CN213547922U - Connecting structure of substrate and functional module - Google Patents

Abstract

The utility model provides a connection structure of base plate and functional module, include: a substrate; the substrate is provided with a functional module mounting position; the functional module position is optionally provided with a functional module; and the detachable chip resistor is positioned on the substrate and correspondingly connected with the functional module. In the connection structure, the chip resistor is bridged between the substrate and the functional module, and the chip resistor is used for realizing the electrical connection between the substrate and the functional module. And when this base plate need not install functional module, this chip resistor is demolishd, again because the part that lies in the boundary line region on the base plate is the insulating region, like this, even with base plate and functional module separation can not lead to the metal line not to be exposed because of cutting outside to avoided exposing the short circuit problem that leads to because of the metal line, realize the compatible design demand of base plate, eliminated the quality potential safety hazard and the outward appearance problem of base plate.

Description

Connecting structure of substrate and functional module

Technical Field

The utility model relates to a PCB base plate, concretely relates to connection structure of base plate and functional module.

Background

An electric circuit is required to be connected between the flash lamp circuit board and the PCB substrate to realize the flash function of the product. At present, the connection mode of the PCB product is usually to realize electrical connection by distributing metal circuits on the surface layer or the inner layer of the PCB. However, when the product does not need the flasher board, the flasher board is separated from the PCB, and the PCB surface layer or the inner-layer electrical appliance connecting circuit (metal wiring) at the position of the separating line is cut off and exposed, so that the potential quality safety hazard and the appearance problem of the product can be brought.

SUMMERY OF THE UTILITY MODEL

The utility model discloses the technical problem that will solve is: the connecting structure of the substrate and the functional module is provided for solving the technical defect that after the substrate and the functional circuit board are separated in the prior art, the metal wiring on the boundary position of the substrate is short-circuited to cause potential safety hazards.

In order to solve the above technical problem, the utility model provides a connection structure of base plate and functional module, include: a substrate; the substrate is provided with a functional module mounting position; the functional module position is optionally provided with a functional module; and the detachable chip resistor is positioned on the substrate and correspondingly connected with the functional module.

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: when the functional module is arranged on the functional module position, two pins of the chip resistor are respectively connected with the functional module and the substrate

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: and when the functional module is in a vacant position, the substrate removes the chip resistor.

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: the middle area of the two pins of the chip resistor is the boundary area of the substrate and the functional module.

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: the part of the substrate located in the demarcation line area is an insulation area.

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: the functional module is a flash lamp module.

The utility model provides an in the connection structure of base plate and functional module, can also have such characteristic: the function module is a telephone receiver module.

The beneficial effects of the utility model reside in that:

the utility model provides an among the connection structure of base plate and functional module, the chip resistor cross-over connection utilizes the chip resistor to realize that base plate and functional module's electrical apparatus is connected between base plate and functional module. And when this base plate need not install functional module, this chip resistor is demolishd, again because the part that lies in the boundary line region on the base plate is the insulating region, like this, even with base plate and functional module separation can not lead to the metal line not to be exposed because of cutting outside to avoided exposing the short circuit problem that leads to because of the metal line, realize the compatible design demand of base plate, eliminated the quality potential safety hazard and the outward appearance problem of base plate.

Drawings

Fig. 1 is a schematic structural diagram of the connection between the substrate and the functional module in the embodiment of the present invention;

FIG. 2 is an enlarged schematic view at A in FIG. 1;

fig. 3 is a schematic structural diagram of the substrate after the substrate is separated from the functional module according to the embodiment of the present invention.

The reference numerals in the figures are as follows:

10. a substrate;

20. a functional module;

30. a chip resistor; 31. a first pin; 32. and a second pin.

Detailed Description

In order to make the technical problem, technical solution and advantageous effects solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

As shown in fig. 1-2, the substrate 10 is applied to an electronic product, and the substrate 10 is provided with a functional module position, and the functional module position can be selectively provided with a functional module 20. The substrate 10 is further provided with a chip resistor 30 to be connected to the functional module 20. The chip resistor 30 is detachably provided on the substrate 10.

The function module 20 is a flash module or a receiver module. In the present embodiment, the function module 20 is a flash module.

When the substrate 10 is applied to an electronic product requiring a flash function, the functional module is mounted with the functional module 20, which is a flash module. The substrate 10 and the functional module 20 are connected by a chip resistor 30. The chip resistor 30 is bridged between the substrate 10 and the functional module 20, a first pin 31 is connected with the substrate 10, and the first pin 31 is a substrate power supply input end; pin two 32 is connected to functional module 20. So as to realize the flash lamp application of the electronic product.

The area of the substrate 10 between the two leads of the chip resistor 30 is the boundary area between the substrate 10 and the functional module 20, and the substrate 10 in the boundary area is subjected to clearance treatment (i.e. only the base material is left, and no metal circuit is provided), and is the insulating area B.

When the substrate 10 is applied to an electronic product that does not require a flash function, the functional module mounting site on the base 10 is vacant, i.e., no functional module is mounted on the functional module mounting site, and at this time, the chip resistor 30 is also removed, i.e., is not mounted. After the substrate 10 is separated from the functional module 20, the problem of metal circuit exposure does not occur in the boundary region, and the safety quality problem caused by short circuit due to metal circuit exposure is avoided.

According to the connection structure of the substrate and the functional module in the above embodiment, the chip resistor 30 is bridged between the substrate 10 and the functional module 20, and the two pins of the chip resistor 30 are used to implement the electrical connection between the substrate and the functional module. When the product needs the flash function, two pins of the chip resistor 30 are respectively connected to the substrate 10 and the functional module 20.

When the product does not need the flashing function, the chip resistor 30 is removed, and because the part of the substrate 10 located in the boundary line area between the two pins of the chip resistor 30 is subjected to clearance treatment, namely, is an insulation area, the substrate is separated from the functional module, and then the metal circuit is not exposed outside due to truncation, so that the short circuit problem caused by exposure of the metal circuit is avoided, the compatible design requirement of the substrate is realized, and the quality safety hazard and the appearance problem of the substrate are eliminated.

It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their full equivalents, the present application is intended to include such modifications and variations.

Claims (7)

1. A connecting structure of a substrate and a functional module, comprising:

a substrate; the substrate is provided with a functional module mounting position;

the functional module mounting position is optionally provided with a functional module;

and the detachable chip resistor is positioned on the substrate and correspondingly connected with the functional module.

2. The structure of claim 1, wherein:

when the functional module is mounted in the functional module mounting position,

two pins of the chip resistor are respectively connected with the functional module and the substrate.

3. The structure of claim 1, wherein:

when the functional module installation site is vacant,

and the substrate is detached from the chip resistor.

4. The structure of claim 1, wherein:

the middle area of the two pins of the chip resistor is the boundary area of the substrate and the functional module.

5. The structure of claim 4, wherein:

and the part of the substrate, which is positioned in the demarcation line area, is an insulating area.

6. The structure of claim 1, wherein:

the functional module is a flash lamp module.

7. The structure of claim 1, wherein:

the functional module is a telephone receiver module.

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