JPH08186440A - Laminated board for oscillation circuit and its manufacture - Google Patents

Abstract

PURPOSE: To enable the circuit to accurately correct frequency or the like with a simple configuration by laminating plural insulating boards. CONSTITUTION: Insulating boards 14 respectively formed with conductive patterns 12 and mutually laminated are provided, and the board of the outer-most layer formed of a high dielectric constant resin to obtain a high dielectric constant board 14. A pair of capacitor electrodes 17 and 18 respectively faced to each other are formed on the front and rear surfaces of the high dielectric constant board 16, and a capacitor is provided to be adjusted by trimming the capacitor electrode 17 on the front surface side. Also, inductors 20 formed by the conductive patterns 12 are provided at the other parts of the respective laminated boards 14 and 16, and the capacitor electrodes 17 and 18 and the inductors 20 are connected with a through hole 24 coated with silver paste or the like.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an oscillator circuit laminated substrate having a plurality of insulating substrates laminated to form a circuit, and a method for manufacturing the same.

[0002]

2. Description of the Related Art As shown in FIG. 5, a conventional laminated substrate for an oscillation circuit has a conductive pattern 4 made of copper foil or the like formed on an insulating substrate 2 such as a glass epoxy substrate. By using this, a circuit pattern including the electrodes of the inductor 5 and other mounted electronic components was formed. The inductor 5 and the conductive pattern 4 of the other layer are connected to the through hole 7
Connected by. In this method for manufacturing a laminated substrate for an oscillation circuit, for example, two upper and lower substrates 2 are bonded together with an insulating adhesive 3 and laminated on each other, and the adjustment electrode 6 of the inductor is positioned on the outermost layer. 6 was trimmed to increase the inductance and adjust the oscillation frequency of the oscillation circuit.

[0003]

In recent years, a small and thin size is required for a built-in substrate in electronic equipment, but in the case of the above conventional technique, the adjustment electrode 6 exposed at the outermost layer is used. The large area hinders the miniaturization of electronic device substrates. Further, if the adjustment electrode 6 is made too small, the oscillation frequency may not be corrected in the entire circuit due to variations in accuracy of other electronic components. Therefore, in order to enable correction, the accuracy of other mounted electronic components must be made higher, and there is a problem that high-precision electronic components are expensive and difficult to obtain. ,

The present invention has been made in view of the above-mentioned problems of the prior art, and provides a laminated substrate for an oscillation circuit and a method of manufacturing the same, which has a simple structure and enables accurate frequency correction and the like. To aim.

[0005]

According to the present invention, a plurality of insulating substrates each having a conductive pattern formed thereon and laminated on each other, and an outermost substrate of the substrates are formed of a high dielectric constant resin. As a high dielectric constant substrate, a pair of capacitor electrodes facing each other are formed on the front and back surfaces of this high dielectric constant substrate,
Oscillation in which a capacitor electrode on the surface side is trimmed to provide a capacitor adjustable, an inductor having the conductive pattern is provided on the other portion of each of the stacked substrates, and the capacitor electrode and the inductor are connected by a through hole. It is a circuit board.

Further, according to the present invention, an inductor having a conductive pattern is provided on an insulating substrate, and a pair of capacitor electrodes made of a high dielectric constant resin and facing each other are formed on the outer layer of the substrate. This is a method for manufacturing a laminated substrate for an oscillation circuit, in which the frequency substrates are laminated, the capacitor electrodes on the front surface side are trimmed to change the capacitors, and the oscillation frequency is adjusted.

[0007]

According to the present invention, there is provided a laminated substrate for an oscillation circuit and a method for manufacturing the same, in which a capacitor is formed by a high dielectric constant substrate provided on the outermost layer of the laminated substrate, and an adjustment electrode of the capacitor is trimmed to adjust the oscillation frequency. To do
The adjustment electrode can be downsized. Further, the use of a high-dielectric constant substrate having a higher dielectric constant or reducing the thickness thereof increases the number of capacitors, so that the adjustment electrode can be made smaller.

[0008]

Embodiments of the present invention will be described below with reference to the drawings. 1 to 4 show an embodiment of the present invention. A laminated substrate 10 for an oscillation circuit of this embodiment is a glass epoxy substrate in which a conductive pattern 12 is formed of copper foil or the like and laminated on each other. An insulating substrate 14 such as
A high dielectric constant substrate 16 formed of a high dielectric constant resin is provided as the outermost substrate. And this substrate 14,
An adhesive agent such as an epoxy resin or an adhesive layer 13 such as a prepreg is provided to bond the 16 to each other.

Capacitor electrodes 17 and 18 of a pair of conductive patterns 12 facing each other are formed on the front and back surfaces of the high dielectric constant substrate 16 to form a capacitor 19. The front surface side capacitor electrode 17 is an electrode for adjusting the capacitor, and is formed on the first layer of the laminated substrate 10. Further, other resistors, capacitors, diodes, transistors, and other electronic components are soldered to the first layer. Then, as shown in FIG. 3, the back surface of the high dielectric constant substrate 16 is the laminated substrate 10
Forming a second layer of the capacitor electrode 18 is formed.

The lower surface of the substrate 14 is the third layer of the laminated substrate 10, and the inductor 20 is formed by the conductive pattern 12, as shown in FIG.
In addition, the fourth layer on the back side has a ground electrode 22 on almost one surface.
Are formed. Then, the stacked substrates 14 and 1
The conductive patterns 12 of 6, the electrodes 17, 18, the inductor 20, and the ground electrode 22 are connected by through holes 24 penetrating between the substrates 14 and 16. The through holes 24 are plated with copper or solder to enable electrical connection.

Further, the oscillating circuit laminated substrate 1 of this embodiment
0, as shown in FIG.
Electronic components such as 1, the diode 32, and the transistor 33 are mounted on the surface of the outermost high-dielectric constant substrate 16. Then, the electronic components are connected to each other by electrodes and circuits formed by the conductive pattern 12.

In the method for manufacturing a laminated substrate for an oscillation circuit according to this embodiment, the adhesive layer 13 is sandwiched between the insulating substrate 14 and the high dielectric constant substrate 16, and the substrates 14 and 1 are pressed and heated.
6 is joined while being surely aligned. Further, through holes 24 for electrically connecting the conductive patterns 12 between the respective layers are formed. The through hole 24 is formed so as to penetrate through the laminated substrates 14 and 16 at a predetermined position, and the inner wall surface of the through hole is formed by plating copper and solder. After that, electronic components are mounted, the electrodes 17 are function-trimmed, and the capacitance value of the capacitor 19 is adjusted so that the oscillation circuit as a whole has a desired oscillation frequency.

According to the oscillating circuit laminated substrate and the method of manufacturing the same of the present embodiment, when adjusting the oscillation frequency, the required capacitance value with respect to the adjustment width required for the frequency adjustment is set to the area of the electrode 17. The thickness of the high dielectric constant substrate 16 and the dielectric constant 3
It can be set from the type parameters. Therefore, when it is desired to reduce the size of the electrode, the thickness of the high dielectric constant substrate 16 may be reduced or a substrate having a higher dielectric constant may be selected, and the size of the laminated substrate 10 may be easily reduced. Therefore, it is possible to configure an oscillation circuit having a small outer size. Further, it is possible to adjust with higher accuracy, and further, the adjustable range of the frequency can be widened without increasing the accuracy of other mounted electronic components of the laminated substrate 10. Eliminates the use of expensive electronic components.

The oscillating circuit laminated substrate of the present invention is not limited to the above embodiment, and the material of the high dielectric constant substrate can be appropriately selected. The trimming method for the capacitor electrode 17 can be adjusted by laser trimming or other trimming methods.

[0015]

According to the laminated substrate for an oscillation circuit and the method of manufacturing the same of the present invention, electrodes for capacitors are formed with a high dielectric constant substrate sandwiched therebetween, and the electrodes on the surface side are trimmed to adjust the oscillation frequency. Therefore, the adjustment can be performed by three kinds of parameters such as the thickness and the permittivity of the high-dielectric constant substrate and the area of the electrode, and the adjustable width is wide, and even if the error of the mounted electronic component is large, the adjustment is accurate. The frequency can be set.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of an oscillator circuit laminated substrate according to an embodiment of the present invention.

FIG. 2 is a circuit diagram of an oscillator circuit of this embodiment.

FIG. 3 is a plan view of a second layer of the laminated substrate for an oscillation circuit of this example.

FIG. 4 is a plan view of a third layer of the oscillating circuit laminated substrate of this embodiment.

FIG. 5 is a vertical cross-sectional view of a conventional oscillator circuit laminated substrate.

[Explanation of symbols]

 10 Laminated Substrate for Oscillation Circuit 12 Conductive Pattern 13 Adhesive Layer 14 Insulating Substrate 16 High Dielectric Constant Substrate 17, 18 Capacitor Electrode (Conductive Pattern) 20 Inductor (Conductive Pattern) 22 Ground Electrode (Conductive Pattern) 24 Through Hole

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masaki Kato, 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd. Industry Co., Ltd.

Claims (2)

[Claims] 1. A plurality of insulating substrates each having a conductive pattern formed thereon and laminated on each other, and a substrate of the outermost layer of the substrates is a high dielectric constant substrate formed of a high dielectric constant resin. A pair of capacitor electrodes facing each other are formed on the front and back surfaces of the dielectric constant substrate, and the capacitor electrodes on the front surface side are used as capacitance adjusting electrodes for trimming, and the inductor having the conductive pattern is formed on the other portion of the laminated substrate. And a laminated substrate for an oscillation circuit in which the capacitor electrode and the inductor are connected by a through hole. 2. A high dielectric constant substrate in which an inductor having a conductive pattern is provided on an insulating substrate, and a pair of capacitor electrodes formed of high dielectric constant resin and facing each other are formed on an outer layer portion of the substrate. Laminated layers for oscillation circuits, in which through-holes are formed in each of the laminated substrates, the through-holes are electrically connected to each other, and the capacitors are changed by trimming the capacitor electrodes on the surface side to adjust the oscillation frequency. Substrate manufacturing method.