JPH08191174A - Ceramic printed wiring board - Google Patents

Ceramic printed wiring board

Info

Publication number
JPH08191174A
JPH08191174A JP100795A JP100795A JPH08191174A JP H08191174 A JPH08191174 A JP H08191174A JP 100795 A JP100795 A JP 100795A JP 100795 A JP100795 A JP 100795A JP H08191174 A JPH08191174 A JP H08191174A
Authority
JP
Japan
Prior art keywords
lead terminals
plating
printed wiring
wiring board
residue
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP100795A
Other languages
Japanese (ja)
Inventor
Masaya Nakada
雅也 中田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP100795A priority Critical patent/JPH08191174A/en
Publication of JPH08191174A publication Critical patent/JPH08191174A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards

Abstract

PURPOSE: To eliminate residual conductor due to plating residue, and obtain a ceramic printed wiring board of high quality wherein short circuit is not caused between lead terminals, by previously making dividing grooves of lead terminal parts before baking. CONSTITUTION: A ceramic printed wiring board 1 has individual boards A, B, C wherein wirings are printed on the surface and the back, and dividing grooves shown by broken lines are formed. After plating, the board 1 is divided along the dividing grooves, and the individual boards A, B, C are obtained. After dividing, lead terminals spreading over the surfaces and the backs of sides facing hatched parts D, E, F, G are fixed to pads 2 for fixing the lead terminals, and then soldered. When electroless plating is used, residue of plating is after generated in the dividing grooves. Since the residue is conductive, electric conduction to the lead terminals is caused and it is possible that short circuit between lead terminals is generated. The hatched parts D, E, F, G are previously cut off before baking, so that residual conductor due to plating residue does not exist. Thereby a ceramic printed wiring board of high quality wherein short circuit between lead terminals is not generated can be obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はハイブリッドＩＣ等に使
用されるセラミック両面印刷配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ceramic double-sided printed wiring board used for hybrid ICs and the like.

【０００２】[0002]

【従来の技術】例えば、特開昭６０−７７４８９号公報
に於いて述べられているように基板の切断は焼成後行わ
れる。2. Description of the Related Art For example, as described in JP-A-60-77489, the cutting of a substrate is performed after firing.

【０００３】[0003]

【発明が解決しようとする課題】印刷された配線に焼成
後メッキを行う場合、分割溝に残留したメッキ液によ
り、分割後の基板端面に線状の残留導体が形成される。
この残留導体はリード端子を取り付ける際、リード端子
と導通しリード端子間の短絡を招く。When the printed wiring is plated after firing, a linear residual conductor is formed on the end face of the board after the division due to the plating liquid remaining in the division groove.
When the lead terminals are attached, the residual conductors conduct with the lead terminals and cause a short circuit between the lead terminals.

【０００４】[0004]

【課題を解決するための手段】上記問題は、焼成前に前
記リード端子部分の分割溝を予め切断し、メッキ残によ
る残留導体を無くすことで解決される。The above problems can be solved by cutting the dividing groove of the lead terminal portion in advance before firing to eliminate the residual conductor due to the plating residue.

【０００５】[0005]

【作用】焼成前にリード端子部分の分割溝を切断するこ
とでメッキ残による残留導体は無くなり、リード端子間
の短絡は無くなる。By cutting the dividing groove of the lead terminal portion before firing, the residual conductor due to the plating residue is eliminated and the short circuit between the lead terminals is eliminated.

【０００６】[0006]

【実施例】以下、本発明の１実施例である表裏両面に配
線されたセラミック印刷配線基板を図１により説明す
る。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A ceramic printed wiring board having wiring on both front and back sides, which is one embodiment of the present invention, will be described below with reference to FIG.

【０００７】表裏両面に配線が印刷された個別基板Ａ，
Ｂ，Ｃを有し、破線で表した分割溝が形成されたセラミ
ック印刷配線基板１は、焼成、メッキ後分割溝で分割さ
れ、それぞれ個別の基板Ａ，Ｂ，Ｃとなる。また、個別
基板Ａ，Ｂ，Ｃには、分割前にＩＣ、抵抗、コンデンサ
等が搭載され半田付けされる。分割後ハッチ部Ｄ，Ｅ，
Ｆ，Ｇと面する辺に表裏両面にまたがったリード端子が
リード端子取り付け用パッド２に取り付けられ半田付け
される。このリード端子を介して信号の入出力や電源の
供給が行われる。無電解メッキを使用する場合、分割溝
にはメッキの残留物が発生し易く、この残留物は導伝性
のためリード端子と導通しリード端子間で短絡する可能
性がある。ここで、ハッチ部Ｄ，Ｅ，Ｆ，Ｇは焼成前に
予め切断されているため、メッキの残留による残留導体
も無く、リード端子間の短絡が無い高品質なセラミック
印刷配線基板が得られる。An individual substrate A having wiring printed on both front and back sides,
The ceramic printed wiring board 1 having B and C and in which the dividing grooves shown by the broken lines are formed is divided by the dividing grooves after firing and plating to be individual substrates A, B and C, respectively. Further, ICs, resistors, capacitors, etc. are mounted and soldered on the individual boards A, B, C before being divided. After division hatch parts D, E,
Lead terminals, which are on the front and back sides on the sides facing F and G, are attached to the lead terminal attachment pads 2 and soldered. Input / output of signals and supply of power are performed through the lead terminals. When electroless plating is used, a plating residue is likely to be generated in the dividing groove, and since the residue is conductive, it may be electrically connected to the lead terminals and may be short-circuited between the lead terminals. Here, since the hatch portions D, E, F, and G are cut in advance before firing, there is no residual conductor due to residual plating, and a high-quality ceramic printed wiring board with no short circuit between lead terminals can be obtained.

【０００８】[0008]

【発明の効果】本発明によればセラミック基板端面のメ
ッキ残留物が無くなるため、リード端子間で短絡するこ
とが無い高品質なセラミック基板が得られる。According to the present invention, since the plating residue on the end surface of the ceramic substrate is eliminated, it is possible to obtain a high-quality ceramic substrate that does not short-circuit between lead terminals.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明のセラミック印刷配線基板の１実施例を
示す説明図。FIG. 1 is an explanatory view showing one embodiment of a ceramic printed wiring board of the present invention.

【符号の説明】[Explanation of symbols]

１…セラミック印刷配線基板、 ２…リード端子用取り付けパッド、 Ａ〜Ｃ…個別基板、 Ｄ〜Ｇ…基板切断部分、 破線…分割溝。 DESCRIPTION OF SYMBOLS 1 ... Ceramic printed wiring board, 2 ... Lead terminal mounting pad, AC ... Individual board, DG ... Board cutting part, Broken line ... Dividing groove.

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】表裏両面に印刷された配線を有し、前記配
線から信号の外部への取り出しや電源の供給に表裏両面
にまたがったリード端子を用い、焼成前に分割溝を設け
焼成後メッキを行った後に前記分割溝に従って分割し最
終形状を得るセラミック印刷配線基板において、前記分
割溝を焼成前に予め切断した事を特徴とするセラミック
印刷配線基板。1. A lead terminal having printed wirings on both front and back surfaces and used for taking out signals from the wirings to the outside and supplying power to the front and back surfaces, and providing a dividing groove before firing and plating after firing. A ceramic printed wiring board obtained by dividing the groove according to the dividing groove to obtain a final shape after performing the above step, wherein the dividing groove is cut in advance before firing.
JP100795A 1995-01-09 1995-01-09 Ceramic printed wiring board Pending JPH08191174A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP100795A JPH08191174A (en) 1995-01-09 1995-01-09 Ceramic printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP100795A JPH08191174A (en) 1995-01-09 1995-01-09 Ceramic printed wiring board

Publications (1)

Publication Number Publication Date
JPH08191174A true JPH08191174A (en) 1996-07-23

Family

ID=11489532

Family Applications (1)

Application Number Title Priority Date Filing Date
JP100795A Pending JPH08191174A (en) 1995-01-09 1995-01-09 Ceramic printed wiring board

Country Status (1)

Country Link
JP (1) JPH08191174A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014107891A1 (en) * 2013-01-09 2014-07-17 深圳市华星光电技术有限公司 Backlight module, printed circuit board and manufacturing method therefor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014107891A1 (en) * 2013-01-09 2014-07-17 深圳市华星光电技术有限公司 Backlight module, printed circuit board and manufacturing method therefor

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