individually measured and controlled. Generally, ferric chloride concentration: 1.
9-2.1 mol / liter, hydrochloric acid concentration: 0.8-1.
0 mol / liter, etching solution temperature: 45 to 50
C., etching liquid specific gravity: 1.280 to 1.300. Further, the specific gravity of the first washing tank waste liquid is 1.010 to 1.
It becomes 020.
【００１４】以上説明したエッチング装置により以下の
条件のエッチングを行った。銅はく厚み：３５μｍ、エ
ッチング面積：５０ｍ2 、塩化第２鉄濃度：２．０ｍｏ
ｌ／リットル、塩酸濃度：１．０ｍｏｌ／リットル、エ
ッチング液温度：４８℃。このときの具体的効果は以下
の表に示す通りである。なお、表１で従来例とは、工業
用水のみで比重制御したもの、実施例とは、第１水洗槽
廃液により比重制御したものである。Etching was performed under the following conditions using the etching apparatus described above. Copper foil thickness: 35 μm, etching area: 50 m 2 , ferric chloride concentration: 2.0 mo
l / l, hydrochloric acid concentration: 1.0 mol / l, etching solution temperature: 48 ° C. The specific effects at this time are as shown in the table below. In Table 1, the conventional example is the one in which the specific gravity is controlled only with industrial water, and the example is the one in which the specific gravity is controlled by the first washing tank waste liquid.
【００１５】[0015]
【表１】 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ 従来例 実施例 ───────────────────────────────── 比重管理値 １．２８０〜１．３００ １．２８５〜１．３００ 工業用水使用量 １００ ９２ エッチング液使用量 １００ ９５ ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━[Table 1] ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ Conventional example Example ────────── ──────────────────────── Specific gravity control value 1.280-1.300 1.285-1.300 Industrial water usage 100 92 Etching solution usage Quantity 100 95 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━
【００１６】[0016]
【発明の効果】本発明によれば、エッチング後の洗浄水
を塩化第２鉄溶液の比重制御に利用することにより、塩
化第２鉄エッチング液の安定化が図られ、エッチング精
度も安定し、工業用水の使用量も低減できる。According to the present invention, by using the cleaning water after etching for controlling the specific gravity of the ferric chloride solution, the ferric chloride etching solution is stabilized and the etching accuracy is stabilized. The amount of industrial water used can also be reduced.
【図１】本発明のエッチング装置の概略図である。FIG. 1 is a schematic view of an etching apparatus of the present invention.
【符号の説明】 １ エッチング槽 ２ 酸洗槽 ３ 水洗槽 ３ａ 第１水洗槽 ３ｂ 第２水洗槽 ３ｃ 第３水洗槽 ７ タンク １０ 塩化第２鉄溶液槽[Explanation of symbols] 1 etching tank 2 pickling tank 3 water washing tank 3a first water washing tank 3b second water washing tank 3c third water washing tank 7 tank 10 ferric chloride solution tank
Claims (2)
リント配線板を洗浄した水洗水廃液を塩化第２鉄溶液槽
に供給して、塩化第２鉄の比重を制御することを特徴と
する塩化第２鉄によるエッチング方法。1. A method for controlling the specific gravity of ferric chloride by supplying a waste water of rinsing water for cleaning a printed wiring board after etching with a ferric chloride solution to a ferric chloride solution tank. Etching method with ferric chloride.
の順に配置し、水洗槽からのオーバーフロー水を貯留す
るタンクを設け、塩化第２鉄溶液槽から塩化第２鉄溶液
をエッチング槽のスプレーノズルに供給し、水洗槽から
のオーバーフロー水を貯留するタンクに貯留されたオー
バーフロー水を塩化第２鉄溶液槽に供給するように構成
されたエッチング装置。2. An etching tank, a pickling tank and a water washing tank are arranged in this order, a tank for storing overflow water from the water washing tank is provided, and the ferric chloride solution is fed from the ferric chloride solution tank to the etching tank. An etching apparatus configured to supply to a ferric chloride solution tank overflow water supplied to a spray nozzle and stored in a tank that stores overflow water from a water washing tank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3203595A JPH08225962A (en) | 1995-02-21 | 1995-02-21 | Etching method by ferric chloride and etching device therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3203595A JPH08225962A (en) | 1995-02-21 | 1995-02-21 | Etching method by ferric chloride and etching device therefor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08225962A true JPH08225962A (en) | 1996-09-03 |
Family
ID=12347626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3203595A Pending JPH08225962A (en) | 1995-02-21 | 1995-02-21 | Etching method by ferric chloride and etching device therefor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08225962A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491715A (en) * | 2012-06-13 | 2014-01-01 | 健鼎（无锡）电子有限公司 | Circuit-board developing, electroplating and etching device |
-
1995
- 1995-02-21 JP JP3203595A patent/JPH08225962A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103491715A (en) * | 2012-06-13 | 2014-01-01 | 健鼎（无锡）电子有限公司 | Circuit-board developing, electroplating and etching device |
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