JPH08204489A - Piezoelectric vibrator - Google Patents

Abstract

PURPOSE: To easily manufacture the piezoelectric vibrator of improved characteristics and to improve productivity and reliability by fixing one end of a piezoelectric diaphragm at one point by an insulating adhesive material and connecting conductors by wire bonding. CONSTITUTION: One end of the long side of the piezoelectric diaphragm 2 and an opposing insulating substrate are fixed by the insulating adhesive material 3 at one part and the pull-out port of the electrode of the piezoelectric diaphragm 2 and the insulating substrate 1 are separately conducted by using the wire bonding 4 at two parts at the other end. The method can be used not only for the insulating substrate 1 but also for a ceramic case and a metallic case, etc., and the wire bonding on one side can be pulled from an opposite side. Instead of the method for simultaneously performing fixing and conduction by a conductive adhesive material, only one part of the piezoelectric diaphragm 2 is fixed to the insulating substrate 1 by the insulating adhesive material 3. As the other conduction is performed through the wire bonding 4, stress is hardly applied to the piezoelectric diaphragm 2. Thus, the characteristics themselves of the piezoelectric diaphragm 2 are without any incovenience demonstrated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric vibrator support and electrical connection structure.

[0002]

2. Description of the Related Art Conventionally, in a piezoelectric vibrator in which a piezoelectric vibrating plate is mounted on an insulating substrate, a method of fixing the piezoelectric vibrating plate on the insulating substrate for electrical continuity is to fix it using a conductive adhesive. It was common to carry out and conduction at the same time. Further, as a fixing method, it is general that both ends are fixed symmetrically in the longitudinal direction of the piezoelectric diaphragm.

[0003]

In the prior art, as a method of fixing a piezoelectric vibrating plate on an insulating substrate to make it conductive, it is general to use a conductive adhesive to perform fixing and conducting at the same time. However, 70% to 80% by weight of the conductive adhesive is a conductive substance, and the remaining 20% to 30% is the adhesive. Therefore, not only the adhesive strength of the adhesive is lowered, but also the conductivity is inferior to that of metal. Further, as for the method of fixing the piezoelectric vibrating plate, the method of fixing the both ends in the longitudinal direction of the piezoelectric vibrating plate can be easily fixed even with a conductive adhesive having a low adhesive force, while the piezoelectric vibrating plate and the insulating substrate are fixed. There is a problem that the characteristics of the piezoelectric vibrator are deteriorated because they are easily affected by the difference in linear expansion coefficient, bending, and other stress.

[0004]

As a method for fixing a piezoelectric vibrating plate to an insulating substrate, an insulating adhesive is used at one place, and two electrodes are wire-bonded for the conduction between the electrode of the piezoelectric vibrating plate and the conductor of the insulating substrate. Method is used. Further, as the method of fixing the piezoelectric vibrating plate, a method of fixing the piezoelectric vibrating plate only at one end of the piezoelectric vibrating plate was used.

[0005]

EXAMPLE In FIG. 1, one end of a long side of a piezoelectric vibrating plate 2 and an insulating substrate 1 facing each other are fixed with an insulating adhesive 3 at one place,
An example is shown in which the lead-out port of the electrode of the piezoelectric vibrating plate 2 and the electrical connection of the insulating substrate 1 are separated from each other at one end by using the wire bonding 4 at two places.

In FIG. 2, one end of the long side of the piezoelectric vibrating plate 2 and the insulating substrate 1 facing the long side are fixed to each other with an insulating adhesive 3 at one place, and the same end is connected to the lead-out port of the electrode of the piezoelectric vibrating plate 2. Separate the electrical connection of the insulating substrate 1 and wire bonding 4 at two locations.
An example is shown using In short, this is a type in which the fixing insulating adhesive 3 and the conducting wire bonding 4 are concentrated on one end of the long side of the piezoelectric vibrating plate 2, and the fixing insulating adhesive 3 has two wire bondings 4 at two locations.
An example is shown in which the insulating adhesive 3 is used in a place where neither the electrode of the piezoelectric vibrating plate 2 nor the conductor of the insulating substrate 1 contacts between them.

In FIGS. 1 and 2, the electrodes of the piezoelectric vibrating plate, the conductors of the insulating substrate, and the cover of the piezoelectric vibrator are omitted. Further, these methods can be applied not only to the insulating substrate but also to a ceramic case, a metal case, or the like. In addition, in FIG. 1 and FIG. 2, the two wire bonding wires for conduction are drawn out in the same direction, but not limited to this method. Wire bonding on one side is drawn out from the other side and drawn out to the diagonal line of the piezoelectric vibration plate. May

[0008]

As for the fixing structure, in the piezoelectric vibrator in which the piezoelectric vibrating plate is mounted on the insulating substrate, instead of the conventional method of simultaneously fixing and conducting with the conductive adhesive, the piezoelectric vibrating plate is replaced. Only adhere to the insulating substrate with insulating adhesive in only one place. Since other conduction is performed by wire bonding, almost no stress is applied to the piezoelectric diaphragm. For this reason, the characteristics of the piezoelectric diaphragm itself are exerted in a straightforward manner, so that it is possible to easily manufacture a piezoelectric vibrator having good characteristics, which not only improves productivity and reliability but also realizes cost reduction. .

[Brief description of drawings]

FIG. 1 is a front view showing a state in which an insulating adhesive is used for fixing, and wire bonding is used for conduction, separately from both ends of a long side of a piezoelectric diaphragm.

FIG. 2 is a front view showing a state in which an insulating adhesive is used for fixing, and wire bonding is used for conducting, separately from the wire bonding, and arranged on the same end of the piezoelectric diaphragm.

[Explanation of symbols]

 1 Insulating substrate 2 Piezoelectric diaphragm 3 Insulating adhesive 4 Wire bonding

Claims (3)

[Claims] 1. A piezoelectric vibrator having a piezoelectric vibration plate mounted on an insulating substrate, wherein a main surface of the piezoelectric vibration plate is mounted parallel to a surface of the insulating substrate, and one end of a long side of the piezoelectric vibration plate is mounted. The piezoelectric element is characterized in that the insulating substrate is fixed to the insulating substrate at one point with an insulating adhesive, and the connection between the lead-out port of the electrode of the piezoelectric diaphragm and the conductor of the insulating substrate is made by wire bonding. Oscillator. 2. A piezoelectric vibrating plate at the other end of the long side of the piezoelectric vibrating plate, wherein one end of the long side of the piezoelectric vibrating plate is fixed to the piezoelectric vibrating plate and the insulating substrate with the insulating adhesive. 2. The piezoelectric vibrator according to claim 1, wherein the lead-out ports of the electrodes and the conductors of the insulating substrate are connected to each other by wire bonding. 3. The piezoelectric vibrating plate is fixed to one end of a long side thereof and the piezoelectric vibrating plate and the insulating substrate with the insulating adhesive, and the piezoelectric vibration at the same end of the long side of the piezoelectric vibrating plate. 2. The piezoelectric vibrator according to claim 1, wherein the lead-out ports of the electrodes and the conductors of the insulating substrate are connected to each other at two positions of the plate by wire bonding.