JPH0681137U - Piezoelectric vibrator - Google Patents

Abstract

(57) [Summary] [Objective] The object of the present invention is to make it possible to inexpensively manufacture a piezoelectric vibrator having a simple structure, good characteristics, and high reliability. [Structure] To separate the piezoelectric diaphragm from the insulating substrate,
By using the thickness of the insulating adhesive that fixes the piezoelectric vibration plate to the insulating substrate, the base and the recess are omitted. As for the fixing method, fixing and conduction are separated. For fixing, firmly fixing is performed using an insulating adhesive, and for conducting, connection is performed with a conductive adhesive or wire bonding. Further, as a method of fixing the piezoelectric vibrating plate, a method of fixing and conducting only the short side of one end of the long side shape of the piezoelectric vibrating plate was used.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a support structure for a piezoelectric vibrator.

[0002]

[Prior art]

 Conventionally, in a piezoelectric vibrator in which a piezoelectric vibrating plate is mounted on an insulating substrate, as a method of maintaining a gap between the piezoelectric vibrating plate and the insulating substrate, a vibrating main part is placed on the base part on which the piezoelectric vibrating plate is placed It was common to provide a recess so as not to contact. In addition, as a method of fixing the piezoelectric vibrating plate on the insulating substrate to establish conduction, it is common to use a conductive adhesive to simultaneously perform fixing and conduction. Further, as a fixing method, it is general that both ends are fixed symmetrically in the longitudinal direction of the piezoelectric diaphragm.

[0003]

[Problems to be solved by the device]

 In the conventional technology, the structure becomes complicated and it is not possible to make the structure inexpensive if a pedestal to which the piezoelectric diaphragm is attached is provided to separate the piezoelectric diaphragm from the insulating substrate, or if a recess is provided in the insulating substrate. There is a problem that the piezoelectric vibrator cannot be made thin without it. Regarding the fixing method, in the conductive adhesive, 70 to 80% by weight is the conductive substance, and the remaining 20 to 30% is the adhesive. Therefore, there is a problem that the adhesive strength of the adhesive is lowered. In addition, the method of fixing the piezoelectric diaphragm in such a way that both ends in the longitudinal direction of the piezoelectric diaphragm can be easily fixed even with a conductive adhesive that does not have strong adhesive force, while it has an insulation property with the piezoelectric diaphragm. There is a problem that the characteristics of the piezoelectric vibrator are deteriorated because they are easily affected by the difference in linear expansion coefficient from the substrate, bending, and other stress.

[0004]

[Means for solving the problem]

 In order to separate the piezoelectric vibrating plate 2 from the insulating substrate 1, the thickness of the insulating adhesive 3 that fixes the piezoelectric vibrating plate 2 to the insulating substrate 1 is used, and the pedestal and the recess are omitted. As for the fixing method, fixing and conduction are separated. For fixing, the insulating adhesive 3 is used to firmly fix, and for conduction, the conductive adhesive 4 or wire bonding is used for connection. Furthermore, as the method of fixing the piezoelectric diaphragm, a method of fixing and conducting only at one end of the piezoelectric diaphragm was used.

[0005]

【Example】

 As shown in FIG. 1, in a piezoelectric vibrator in which a piezoelectric vibrating plate is mounted on an insulating substrate, one end of the piezoelectric vibrating plate is fixed to an insulating substrate facing with an insulating adhesive. At this time, in order to form a gap between the insulating substrate and the piezoelectric diaphragm, the insulating substrate is not formed with a base or a recess for mounting the piezoelectric diaphragm, and the thickness of the insulating adhesive is used. This eliminates the need to provide a base or recess on the insulating substrate, so the insulating substrate has a simple structure called a flat plate, which not only makes it cheaper but also allows the piezoelectric vibrator to be made thinner. done.

Regarding the fixing method, in the piezoelectric vibrator in which the piezoelectric vibration plate is mounted on the insulating substrate, instead of the conventional method of simultaneously fixing and conducting with a conductive adhesive, one end of the piezoelectric vibration plate is replaced. And an insulative substrate opposite to that are fixed to each other with an insulative adhesive. At this time, since the adhesive is insulating, it can be used for bonding over the entire width of the piezoelectric vibrating plate regardless of the conductor of the insulating substrate or the electrode of the piezoelectric vibrating plate, and the bonding can be made firm. Regarding electrical continuity, since it is sufficient if electrical continuity can be established and strength is not required, the electrodes of the piezoelectric vibrating plate and the conductors of the insulating substrate are connected to each other with a conductive adhesive or wire bonding.

Further, as shown in FIG. 2, in the method of fixing the piezoelectric vibrating plate, the fixing and the conduction are concentrated at one end of the piezoelectric vibrating plate. This prevents the stress of distortion such as the difference in linear expansion coefficient between the piezoelectric diaphragm and the insulating substrate and the bending of the insulating substrate from affecting the piezoelectric diaphragm and damaging the original characteristics of the piezoelectric diaphragm. FIG. 2 is a view taken along the line A-A ′ in FIG. 1.

In the figure, the electrodes of the piezoelectric vibrating plate, the conductors of the insulating substrate, and the cover of the piezoelectric vibrator are omitted. Moreover, the figure showing the wire bonding given as an example of conduction is also omitted.

[0009]

[Effect of device]

 In order to separate the piezoelectric vibrating plate from the insulating substrate, the thickness of the insulating adhesive that fixes the piezoelectric vibrating plate to the insulating substrate is used, and the pedestal and the recess are omitted. For this reason, not only could the insulating plate structure be a simple structure called a flat plate, but also the piezoelectric vibrator could be made thin. As for the fixing method, fixing and conduction are separated. A highly reliable piezoelectric vibrator could be realized by firmly fixing it with an insulating adhesive and connecting it with a conductive adhesive or wire bonding for conduction. Furthermore, by fixing the piezoelectric vibrating plate only by one end of the piezoelectric vibrating plate, the stress related to the piezoelectric vibrating plate can be reduced as much as possible and the original characteristics of the piezoelectric vibrating plate can be exhibited.

[Brief description of drawings]

FIG. 1 is a perspective view showing a state where a piezoelectric vibration plate is mounted on an insulating substrate.

FIG. 2 is a cross-sectional view showing a state where a piezoelectric vibrating plate is mounted on an insulating substrate.

[Explanation of symbols]

 1 Insulating Substrate 2 Piezoelectric Vibration Plate 3 Insulating Adhesive 4 Conductive Adhesive

Claims (2)

[Scope of utility model registration request] 1. A piezoelectric vibrator having a piezoelectric vibrating plate mounted on an insulating substrate, wherein a main surface of the piezoelectric vibrating plate is mounted parallel to a surface of the insulating substrate, and one end of a long side of the piezoelectric vibrating plate is mounted on the insulating substrate. The opposite sides of the insulating substrate are adhered to each other with the insulating adhesive, and conduction is established between the lead-out ports of the electrodes at both ends of the piezoelectric vibrating plate and the conductors of the insulating substrate at the same long side. A piezoelectric vibrator which is connected by a conductive adhesive or wire bonding. 2. The utility model registration claim 1, wherein the gap between the insulating substrate and the piezoelectric vibrating plate depends only on the thickness of the insulating adhesive that fixes the piezoelectric vibrating plate to the insulating substrate. A piezoelectric vibrator characterized in that.