JPH08222823A - Through hole wiring board - Google Patents

Abstract

PURPOSE: To obtain a through hole wiring board which makes it possible to fill a through hole with a filling material such as solder paste and to execute printing with ease. CONSTITUTION: In a through hole wiring board 1 which is provided with a through hole 3 which opens on the surface and the rear of a base material 2 and is made by forming a conductor layer 5 from the inner peripheral surface to the peripheral edge parts of openings on the surface and rear sides and with a conductor pattern 4 formed on the surface of the base material 2 and is printed by filling through holes 3 with a filling material, a projecting part 6 projecting higher than the conductor layer 5 is provided in a part of the conductor pattern 4 formed on the surface of the base material 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a through-hole wiring board, and more particularly, to a through-hole wiring board in which a filling material is embedded in a through hole for printing.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventional through hole wiring board 21 is provided with a plurality of through holes 23 opened on the front and back surfaces of an insulating substrate 22.
In, the conductor layer 25 is formed from the inner peripheral surface to the opening peripheral edge portions on the front surface side and the back surface side. Then, after placing this through-hole wiring board 21 on the printing stage 31 of the printing machine, a screen 32 having a predetermined print pattern formed thereon is arranged on the through-hole wiring board 21, and the squeegee 3
By moving 3 from one end side of the screen 32 to the other end side, for example, the solder paste 34 supplied onto the screen 32 is filled into the through holes 23.

However, in such a conventional through-hole wiring board 21, one opening of the through-hole 23 of the insulating substrate 22 is closed by the surface of the printing stage 31, so that the solder paste 34 is applied from the other opening. By injecting, the air is trapped between the solder paste 34 and the printing stage 31 in the through hole 23, and the solder paste 34 is not sufficiently filled. As a result, when a terminal or a lead wire of a component is inserted into the through hole 23 for soldering, the solder paste 34 is insufficient and soldering cannot be performed sufficiently.

Therefore, in order to solve the above problem, a method is adopted in which a suction mechanism is provided in the printing stage 31 so that the air in the through hole 23 is evacuated from the printing stage 31 side and the solder paste 34 is sufficiently filled. Has been.

[0005]

However, by providing the suction mechanism on the printing stage 31, the structure of the printing machine becomes complicated. Further, when performing embedded printing, it was necessary to manage the squeegee pressure, the squeegee bottom dead center, the squeegee moving speed, etc. of the printing machine. However, by providing a suction mechanism on the printing stage 31, in addition to these, the suction amount and suction time Also has to be managed, making the work more complicated.

Therefore, a main object of the present invention is to provide a through-hole wiring board in which a filling material such as a solder paste can be easily embedded and printed in the through-hole.

[0007]

In order to achieve the above object, the present invention has openings on both main surfaces of an insulating substrate, and a conductor layer is formed from the inner peripheral surface to the peripheral edges of the openings on both main surface sides. A through hole formed on at least one main surface of the insulating substrate, and a through hole on the one main surface side of the insulating substrate in a through hole wiring board in which a filling material is embedded and printed in the through hole. Part of the conductor layer formed on the peripheral portion, part of the conductor pattern formed on one main surface of the insulating substrate, or part of the other main surface of the insulating substrate excluding them protrudes higher than the conductor layer It is characterized in that a protrusion is provided.

[0008]

According to the above structure, the through hole is filled with the filling material by providing the projecting portion projecting higher than the conductor layer formed on the peripheral edge portion of the opening of the through hole on the one main surface side of the insulating substrate. When the embedded printing is performed, if the through-hole wiring board is placed on the printing stage so that one main surface side of the insulating substrate faces the printing stage side of the printing machine, only the protruding portion contacts the printing stage and the conductor layer There is a constant gap between the printing stage and the printing stage, and the opening of the through hole on the surface side of the insulating substrate is not blocked by the printing stage. Therefore, air is not trapped between the filling and the printing stage in the through hole, and the filling can be sufficiently filled.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in the drawings. FIG. 1 is a cross-sectional view of essential parts showing a first embodiment of the present invention. In FIG. 1, reference numeral 1 is a through-hole wiring substrate, for example, a glass epoxy insulating substrate 2, a plurality of through holes 3 opened on the front surface side and the back surface side of the insulating substrate 2, and a front surface side of the insulating substrate 2. And the formed conductor pattern 4 made of Cu. Here, the through hole 3 has a structure in which the conductor layer 5 made of Cu is formed from the inner peripheral surface to the opening peripheral portions on the front surface side and the back surface side. Then, in a part of the conductor pattern 4, 0.05 to 0.2 mm more than the conductor layer 5 formed on the opening peripheral edge portion of the through hole 3.
A protruding portion 6 that protrudes high is formed.

FIG. 2 is a sectional view of the essential parts showing a second embodiment of the present invention. The same parts as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted. In FIG. 2, reference numeral 7 denotes a protrusion, which is formed 0.05 to 0.2 mm higher than the conductor layer 5 on a part of the conductor layer 5 formed on the peripheral edge of the opening of the through hole 3.

FIG. 3 is a sectional view of the essential parts showing a third embodiment of the present invention. The same parts as those in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted. In FIG. 3, reference numeral 8 is a protrusion made of an insulating material, and the insulating substrate 2
In the portion of the surface other than where the pattern 4 or the conductor layer 5 is formed, the conductor layer 5 is formed so as to be higher by 0.05 to 0.2 mm than the conductor layer 5 formed in the opening peripheral portion of the through hole 3.

Although the glass epoxy type insulating substrate 2 is used in the above first to third embodiments, the material of the insulating substrate is not limited to this, and other synthetic resin materials or ceramic materials may be used. Alternatively, the insulating substrate may have a multi-layer structure. Further, although Cu is used for the conductor pattern 4 and the conductor layer 5, any other conductor such as Ni, Ag, Ag-Pd, or the like, or a multiple structure of these conductors may be used. Further, as the method for forming the conductor pattern 4 and the conductor layer 5, any method such as plating, printing, vapor deposition, or sputtering may be used.

Next, the through-hole wiring board 1 of the first embodiment
The process of embedding and printing solder paste in the through hole 3 will be described with reference to FIG. As shown in FIG. 4, the insulating substrate 3 is formed on the surface of the printing stage 11 of the printing machine.
The through-hole wiring board 1 is placed on the printing stage 11 so that the protrusions 6 formed on the front surface side of the printed circuit board abut. Then, the through hole 3 formed on the back surface side of the insulating substrate 2
Arrange the screen 12 so as to contact the conductive layer 5 of
By moving the squeegee 13 from one end side of the screen 12 to the other end side, the solder paste 14 supplied onto the screen 12 is filled in the through holes 3. Here, since the protrusion 6 is formed higher than the conductive layer 5 of the through hole 3 by 0.05 to 0.2 mm with respect to the surface of the insulating substrate 2, only the protrusion 6 contacts the printing stage 11, There is a gap of 0.05 to 0.2 mm between the printing stage 11 and the conductive layer 5 formed on the surface side of the insulating substrate 2. This prevents the opening of the through hole 3 from being blocked by the surface of the printing stage 11 and trapping air in the through hole 3.
The solder paste 14 can be sufficiently filled therein.

Further, even when the solder paste is embedded and printed in the through holes 3 of the through hole wiring substrate 1 of the second and third embodiments, only the protrusions 7 and 8 come into contact with the printing stage 11, so that the printing stage 11 and a conductive layer 5 formed on the front surface side of the insulating substrate 2, a gap is formed,
The solder paste 14 can be sufficiently filled in the through holes 3. As a result, when the terminal or the lead wire of the component is inserted into the through hole 3 and soldered, the solder paste 14 does not run short, and firm soldering can be performed.

In the embedding printing process shown in FIG. 4, the solder paste is used as the filling material to be filled in the through hole, but the filling material may be a conductive adhesive, a conductor paste, or the like, and is not particularly limited.

[0016]

As described above, according to the through-hole wiring board according to the present invention, at the time of embedding and printing the filling material, it is possible to provide the printing stage of the printing machine without a suction mechanism.
Since the filling can be sufficiently filled, the structure of the printing machine can be simplified. Further, along with this, there is no need to manage the suction amount and the suction time, which were managed at the time of embedded printing using a printing machine having a suction mechanism, and the work is facilitated.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of essential parts showing a through-hole wiring board according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view of essential parts showing a through-hole wiring board in a second embodiment of the present invention.

FIG. 3 is a cross-sectional view of essential parts showing a through-hole wiring board according to a third embodiment of the present invention.

FIG. 4 is an explanatory diagram showing a state in which embedded printing is applied to the through-hole wiring board in FIG.

FIG. 5 is an explanatory diagram showing a state in which embedded printing is performed on a conventional through-hole wiring board.

[Explanation of symbols]

 1 Through Hole Wiring Board 2 Insulating Board 3 Through Hole 4 Conductor Pattern 5 Conductor Layer 6 Projection

Claims (1)

[Claims] 1. A through hole formed in at least one main surface of an insulating substrate, and a through hole formed in both main surfaces of the insulating substrate and having a conductor layer formed from an inner peripheral surface to an opening peripheral portion on both main surface sides. In a through-hole wiring board including a conductor pattern and embedding and printing a filling material in the through-hole, a part of the conductor layer formed on the peripheral edge of the opening of the through-hole on the one main surface side of the insulating board, or one of the insulating board A through-hole wiring board, characterized in that a part of the conductor pattern formed on the main surface or a part of one main surface of the insulating substrate excluding them is provided with a protrusion protruding higher than the conductor layer.