JPH08215971A - Substrate fitting stage - Google Patents

Substrate fitting stage

Info

Publication number
JPH08215971A
JPH08215971A JP6853595A JP6853595A JPH08215971A JP H08215971 A JPH08215971 A JP H08215971A JP 6853595 A JP6853595 A JP 6853595A JP 6853595 A JP6853595 A JP 6853595A JP H08215971 A JPH08215971 A JP H08215971A
Authority
JP
Japan
Prior art keywords
union
substrate
case
water supply
outflow
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6853595A
Other languages
Japanese (ja)
Inventor
Toshito Nobukiyo
俊人 信清
Soujirou Hashino
早次郎 橋野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ENU ESU KK
Original Assignee
ENU ESU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ENU ESU KK filed Critical ENU ESU KK
Priority to JP6853595A priority Critical patent/JPH08215971A/en
Publication of JPH08215971A publication Critical patent/JPH08215971A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To improve the cooling effect of a substrate fitting part, in the substrate fitting stage of an ion beam etching device and the like. CONSTITUTION: When a case 5 is rotated, a substrate fitting part 6 makes a planetary motion. The case 5 is provided with a water feed body 51 rotatably surrounding a fitting shaft 39, and a flow passage 43 formed within the substrate fitting part 6 and the fitting shaft 39 is communicated to the inflow passage 53 and the outflow passage 54 of the water feed body 51. An upper union 33 is provided on the center of the case 5. This union 33 is rotatably connected to a lower union 22. The upper union 33 is connected to the water feed body 51 through pipings 55, 56. Cooling water fed to the lower union 22 flows in the substrate fitting part 6 through the upper union 33 and the water feed body 51, and directly cools the substrate fitting part 6.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体製造工程等にお
いて、基板(ウェーハ)上にスパッタリングにより薄膜
を形成したり、基板上に形成された膜をイオンビームに
よりエッチングしたりする際、真空チャンバ内に上記基
板を保持するための基板取付用ステージに関するもので
ある。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum chamber for forming a thin film on a substrate (wafer) by sputtering or etching the film formed on the substrate with an ion beam in a semiconductor manufacturing process or the like. The present invention relates to a substrate mounting stage for holding the substrate therein.

【0002】[0002]

【従来の技術】チャンバ内において、基板にスパッタリ
ングやエッチング処理するため、該基板を保持するよう
にした各種の基板取付用ステージが提案されている。図
2中、(A)は、その一例を示し、真空チャンバ(1)
の蓋(2)の内面にチャンバ外のモータ(3)により回
転するよう略L字形のフレーム(4)を設け、該フレー
ム上にケース(5)を回転可能に取付け、該ケース
(5)の上部に基板を支持する基板取付部(6)を形成
してある。該基板取付部(6)は、チャンバ外に設けた
モータ(7)、チェーン(8)等を介して遊星運動さ
れ、図示を省略したターゲットやイオン源に対して基板
が均一的に対向するように構成されている。なお、上記
チャンバに真空漏れを生じないように、各所に適宜のシ
ール部材が設けられている。
2. Description of the Related Art Various substrate mounting stages have been proposed for holding a substrate so that the substrate is subjected to sputtering or etching in a chamber. In FIG. 2, (A) shows an example of the vacuum chamber (1).
A substantially L-shaped frame (4) is provided on the inner surface of the lid (2) for rotation by the motor (3) outside the chamber, and the case (5) is rotatably mounted on the frame (4). A substrate mounting portion (6) for supporting the substrate is formed on the upper portion. The substrate mounting portion (6) is planetarily moved through a motor (7), a chain (8) and the like provided outside the chamber so that the substrate uniformly faces a target (not shown) or an ion source. Is configured. Appropriate sealing members are provided at various places so that vacuum leakage does not occur in the chamber.

【0003】図3は、従来技術における上記チャンバ内
のケース(5)等の拡大断面図を示し、ケース(5)
は、上記チェーン(8)に係合するスプロヶット(9)
を有し、その前面のトップベース(10)には基板を保
持するための基板取付部(6)を軸受(11)により回
転可能に取付けてある。該基板取付部(6)の下端には
遊星歯車(12)が取付けられており、該遊星歯車(1
2)は上記フレームに固定した太陽歯車(13)に係合
している。また、該遊星歯車(12)の下面は、上記フ
レームに固定した冷却プレート(14)に接触し、該冷
却プレート(14)には給水管(15)及び排水管(1
6)を通して冷却水が循環している。
FIG. 3 shows an enlarged cross-sectional view of the case (5) and the like in the chamber according to the prior art.
Is a sprocket (9) that engages with the chain (8).
A board mounting portion (6) for holding the board is rotatably mounted on the front base (10) on the front surface thereof by a bearing (11). A planetary gear (12) is attached to the lower end of the board mounting portion (6), and the planetary gear (1)
2) engages a sun gear (13) fixed to the frame. Further, the lower surface of the planetary gear (12) contacts a cooling plate (14) fixed to the frame, and the cooling plate (14) has a water supply pipe (15) and a drain pipe (1).
Cooling water is circulating through 6).

【0004】上記遊星歯車(12)は、ばね(17)に
より上記冷却プレート(14)に押圧されているので、
上記ケース(5)が上記モータ(7)の作用で公転して
上記基板取付部(6)が遊星運動する際、冷却プレート
(14)上を接触して自転しながら公転する。そして、
上記スパッタリング処理や特にエッチング処理のとき、
上記基板取付部(6)上に支持された基板(図示略)に
発生する熱は、上記遊星歯車(12)等を通して冷却プ
レート(14)により冷却される。
Since the planetary gear (12) is pressed against the cooling plate (14) by the spring (17),
When the case (5) revolves under the action of the motor (7) and the board mounting part (6) makes a planetary motion, it contacts the cooling plate (14) and revolves while rotating. And
At the time of the above-mentioned sputtering treatment or particularly the etching treatment,
The heat generated in the substrate (not shown) supported on the substrate mounting portion (6) is cooled by the cooling plate (14) through the planetary gear (12) and the like.

【0005】[0005]

【発明の解決課題】上記のように、従来の基板取付用ス
テージは、基板等に生じた発熱を、冷却プレートを介し
て間接的に冷却していたので、冷却効率が良くなく、長
時間運転させることがむずかしかった。そこで、本発明
の目的は、上述のように基板取付部を遊星運動させるよ
うにした基板取付用ステージにおいて、該基板取付部を
直接冷却できるようにした新規な基板取付用ステージを
提供することである。
As described above, in the conventional substrate mounting stage, the heat generated in the substrate or the like is indirectly cooled through the cooling plate, so that the cooling efficiency is not good and the substrate is operated for a long time. It was difficult to make them. Therefore, an object of the present invention is to provide a novel substrate mounting stage in which the substrate mounting portion can be directly cooled in the substrate mounting stage in which the substrate mounting portion is caused to make a planetary motion as described above. is there.

【0006】[0006]

【課題解決の手段】本発明によれば、ケースの公転に伴
って遊星運動するよう該ケースに回転可能に取付けた基
板取付部内に冷却水の流路を形成し、該基板取付部の取
付軸を囲んで給水ボディを設け、該給水ボディをケース
に固定すると共に該ケースの中央部に上部ユニオンを取
付け、上記給水ボディと上部ユニオンにそれぞれ形成し
た流入路、流出路を連絡し、上記上部ユニオンにフレー
ムに固定した下部ユニオンを回転可能に接続し、該下部
ユニオンに連結した給水管及び排水管を通して上記基板
取付部に冷却水を直接循環させるようにした基板取付用
ステージが提供され、上記目的が達成される。
According to the present invention, a flow path of cooling water is formed in a substrate mounting portion rotatably mounted on the case so as to make a planetary motion with the revolution of the case, and a mounting shaft of the substrate mounting portion. A water supply body is provided surrounding the water supply body, the water supply body is fixed to the case, and an upper union is attached to the center of the case. The water supply body and the upper union are connected to the inflow passage and the outflow passage, There is provided a substrate mounting stage in which a lower union fixed to a frame is rotatably connected, and cooling water is directly circulated to the substrate mounting portion through a water supply pipe and a drain pipe connected to the lower union. Is achieved.

【0007】[0007]

【作用】上記ケースが公転すると、該ケースに固定した
給水ボディは公転し、上部ユニオンもケースの中央で一
緒に回転する。上記基板取付部は、取付軸が上記給水ボ
ディに取り囲まれた状態で自転、公転する。上記上部ユ
ニオンに回転可能に接続した下部ユニオンから冷却水が
供給されると、冷却水は上記上部ユニオン及び給水ボデ
ィを介し上記取付軸に流れ、上記基板取付部内を流通
し、その後、給水ボディ及び上部ユニオンを介して下部
ユニオンから排水される。
When the case revolves, the water supply body fixed to the case revolves and the upper union also rotates together at the center of the case. The board mounting portion rotates and revolves with the mounting shaft surrounded by the water supply body. When cooling water is supplied from the lower union rotatably connected to the upper union, the cooling water flows to the mounting shaft through the upper union and the water supply body, flows in the board mounting portion, and then the water supply body and Drains from the lower union via the upper union.

【0008】[0008]

【実施例】以下実施例と共に詳述する。本発明の基板取
付用ステージの駆動源やフレーム等の構成は、図2に示
した従来の装置と基本的に同様であるので、同一付号を
付してその説明は省略する。図1は、本発明の要部を示
し、真空チャンバ内に設けられるフレーム(4)には、
絶縁ワッシャ(18)及び絶縁フランジ(19)を介し
て磁気シールの内輪(20)が取付けられ、該磁気シー
ルの内輪(20)の上部には太陽歯車(21)と下部ユ
ニオン(22)が取付けられている。該下部ユニオン
(22)には、チャンバ外に通じる給水管(23)と排
水管(24)にそれぞれ連通するよう流入路(25)及
び流出路(26)が形成され、先端に流入路(25)の
流入管(27)が突出し、該流入管(27)の周囲には
流出路(26)の流出管(28)が設けられている。
Embodiments will be described in detail below with reference to embodiments. The structure of the drive source, frame, etc. of the substrate mounting stage of the present invention is basically the same as that of the conventional device shown in FIG. FIG. 1 shows an essential part of the present invention, in which a frame (4) provided in a vacuum chamber includes:
An inner ring (20) of the magnetic seal is attached through an insulating washer (18) and an insulating flange (19), and a sun gear (21) and a lower union (22) are attached to the upper part of the inner ring (20) of the magnetic seal. Has been. An inflow passage (25) and an outflow passage (26) are formed in the lower union (22) so as to respectively communicate with a water supply pipe (23) and a drain pipe (24) communicating with the outside of the chamber, and an inflow passage (25) is formed at a tip thereof. The inflow pipe (27) of () is projected, and the outflow pipe (28) of the outflow passage (26) is provided around the inflow pipe (27).

【0009】上記磁気シールの内輪(20)の周囲に
は、磁気シールのフランジ付外輪(29)が回転可能に
設けられ、該磁気シールの外輪(29)には絶縁ワッシ
ャ(30)及び絶縁スペーサ(31)を介してスプロケ
ット(9)が固定して取付けられ、また該磁気シールの
フランジ付外輪(29)の上部にはケース(5)が固定
されている。上述したように、上記スプロケット(9)
は、チェーン(8)を介して真空チャンバ(1)外のモ
ータ(7)に連絡し、該モータ(7)により上記ケース
(5)は公転する。
A flanged outer ring (29) of the magnetic seal is rotatably provided around the inner ring (20) of the magnetic seal, and an insulating washer (30) and an insulating spacer are attached to the outer ring (29) of the magnetic seal. The sprocket (9) is fixedly mounted via (31), and the case (5) is fixed to the upper part of the flanged outer ring (29) of the magnetic seal. As mentioned above, the sprocket (9).
Communicates with a motor (7) outside the vacuum chamber (1) via a chain (8), and the case (5) revolves around the motor (7).

【0010】上記ケース(5)の上面にはトップベース
(32)が設けけられ、該トップベース(32)の表面
には、図示を省略したビームのシールド板が設けられ
る。該トップベース(32)の中央部には上部ユニオン
(33)が取付けられている。該上部ユニオン(33)
は、上記下部ユニオン(22)の流入管(27)及び流
出管(28)が回転可能に係合し、上記下部ユニオン
(22)の流入路(25)に連通する流出路(34)及
び上記下部ユニオン(22)の流出路(26)に連通す
る流入路(35)を有している。上記流入管(27)及
び流出管(28)の周囲には、ロリング、オイルシール
(36)等を設けて、シールしてあり、上部ユニオン
(33)の下面には板(37)が取付けられている。
A top base (32) is provided on the upper surface of the case (5), and a beam shield plate (not shown) is provided on the surface of the top base (32). An upper union (33) is attached to the center of the top base (32). The upper union (33)
Includes an outflow passage (34) communicating with an inflow passage (25) of the lower union (22) and an inflow pipe (27) and an outflow pipe (28) of the lower union (22) rotatably engaged with each other. It has an inflow channel (35) communicating with the outflow channel (26) of the lower union (22). Around the inflow pipe (27) and the outflow pipe (28), a rolling, an oil seal (36) and the like are provided and sealed, and a plate (37) is attached to the lower surface of the upper union (33). ing.

【0011】基板取付部(6)は、上記ケース(5)の
トップベース(32)の周囲に複数個所設けられてい
る。該基板取付部(6)は、図示を省略した基板(ウェ
ーハ)を支持するトップ部(38)と該トップ部(3
8)の下方に取付けた取付軸(39)を具備し、該取付
軸(39)の下端には上記太陽歯車(21)に係合する
よう遊星歯車(40)が設けられ、磁気シールの内輪
(41)及びこれと回転自在に組合わせた磁気シールの
外輪(42)を介し上記トップベース(32)に回転可
能に取付けられている。
A plurality of board mounting portions (6) are provided around the top base (32) of the case (5). The substrate mounting portion (6) includes a top portion (38) for supporting a substrate (wafer) (not shown) and the top portion (3).
8) is provided with a mounting shaft (39) mounted below, and a planetary gear (40) is provided at a lower end of the mounting shaft (39) so as to engage with the sun gear (21), and an inner ring of the magnetic seal is provided. (41) and a magnetic seal outer ring (42) rotatably combined therewith, are rotatably attached to the top base (32).

【0012】上記基板取付部(6)のトップ部(38)
及び取付軸(39)は、中空に形成され、該中空部分に
冷却水の流路(43)を形成するよう分水管(44)が
内装されている。該分水管(44)は、中央から入った
冷却水を周囲に流出させるよう上下にフランジ(4
5)、(46)を有し、下端のフランジ(46)は取付
軸(39)の中空部に内接し、該内接部の上下の取付軸
(39)には孔(47)、(48)が開口されている。
The top portion (38) of the board mounting portion (6)
The mounting shaft (39) is hollow, and the water diversion pipe (44) is internally provided in the hollow portion so as to form the cooling water passage (43). The diversion pipe (44) is provided with a flange (4
5) and (46), the lower end flange (46) is inscribed in the hollow portion of the mounting shaft (39), and holes (47), (48) are provided in the mounting shaft (39) above and below the inscribed portion. ) Is opened.

【0013】オイルシール(49)、(50)を介して
回転可能に上記取付軸(39)を取り囲むよう給水ボデ
ィ(51)が上記磁気シールの外輪(42)の下部に取
付けられている。上記オイルシール(49)、(50)
間には、上記分水管(44)の下端のフランジ(46)
に対応する位置に仕切板(52)が設けられており、上
記給水ボディ(51)には該仕切板(52)の一側に開
口する流入路(53)と他側に開口する流出路(54)
が形成され、各流入路(53)と流出路(54)は上記
孔(47)、(48)を介して上記取付軸(39)の流
路(43)と連通している。
A water supply body (51) is attached to a lower portion of the outer ring (42) of the magnetic seal so as to rotatably surround the attachment shaft (39) via oil seals (49) and (50). The oil seals (49), (50)
Between the flanges (46) at the lower end of the diversion pipe (44)
A partition plate (52) is provided at a position corresponding to the partition plate (52), and the water supply body (51) has an inflow passage (53) opening to one side of the partition plate (52) and an outflow passage (53) opening to the other side. 54)
The inflow passage (53) and the outflow passage (54) communicate with the flow passage (43) of the mounting shaft (39) through the holes (47) and (48).

【0014】上記給水ボディ(51)の流入路(53)
と流出路(54)は、配管(55)、(56)により上
記上部ユニオン(33)の流出路(34)と流入路(3
5)に連通している。なお、これらの配管(54)、
(55)は、複数の基板取付部(6)…に設けた給水ボ
ディ(51)…を次々と直列につないで最初と最後を上
記上部ユニットに接続するようにしてある。
Inflow channel (53) of the water supply body (51)
The outflow passage (54) and the outflow passage (54) are connected to the outflow passage (34) and the inflow passage (3) of the upper union (33) by the pipes (55) and (56).
It communicates with 5). In addition, these pipes (54),
In (55), the water supply bodies (51) provided on the plurality of board mounting portions (6) are connected in series one after another so that the first and last parts are connected to the upper unit.

【0015】上記給水ボディ(51)の下端と上記遊星
歯車(40)の間には軸受(57)を設けてあり、また
レールを要求される部分には適所にOリングを設けてあ
る。なお、上記オイルシール、磁気シール等は適宜のシ
ール部材に代えることもできる。
A bearing (57) is provided between the lower end of the water supply body (51) and the planetary gear (40), and an O-ring is provided at an appropriate position where a rail is required. The oil seal, magnetic seal and the like may be replaced with an appropriate seal member.

【0016】而して、上記ケース(5)がチャンバ外に
設けたモータ(7)により回転すると、上記基板取付部
(6)は遊星歯車(40)と太陽歯車(21)により自
転および公転の遊星運動をするが、該基板取付部(6)
の取付軸(39)を取り囲む給水ボディ(51)と上部
ユニオン(33)はケース(5)と一緒に回転している
ので、相対位置は変らない。したがって、上記上部ユニ
オン(33)に下部ユニオン(22)から冷却水を供給
すると、冷却水は上部ユニオン(33)及び給水ボディ
(51)を介して上記取付軸(39)に給水され、基板
取付部(6)内の流路(43)を循環して該基板取付部
を直接冷却し、その後給水ボディ(51)及び上部ユニ
オン(33)を介して下部ユニオン(22)に戻り、チ
ャンバ外へ排水される。
When the case (5) is rotated by the motor (7) provided outside the chamber, the substrate mounting portion (6) is rotated and revolved by the planetary gear (40) and the sun gear (21). It makes a planetary motion, but the board mounting part (6)
Since the water supply body (51) surrounding the mounting shaft (39) and the upper union (33) rotate together with the case (5), their relative positions do not change. Therefore, when cooling water is supplied to the upper union (33) from the lower union (22), the cooling water is supplied to the mounting shaft (39) through the upper union (33) and the water supply body (51) to mount the board. The substrate mounting part is directly cooled by circulating the flow path (43) in the part (6), and then returns to the lower union (22) through the water supply body (51) and the upper union (33) and goes out of the chamber. Be drained.

【0017】[0017]

【発明の効果】本発明は上記ように構成され、チャンバ
内でそれぞれ個々に自転、公転する基板の取付部を直接
冷却して冷却効果を高めることができるので、イオンビ
ームエッチング等のように特に発熱が大きい処理を行う
際に基板の温度上昇を防ぐことができ、また長時間のエ
ッチング処理等を行うことが可能になり、作業効率を高
めることができ、その上従来の基板取付用ステージに置
換えできるから、現存のイオンビームエッチング装置等
をそのまま利用でき、経済的である。
The present invention is configured as described above, and since the cooling effect can be enhanced by directly cooling the mounting portions of the substrates that individually rotate and revolve in the chamber, the cooling effect can be increased particularly in ion beam etching. It is possible to prevent the temperature rise of the substrate when performing a process that generates a large amount of heat, and it is possible to perform a long-time etching process, etc., which can improve work efficiency, and in addition to the conventional substrate mounting stage. Since it can be replaced, the existing ion beam etching apparatus or the like can be used as it is, which is economical.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す一部の断面図。FIG. 1 is a partial sectional view showing an embodiment of the present invention.

【図2】基板取付用ステージを使用するイオンビームエ
ッチング装置等の説明図。
FIG. 2 is an explanatory view of an ion beam etching apparatus or the like that uses a substrate mounting stage.

【図3】従来の基板取付用ステージの一部の断面図。FIG. 3 is a partial cross-sectional view of a conventional substrate mounting stage.

【符合の説明】 A…基板取付用ステージ 1…真空チャンバ 4…フレーム 5…ケース 6…基板取付部 9…スプロケット 21…太陽歯車 22…下部ユニオン 32…トップベース 33…上部ユニオン 39…取付軸 40…遊星歯車 43…流路 51…給水ボディ[Description of References] A ... Substrate mounting stage 1 ... Vacuum chamber 4 ... Frame 5 ... Case 6 ... Substrate mounting portion 9 ... Sprocket 21 ... Sun gear 22 ... Lower union 32 ... Top base 33 ... Upper union 39 ... Mounting shaft 40 … Planetary gear 43… Flow path 51… Water supply body

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 チャンバ(1)内に形成したフレーム
(4)上にチャンバ外の駆動源により公転するようケー
ス(5)を設け、該ケース(5)の上部に基板を支持す
る基板取付部(6)を回転可能に設け、上記ケース
(5)が公転した際、上記基板取付部(6)が遊星運動
するよう上記基板取付部(6)の取付軸(39)の下端
に遊星歯車(40)を設けると共に、上記ケース(5)
中央部の上記フレーム(4)に該遊星歯車(40)に係
合する太陽歯車(21)を固定し、該ケース(5)のほ
ぼ中央位置に相当するフレーム(4)にチャンバ外に通
じる給水管(23)と排水管(24)を設け、フレーム
(4)にはまた該給水管(23)と排水管(24)にそ
れぞれ連通する流入路(25)と流出路(26)を有す
る下部ユニオン(22)を固設し、該下部ユニオン(2
2)の該流出路(25)及び流出路(26)にそれぞれ
連通する流入路(35)及び流出路(34)を有しかつ
該下部ユニオン(22)に回転可能に接続する上部ユニ
オン(33)を上記ケース(5)のトップベース(3
2)の中央部に取付け、一方上記取付軸(39)を通し
て上記基板取付部(6)内を流れる流路(43)を形成
し、該取付軸(39)の該流路(43)に連通する流入
路(53)及び流出路(54)を有しかつ該取付軸(3
9)に回転可能に係合する給水ボディ(51)を上記ケ
ース(5)に固定して取付け、該給水ボディ(51)の
該流入路(53)及び流出路(54)を上記上部ユニオ
ン(33)の上記流入路(35)及び流出路(34)に
配管で連通し、上記チャンバー(1)の外部から上記基
板取付部(6)に冷却水を直接循環させるようにしたこ
とを特徴とする基板取付用ステージ。
1. A substrate mounting portion for supporting a substrate on a frame (4) formed in the chamber (1) so as to be revolved by a driving source outside the chamber and supporting the substrate on the upper part of the case (5). (6) is rotatably provided, and when the case (5) revolves, a planetary gear () is attached to the lower end of the mounting shaft (39) of the board mounting part (6) so that the board mounting part (6) makes a planetary motion. 40) and the above case (5)
A sun gear (21) that engages with the planetary gear (40) is fixed to the frame (4) in the central portion, and water is communicated to the outside of the chamber in the frame (4) corresponding to approximately the central position of the case (5). A pipe (23) and a drainage pipe (24) are provided, and the frame (4) also has an inflow passage (25) and an outflow passage (26) communicating with the water supply pipe (23) and the drainage pipe (24), respectively. The union (22) is fixed, and the lower union (2
An upper union (33) having an inflow path (35) and an outflow path (34) communicating with the outflow path (25) and the outflow path (26) of 2) and rotatably connected to the lower union (22). ) Is the top base (3) of the above case (5)
2) is attached to the central portion of the mounting shaft (39), and a flow path (43) that flows through the mounting shaft (39) in the board mounting portion (6) is formed and communicates with the flow path (43) of the mounting shaft (39). Has an inflow passage (53) and an outflow passage (54) for
9) A water supply body (51) rotatably engaged with the water supply body (51) is fixedly attached to the case (5), and the inflow path (53) and the outflow path (54) of the water supply body (51) are connected to the upper union (5). 33) The cooling water is directly circulated from the outside of the chamber (1) to the substrate mounting portion (6) by communicating with the inflow path (35) and the outflow path (34) of 33) by a pipe. A substrate mounting stage.
JP6853595A 1995-02-19 1995-02-19 Substrate fitting stage Pending JPH08215971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6853595A JPH08215971A (en) 1995-02-19 1995-02-19 Substrate fitting stage

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6853595A JPH08215971A (en) 1995-02-19 1995-02-19 Substrate fitting stage

Publications (1)

Publication Number Publication Date
JPH08215971A true JPH08215971A (en) 1996-08-27

Family

ID=13376539

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6853595A Pending JPH08215971A (en) 1995-02-19 1995-02-19 Substrate fitting stage

Country Status (1)

Country Link
JP (1) JPH08215971A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110180001A1 (en) * 2010-01-26 2011-07-28 Japan Pionics Co., Ltd. Vapor phase epitaxy apparatus of group iii nitride semiconductor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110180001A1 (en) * 2010-01-26 2011-07-28 Japan Pionics Co., Ltd. Vapor phase epitaxy apparatus of group iii nitride semiconductor
US8679254B2 (en) * 2010-01-26 2014-03-25 Japan Pionics Co., Ltd. Vapor phase epitaxy apparatus of group III nitride semiconductor

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