JPH08218137A - Copper or copper alloy member excellent in laser weldability - Google Patents
Copper or copper alloy member excellent in laser weldabilityInfo
- Publication number
- JPH08218137A JPH08218137A JP7025227A JP2522795A JPH08218137A JP H08218137 A JPH08218137 A JP H08218137A JP 7025227 A JP7025227 A JP 7025227A JP 2522795 A JP2522795 A JP 2522795A JP H08218137 A JPH08218137 A JP H08218137A
- Authority
- JP
- Japan
- Prior art keywords
- copper
- laser
- copper alloy
- plating
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Laser Beam Processing (AREA)
- Coating With Molten Metal (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体素子、集積回路
ならびに端子およびコネクタ用の電気・電子部品などに
使用されている銅系部材において、そのレーザー溶接性
を向上させた銅または銅合金部材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper-based member used for a semiconductor element, an integrated circuit, and electric / electronic parts for terminals and connectors, etc., having improved laser weldability. Regarding
【０００２】[0002]
【従来の技術】従来、銅または銅合金は導電性および熱
伝導性に優れていることから電気・電子部品材料として
広く使用されている。一般的に電気・電子部品の組み立
て工程においては、従来は半田を使用する接合法が主で
あったが、最近ではレーザーを用いた溶接法も導入され
ている。レーザーはエネルギー密度が高いという特徴か
ら、より高性能および高速度の溶接が可能である。2. Description of the Related Art Conventionally, copper or a copper alloy has been widely used as a material for electric / electronic parts because of its excellent electrical conductivity and thermal conductivity. Generally, in the process of assembling electric / electronic components, a joining method using solder has been mainly used in the past, but a welding method using a laser has recently been introduced. Due to the high energy density of lasers, higher performance and higher speed welding are possible.
【０００３】しかしながら、銅または銅合金のようにレ
ーザー光の反射率が高く、熱伝導率が高い材料では、発
熱が少ないため溶接性が良好ではなくたとえば以下のよ
うな不具合が生じ、結果として溶接部の接合強度が低下
する。 熱伝導率が高いため、厚板では裏面まで溶融せず、
溶接が不十分となる。 溶接部の周りに溶融した素材が盛り上がるエグレが
生じ、適切な溶接面が得られない。 溶接時に素材が飛び散るスパッタが生じ、適切な溶
接面が得られないばかりでなく作業にも危険性が伴う。 溶接部断面にブローホールやクラック等の欠陥が生
じる。However, a material such as copper or a copper alloy having a high reflectance of laser light and a high thermal conductivity does not have good weldability due to a small amount of heat generation, resulting in the following defects, resulting in welding. The joint strength of the part is reduced. Due to its high thermal conductivity, thick plates do not melt to the back side,
Insufficient welding. The melted material rises around the weld zone, and an appropriate weld surface cannot be obtained. When welding, spatters that spatter the material occur, not only a proper welded surface cannot be obtained, but there is also a danger in the work. Defects such as blowholes and cracks occur in the cross section of the weld.
【０００４】これらの問題を解決する方法として、被溶
接部材である銅または銅合金にＮｉめっきを施したのち
に溶接する方法（特開昭６４−７５６９９号公報）や、
Ｎｉめっき後、熱処理（８００〜１０００℃）を行なっ
てＮｉを銅または銅合金中に拡散させ、部材の表面にＮ
ｉと銅との合金層を形成したものを溶接接合する方法
（特開平３−１０６５８２号公報）が提案されている。As a method for solving these problems, there is a method in which copper or a copper alloy as a member to be welded is plated with Ni and then welded (Japanese Patent Laid-Open No. 64-75699),
After Ni plating, heat treatment (800 to 1000 ° C.) is performed to diffuse Ni into copper or copper alloy, and N is applied to the surface of the member.
A method (JP-A-3-106582) for welding and joining those formed with an alloy layer of i and copper has been proposed.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら前記公知
の方法では作業工程が増えることによるコストアップが
避けられず、熱処理により素材自体が軟化してしまっ
て、特に強度を必要とする電気・電子部品材料には適用
できないという問題点がある。本発明は前記した従来技
術における問題点を解消し、銅または銅合金の電気・電
子部品材料としての特性を劣化させることなく、レーザ
ー溶接性に優れた銅または銅合金部材を提供することを
目的としている。However, in the above-mentioned known method, the cost increase due to the increase of the work steps is unavoidable, and the raw material itself is softened by the heat treatment, and the electric / electronic component material requiring particularly high strength. There is a problem that it cannot be applied to. It is an object of the present invention to solve the above-mentioned problems in the prior art and to provide a copper or copper alloy member excellent in laser weldability without deteriorating the characteristics of copper or copper alloy as a material for electric / electronic parts. I am trying.
【０００６】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明者等は鋭意研究を重ねた結果、電気・電子部
品材料用銅または銅合金の表面に薄いＳｎめっき皮膜を
形成することがレーザー溶接性向上に効果的であること
を知見し、本発明を完成するに至った。前記知見に基づ
いてなされた本発明は、銅または銅合金からなる銅系部
材本体の表面に、厚さが０．０５〜５．００μｍのＳｎ
めっき層を有することを特徴とするレーザー溶接性に優
れた銅または銅合金部材を要旨としている。In order to achieve the above object, the inventors of the present invention have conducted extensive studies and as a result have found that a thin Sn plating film is formed on the surface of copper or copper alloy for electric / electronic component materials. The inventors have found that it is effective in improving laser weldability, and completed the present invention. The present invention made on the basis of the above-mentioned findings provides Sn having a thickness of 0.05 to 5.00 µm on the surface of a copper-based member body made of copper or a copper alloy.
The gist is a copper or copper alloy member excellent in laser weldability, which is characterized by having a plating layer.
【０００７】[0007]
【作用】本発明の構成と作用を説明する。本発明におい
て、０．０５〜５．００μｍ厚さのＳｎめっき層は、レ
ーザー光の吸収率を高め、これによって、銅系部材本体
のレーザー溶接性を向上させることができる。すなわ
ち、銅系部材本体へのＳｎめっき層は、 エグレおよびスパッタを防止する。 溶接部内部のブローホールやクラック等の欠陥を防
止する。 Ｓｎの固溶強化により、溶接部における機械的特性
の劣化を抑制できる。 ＨＡＺ（Ｈｅａｔ Ａｆｆｅｃｔｅｄ Ｚｏｎｅ：
熱影響部）が小さいため溶接周辺部への熱影響が低い。 接合強度が向上する。 等の作用を有する。また、Ｓｎが低融点であるため、レ
ーザービーム照射時に瞬時に母材中に均一拡散し、偏析
し難いので、上記の作用・効果の発現が一様である利点
がある。The structure and operation of the present invention will be described. In the present invention, the Sn plating layer having a thickness of 0.05 to 5.00 μm enhances the absorptance of laser light, thereby improving the laser weldability of the copper-based member body. That is, the Sn plating layer on the copper-based member body prevents egress and spatter. Prevents defects such as blowholes and cracks inside the weld. The solid solution strengthening of Sn can suppress deterioration of mechanical properties in the welded portion. HAZ (Heat Affected Zone:
The heat-affected zone is small, so the heat-affected area around the weld is low. Bonding strength is improved. And so on. Further, since Sn has a low melting point, it is uniformly diffused in the base material instantly during laser beam irradiation, and it is difficult for segregation to occur. Therefore, there is an advantage that the above-described actions and effects are uniformly expressed.
【０００８】このＳｎめっきは、銅系部材素材の製造段
階でめっき処理により形成させることができるので余分
な工程を必要とせず、作業性には何ら問題はない。ま
た、めっき厚さが均一なため機械的性質等のバラツキが
少ない溶接が可能であり、異物が溶接金属中に混入する
こともない。Since this Sn plating can be formed by plating at the manufacturing stage of the copper-based member material, no extra step is required and there is no problem in workability. In addition, since the plating thickness is uniform, it is possible to perform welding with less variation in mechanical properties and the like, and foreign substances are not mixed in the weld metal.
【０００９】次にめっき厚さの限定理由について説明す
る。レーザー光吸収率および溶接部のクラックの有無と
Ｓｎめっき厚さとの関係を下記の表１に示した。Next, the reason for limiting the plating thickness will be described. Table 1 below shows the relationship between the laser light absorptance, the presence or absence of cracks in the weld, and the Sn plating thickness.
【００１０】Ｓｎめっきは、レーザー光の吸収率を高
め、エグレおよびスパッタの低減、機械的特性の劣化を
抑制するのに寄与するが、めっき厚さが０．０５μｍ未
満では前記のような効果は少なく、溶接部の健全性は向
上しない。また、５μｍを超えてめっきが施されてもこ
れに見合う効果は得られず、レーザ光照射後の冷却過程
において銅合金特有の中間温度脆性が顕著となり、クラ
ックが生じやすくなる。加えて、めっきを溶融するため
に余分なレーザー照射が必要となり、経済的にも不利と
なる。したがって、Ｓｎめっきの厚さは０．０５〜５μ
ｍが適切である。Sn plating contributes to increasing the absorption rate of laser light, reducing egress and spatter, and suppressing deterioration of mechanical properties. However, if the plating thickness is less than 0.05 μm, the above-mentioned effects are not obtained. There is little, and the soundness of the weld does not improve. Further, even if plating is performed to a thickness of more than 5 μm, an effect commensurate with this is not obtained, and intermediate temperature embrittlement peculiar to a copper alloy becomes remarkable in the cooling process after laser light irradiation, and cracks easily occur. In addition, extra laser irradiation is required to melt the plating, which is economically disadvantageous. Therefore, the thickness of Sn plating is 0.05 to 5 μm.
m is suitable.
【００１１】[0011]
【表１】 [Table 1]
【００１２】[0012]
【実施例】本発明の実施例を説明するが、これによって
本発明はなんら限定されるものではない。 実施例 図１に示すように、銅系部材本体１として板厚０．６４
ｍｍのＪＩＳ Ｃ １０２０無酸素銅板を用意し、この
本体１の表面および裏面に各々１．２μｍ厚さのＳｎめ
っき２を形成した。そして一方の銅系部材の表面と他方
の銅系部材の裏面とを一部重ね合わせ、この部分にレー
ザービーム３を照射した。使用したレーザー装置と試験
条件は次のとおりである。 １）レーザー装置 パルスＹＡＧレーザー（ＪＫ７０４） パルス幅：０．３〜２０ｍｓ 平均出力：４００Ｗ ２）試験条件 パルス幅 ：５ｍｓ 出力エネルギー：５５Ｊ／ｐｕｌｓｅ 供試材寸法 ：０．６４ｍｍt ×１０ｍｍw ×５０ｍ
ｍL EXAMPLES Examples of the present invention will be described, but the present invention is not limited thereto. Example As shown in FIG. 1, the copper-based member body 1 has a plate thickness of 0.64.
A JIS C 1020 oxygen-free copper plate having a thickness of 1.2 mm was prepared, and Sn plating 2 having a thickness of 1.2 μm was formed on each of the front surface and the back surface of the main body 1. Then, the front surface of one copper-based member and the back surface of the other copper-based member were partly overlapped, and this portion was irradiated with the laser beam 3. The laser equipment used and the test conditions are as follows. 1) Laser device Pulse YAG laser (JK704) Pulse width: 0.3 to 20 ms Average output: 400 W 2) Test condition Pulse width: 5 ms Output energy: 55 J / pulse Specimen size: 0.64 mm t × 10 mm w × 50 m
m L
【００１３】この条件で溶接した結果（溶接外観部およ
び溶接断面部）を図２および図３に示した。比較例とし
て、裸材とＮｉめっき材を選定し、同時に供試した。こ
れらの結果から、本発明部材はエグレおよびスパッタが
抑えられており、溶接部内部にブローホールおよびクラ
ックは認められず、良好な溶接性を有することが示され
ている。しかるに比較の裸材については、図２にみられ
るようにエグレ４およびスパッタ５が発生し、図３から
溶接部内部にはブローホール６が認められる。また、Ｎ
ｉめっき材についても同様のエグレおよびスパッタが認
められる。The results of welding under these conditions (welding appearance portion and welding cross-section portion) are shown in FIGS. 2 and 3. As a comparative example, a bare material and a Ni-plated material were selected and tested at the same time. From these results, it is shown that the member of the present invention has suppressed egress and spatter, has no blowholes and cracks inside the welded portion, and has good weldability. However, in the bare material for comparison, as shown in FIG. 2, egre 4 and spatter 5 are generated, and from FIG. 3, blowholes 6 are recognized inside the welded portion. Also, N
Similar egre and spatter are also observed for the i-plated material.
【００１４】次に、溶接部の機械的特性を評価するため
溶接断面部の硬さ分布を測定した。その結果を図４〜６
に示した。本発明部材の溶接接合部の硬さは図４に示さ
れたように、 母材硬さＨｖ８５に対して、Ｈｖ７０以上を維持し
ている。 局部的な硬さ劣化は認められない（偏析がない）。 ＨＡＺが小さい。 というものであり、良好な機械的特性を有している。Next, in order to evaluate the mechanical properties of the weld, the hardness distribution of the weld cross section was measured. The results are shown in Figs.
It was shown to. As shown in FIG. 4, the hardness of the welded joint of the member of the present invention is Hv70 or more with respect to the base metal hardness Hv85. No local hardness deterioration is observed (no segregation). HAZ is small. It has good mechanical properties.
【００１５】これに対し、比較のために表面にめっきを
施していない裸材については、図５に示されたようにそ
の溶接接合部は、 Ｈｖ５０にまで硬さの劣化が認められる。 ＨＡＺは本発明部材に比べて大きい。 という結果が示され、機械的特性の劣化が認められる。On the other hand, for comparison, in the case of the bare material whose surface is not plated, as shown in FIG. 5, the welded joint shows deterioration in hardness up to Hv50. HAZ is larger than the member of the present invention. The results are shown, and deterioration of mechanical properties is recognized.
【００１６】一方、表面にＮｉめっきを施している比較
材については図６に示されたようにその溶接接合部は、 Ｎｉが偏析しているため、局部的に硬さの劣化が認
められる。 ＨＡＺは本発明部材に比べて大きい。 という結果が示され、機械的特性の劣化が認められる。On the other hand, regarding the comparative material having the surface plated with Ni, Ni is segregated in the welded joint as shown in FIG. 6, so that the hardness is locally deteriorated. HAZ is larger than the member of the present invention. The results are shown, and deterioration of mechanical properties is recognized.
【００１７】さらに、溶接部の接合強度を評価するため
に、剪断引張強さを測定し、その結果を表２に示した。Further, in order to evaluate the joint strength of the welded portion, the shear tensile strength was measured, and the results are shown in Table 2.
【００１８】[0018]
【表２】 [Table 2]
【００１９】これらの結果より、比較材である裸材が
７．５ｋｇｆ／点、Ｎｉめっき材が１０．５ｋｇｆ／点
を有するのに対して、本発明部材は良好な接合面を有
し、さらに溶接部の機械的特性の劣化が小さいため１
５．５ｋｇｆ／点にまで接合強度が向上している。な
お、上記各実施例のデータは、いずれもＹＡＧレーザー
を使用して得られたものであるが、ＣＯ2 レーザー等そ
の他のレーザー溶接を適用することも出来ることは勿論
である。From these results, the bare material as a comparative material has 7.5 kgf / point and the Ni plated material has 10.5 kgf / point, whereas the member of the present invention has a good joint surface, and Because the deterioration of the mechanical properties of the weld is small, 1
The bonding strength is improved up to 5.5 kgf / point. The data in each of the above-mentioned examples were obtained using a YAG laser, but it goes without saying that other laser welding such as CO2 laser can be applied.
【００２０】[0020]
【発明の効果】本発明は以上説明したように構成されて
いるから、レーザー溶接の前もしくは後に格別の処理工
程を設ける必要はなく、鋼材等の他の材料の場合と同様
の方法でレーザー溶接が可能であり、産業上極めて有用
である。Since the present invention is configured as described above, there is no need to provide a special treatment step before or after laser welding, and laser welding can be performed by the same method as in the case of other materials such as steel materials. Is possible and is extremely useful industrially.
【図１】本発明部材の接合を実施する側面断面図であ
る。FIG. 1 is a side sectional view for joining members of the present invention.
【図２】本発明部材および比較材のレーザー溶接部外観
金属組織を示す、金属顕微鏡写真である。FIG. 2 is a metallurgical micrograph showing a laser welded appearance metallic structure of a member of the present invention and a comparative material.
【図３】本発明部材および比較材のレーザー溶接部断面
金属組織を示す、金属顕微鏡写真である。FIG. 3 is a metallurgical micrograph showing a cross-sectional metallographic structure of a laser-welded portion of a member of the present invention and a comparative material.
【図４】本発明部材のレーザー溶接部硬さ分布を示す説
明図である。FIG. 4 is an explanatory view showing a hardness distribution of a laser-welded portion of the member of the present invention.
【図５】比較材のレーザー溶接部硬さ分布を示す説明図
である。FIG. 5 is an explanatory view showing a hardness distribution of a laser welded portion of a comparative material.
【図６】他の比較材のレーザー溶接部硬さ分布を示す説
明図である。FIG. 6 is an explanatory view showing a hardness distribution of a laser welded portion of another comparative material.
１…銅系部材本体、 ２…Ｓｎめっき、 ３…レ
ーザービーム、４…エグレ、 ５…スパッタ、
６…ブローホール。1 ... Copper-based member body, 2 ... Sn plating, 3 ... Laser beam, 4 ... Egret, 5 ... Sputter,
6 ... Blowhole.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２３Ｋ 103:12 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display area // B23K 103: 12
Claims (1)
の表面に、厚さが０．０５〜５．００μｍのＳｎめっき
層を有することを特徴とするレーザー溶接性に優れた銅
または銅合金部材。1. A copper or copper alloy having excellent laser weldability, characterized in that a copper-based member body made of copper or a copper alloy has an Sn plating layer having a thickness of 0.05 to 5.00 μm on the surface thereof. Element.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7025227A JPH08218137A (en) | 1995-02-14 | 1995-02-14 | Copper or copper alloy member excellent in laser weldability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7025227A JPH08218137A (en) | 1995-02-14 | 1995-02-14 | Copper or copper alloy member excellent in laser weldability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08218137A true JPH08218137A (en) | 1996-08-27 |
Family
ID=12160091
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7025227A Pending JPH08218137A (en) | 1995-02-14 | 1995-02-14 | Copper or copper alloy member excellent in laser weldability |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08218137A (en) |
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| JP2011135092A (en) * | 2002-09-06 | 2011-07-07 | Tyco Electronics Raychem Kk | Method for manufacturing connection structure between ptc element and metal lead element, and ptc element for use in the same |
| JP2012071356A (en) * | 2012-01-17 | 2012-04-12 | Fuji Electric Co Ltd | Laser welding member and laser welding method |
| JP2012092405A (en) * | 2010-10-28 | 2012-05-17 | Kobe Steel Ltd | Copper plate material for laser welding |
| JP2013028828A (en) * | 2011-07-27 | 2013-02-07 | Furukawa Electric Co Ltd:The | Copper sheet for laser processing |
| US8415027B2 (en) | 2008-03-20 | 2013-04-09 | Denso Corporation | Laser welding structure |
| JP2014017081A (en) * | 2012-07-06 | 2014-01-30 | Hitachi Vehicle Energy Ltd | Secondary battery |
| JP5537751B1 (en) * | 2013-02-24 | 2014-07-02 | 古河電気工業株式会社 | Metal member, terminal, wire connection structure, and method of manufacturing terminal |
| JP2015014699A (en) * | 2013-07-05 | 2015-01-22 | 日本電産サンキョー株式会社 | Manufacturing method of optical device and optical device |
| US9272368B2 (en) | 2012-07-18 | 2016-03-01 | Emerson Climate Technologies Gmbh | Method of joining two components using a welding process |
-
1995
- 1995-02-14 JP JP7025227A patent/JPH08218137A/en active Pending
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| JP4572984B2 (en) * | 2008-05-08 | 2010-11-04 | 株式会社デンソー | Laser welding structure and laser welding method |
| JP2012092405A (en) * | 2010-10-28 | 2012-05-17 | Kobe Steel Ltd | Copper plate material for laser welding |
| JP2013028828A (en) * | 2011-07-27 | 2013-02-07 | Furukawa Electric Co Ltd:The | Copper sheet for laser processing |
| JP2012071356A (en) * | 2012-01-17 | 2012-04-12 | Fuji Electric Co Ltd | Laser welding member and laser welding method |
| JP2014017081A (en) * | 2012-07-06 | 2014-01-30 | Hitachi Vehicle Energy Ltd | Secondary battery |
| US9272368B2 (en) | 2012-07-18 | 2016-03-01 | Emerson Climate Technologies Gmbh | Method of joining two components using a welding process |
| JP5537751B1 (en) * | 2013-02-24 | 2014-07-02 | 古河電気工業株式会社 | Metal member, terminal, wire connection structure, and method of manufacturing terminal |
| WO2014129221A1 (en) * | 2013-02-24 | 2014-08-28 | 古河電気工業株式会社 | Metal member, terminal, electric wire connection structure, and method of manufacturing terminal |
| JP2014187025A (en) * | 2013-02-24 | 2014-10-02 | Furukawa Electric Co Ltd:The | Metal member, terminal, wire connection structure and method for manufacturing terminal |
| CN104126033A (en) * | 2013-02-24 | 2014-10-29 | 古河电气工业株式会社 | Metal member,terminal,electric wire connection structure and method of manufacturing terminal |
| US9385439B2 (en) | 2013-02-24 | 2016-07-05 | Furukawa Electric Co., Ltd. | Metal member, a terminal, a wire connecting structure and a method of manufacturing a terminal |
| JP2015014699A (en) * | 2013-07-05 | 2015-01-22 | 日本電産サンキョー株式会社 | Manufacturing method of optical device and optical device |
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