JPH08213525A - マイクロデバイス - Google Patents

マイクロデバイス

Info

Publication number
JPH08213525A
JPH08213525A JP7303406A JP30340695A JPH08213525A JP H08213525 A JPH08213525 A JP H08213525A JP 7303406 A JP7303406 A JP 7303406A JP 30340695 A JP30340695 A JP 30340695A JP H08213525 A JPH08213525 A JP H08213525A
Authority
JP
Japan
Prior art keywords
package body
microdevice
cooling fluid
integrated circuit
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7303406A
Other languages
English (en)
Japanese (ja)
Inventor
Kaveh Azar
アザー カヴェー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
AT&T Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AT&T Corp filed Critical AT&T Corp
Publication of JPH08213525A publication Critical patent/JPH08213525A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01019—Potassium [K]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12033—Gunn diode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP7303406A 1994-10-31 1995-10-30 マイクロデバイス Pending JPH08213525A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33222294A 1994-10-31 1994-10-31
US332222 1994-10-31

Publications (1)

Publication Number Publication Date
JPH08213525A true JPH08213525A (ja) 1996-08-20

Family

ID=23297264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7303406A Pending JPH08213525A (ja) 1994-10-31 1995-10-30 マイクロデバイス

Country Status (6)

Country Link
EP (1) EP0709884A2 (OSRAM)
JP (1) JPH08213525A (OSRAM)
KR (1) KR960016668A (OSRAM)
AU (1) AU3452895A (OSRAM)
CA (1) CA2160495A1 (OSRAM)
TW (1) TW278225B (OSRAM)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (ja) * 2003-03-27 2004-10-21 Stmicroelectronics Inc 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法
JP2013512422A (ja) * 2009-11-26 2013-04-11 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング センサモジュールおよびセンサモジュールの製造方法
JP2020004894A (ja) * 2018-06-29 2020-01-09 三菱重工業株式会社 半導体素子の冷却構造及び電子デバイスの冷却構造

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0768711A3 (en) * 1995-10-13 1998-07-08 AT&T Corp. Microelectronic package with device cooling
GB2313960A (en) * 1996-06-08 1997-12-10 Marconi Gec Ltd Heat sink including a cooling pipe having a planar section
US6891385B2 (en) 2001-12-27 2005-05-10 Formfactor, Inc. Probe card cooling assembly with direct cooling of active electronic components
US7064953B2 (en) 2001-12-27 2006-06-20 Formfactor, Inc. Electronic package with direct cooling of active electronic components
DK200301577A (da) * 2003-10-27 2005-04-28 Danfoss Silicon Power Gmbh Flowfordelingsenhed og köleenhed
US6992381B2 (en) 2003-10-31 2006-01-31 Intel Corporation Using external radiators with electroosmotic pumps for cooling integrated circuits
US7364684B2 (en) * 2004-08-16 2008-04-29 Delphi Technologies, Inc. Method of making an encapsulated microelectronic package having fluid carrying encapsulant channels
US7205653B2 (en) 2004-08-17 2007-04-17 Delphi Technologies, Inc. Fluid cooled encapsulated microelectronic package
EP2605345B1 (en) * 2011-12-13 2021-04-28 Alcatel Lucent Thermal management of photonics assemblies
US9961798B2 (en) 2013-04-04 2018-05-01 Infineon Technologies Austria Ag Package and a method of manufacturing the same
US9449895B2 (en) 2013-05-03 2016-09-20 Infineon Technologies Ag Cooling system for molded modules and corresponding manufacturing methods
US9613885B2 (en) 2015-03-03 2017-04-04 Infineon Technologies Ag Plastic cooler for semiconductor modules
CN114430642B (zh) * 2020-10-29 2024-12-10 春鸿电子科技(重庆)有限公司 液冷散热装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004297069A (ja) * 2003-03-27 2004-10-21 Stmicroelectronics Inc 露出されている集積回路ダイ表面の直接的対流冷却用のシステム及び方法
JP2013512422A (ja) * 2009-11-26 2013-04-11 コンチネンタル オートモーティヴ ゲゼルシャフト ミット ベシュレンクテル ハフツング センサモジュールおよびセンサモジュールの製造方法
JP2020004894A (ja) * 2018-06-29 2020-01-09 三菱重工業株式会社 半導体素子の冷却構造及び電子デバイスの冷却構造

Also Published As

Publication number Publication date
CA2160495A1 (en) 1996-05-01
TW278225B (OSRAM) 1996-06-11
AU3452895A (en) 1996-05-09
KR960016668A (ko) 1996-05-22
EP0709884A2 (en) 1996-05-01

Similar Documents

Publication Publication Date Title
US9013035B2 (en) Thermal improvement for hotspots on dies in integrated circuit packages
US6373703B2 (en) Integral design features for heatsink attach for electronic packages
US6265771B1 (en) Dual chip with heat sink
US7446408B2 (en) Semiconductor package with heat sink
US7196403B2 (en) Semiconductor package with heat spreader
JP2844316B2 (ja) 半導体装置およびその実装構造
US7759170B2 (en) Fabrication method of semiconductor package having heat dissipation device
KR100586698B1 (ko) 수직 실장된 반도체 칩 패키지를 갖는 반도체 모듈
US8053876B2 (en) Multi lead frame power package
US5783860A (en) Heat sink bonded to a die paddle having at least one aperture
JPH08213525A (ja) マイクロデバイス
US7372148B2 (en) Semiconductor chip having coolant path, semiconductor package and package cooling system using the same
US6700783B1 (en) Three-dimensional stacked heat spreader assembly for electronic package and method for assembling
CN101887886A (zh) 一种多芯片封装及制造方法
US6350634B2 (en) Semiconductor device having a built-in heat sink and process of manufacturing same
JP2593702B2 (ja) 半導体装置の製造方法
JPH09232473A (ja) 半導体パッケージとその製造方法およびプリント基板
US7560309B1 (en) Drop-in heat sink and exposed die-back for molded flip die package
US20250349680A1 (en) Lead-frame package with improved heat dissipation
JP2001352008A (ja) 半導体装置およびその製造方法
CN117673071A (zh) 芯片封装、芯片系统、芯片封装及芯片系统的形成方法
TW202543077A (zh) 具有冷卻系統的電子封裝組件及其形成方法
JPH11163229A (ja) 半導体装置およびその製造方法
CN120834100A (zh) 具有冷却系统的电子封装组件及其形成方法
JPH1187408A (ja) 半導体装置の製造方法