JPH08222405A - Chip-type electronic component and its manufacture - Google Patents

Abstract

PURPOSE: To easily thin a surface mounting type electronic component and to realize stable quality and easy manufacturing. CONSTITUTION: At least one pair of electrodes 16 consisting of a metallic thin film are formed in an end part on an insulating resin film 12. A metallic thin film which is a resistor 18 and a dielectric such as barium titanate are formed as an electronic element between the electrodes 16. The electrode 16 is formed in a surface of the resin film 12 through a ceramic thin film 14.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip-shaped electronic component in which a resistor or other electronic element is provided on an insulating substrate to form a surface-mounted electronic component, and a method for manufacturing the same.

[0002]

2. Description of the Related Art Conventional surface mount type electronic components are soldered to the surface of a circuit board by a flow soldering method or a reflow soldering method. Had to be able to withstand. Therefore, for example, Japanese Patent Publication No.
Like the chip resistor disclosed in Japanese Patent No. 53281, a large number of electrodes are printed on the surface of a thin plate-shaped ceramic substrate, and a plurality of resistors are printed between these electrodes. It was made by dividing it.

Further, as disclosed in Japanese Patent Laid-Open No. 62-9601, a film made of a polyimide resin or the like is
It is also proposed that electrodes are formed of copper foil or conductive paint, a resistor paste is printed between the electrodes, or a metal thin film resistor is formed by vapor deposition or sputtering to form a chip resistor.

[0004]

In the former case of the above-mentioned prior art, the chip resistor mounted on the circuit board is formed by dividing a large ceramic substrate to form the chip resistor here. In terms of strength, handleability, etc., the outer shape of about 1 × 0.5 mm used today is the limit of downsizing, and similarly, thinning cannot be made too thin due to the strength of the ceramic substrate. Therefore, this has hindered the miniaturization of the circuit board and the hybrid integrated circuit on which the electronic components on the chip are mounted.

In the latter case of the above-mentioned prior art, since a conductive paint or a resistor paste is printed on a thin film and dried, the printed resistor or the like contracts due to the drying, and the resistor side is depressed. However, there is a problem in that it is not possible to mount it stably on a circuit board and solder it, because it is greatly curved so that it becomes uneven, and distortion such as non-uniform warpage occurs. Furthermore, since vacuum deposition and sputtering are performed at a relatively high temperature, after forming a thin film on the resin film surface,
When returned to room temperature, there is a problem that warpage occurs due to the difference in thermal expansion coefficient between the metal thin film and the resin film.

The present invention has been made in view of the above-mentioned prior art, and it is easy to reduce the thickness of the surface mount type electronic component, has stable quality, and is easy to manufacture, and a method of manufacturing the same. The purpose is to provide.

[0007]

According to the present invention, at least one pair of electrodes made of a thin film in which fine metal particles such as gold are deposited is formed on an end portion of an insulating resin film, and between the electrodes,
The electronic element is a chip-shaped electronic component provided with a metal thin film resistor which is a resistor, and a capacitor having a dielectric thin film such as barium titanate formed between electrodes of the metal thin film.

Further, according to the present invention, the above electrodes and electronic elements are formed on the surface of an insulating resin film via a ceramic thin film. The electrodes are formed on the front and back surfaces of the resin film, and through-holes are formed so as to penetrate between the electrodes on the front and back surfaces and be electrically connected. Further, the electrodes are formed on the front and back of the resin film, and the front and back electrodes are electrically connected to each other by end face electrodes formed on the end faces of the resin film in the same manner as the front and back electrodes. is there. further,
The ceramic thin film, the electrode, and the electronic element are each formed by densely depositing fine particles of the constituent components by the gas deposition method.

Further, according to the present invention, fine particles of metal such as gold, silver, copper, and palladium are sprayed on the end portion of the insulating resin film in vacuum at a room temperature by a gas deposition method to closely deposit the fine particles. A resistor or a capacitor, which is an electronic element connected between the electrodes before and after the formation of the electrodes, is formed in a vacuum at about room temperature. This is a method of manufacturing a chip-shaped electronic component in which fine particles are sprayed at a predetermined position by a gas deposition method to be closely deposited, and then divided individually.

The electrodes and electronic elements on the film are formed by spraying ceramic fine particles onto the film in a vacuum at about room temperature by an aerosol gas deposition method to closely deposit them, and then evaporating the gas on the film. It is formed by the position method. Further, the temperature of the resin film on which the fine particles are deposited may be raised from about room temperature to a temperature at which the film is not adversely affected. Eg 20
When the temperature is raised to 0 to 300 ° C., the adhesion of the volume fine particles is improved.

[0011]

In the chip-shaped electronic component of the present invention, the insulating substrate is formed of a resin film, and the electrodes and electronic elements on the surface are formed of a thin film by the gas deposition method.
It can be made extremely thin. In addition, in the manufacturing process of this chip-shaped electronic component, there is no portion exposed to high temperatures of several hundreds of degrees Celsius or more, so that a resin film substrate or the like does not warp or crack after being manufactured.

[0012]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment of the present invention. A chip resistor 10 which is a chip-shaped electronic component of this embodiment has a surface side of an insulating resin film substrate 12 having a thickness of, for example, about 30 μm. , A ceramic thin film 14 having a thickness of, for example, about 10 μm is formed, and a pair of electrodes 16 are provided on both ends of the surface of the ceramic thin film 14.
Similarly, a pair of electrodes 17 is also formed on the back surface side. The resin film substrate 12 is an epoxy resin, a phenol resin, a BT resin, a polyimide resin, a silicon resin, a polyester resin, a fluororesin, a polybutadiene resin, a liquid crystal polyester resin, a liquid crystal polyamide resin, or the like, and the ceramic thin film 14 is alumina or mullite. And other ceramics. The electrodes 16 and 17 are, for example, Au thin films having a thickness of about 20 μm.

In addition, between the pair of electrodes 16 on the front surface side of the resin film substrate 12, as an electronic element, a Ni--Cr system,
Alternatively, the Ta-based metal thin film resistor 18 is formed.
Further, the surface of the resistor 18 is covered with an overcoat 19 made of epoxy resin or the like. Also, the electrode 1
A through hole 20 is formed between 6 and 17.
The through hole 20 is for electrically connecting the electrodes 16 and 17 on the front and back sides, and has a conductive paste 2 such as silver paint inside.
1 is filled.

Next, a method of manufacturing the chip-shaped electronic component of this embodiment will be described. The chip resistor 10 of this embodiment
First, the ceramic thin film 14 is formed on the surface of the large-sized resin film substrate 12. The formation method is based on the aerosol gas deposition method, in a vacuum at about room temperature,
Fine particles of ceramics, which is a component of the ceramic thin film 14, are sprayed from the nozzle onto the surface and are closely deposited. As fine particles of ceramics, fine particles of 1 μm or less are used, and the deposition thickness is thin, for example, about 10 μm. After that, a large number of electrodes 16 and 17 are formed at predetermined locations on the front and back. This formation method is based on the vaporization gas deposition method.
The u fine particles are sprayed from the nozzle onto the surface of the substrate and are tightly deposited to a thickness of, for example, about 20 μm. Evaporation method Gas deposition method, in helium gas pressurized to several atmospheres, vaporized atoms collide with helium gas and are cooled to form ultrafine particles, and these long fine particles are passed through a carrier pipe. It is introduced into a substantially vacuum generation chamber and is sprayed from the nozzle onto the surface of the substrate to deposit it. Substrate 12 at this time
Although the temperature is about room temperature, it may be raised to 200 to 300 ° C. within a range that does not affect the substrate 12, thereby increasing the adhesion of the deposited metal fine particles.

Further, between the electrodes 16 on the front surface side of the large-sized resin film substrate 12, fine particles of a Ni-Cr-based or Ta-based metal thin film resistor material are vaporized in a vacuum at about room temperature as described above. It is sprayed by the gas deposition method and is closely deposited to form the resistor 18. Its thickness
For example, it is about ten and several μm. Then, an overcoat 19 is formed on the surface of the resistor 18 by printing or the like. Further, in order to electrically connect the electrodes 16 and 17, a through hole is first formed by punching, and the through hole is filled with a conductive paste 21 to form a through hole 20. After that, the large resin film substrate 12 is cut into a tape shape in which the individual chip resistors 10 are arranged in a line, and is stored in a predetermined storage location for transportation and the like. And when mounting
Cut into individual chip resistors 10 with an automatic machine,
Surface-mounted on a circuit board.

At the time of mounting, a circuit board (not shown) is temporarily fixed with an adhesive such as an epoxy resin or a silicone resin, and is soldered to a copper foil electrode on the circuit board or is connected with a conductive resin coating. The chip resistor 10 is manufactured, for example, by appropriately setting the thickness to about 100 μm or less. If the chip resistor 10 is 100 μm or less, the thickness is not much different from the thickness of the copper foil electrode on the circuit board, and it is surely printed by the conductive resin paint. It can be electrically connected and fixed.

According to the chip resistor 10 of this embodiment,
A very thin chip resistor 10 can be formed. Moreover, the ceramic thin film 1 is formed on the resin film substrate 12.
Since No. 4 is formed, it has good thermal conductivity and can be used for small chip resistors and high-power electronic devices. Further, the electrode 16 and the resistor 18 can be formed in a relatively thick layer in a shorter time than vacuum deposition or sputtering.
Good manufacturing efficiency. Furthermore, since fine particles such as metal are sprayed onto the resin film substrate 12 to form the electrodes 12, the resistor 18, and the like, the resin film substrate 12 and other portions formed in the previous process have a thermal effect in the subsequent process. It is not subject to distortion, and distortion such as warpage does not occur in the manufactured product. The ceramic thin film 14 may be formed on the front and back surfaces of the resin film substrate 12.

Next, a chip-shaped electronic component according to a second embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.
The chip-shaped electronic component of this embodiment is also for the chip resistor 10. First, a ceramic thin film 14 is formed on the entire surface of a large-sized resin film substrate 12 in the same manner as in the above-mentioned embodiment, and the ceramic thin film 14 is further formed. The thin film of the resistor 18 is formed on the entire surface of the above by the same method as in the above embodiment. Then, a large number of pairs of electrodes 16 and 17 are formed at predetermined locations on the front and back surfaces of the resistor 18, and an overcoat 19 is formed between the electrodes 16. Then, a through hole 20 is formed between the electrodes 16 and 17, divided into individual chip resistors 10 and surface-mounted on the circuit board.

In the chip-shaped electronic component of this embodiment, the resistor 18 is formed on one surface, and the electrode 16 is formed on it. Therefore, cracks may occur in the resistor 18 at the corners of the electrode 16. , The surface is flat, it can be made extremely thin, it can be easily mounted on a circuit board, and other electronic elements can be mounted on the chip resistor 10. This greatly contributes to miniaturization of electronic devices.

Next, a chip-shaped electronic component according to a third embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted. The chip-shaped electronic component of this embodiment is for the chip capacitor 30, and as in the first embodiment, first, on the entire surface of the large resin film substrate 12, first,
The ceramic thin film 14 is provided with one electrode 26 at a predetermined position on the surface thereof in an area about half the size of each chip capacitor 30. Then, the central portion of the electrode 26 on the surface side is covered with a dielectric layer 32 of barium titanate or a high dielectric constant resin such as styrene.
An electrode 27 is formed on the surface side of the dielectric layer 32 so as to face the electrode 26 so as to overlap the central portion thereof and extend to the other side. The central portion of the surface of the electrode 27 is also overcoated 19 and can be used as an individual chip capacitor 30. And the electrodes 26, 1
A through hole 20 is formed between the semiconductor chip 7 and the electrodes 27 and 17, and each chip resistor 10 is divided and surface-mounted on the circuit board.

The ceramic thin film 14 and the electrodes 26 and 27 of the chip capacitor 30 of this embodiment are formed by the aerosol gas deposition method and the evaporation gas deposition method, respectively, in the same manner as described above, and the dielectric layer of barium titanate is used. Also in 32, the fine particles of the constituent material are sprayed at a predetermined position in a vacuum at a room temperature by the aerosol gas deposition method to form a desired thickness.
As a result, when the electrode 27 is formed, it is possible to prevent the dielectric layer 32 and the like from being thermally adversely affected and to prevent distortion. Moreover, the extremely thin chip capacitor 30 can be formed.

Next, a chip-shaped electronic component according to a fourth embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.
The chip-shaped electronic component of this embodiment also includes the chip capacitor 3
0, which is the chip capacitor 3 of this embodiment.
In No. 0, a pair of large and small electrodes 26 and 27 are formed on the surface of the large resin film substrate 12 and pressed so as to be flush with the surface of the resin film substrate 12. This press may be performed at a temperature at which the resin film substrate 12 becomes flexible. Then, the dielectric 32 is provided at the center of the electrode 26. After that, a conductor layer 33 of Au or the like is formed so as to cover the dielectric 32 and extend toward the electrode 27 side and be connected. This conductor layer 33
The formation is also performed by spraying Au fine particles in a vacuum by the gas deposition method. And overcoat 1
9 is applied, and the chip capacitors 30 can be used as individual chip capacitors 30. After this, the electrodes 26 and 17 and the electrodes 27 and 17
A through hole 20 is formed between them, and each chip resistor 10 is divided and surface-mounted on the circuit board.

The electrodes 26 and 27 of the chip capacitor 30 of this embodiment and the dielectric layer 32 of barium titanate.
Also in the same manner as described above, fine particles of the constituent material are sprayed at a predetermined position in a vacuum at room temperature by the gas deposition method to have a desired thickness. Thereby, when the electrode 27 and the conductor layer 33 are formed, it is possible to prevent the dielectric layer 32 and the like from being thermally adversely affected and to prevent distortion. Moreover, in the case of the above-mentioned third embodiment, the dielectric layer 32 hangs on the corner portion of the electrode 26, and cracks are likely to occur in the dielectric layer 32 at this corner portion. There is no short circuit due to the occurrence of.

Next, a chip-shaped electronic component according to a fifth embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted. The chip-shaped electronic component of this embodiment is a chip-shaped CR composite chip component 40 provided with a resistor and a capacitor.
In the same manner as in the above embodiment, the ceramic thin film 14 is first formed on the front and back surfaces of the large-sized resin film substrate 12 by the same method as in the above embodiment. And resistor 1
8 is formed. Then, a large number of pairs of electrodes 17 and 26 are formed at predetermined locations on the front and back surfaces of the ceramic thin film 14 and the resistor 18, respectively, and an overcoat 19 is formed between the electrodes 17 on the back surface side. The method of forming these is similar to that of the above-mentioned embodiment.

Further, one electrode 26 is formed at a predetermined position on the surface of the resin film substrate 12 so as to have an area about half the size of each chip capacitor 30.
The central portion of the electrode 26 on the surface side is covered with a dielectric layer 32 of barium titanate, styrene, or the like.
An electrode 27 is formed on the surface side of the dielectric layer 32 so as to face the electrode 26 so as to overlap the central portion thereof and extend to the other side. This dielectric layer 32 is also formed in the same manner as in the above embodiment. The central portion of the surface of the electrode 27 is also overcoated 19 and can be used as an individual chip capacitor 30. Then, a through hole 20 is formed between the electrodes 26 and 17 and the electrodes 27 and 17, and each chip resistor 10 is divided and surface-mounted on the circuit board.

In the chip-shaped electronic component of this embodiment, a relatively flat resistor forming portion is located on the back surface side, which can be easily surface-mounted and can be formed into a thin chip. is there.

Next, a chip-shaped electronic component according to a sixth embodiment of the present invention will be described with reference to FIG. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted.
The chip-shaped electronic component of this embodiment is also a chip-shaped CR provided with a resistor and a capacitor by the gas deposition method.
Regarding the composite chip part 40, the capacitor portion formed on the front surface side of the fifth embodiment is formed in the same manner as the capacitor of the fourth embodiment. The chip-shaped electronic component of this embodiment can be made thinner.

Next, a chip-shaped electronic component according to a seventh embodiment of the present invention will be described with reference to FIGS. Here, the same members as those in the above-described embodiment are designated by the same reference numerals and the description thereof will be omitted. The chip-shaped electronic component of this embodiment is for the multiple chip resistor 50, and a plurality of resistors are provided on one resin film substrate 12. The resistor 18 is formed by the same method as in the first embodiment or the second embodiment. Also, in this example,
An end face electrode 51 is also formed on the end face between the electrodes 16 and 17 by the gas deposition method.

According to the multiple chip resistor 50 of this embodiment, even if the substrate is relatively long, the resin film substrate 12 is not broken or cracked, and the multiple chip resistor 50 having more elements is provided. It can be a continuous chip. The electronic elements formed here are not limited to resistors, and may be multiple capacitors or multiple elements of CR composites.
Further, by forming the electrodes on the end faces, the through holes can be omitted, and the structure for achieving conduction between the front and back electrodes by the end face electrodes can be applied to each of the above embodiments.

The material of the resin film substrate of the present invention may be selected from liquid crystal polymer resins other than the above and other resins. The thickness of each component of the chip-shaped electronic component is
It can be set as appropriate, and the material of each electronic element such as the resistor and the capacitor can be appropriately selected. In addition to gold, silver, copper, palladium and the like can be appropriately selected as the electrode material. Further, the temperature of the film substrate, the temperature of the film substrate to which the ultrafine particles of each component are sprayed, may be raised from room temperature to about 300 ° C. depending on the substrate.
A relatively low temperature of several hundreds of degrees Celsius or less is sufficient.

[0031]

The chip-shaped electronic component and the method for manufacturing the same according to the present invention are capable of mass-producing a small-sized and thin chip-shaped electronic component at low cost. In addition, on the surface of the resin film substrate, at a relatively low temperature from approximately room temperature to several hundreds of degrees Celsius,
By spraying in a vacuum, it is possible to form electrodes and electronic elements without thermal adverse effects, and it is possible to form elements having good characteristics.

[Brief description of drawings]

FIG. 1 is a plan view of a chip-shaped electronic component according to a first embodiment of the present invention.

FIG. 2 is a vertical cross-sectional view of the chip-shaped electronic component of the first embodiment of the present invention.

FIG. 3 is a vertical sectional view of a chip-shaped electronic component according to a second embodiment of the present invention.

FIG. 4 is a plan view of a chip-shaped electronic component according to a third embodiment of the present invention.

FIG. 5 is a vertical sectional view of a chip-shaped electronic component of a third embodiment of the present invention.

FIG. 6 is a vertical sectional view of a chip-shaped electronic component according to a fourth embodiment of the present invention.

FIG. 7 is a plan view of a chip-shaped electronic component of a fifth embodiment of the present invention.

FIG. 8 is a vertical sectional view of a chip-shaped electronic component of a fifth embodiment of the present invention.

FIG. 9 is a vertical sectional view of a chip-shaped electronic component according to a sixth embodiment of the present invention.

FIG. 10 is a plan view of a chip-shaped electronic component according to a seventh embodiment of the present invention.

FIG. 11 is a front view of a chip-shaped electronic component according to a seventh embodiment of the present invention.

[Explanation of symbols]

 10 Chip Resistor (Chip-shaped Electronic Component) 12 Resin Film Substrate 14 Ceramics Thin Film 16, 17, 26, 27 Electrode 18 Resistor 20 Through Hole

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Ryuichiro 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. (72) Yozo Ohara 3158 Shimookubo, Osawano-cho, Kamishinkawa-gun, Toyama Prefecture Within the corporation

Claims (9)

[Claims] 1. A ceramic thin film is formed on an insulating resin film, and an electrode is formed at the end of the ceramic thin film by a metal thin film in which metal fine particles are densely deposited, and an electronic element is formed between the electrodes. Chip-shaped electronic components. 2. The chip-shaped electronic component according to claim 1, wherein the ceramic thin film is formed by closely depositing fine particles of its constituent components. 3. The chip shape according to claim 1, wherein the electrodes are formed on the front and back surfaces of the resin film, and through holes are formed so as to penetrate between the electrodes on the front and back surfaces and electrically connect to each other. Electronic components. 4. The electrode is formed on the front and back of the resin film, and the electrodes on the front and back are electrically connected by an end face electrode formed on an end face of the resin film. 2. The chip-shaped electronic component according to 2. 5. The electronic element on the resin film is a resistor formed by spraying fine particles of a metal thin film resistor on the resin film in a vacuum at about room temperature and closely depositing them. The chip-shaped electronic component according to 3 or 4. 6. The electronic device on the resin film is a capacitor formed by spraying fine particles of an electrode and a dielectric material on the resin film in a vacuum at a room temperature to closely deposit them. Alternatively, the chip-shaped electronic component according to item 4. 7. A plurality of electrodes are formed by spraying fine metal particles in vacuum onto the ends of an insulating resin film in vacuum to form a plurality of electrodes, and before or after forming the electrodes, connecting between the electrodes. The electronic element to be sprayed, the fine particles of the component are sprayed at a predetermined position in a vacuum to be closely deposited,
After that, a method for manufacturing a chip-shaped electronic component in which the resin film is divided into individual electronic elements. 8. The chip-shaped electronic component according to claim 7, wherein the electrode and the electronic element on the resin film are obtained by spraying fine particles of each constituent element in vacuum on the resin film and closely depositing them. Manufacturing method. 9. The fine particles of the metal thin film resistor are sprayed and densely deposited on the entire surface of the resin film in a vacuum from about room temperature to about 300 ° C. or less, and thereafter, the metal particles for forming electrodes are formed in a vacuum. 9. The method for manufacturing a chip-shaped electronic component according to claim 7, wherein the resin film is sprayed at a predetermined position to be closely deposited to form an electrode, and thereafter the resin film is divided into individual electronic elements.