JPH0681135U - Piezoelectric vibrator - Google Patents

Abstract

(57) [Summary] [Objective] The object of the present invention is to make it possible to inexpensively manufacture a piezoelectric vibrator having good characteristics and high reliability. [Structure] The method of fixing the piezoelectric vibrating plate to the insulating substrate is performed with one bump. Since the bump is a metal, it is fixed more firmly than the case where an insulating adhesive is used for fixing, and there is a part where the bump is shared for conduction, but it is performed by wire bonding, and the conduction state is more reliable than the conductive adhesive. You can make a connection. In any case, since the method of fixing the piezoelectric diaphragm is performed only by bumps at one place, the stress of the insulating substrate or the like is not applied to the piezoelectric diaphragm, so that the original characteristics of the piezoelectric diaphragm can be realized obediently.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a piezoelectric vibrator support and electrical connection structure.

[0002]

[Prior art]

 Conventionally, for piezoelectric vibrators that have a piezoelectric vibrating plate mounted on an insulating substrate, a method of fixing the piezoelectric vibrating plate on the insulating substrate to achieve conduction is to use a conductive adhesive to simultaneously fix and conduct electricity. It was common practice. Further, as a fixing method, it is general that both ends are fixed symmetrically in the longitudinal direction of the piezoelectric diaphragm.

[0003]

[Problems to be solved by the device]

 In the prior art, as a method of fixing a piezoelectric vibrating plate on an insulating substrate to establish conduction, it was common to use a conductive adhesive to simultaneously perform fixing and conduction. 70 to 80% by weight is a conductive substance, and the remaining 20 to 30% is an adhesive. Therefore, not only the adhesive strength of the adhesive is lowered, but also the conductivity is inferior to that of metal. . In addition, the method of fixing the piezoelectric diaphragm in such a way that both ends in the longitudinal direction of the piezoelectric diaphragm can be easily fixed even with a conductive adhesive that does not have strong adhesive force, while it has an insulation property with the piezoelectric diaphragm. There is a problem that the characteristics of the piezoelectric vibrator are deteriorated because they are easily affected by the difference in linear expansion coefficient from the substrate, bending, and other stress.

[0004]

[Means for solving the problem]

 As a method of fixing the piezoelectric vibration plate to the insulating substrate, one bump is used. Regarding the electrical connection between the electrodes of the piezoelectric diaphragm and the conductor of the insulating substrate, one of the two locations shares the above bump, and the other only uses wire bonding to establish electrical continuity, and the adhesion is done at one bump. For the continuity, a method of using two wire bonding structures is used. Further, as the method of fixing the piezoelectric diaphragm, a method of fixing the piezoelectric diaphragm only at one end of the piezoelectric diaphragm was used.

[0005]

【Example】

 Example 1 (Example in which a fixed bump is commonly used at one place for conduction) In FIG. 1, in a piezoelectric vibrator in which a piezoelectric vibration plate 2 is mounted on an insulating substrate 1, the electrodes of the piezoelectric vibration plate 1 are One end of the lead-out port and the insulating substrate 2 facing each other are fixedly connected by the bump 3 at one place, and the other end of the electrode of the piezoelectric vibrating plate is connected to the conductor of the insulating substrate facing one end of the lead-out port. An example is shown in which the wire bonding 4 at one place is used to establish continuity.

Example 2 (example in which bumps are used for fixing and wire bonding is used for conduction) FIG. 2 shows one end of the long side of the piezoelectric vibrating plate 2 and the insulating substrate 1 facing each other. An example in which the bumps 3 are fixed at two locations, and the electrical connection between the electrode lead-out port of the piezoelectric vibration plate 2 and the insulating substrate 1 is separated at the other end and the wire bonding 4 at two locations is used. Shimesu. In FIG. 3, one end of the long side of the piezoelectric vibrating plate 2 and the insulating substrate 1 facing the long side are fixed to each other by a bump 3 at one place, and the electrode outlet of the piezoelectric vibrating plate 2 and the insulating substrate 1 are attached to the same end. The following shows an example in which the wiring is separated and the wire bonding 4 at two locations is used. In short, this is a type in which the fixing bumps 3 and the conductive wire bonding 4 are concentrated on one end of the long side of the piezoelectric diaphragm 2, and the fixing bumps 3 are provided between the two wire bonding portions 4 of the piezoelectric diaphragm 2. An example is shown in which the bump 3 is used in a place where neither the electrode of FIG.

1, FIG. 2, and FIG. 3, the electrodes of the piezoelectric vibrating plate, the conductors of the insulating substrate, and the cover of the piezoelectric vibrator are omitted. Further, these methods can be applied not only to an insulating substrate but also to a ceramic case, a metal case, or the like.

[0008]

[Effect of device]

 Regarding the fixing structure, in the piezoelectric vibrator in which the piezoelectric vibrating plate is mounted on the insulating substrate, instead of the conventional method of simultaneously fixing and conducting with a conductive adhesive, one part of the piezoelectric vibrating plate is used. Only fixed to the insulating substrate with bumps. Since other conduction is performed by wire bonding, almost no stress is applied to the piezoelectric diaphragm. For this reason, the characteristics of the piezoelectric vibrating plate itself are exerted in a straightforward manner, and it is possible to easily obtain a piezoelectric vibrator having good characteristics. In addition, fixing and conduction using bumps or wire bonding does not require heating time for curing as compared to fixing and conduction using insulating adhesives or conductive adhesives, work is easy and productivity is improved. Not only that, but since they are all metal, the adhesion is strong and the conduction is reliable. Therefore, the reliability of the piezoelectric vibrator is improved.

[Brief description of drawings]

FIG. 1 is a front view of a piezoelectric vibrating plate showing a state in which bumps and wire bonding are arranged on both ends of the piezoelectric vibrating plate.

FIG. 2 is a front view showing a state in which fixing is provided on bumps and conduction is separated from wire bonding, and they are arranged on both ends of a long side of a piezoelectric vibrating plate.

FIG. 3 is a front view showing a state in which fixing is performed by bumps and conduction is performed by separating from wire bonding, and the piezoelectric vibrating plates are arranged at the same end.

[Explanation of symbols]

 1 Insulating substrate 2 Piezoelectric diaphragm 3 Bump 4 Wire bonding

Claims (4)

[Scope of utility model registration request] 1. A piezoelectric vibrator having a piezoelectric vibrating plate mounted on an insulating substrate, wherein a main surface of the piezoelectric vibrating plate is mounted parallel to a surface of the insulating substrate, and a long side of the piezoelectric vibrating plate is mounted. One end is fixed to the insulating substrate with a bump at one point, and the lead-out port of the electrode of the piezoelectric diaphragm and the conductors of the insulating substrate are connected by wire bonding. Piezoelectric vibrator. 2. The piezoelectric vibrating plate has, at one end of a long side thereof, a lead-out port of an electrode of the piezoelectric vibrating plate and a bump which also serves as a conductor fixing and a conductor of the insulative substrate. The piezoelectric vibration according to claim 1, wherein the lead-out port of the electrode of the piezoelectric vibrating plate at the other end of the side and the conductor of the insulating substrate are connected by wire bonding. Child. 3. One end of the long side of the piezoelectric vibrating plate and the piezoelectric vibrating plate and the insulating substrate are fixed to each other by bumps, and two places of the piezoelectric vibrating plate at the other end of the long side of the piezoelectric vibrating plate. The piezoelectric vibrator according to claim 1, wherein the lead-out port of the electrode is connected to the conductor of the insulating substrate by wire bonding. 4. One end of the long side of the piezoelectric vibrating plate and the piezoelectric vibrating plate and the insulating substrate are fixed to each other by bumps, and two of the piezoelectric vibrating plates at the same end of the long side of the piezoelectric vibrating plate. The piezoelectric vibrator according to claim 1, wherein the connection for the lead-out port of the electrode and the conductor of the insulative substrate is made at various places by wire bonding.