JP2018142616A - Wafer processing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer processing device that can reduce costs by simplifying equipment and reducing water consumptions and can downsize the equipment and simplify temperature adjustment.SOLUTION: The wafer processing device comprises: a shaft-like inner case 21 that rotates together with a rotary shaft 8 in a wafer chuck part 12 for chucking a wafer; a cylindrical outer case 23 that has an annular communication space 22 provided between the inner case 21 and the outer case and is arranged concentrically with the inner case 21 to cover an outer peripheral surface of the inner case 21; and a rotary joint 9 which has a first fluid passage 31, communicated with the annular communication space 22 through the outer case 23, which supplies cooling water E for adjusting temperatures, from outside of the outer case 23 into the annular communication space 22, and a second fluid passage 18 which supplies the cooling water E supplied into the annular communication space 22 to a wafer chuck part 12 through the inner case 21.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a wafer processing apparatus, and more particularly to a wafer processing apparatus used for grinding a back surface of a semiconductor wafer in a semiconductor wafer manufacturing process or polishing a surface of a semiconductor wafer.

  For example, a surface grinding apparatus is used in a processing step of grinding the back surface of a semiconductor wafer (hereinafter referred to as “wafer”) (see, for example, Patent Document 1).

  FIG. 4 is a plan view showing an example of a conventional wafer processing apparatus, that is, a surface grinding apparatus. As shown in FIG. 4, the surface grinding apparatus 100 includes a chuck table 101 and a cup wheel type grindstone 102. The chuck table 101 sucks and holds the surface of the wafer W, and the grindstone 102 is placed on the back surface of the wafer W. While pressing, the chuck table 101 and the grindstone 102 are rotated in the direction of the arrow while supplying the grinding liquid between the wafer W and the grindstone 102, and further, the grindstone 102 is slid on the back surface of the wafer W for grinding. ing.

  In addition, during grinding by the surface grinding apparatus 100, the wafer W is prevented from reaching a predetermined temperature or higher by the grinding liquid supplied between the grindstone 102 and the wafer W and the temperature adjustment of the chuck table 101. Here, temperature adjustment of the chuck table 101 is performed by introducing water or gas for temperature adjustment from the outside into the suction pad portion of the rotating chuck table 101, and the back surface side of the suction pad portion by the introduced water or gas. Is heated or cooled to adjust the entire temperature of the suction pad portion to about 23 ° C.

  Therefore, in such a chuck table 101 of the surface grinding apparatus 100, it is necessary to supply water or gas from the outside to the rotating chuck table 101. Therefore, in the conventional surface grinding apparatus 100, a rotary joint is used as a connecting means for supplying water or gas to the chuck table 101 from the outside.

  5 and 6 show an example of the structure of the chuck table 101 using the conventional rotary joint 103. FIG. 5 is a schematic sectional view of the chuck table 101, and FIG. There is a figure.

  As shown in FIG. 6, the chuck table 101 mainly rotates on the rotation main body 111 supported by the support 110 of the apparatus main body, on the same rotation axis O as the rotation main body 111, and rotates integrally with the rotation main body 111. A rotating shaft 108, a wafer chuck portion 112 attached to one end (upper end) side of the rotating shaft 108 so as to be integrally rotatable, and a pulley 113 attached to the other end (lower end) side of the rotating shaft 108 so as to be integrally rotatable. And a rotary joint 103 disposed concentrically with the rotating main body 111 below the pulley 113.

  The rotation main body 111 is rotatably supported by a support 110 that can move in the vertical direction via a bearing 114.

  The pulley 113 is power-coupled via a transmission belt 117 and a pulley 116 attached to an output shaft 115a of a motor 115 disposed on the support portion 110 so as to be integrally rotatable. When the motor 115 is driven to rotate, the rotation of the motor 115 is transmitted to the pulley 113 via the output shaft 115a, the pulley 116, and the transmission belt 117. With this rotation, the rotation shaft 108, the rotation main body 111, the wafer chuck is transmitted. The part 112 is also rotated integrally.

  The rotary joint 103 includes an inner case 121 that rotates integrally with the rotation shaft 108, an outer case 123 that is fixed to the inner case 121 so as not to rotate, and an annular gap between the inner case 121 and the outer case 123. That is, a bearing 124 or the like as a pair of upper and lower bearings that provide the annular communication space 122 and rotatably hold the outer case 123 with respect to the inner case 121 is provided.

  The rotating shaft 108 has a cooling water passage 118 for supplying cooling water (chiller water) D to the chuck main body 112a, and an air Va for detachably sucking and holding the unprocessed wafer on the suction pad 112b from the outside. An air passage 119 for suction. One end side of the cooling water passage 118 is openly connected to the cooling water intake hole 127 of the rotary joint 103, and one end side of the air passage 119 is openly connected to the air suction hole 134 of the rotary joint 103.

  Further, the cooling water intake hole 127 and the air suction hole 134 alternately form an annular rotary seal 125 attached to the inner case 121 so as to be integrally rotatable and an annular fixed seal 126 attached to the outer case 123 so as not to rotate. The annular communication space 122 is divided into a plurality of independent spaces juxtaposed in the axial direction by being densely arranged in the axial direction so as to open into different annular communication spaces therein. Is formed. Accordingly, when the rotary seal 125 rotates with respect to the fixed seal 126, the rotary seal 125 rotates while rubbing against the fixed seal 126, and frictional heat is generated between the fixed seal 126 and the rotary seal 125, The inside of the rotary joint 103 becomes hot. Therefore, cooling water (quenching water) C is allowed to flow in the rotary joint 103 in order to prevent the temperature inside the rotary joint 103 from rising more than necessary due to frictional heat.

  That is, in FIGS. 5 and 6, the cooling water C flows into the annular communication space 122 between the inner case 121 and the outer case 123 from the cooling water intake hole 129 and is discharged through the cooling water discharge hole 130. Thus, the inside of the rotary joint 103 is cooled to prevent the temperature inside the rotary joint 103 from rising more than necessary due to frictional heat.

JP-A-11-309664

  However, in the surface grinding apparatus 100 as the conventional wafer processing apparatus shown in FIGS. 5 and 6, the cooling water D flows through the wafer chuck portion 112 and the temperature of the wafer chuck portion 112 fluctuates more than necessary. The cooling water system (cooling water intake hole 127-cooling water passage 118) for the wafer chuck portion to be avoided and the cooling water C flowing in the rotary 9 will prevent the temperature of the rotary joint 103 from rising more than necessary. The cooling water system (cooling water intake hole 129 -annular communication space 122 -cooling water discharge hole 130) for the rotary joint to be avoided is provided independently. Therefore, a cooling water system temperature adjusting means for the wafer chuck portion and a cooling water temperature adjusting means for the rotary joint are separately required. As a result, the equipment becomes complicated and expensive, and there is a problem that the amount of water consumption is large, resulting in an increase in cost and the processing equipment itself being enlarged.

  In addition, since the temperature adjustment of the cooling water system for the wafer chuck part and the temperature adjustment of the cooling water system for the rotary joint are provided separately, for example, the temperature of the cooling water system for the wafer chuck part and the temperature of the cooling water system for the rotary joint are adjusted. When adjusting at the same time, it was necessary to adjust the temperature individually because there was no linkage with each cooling water system. For this reason, there existed a problem that temperature adjustment was troublesome.

  Therefore, the technology that should be solved to provide a wafer processing system that simplifies equipment, reduces water consumption, enables cost reduction, and enables equipment downsizing and temperature adjustment. The present invention aims to solve this problem.

  The present invention has been proposed to achieve the above object, and the invention according to claim 1 includes a shaft-like inner case rotating integrally with a wafer chuck portion for chucking a wafer, and the inner case. An annular communication space is provided, a tubular outer case is disposed concentrically with the inner case so as to cover an outer peripheral surface of the inner case, and communicates with the communication space through the outer case. A first fluid passage for supplying a fluid for adjusting temperature into the communication space from the outside of the case, and the fluid supplied into the annular communication space are supplied to the wafer chuck portion through the inner case. A wafer processing apparatus comprising a rotary joint having a second fluid passage.

  According to this configuration, the flow of the temperature adjusting fluid supplied to the annular communication space in the rotary joint through the first fluid passage takes away the temperature in the rotary joint, and the temperature in the rotary joint is more than necessary. Can be avoided in advance. In addition, the fluid whose temperature has been increased by removing the temperature in the rotary joint is supplied from the rotary joint to the wafer chuck portion, and the rotary joint and the wafer chuck portion are adjusted to substantially the same temperature. That is, the cooling water system for the rotary joint (first fluid passage) and the cooling water system for the wafer chuck portion (second fluid passage) are connected in series, and the cooling water system for the rotary joint and the cooling for the wafer chuck portion are connected. The rotary joint and the wafer chuck part are adjusted to substantially the same temperature by sequentially flowing through the water system. Therefore, it is not necessary to separately provide a cooling water system for the wafer chuck portion and a cooling water system for the rotary joint. This simplifies the equipment and enables miniaturization. Further, since the cooling water system water for the wafer chuck part and the cooling water system water for the rotary joint can be shared, water consumption can be reduced.

  According to a second aspect of the present invention, in the configuration of the first aspect, the wafer chuck portion includes a chuck main body portion and a suction pad portion for chucking and holding the wafer, and the fluid supplied to the wafer chuck portion is Provided is a wafer processing apparatus that is discharged from the peripheral surface of the chuck body.

  According to this configuration, the water that has passed through the cooling water system for the rotary joint and the cooling water system for the wafer chuck portion can be discharged from the peripheral surface of the chuck body portion.

According to a third aspect of the present invention, in the configuration according to the first or second aspect, the outer case has an annular fixed seal fixedly attached to an inner peripheral surface of the outer case. Having an annular rotary seal rotatably attached to the outer peripheral surface of the inner case with respect to the annular fixed seal;
A wafer processing apparatus is provided.

  According to this configuration, it is possible to seal the fluid leaking from the passage through which the fluid flows with the fixed seal and the rotary seal.

  According to a fourth aspect of the present invention, in the configuration according to the third aspect, in the rotary joint, a plurality of the fixed seals and the rotary seals are alternately arranged in series in the rotation axis O direction of the rotary joint, Provided is a wafer processing apparatus in which an annular communication space is divided into a plurality of annular communication spaces.

  According to this configuration, the annular communication space can be divided into a plurality of parts in the axial direction of the rotary joint.

  According to a fifth aspect of the present invention, in the configuration according to the fourth aspect, at least one of the plurality of communication spaces has a suction force for sucking and chucking the wafer to the suction pad portion of the wafer chuck portion. Provided is a wafer processing apparatus connected to an air passage hole provided from the outside.

  According to this configuration, the suction force for sucking and chucking the wafer to the suction pad of the work chuck portion can be supplied from the outside via the rotary joint.

  According to the invention, it is not necessary to separately provide a cooling water system for the wafer chuck portion and a cooling water system for the rotary joint, so that the facilities can be simplified and the size can be reduced. Further, since the water for the cooling water system for the wafer chuck portion and the water for the cooling water system for the rotary joint can be shared, the consumption of water can be reduced and the cost can be reduced.

It is a perspective view showing roughly the whole composition of the surface grinding device to which the wafer processing device of the present invention is applied. It is a schematic sectional drawing of the chuck table shown as one Example of the wafer processing apparatus of this invention. It is a principal part expanded sectional view of the chuck table shown in FIG. It is a top view which shows an example of the conventional surface grinding apparatus. It is a schematic sectional drawing of the chuck table shown in FIG. It is a principal part expanded sectional view of the chuck table shown in FIG.

  In order to achieve the object of simplifying the equipment, reducing the consumption of water and reducing the cost, and enabling the miniaturization of the equipment and the simplification of temperature adjustment, A shaft-shaped inner case that rotates integrally with the chucking wafer chuck portion, and an annular communication space between the inner case and the outer peripheral surface of the inner case are disposed concentrically with the inner case. A tubular outer case, a first fluid passage that communicates with the communication space through the outer case, and supplies a temperature adjusting fluid from the outside of the outer case to the communication space; This is realized by including a rotary joint having a second fluid passage for supplying the fluid supplied to the wafer chuck portion through the inner case.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same reference numerals are given to the same elements throughout the description of the embodiments. Further, in the following description, expressions indicating directions such as up and down and left and right are not absolute, and are appropriate when each part of the wafer processing apparatus of the present invention is depicted, Should change and be interpreted according to the change of posture.

  FIG. 1 is a plan view showing an example of a wafer processing apparatus according to the present invention, that is, a wafer surface grinding apparatus 1. A surface grinding apparatus 1 shown in FIG. 1 includes a chuck table 2 and a cup wheel type grindstone 3. The chuck table 2 sucks and holds the surface of the wafer W and presses the grindstone 3 against the back surface of the wafer W. The chuck table 2 and the grindstone 3 are each rotated in the direction of the arrow while supplying a grinding liquid between the wafer W and the grindstone 3, and the grindstone 3 is slid on the back surface of the wafer W for grinding. .

  Further, the surface grinding apparatus 1 also suppresses the wafer W from reaching a predetermined temperature or higher by grinding liquid supplied between the wafer W and the grindstone 3 and temperature adjustment of the chuck table 2 during grinding. . The temperature adjustment of the chuck table 2 here is also performed by introducing water or gas for temperature adjustment from the outside into the suction pad portion of the rotating chuck table 2, and the back side of the suction pad portion is moved by the introduced water or gas. It is adjusted by heating or cooling so that the entire temperature of the suction pad portion is about 23 ° C.

  Therefore, also in this surface grinding apparatus 1, the chuck table 2 uses a rotary joint to supply water or gas from the outside to the rotating chuck table 2.

  2 and 3 show one configuration example of the chuck table 2 which is a wafer processing apparatus using the rotary joint 9, FIG. 2 is a schematic sectional view of the chuck table 2, and FIG. It is a principal part expanded sectional view.

  As shown in FIG. 2, the chuck table 2 is mainly disposed on the rotary main body 11 supported by the support portion 10 of the apparatus main body, is coaxial with the rotary main body 11, and rotates integrally with the rotary main body 11. A rotating shaft 8, a wafer chuck portion 12 attached to one end (upper end) side of the rotating shaft 8 so as to be integrally rotatable, a pulley 13 attached to the other end (lower end) side of the rotating shaft 8 so as to be integrally rotatable, A rotary joint 9 disposed coaxially with the rotary body 11 is provided below the pulley 13.

  The rotating main body 11 is rotatably supported by a support 10 that can move in the vertical direction via a bearing 14.

  The pulley 13 is power-coupled via a transmission belt 17 and a pulley 16 attached to an output shaft 15 a of a motor 15 disposed on the support portion 10 so as to be integrally rotatable. When the motor 15 is driven to rotate, the rotation of the motor 15 is transmitted to the pulley 13 via the output shaft 15a, the pulley 16, and the transmission belt 17, and this rotation causes the rotation shaft 8, the rotation main body 11, and the wafer chuck. The part 12 also rotates integrally with the pulley 13.

  The rotary shaft 8 is provided with a cooling water passage hole 18a and an air passage hole 19a that are continuously penetrated from one end (upper end) side to the other end (lower end) side.

  The wafer chuck portion 12 includes a chuck body portion 12a formed in a disk shape, and a suction pad portion 12b provided on the upper surface side of the chuck body portion 12a.

  The chuck body 12a is provided with a cooling water passage hole 18b corresponding to the cooling water passage hole 18a of the rotating shaft 8, and an air passage hole 19b corresponding to the air passage hole 19a.

  One end side of the cooling water passage 18b communicates with one end side of a cooling mechanism (not shown) provided in the chuck body 12a for cooling the chuck body 12a and the suction pad 12b of the wafer chuck 12 respectively. . Note that the other end of the cooling mechanism communicating with the cooling water passage 18b is connected to a drain hole 20 opened in the peripheral surface of the chuck body 12a. Therefore, the cooling water (chiller water) E that has entered the cooling mechanism in the chuck main body 12a from the cooling water passage 18b passes through the cooling mechanism, and then from the drain hole 20, that is, from the peripheral surface of the chuck main body 12a. Water is drained to the outside of the wafer chuck portion 12.

  One end side of the air passage hole 19b communicates with the air passage hole 19a, and the other end side communicates with the suction pad portion 12b. The suction pad portion 12b has a porous plate having air permeability and communicates with a vacuum source such as a vacuum pump through air passage holes 19a and 19b. When the vacuum source is driven, the suction pad portion 12b is depressurized, and the target wafer W can be sucked and held on the upper surface of the porous plate, that is, the upper surface of the suction pad portion 12b.

  The rotary joint 9 includes an inner case 21 that rotates integrally with the rotary shaft 8, and an outer case 23 that covers the outer peripheral surface of the inner case 21, is concentric with the inner case 21, and is non-rotatably fixed to the inner case 21. And a bearing 24 as a pair of upper and lower bearings provided with an annular gap, that is, an annular communication space 22 between the inner case 21 and the outer case 23 to hold the outer case 23 rotatably with respect to the inner case 21. Etc.

  The inner case 21 has a shaft shape, that is, a solid shaft having a circular cross section. The inner case 21 is integrally provided with a disk-shaped flange 21 a that connects and fixes the inner case 21 to the lower surface of the pulley 13 on the upper end side facing the lower surface of the pulley 13. The inner case 21 is provided with a cooling water passage hole 18c corresponding to the cooling water passage hole 18a of the rotary shaft 8, and an air passage hole 19c corresponding to the air passage hole 19a. .

  The annular communication space 22 alternately includes an annular rotary seal 25 fixed to the outer periphery of the inner case 21 and rotatable integrally with the inner case 21, and an annular fixed seal 26 fixed to the inner periphery of the outer case 23. The rotary joint 9 is divided into a plurality of (three in this embodiment) annular communication spaces 22a, 22b, and 22c arranged in series in the axial direction (direction along the rotation axis O) of the rotary joint 9. The rotary seal 25 and the fixed seal 26 are in close contact with each other, and the rotary seal 25 is disposed so as to be rotatable with respect to the fixed seal 26. Therefore, fluid and gas do not leak from between the annular communication spaces 22a, 22b, and 22c to the adjacent annular communication spaces.

  Among the annular communication spaces 22 a to 22 c, the annular communication spaces 22 a and 22 c are annular communication spaces for flowing cooling water (quenching / chiller water) E for cooling the rotary joint 9 and the wafer chuck portion 12. The annular communication space 22b is an annular communication space for flowing air Va for air suction.

  Further, the annular communication spaces 22a and 22c are connected by a bypass passage 22d provided in the outer case 23, and are formed as one annular communication space connected to each other in series. The annular communication spaces 22 a and 22 c are provided so as to wrap around the outer peripheral surface of the inner case 21.

  The outer case 23 has a cooling water intake hole 27 drilled from the outside to the annular communication space 22a and an air suction hole 28 drilled from the outside to the annular communication space 22b. A cooling water supply pipe 29 is connected to the cooling water intake hole 27, and a vacuum pipe 30 is connected to the air suction hole 28. Further, although not shown, the cooling water supply pipe 29 is connected to a cooling water storage tank as a cooling water source via a cooling water supply pump, and the vacuum pipe 30 is connected to a vacuum source (not shown). Here, the cooling water supply pipe 29 and the cooling water intake hole 27 constitute a first fluid passage 31 for supplying cooling water E for temperature adjustment from the outside of the outer case 23 into the annular communication spaces 22a and 22c. Yes.

  On the other hand, a second fluid passage formed in the inner case 21, that is, a passage for supplying the cooling water (fluid) E supplied into the annular communication spaces 22 a and 22 c to the wafer chuck portion 12 through the inner case 21. The formed cooling water passage 18 communicates with the annular communication space 22c.

  The vacuum pipe 30, the air suction hole 28, and the air passages 19 a, 19 b, 19 c constitute an air adsorption path 32. When the vacuum source is driven, the air suction path 32 depressurizes the suction surface of the suction pad portion 12b through the vacuum pipe 30, the air suction hole 28, the annular connection space 22b, and the air passage holes 19c, 19a, 19b. The wafer to be ground can be sucked (chucked) on the upper surface of the suction pad portion 12b.

  In the rotary joint 9, when the inner case 21 rotates with respect to the outer case 23, frictional heat is generated between the inner case 21 and the outer case 23 between the rotary seal 25 and the fixed seal 26. . However, this frictional heat is cooled by adjusting the temperature to, for example, about 20 ° C. by entering the rotary joint 9 from the cooling water intake hole 27 through the cooling water supply pipe 29 from the cooling water storage tank by driving the cooling water supply pump. Water E, that is, cooling water E supplied through the first fluid passage 31 can be removed. In the rotary joint 9, the entire rotary joint 9 is cooled at the portions of the annular communication spaces 22 a and 22 c that are connected in series with each other and are disposed in the axial direction so as to wrap around the inner surface of the internal gaze 21. . Further, the cooled cooling water takes the heat in the rotary joint 9 and is heated to about 23 ° C., and this is sent to the wafer chuck portion 12 through the cooling water passages 18c, 18a and 18b which are the second fluid passages. .

  Accordingly, at the locations of the annular communication spaces 22a and 22c, the inside of the rotary joint 9 is cooled by the flow of the cooling water E whose temperature is adjusted to 20 ° C., and the temperature is increased by taking the heat generation temperature of the rotary joint 9 The water E is supplied to the wafer chuck portion 12 and the temperature in the wafer chuck portion 12 is adjusted to substantially the same temperature as that of the rotary joint 9. Thereby, the temperature of the rotary joint 9 and the wafer chuck part 12 is always maintained at the same temperature, and the temperature adjustment of the wafer chuck part 12 is stabilized. The cooling water E that has passed through the cooling mechanism is discharged from the peripheral surface of the chuck main body 12 a through the drain hole 20.

  Next, the operation of the chuck table 2 configured as described above will be described. First, when the wafer W before grinding is moved onto the chuck table 2 by a moving mechanism (not shown), a vacuum source (not shown) attached to the chuck table 2 is operated, and the chuck table 2 is connected via the wafer suction path 39. The suction pad portion 12b is decompressed and the wafer before grinding is sucked and held on the upper surface of the suction pad 12b by the suction action of the upper surface of the suction pad 12b.

  Next, the grindstone 3 is moved downward by the moving mechanism, the grindstone 3 is pressed against the back surface of the wafer W, and the chuck table 2 and the grindstone 3 are rotated while supplying the grinding liquid between the wafer W and the grindstone 3. Further, grinding is performed by sliding the grindstone 3 on the back surface of the wafer W. In this state, the chuck table 2 and the grindstone 3 are each rotated in advance in the direction shown in FIG. A cooling water supply pump (not shown) is also operated.

  Then, by the operation of the cooling water supply pump, the cooling water E whose temperature has been adjusted to about 20 ° C. is supplied from the cooling water supply source to the first fluid passage 31, and friction generated in the rotary joint 9 by this cooling water E Heat is removed. Thereby, it is possible to prevent the temperature inside the rotary joint 9 from rising more than necessary due to frictional heat.

  Further, the cooling water E that has been cooled to about 23 ° C. by cooling the inside of the rotary joint 9 is supplied from the annular communication space 22 c to the second fluid passage 39, passes through the cooling mechanism in the wafer chuck portion 12, and then the chuck body. It drains from the outer peripheral surface of the part 12a. Thereby, it is possible to prevent the temperature of the wafer and the wafer chuck portion 12 from being increased more than necessary due to frictional heat.

  When the grinding is finished, the supply of the cooling water E is stopped. Thereafter, a moving mechanism (not shown) is operated to carry the wafer after the grinding process to the wafer storage position, and then the wafer chuck is released.

  Therefore, according to the chuck table 3 as the wafer processing apparatus according to the embodiment, the cooling water system (first fluid passage 31) for cooling the rotary joint 9 and the cooling water system (second fluid passage 18) for cooling the wafer chuck portion 12 are used. Are connected in series and sequentially flow through the cooling water system of the rotary joint 9 and the cooling water system of the wafer chuck portion 12 to adjust the rotary joint 9 and the wafer chuck portion 12 to appropriate temperatures, respectively. The cooling water system and the cooling water system of the rotary joint 9 need not be provided separately. This simplifies the equipment and enables miniaturization. Moreover, since the water of the cooling water system of the wafer chuck part 12 and the water of the cooling water system of the rotary joint 9 can be shared, water consumption can be reduced.

  Although the above embodiment has been described with respect to the case where the present invention is applied to the surface grinding apparatus 1, the present invention is not limited to the surface grinding apparatus, and the rotary joint 9 may be applied to a wafer surface polishing apparatus. That is, the wafer processing apparatus of the present invention includes a surface polishing apparatus.

  Further, the wafer processing apparatus of the present invention can be variously modified without departing from the spirit of the present invention, and the present invention naturally extends to the modified one.

DESCRIPTION OF SYMBOLS 1 Surface grinding apparatus 2 Chuck table 3 Grinding wheel 8 Rotating shaft 9 Rotary joint 10 Support part 11 Rotating main body part 12 Wafer chuck part 12a Chuck main body part 12b Suction pad part 13 Pulley 14 Bearing 15 Motor 15a Output shaft 16 Pulley 17 Transmission belt 18 Cooling Water passage (second fluid passage)
18a, 18b, 18c Cooling water passage holes 19a, 19b, 19c Air passage hole 20 Drain hole 21 Inner case 21a Flange 22 Annular communication space 22a, 22c Annular communication space 22b for cooling water Annular communication space 22d for air suction Bypass passage 23 External case 24 Bearing 25 Rotating seal 26 Fixed seal 27 Cooling water intake hole 28 Air suction hole 29 Cooling water supply pipe 30 Vacuum pipe 31 First fluid passage 32 Wafer suction path O Rotating axis A Arrow indicating the rotation direction of the chuck table B Arrow indicating the rotation direction of the grindstone C Cooling water (quenching water)
D Cooling water (chiller water)
E Cooling water (quenching chiller water)
Va Air

Claims (5)

A shaft-like inner case that rotates integrally with a wafer chuck portion for chucking the wafer;
A tubular outer case disposed concentrically with the inner case by providing an annular communication space between the inner case and covering an outer peripheral surface of the inner case;
A first fluid passage that communicates with the communication space through the outer case and supplies a temperature adjusting fluid from the outside of the outer case into the communication space;
A second fluid passage for supplying the fluid supplied into the communication space to the wafer chuck portion through the inner case;
A wafer processing apparatus, comprising: a rotary joint having:   The wafer chuck part includes a chuck body part and a suction pad part for chucking and holding the wafer, and the fluid supplied to the wafer chuck part is discharged from a peripheral surface of the chuck body part. The wafer processing apparatus according to claim 1. The outer case has an annular fixed seal fixedly attached to the inner peripheral surface of the outer case,
The inner case has an annular rotary seal that is rotatably attached to the outer peripheral surface of the inner case with respect to the annular fixed seal.
The wafer processing apparatus according to claim 1 or 2, wherein   The rotary joint is formed by alternately arranging a plurality of fixed seals and rotary seals in the axial direction of the rotary joint, and dividing the communication space into a plurality of annular communication spaces. The wafer processing apparatus according to claim 3. At least one of the plurality of communication spaces is connected to an air passage hole for applying a suction force for sucking and chucking the wafer to the suction pad portion of the wafer chuck portion from the outside. The wafer processing apparatus according to claim 4.